A type of heat sink profile

Abstract

This utility model belongs to the field of heat sink technology, and particularly relates to a heat sink profile, comprising: a base plate, wherein a plurality of heat dissipation fins are uniformly arranged in an array on the bottom of the base plate, and a through mounting hole is provided on the bottom surface of the base plate; and side plates, wherein the side plates are placed on the left and right sides of the top of the base plate, and the side plates are detachably connected to the base plate, wherein a plurality of heat dissipation fins are uniformly arranged in an array on the side wall of the side plate away from the base plate; wherein the heat dissipation fins are detachably connected to the base plate and the side plates. Through the base plate and the side plates, the effect of simultaneous heat dissipation from multiple surfaces of the heat-generating element can be achieved.

Description

Technical Field

[0001] This application belongs to the field of radiator technology, and in particular relates to a radiator profile. Background Technology

[0002] With the development of the industrial age, people are using more and more electronic devices in their lives. Most electronic devices are prone to heat generation, and heat sinks need to be installed on the heat-generating components of electronic devices to dissipate heat and maintain the normal operation of electronic devices. In order to keep the size and weight of electronic devices from being too large, aluminum profile heat sinks have become the mainstream in the market.

[0003] For example, Chinese patent CN215835734U discloses a high-ratio radiator profile including a profile body, on which heat dissipation pins are provided, and on the heat dissipation pins are movably disposed socket pins for increasing the heat dissipation area. By increasing the heat dissipation area of ​​the radiator through socketing on the heat dissipation pins, the ratio of the radiator profile can be further improved.

[0004] Although this type of high-performance heat sink profile can increase the heat dissipation area and thus improve the heat dissipation ratio by using heat dissipation pins and socket pins, the heat sink profile of this solution can only dissipate heat on one side of the heat-generating element and cannot dissipate heat on multiple sides of the heat-generating element at the same time. Utility Model Content

[0005] The purpose of this utility model is to address the aforementioned technical problems by providing a heat sink profile that can simultaneously dissipate heat from multiple surfaces of a heat-generating element.

[0006] In view of this, the present invention provides a heat sink profile, comprising:

[0007] A substrate, wherein a plurality of heat dissipation fins are uniformly arranged in an array on the bottom of the substrate, and a through mounting hole is provided on the bottom surface of the substrate;

[0008] Side plates are placed on the left and right sides of the top of the substrate. The side plates are detachably connected to the substrate. A number of heat dissipation fins are evenly arranged on the side wall away from the substrate.

[0009] The heat dissipation fins are detachably connected to the base plate and side plate.

[0010] Furthermore, a slot is provided on the top of the substrate, and a plug that matches the slot is provided on the bottom of the side plate.

[0011] Furthermore, slots are provided on the left and right sidewalls of the substrate and the sidewalls of the side plate away from the substrate, and a locking block is provided between the substrate and the side plate to match and engage with the slots. The locking block has a U-shaped cross section.

[0012] Furthermore, the bottom of the substrate and the side wall of the side plate away from the substrate are provided with several fixing grooves. Limiting grooves are provided on both sides of the inner wall of the fixing groove. An arc-shaped elastic plate is provided in the limiting groove. An arc-shaped groove matching the arc-shaped elastic plate is provided on the heat dissipation fin.

[0013] Furthermore, a guide groove is provided at the bottom of the fixing groove, and a guide block is provided at one end of the heat dissipation fin near the arc-shaped groove. The heat dissipation fin is connected to the base plate and the side plate by means of the guide block and the guide groove.

[0014] Furthermore, a limit block is provided at the top of the side plate.

[0015] The beneficial effects of this utility model are:

[0016] 1. The substrate and side plates enable heat dissipation from multiple surfaces of the heat-generating element, improving the practicality of this technical solution.

[0017] 2. The interlocking connection between the base plate and the side plate through the slots and blocks on the base plate and the side plate makes the connection between the base plate and the side plate more stable, thus improving the practicality of this technical solution.

