A novel heat dissipation airflow shovel-tooth radiator

Abstract

This utility model discloses a novel heat sink with a shovel-shaped airflow channel, comprising a substrate, a shovel-shaped structure, and a flow divider. The shovel-shaped structure consists of multiple inclined shovel-shaped units with microgrooves on its surface to enhance heat transfer efficiency. The flow divider has an arc-shaped design with guide ribs on its inner side to optimize airflow distribution. The bottom of the substrate is coated with a graphene composite thermally conductive coating to improve heat conduction performance. This application solves the wind resistance problem caused by excessively high fin density in traditional heat sinks by optimizing the airflow path and heat conduction design, significantly improving heat dissipation efficiency and meeting the heat dissipation needs of high-performance chips in confined spaces.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a novel heat dissipation air duct toothed radiator. Background Technology

[0002] In the field of electronic device heat dissipation, with the continuous increase in the power consumption of high-performance chips, heat dissipation has become a key factor restricting the stable operation of equipment. Traditional heat sinks mostly use aluminum extrusion or copper fin structures to improve heat dissipation efficiency by increasing the surface area. However, due to limitations in the thermal conductivity of the materials and the design of the airflow, the heat dissipation effect is difficult to meet the needs of high-power devices. Especially in confined spaces, poor airflow leads to heat accumulation, further affecting heat dissipation performance. Existing heat sinks usually rely on forced convection fans, but due to unreasonable airflow layout and uneven airflow distribution, local hot spots are still quite prominent. In addition, increasing fin density to improve heat dissipation capacity will increase air resistance, which will reduce the overall heat dissipation efficiency. These problems make heat sink design optimization particularly important. Utility Model Content

[0003] The purpose of this utility model is to provide a new type of heat dissipation airflow shovel-tooth radiator, which solves the problems mentioned in the background art.

[0004] This invention is achieved as follows: a novel heat dissipation airflow channel toothed radiator, which mainly consists of a base plate, a toothed structure disposed on the base plate, and a diverter plate installed on top of the toothed structure. The base plate is the main structure, and the toothed structure and the diverter plate are both fixed on the base plate. Efficient heat dissipation is achieved by optimizing airflow distribution and heat conduction path.

[0005] The toothed structure comprises multiple parallel toothed units, each tilted at an angle to the substrate. The bottom of each unit is welded to the substrate, while the top connects to a flow divider. The surface of each unit features microgrooves evenly distributed along its length to enhance airflow disturbance and improve heat exchange efficiency. The spacing between the toothed units is precisely calculated to ensure smooth airflow while avoiding excessive density that could significantly increase air resistance. The tilt angle of the toothed units ranges from 15° to 30° to guide airflow in a specific direction and reduce turbulence.

[0006] The manifold is located above the toothed structure, and its bottom is bolted to the top of the toothed unit. The manifold is arc-shaped, with the radius of curvature designed according to the height and spacing of the toothed unit, so that the airflow can be effectively guided to the outlet area of ​​the radiator after passing through the toothed unit. The inner side of the manifold has guide ribs arranged along its length to further optimize the airflow distribution. The cross-section of the guide ribs is trapezoidal, and their height gradually decreases from the center of the manifold to both sides to achieve uniform airflow diffusion.

[0007] The bottom of the substrate has a thermally conductive coating that directly contacts the heat-generating element, improving heat transfer efficiency by filling the gap between the substrate and the element. The thermally conductive coating, with a thickness of 0.1mm to 0.2mm, is made of graphene composite material and possesses high thermal conductivity and good mechanical strength. Mounting holes, 4mm in diameter, are provided around the perimeter of the substrate for securing the heat sink to the device housing with bolts. The substrate itself is 3mm to 5mm thick and made of high thermal conductivity aluminum alloy to balance heat dissipation performance and structural strength.

[0008] The connection between the tooth structure and the substrate is welding, with the welding point located at the bottom center of the tooth unit. The welding area is 2mm to 3mm wide, ensuring a strong connection without affecting heat conduction. The tooth unit is made of copper-aluminum alloy, manufactured using powder metallurgy, giving it both high thermal conductivity and lightweight properties. The surface of the tooth unit undergoes anodizing treatment to form a corrosion-resistant protective film, while also increasing surface roughness to further improve heat exchange efficiency.

[0009] The flow divider plate and the toothed unit are connected by bolts. The bolts are M3 in size, and the bolt heads are embedded in the bottom groove of the flow divider plate. The groove depth is 2mm to ensure the flatness of the connection. The flow divider plate is made of polycarbonate, which has high heat resistance and impact resistance. Its surface is frosted to reduce the impact of light reflection on other internal components of the equipment.