[0018] 3. The ability to detach and connect the heat dissipation fins to the base plate and side plate ensures that this technical solution does not occupy too much space during transportation, thus improving its practicality. Attached Figure Description

[0019] Figure 1 This is a structural schematic diagram of the heat sink profile of this utility model;

[0020] Figure 2 This is a partially exploded view of the heat sink profile of this utility model;

[0021] Figure 3 This is a cross-sectional view of the heat sink fin structure of the heat sink profile of this utility model;

[0022] The markings in the diagram are as follows: 100, base plate; 110, mounting hole; 111, slot; 112, card slot; 113, card block; 120, fixing slot; 121, limiting slot; 122, arc-shaped elastic plate; 123, guide slot; 200, side plate; 210, limiting block; 211, insertion block; 220, heat dissipation fins; 221, arc-shaped groove; 222, guide block. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0024] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items, and therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0025] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] It should be noted that in the description of this application, the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0027] It should be noted that, in this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0028] Example 1

[0029] like Figure 1 , 2 As shown in Figure 3, this utility model provides a radiator profile, comprising:

[0030] The substrate 100 has a plurality of heat dissipation fins 220 uniformly arranged on its bottom surface, and a through mounting hole 110 is provided on the bottom surface of the substrate 100.

[0031] Side plate 200, the side plate 200 is placed on the left and right sides of the top of the substrate 100, the side plate 200 is detachably connected to the substrate 100, and a number of heat dissipation fins 220 are uniformly arranged on the side wall away from the substrate 100.

[0032] The heat dissipation fins 220 are detachably connected to the base plate 100 and the side plate 200.

[0033] In this technical solution, when it is necessary to assemble the heat-generating element with the heat sink profile, the top surface of the substrate 100 is attached to the heat-generating element and fixed with screws or other parts through the mounting holes 110 at the bottom of the substrate 100. Then, the side of the side plate 200 without the heat sink fins 220 is attached to the heat-generating element. Then, the side plate 200 and the substrate 100 are assembled and fixed, and the substrate 100 and the side plate 200 are used to dissipate heat from multiple sides of the heat-generating element.

[0034] Example 2

[0035] like Figure 2 As shown, this embodiment provides a heat sink profile, which, in addition to the technical solution described in the embodiment, also has the following technical features.

[0036] The top of the substrate 100 is provided with a slot 111, and the bottom of the side plate 200 is provided with a plug 211 that matches the slot 111.

[0037] In this technical solution, the slot 111 provided on the top of the substrate 100 and the insert block 211 at the bottom of the side plate 200 enable the substrate 100 and the side plate 200 to be assembled together. After the assembly is completed, the cross-section of this technical solution is concave.

[0038] Example 3

[0039] like Figure 1 , 2 As shown, this embodiment provides a heat sink profile, which, in addition to the technical solution described in the embodiment, also has the following technical features.

[0040] The left and right sidewalls of the substrate 100 and the sidewalls of the side plate 200 away from the substrate 100 are provided with slots 112. A locking block 113 is provided between the substrate 100 and the side plate 200 to match and engage with the slots 112. The locking block 113 has a U-shaped cross section.

[0041] In this technical solution, after the substrate 100 and the side plate 200 have been assembled and fixed, the two protrusions of the locking block 113 are respectively fitted and connected to the locking slots 112 on the substrate 100 and the side plate 200. The locking block 113 can make the connection between the substrate 100 and the side plate 200 more stable and improve the structural stability.

[0042] Example 4

[0043] like Figure 1 , 2 As shown in Figures 1 and 3, this embodiment provides a heat sink profile, which, in addition to the technical solution described in the embodiment, also has the following technical features.

[0044] The bottom of the substrate 100 and the side wall of the side plate 200 away from the substrate 100 are provided with a plurality of fixing grooves 120. The inner walls of the fixing grooves 120 are provided with limiting grooves 121 on both sides. An arc-shaped elastic plate 122 is provided in the limiting groove 121. The heat dissipation fins 220 are provided with arc-shaped grooves 221 that match the arc-shaped elastic plate 122.