[0010] This invention discloses a novel heat sink with a shovel-shaped airflow channel. The shovel-shaped structure and microgroove surface treatment enhance airflow and heat exchange efficiency. The arc-shaped design of the diffuser plate and the arrangement of the guide ribs optimize airflow distribution and reduce the generation of localized hot spots. The thermally conductive coating and high thermal conductivity material selection on the substrate further enhance heat conduction. This design allows the heat sink to maintain high-efficiency heat dissipation performance even in confined spaces, while avoiding wind resistance problems caused by excessively high fin density, thus meeting the heat dissipation requirements of high-performance chips. Attached Figure Description

[0011] Figure 1This is a schematic diagram of the overall structure of the present invention, showing the assembly relationship of the heat sink substrate, the tooth structure and the flow divider plate, wherein the tooth units are arranged at an angle and the flow divider plate is located above the tooth structure.

[0012] Figure 2 This is a magnified view of a shovel tooth unit, highlighting the microgroove structure on the surface of the shovel tooth unit and its welding connection with the substrate. The microgrooves are evenly distributed along the length of the shovel tooth unit.

[0013] Figure 3 This is a schematic diagram of the bottom structure of the diverter, showing the arrangement of the guide ribs and their trapezoidal cross-section design. The height of the guide ribs gradually decreases from the center to both sides.

[0014] The reference numerals in the attached diagram are as follows: 1. Substrate; 2. Toothed unit; 3. Diverter plate; 4. Microgroove structure; 5. Guide ribs; 6. Thermally conductive coating; 7. Mounting hole; 8. Welding point; 9. Bolt; 10. Groove. Detailed Implementation

[0015] The specific implementation method of this utility model of a novel heat dissipation air duct shovel radiator is as follows: Figures 1 to 3 A detailed description is provided. The heat sink in this embodiment mainly consists of a substrate 1, a toothed unit 2 mounted on the substrate 1, and a flow divider 3 located above the toothed unit 2. The substrate 1, as the main structure, is made of high thermal conductivity aluminum alloy with a thickness of 4mm, possessing good thermal conductivity and mechanical strength. A thermally conductive coating 6, made of graphene composite material with a thickness of 0.15mm, is provided on the bottom of the substrate 1, covering the entire bottom surface of the substrate 1 and used for direct contact with the heat-generating element and filling the gaps between them. Four mounting holes 7, each with a diameter of 4mm, are evenly distributed around the perimeter of the substrate 1, and the substrate 1 is fixed to the device housing using bolts.

[0016] The toothed units 2 are arranged in a parallel, inclined manner on the substrate 1, forming an angle of 20° with the substrate 1. There are 20 toothed units 2 in total. The bottom end of each toothed unit 2 is connected to the substrate 1 via a welding point 8, located in the center of the bottom end of the toothed unit 2, with a welding area width of 2.5 mm. The toothed units 2 are made of copper-aluminum alloy, manufactured using powder metallurgy, and their surfaces are anodized to form a corrosion-resistant protective film. The surface of the toothed units 2 has microgroove structures 4, such as... Figure 2 As shown, the microgroove structure 4 is evenly distributed along the length of the shovel tooth unit 2. The depth of the microgroove is 0.2 mm, the width is 0.5 mm, and the spacing is 1 mm. The spacing between the shovel tooth units 2 is precisely calculated and designed to be 3 mm to ensure that the airflow can flow smoothly between the shovel teeth, while avoiding a significant increase in wind resistance due to excessive density.

[0017] The diverter plate 3 is located above the toothed unit 2 and is fixed to the top of the toothed unit 2 by bolts 9. The diverter plate 3 is arc-shaped with a radius of curvature of 50mm, and its design is optimized according to the height and spacing of the toothed unit 2. The diverter plate 3 is made of polycarbonate, which has high heat resistance and impact resistance. Its surface is frosted to reduce the impact of light reflection on other internal components of the equipment. The bottom inner side of the diverter plate 3 is provided with guide ribs 5, such as... Figure 3 As shown, five guide ribs 5 are arranged along the length of the diverter plate 3. Each guide rib 5 has a trapezoidal cross-section, and its height gradually decreases from the center of the diverter plate 3 to both sides, with a height of 3mm at the center and 1mm at the edge. The bolts 9 are M3, and their heads are embedded in the grooves 10 at the bottom of the diverter plate 3. The grooves 10 are 2mm deep to ensure the flatness of the connection.

[0018] The heat sink in this embodiment works as follows: The substrate 1 is in direct contact with the heat-generating element through the thermally conductive coating 6. The heat generated by the heat-generating element is transferred to the substrate 1 through the thermally conductive coating 6, and then conducted to the toothed unit 2 via the substrate 1. The tilt angle and microgroove structure 4 of the toothed unit 2 allow the airflow to flow in a specific direction and create disturbance on the surface of the toothed unit 2, thereby enhancing the heat exchange efficiency. After passing through the toothed unit 2, the airflow enters the space below the diverter plate 3. The arc design of the diverter plate 3 and the arrangement of the guide ribs 5 enable the airflow to be effectively guided to the outlet area of ​​the heat sink, achieving uniform diffusion and reducing the generation of local hot spots. In practical applications, such as in the heat dissipation requirements of high-performance chips, the heat sink of this embodiment can be installed above the chip, driven by a fan on the device casing. The airflow enters from one side of the toothed unit 2 and flows along the tilt direction of the toothed unit 2, and finally exits from the other side of the heat sink, completing the efficient dissipation of heat.

[0019] In this embodiment, the connection and positional relationships between the various components have been optimized. The substrate 1 and the toothed unit 2 are connected by welding, with the welding point 8 located at the center of the bottom of the toothed unit 2, ensuring a short heat conduction path and a firm connection. The toothed unit 2 and the diverter plate 3 are fixed by bolts 9, with the head of the bolt 9 embedded in the groove 10 at the bottom of the diverter plate 3 to ensure the flatness of the connection. The arc design of the diverter plate 3 matches the height and spacing of the toothed unit 2, and the arrangement of the guide ribs 5 further optimizes the airflow distribution. The material selection and surface treatment process of each component have also been strictly considered. For example, the copper-aluminum alloy material and anodizing treatment of the toothed unit 2 give it both high thermal conductivity and lightweight characteristics, while the polycarbonate material and frosted treatment of the diverter plate 3 improve its heat resistance and anti-light reflection performance.

[0020] As can be seen from the detailed description of the above embodiments, the heat sink of this utility model can still maintain efficient heat dissipation performance in a small space, while avoiding the wind resistance problem caused by excessive fin density, thereby meeting the heat dissipation requirements of high-performance chips.

[0021] To enable those skilled in the art to fully understand and implement this utility model, the following supplementary explanation of the specific implementation principle of this utility model is provided in conjunction with a specific application scenario.

[0022] During heat sink installation, the substrate 1 is first secured to the high-performance chip's casing with bolts, ensuring close contact between the thermally conductive coating 6 and the chip surface. The thermally conductive coating 6 is made of graphene composite material with a thickness of 0.15mm, effectively filling the tiny gaps between the substrate 1 and the chip, thereby improving heat conduction efficiency. The substrate 1 is made of high thermal conductivity aluminum alloy with a thickness of 4mm, ensuring both good thermal conductivity and sufficient mechanical strength to support the entire heat sink structure. Four mounting holes 7, each with a diameter of 4mm, are evenly distributed around the substrate 1. These holes are used to firmly secure the substrate 1 to the device casing with bolts, preventing the heat sink from loosening due to vibration or external force.

[0023] When the chip generates heat during operation, the heat is first transferred to the substrate 1 through the thermally conductive coating 6. The substrate 1 then evenly distributes and conducts the heat to the toothed units 2. The toothed units 2 are arranged at an angle, forming a 20° angle with the substrate 1. This design guides the airflow in a specific direction, reducing turbulence. The bottom of the toothed units 2 is connected to the substrate 1 via solder points 8, with a solder area width of 2.5 mm, ensuring a short heat conduction path and a strong connection. The surface of the toothed units 2 has microgroove structures 4, with a depth of 0.2 mm, a width of 0.5 mm, and a spacing of 1 mm. The design of the microgroove structures 4 causes turbulence when the airflow passes over the surface of the toothed units 2, enhancing heat exchange efficiency. The spacing between the toothed units 2 is 3 mm. This parameter has been precisely calculated to ensure smooth airflow while avoiding a significant increase in wind resistance due to excessive density.

[0024] The airflow is driven by a fan on the device casing, entering from one side of the toothed unit 2 and flowing along its inclined direction. After passing through the toothed unit 2, the airflow enters the space below the diffuser plate 3. The diffuser plate 3 is arc-shaped with a radius of curvature of 50mm, and its design is optimized based on the height and spacing of the toothed unit 2, allowing the airflow to be effectively guided to the outlet area of ​​the radiator. Five guide ribs 5 are provided on the inner bottom side of the diffuser plate 3, arranged along its length. The cross-section of the guide ribs 5 is trapezoidal, with the height gradually decreasing from the center of the diffuser plate 3 to both sides, with a height of 3mm at the center and 1mm at the edges. This design further optimizes the airflow distribution, enabling the airflow to diffuse evenly and reducing the generation of local hot spots.

[0025] The diverter plate 3 is fixed to the top of the toothed unit 2 by bolts 9, which are M3 in size. The bolts 9 have heads that are embedded in the groove 10 at the bottom of the diverter plate 3. The groove 10 has a depth of 2mm to ensure the flatness of the connection. The diverter plate 3 is made of polycarbonate, which has high heat resistance and impact resistance. Its surface is frosted to reduce the impact of light reflection on other internal components. The toothed unit 2 is made of copper-aluminum alloy, manufactured using powder metallurgy, and its surface is anodized to form a corrosion-resistant protective film. This material selection and surface treatment process improve the thermal conductivity of the toothed unit 2, while also enhancing its corrosion resistance and lightweight characteristics.

[0026] Throughout the heat dissipation process, heat is transferred from the chip to the substrate 1, and then conducted to the airflow via the toothed unit 2. The tilt angle of the toothed unit 2 and the design of the microgroove structure 4 allow the airflow to flow in a specific direction and create disturbance on the surface of the toothed unit 2, thereby enhancing heat transfer efficiency. The arc-shaped design of the flow divider 3 and the arrangement of the guide ribs 5 further optimize the airflow distribution, enabling the airflow to diffuse evenly and reducing the generation of local hot spots. Finally, the airflow is exhausted from the other side of the heat sink, completing the efficient dissipation of heat.

[0027] As can be seen from the above steps, the heat sink of this invention can maintain efficient heat dissipation performance even in confined spaces, while avoiding wind resistance problems caused by excessive fin density, thus meeting the heat dissipation requirements of high-performance chips. The connection and position relationships between the various components in this invention have been optimized, and the material selection and surface treatment processes of each component have also been strictly considered to ensure that the heat sink can work stably and reliably in practical applications.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel heat dissipation duct toothed radiator, characterized in that, The heat sink includes a base plate (1), a toothed structure disposed on the base plate (1), and a diverter plate (3) mounted on the top of the toothed structure. The base plate (1) is the main structure, and the toothed structure and the diverter plate (3) are both fixed on the base plate (1).

2. The novel heat dissipation duct toothed radiator according to claim 1, characterized in that: The tooth structure includes multiple parallel tooth units (2), each tooth unit (2) is inclined and forms an angle of 15° to 30° with the substrate (1), and the surface of the tooth unit (2) is provided with microgroove structures (4) evenly distributed along the length direction.

3. The novel heat dissipation duct toothed radiator according to claim 2, characterized in that: The spacing between the toothed units (2) is 3 mm. The bottom end of the toothed unit (2) is fixed to the substrate (1) by the welding point (8). The width of the welding area is 2 mm to 3 mm.

4. The novel heat dissipation duct toothed radiator according to claim 1, characterized in that: The shape of the flow divider (3) is arc-shaped with a radius of curvature of 50 mm. The bottom inner side of the flow divider (3) is provided with a flow guide rib (5). The flow guide rib (5) is arranged along the length direction of the flow divider (3). The cross section of the flow guide rib (5) is trapezoidal, and the height gradually decreases from the center of the flow divider (3) to both sides.

5. The novel heat dissipation duct toothed radiator according to claim 1, characterized in that: The bottom of the substrate (1) is provided with a thermally conductive coating (6) with a thickness of 0.1 mm to 0.2 mm. Mounting holes (7) with a diameter of 4 mm are provided around the substrate (1). The thickness of the substrate (1) is 3 mm to 5 mm.

6. A novel heat dissipation duct toothed radiator according to claim 2, characterized in that: The material of the shovel tooth unit (2) is copper-aluminum alloy. The surface of the shovel tooth unit (2) is anodized. The depth of the microgroove structure (4) is 0.2 mm, the width is 0.5 mm, and the spacing is 1 mm.

7. A novel heat dissipation duct toothed radiator according to claim 4, characterized in that: The diverter plate (3) is made of polycarbonate. The surface of the diverter plate (3) is frosted. The diverter plate (3) is fixed to the top of the toothed unit (2) by bolts (9). The bolts (9) are M3 in size. The head of the bolts (9) is embedded in the groove (10) at the bottom of the diverter plate (3). The groove (10) is 2 mm deep.

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