[0045] In this technical solution, because an arc-shaped elastic plate 122 is provided in the fixing groove 120, and an arc-shaped groove 221 matching the arc-shaped elastic plate 122 is provided on the heat dissipation fin 220, the heat dissipation fin 220 can be movably connected through the bending deformation and springback of the arc-shaped elastic plate 122 and the arc-shaped groove 221, thereby realizing the detachable connection between the heat dissipation fin 220 and the substrate 100 and the side plate 200.

[0046] Example 5

[0047] like Figure 1 , 2 As shown in Figures 1 and 3, this embodiment provides a heat sink profile, which, in addition to the technical solution described in the embodiment, also has the following technical features.

[0048] The bottom of the fixing groove 120 is provided with a guide groove 123, and the end of the heat dissipation fin 220 near the arc-shaped groove 221 is provided with a guide block 222. The heat dissipation fin 220 is fitted and disassembled with the base plate 100 and the side plate 200 through the guide block 222 and the guide groove 123.

[0049] In this technical solution, the guide groove 123 provided at the bottom of the fixing groove 120 and the guide block 222 provided on the heat dissipation fin 220 can be positioned when the heat dissipation fin 220 is assembled and fixed with the substrate 100 and the side plate 200. At the same time, after the assembly is completed, the guide block 222 and the guide groove 123 can improve the stability of the connection between the heat dissipation fin 220 and the substrate 100 and the side plate 200.

[0050] Example 6

[0051] like Figure 1 , 2 As shown, this embodiment provides a heat sink profile, which, in addition to the technical solution described in the embodiment, also has the following technical features.

[0052] A limit block 210 is provided at the top of the side plate 200.

[0053] In this technical solution, a limiting block 210 is provided at the top of the side plate 200. The limiting block 210 can limit the position of the heating element connected to this technical solution and prevent the heating element from detaching.

[0054] The working principle and usage process of this utility model are as follows: In this technical solution, when it is necessary to assemble the heat-generating element box heat sink profile, the top surface of the substrate 100 is attached to the heat-generating element, and then the insert block 211 at the bottom of the side plate 200 is fitted into the slot 111 on the top surface of the substrate 100. After the side plate 200 and the substrate 100 are fitted together, the two protrusions of the locking block 113 are fitted into the locking groove 112 on the side plate 200 and the substrate 100 to improve the stability of the overall structure. After the assembly is completed, the arc-shaped elastic plate 122 in the fixing groove 120 in the substrate 100 and the side plate 200 and the arc-shaped groove 221 on the heat sink fin 220 are matched and connected according to the heat dissipation requirements.

[0055] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific implementation methods described. The specific implementation methods described are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat sink profile, characterized in that, include: A substrate (100) has a plurality of heat dissipation fins (220) uniformly arranged on its bottom surface, and a through mounting hole (110) is provided on the bottom surface of the substrate (100). Side plate (200), the side plate (200) is placed on the left and right sides of the top of the substrate (100), the side plate (200) is detachably connected to the substrate (100), and a number of heat dissipation fins (220) are uniformly arranged on the side wall of the side plate (200) away from the substrate (100). The heat dissipation fins (220) are detachably connected to the base plate (100) and the side plate (200).

2. The heat sink profile of claim 1, wherein, The substrate (100) has a slot (111) on its top and a plug (211) that matches the slot (111) on its bottom.

3. The heat sink profile of claim 2, wherein, The left and right sidewalls of the substrate (100) and the sidewalls of the side plate (200) away from the substrate (100) are provided with slots (112). A locking block (113) matching and engaging with the slots (112) is provided between the substrate (100) and the side plate (200). The locking block (113) has a U-shaped cross section.

4. The heat sink profile of claim 1, wherein, The bottom of the substrate (100) and the side wall of the side plate (200) away from the substrate (100) are provided with a plurality of fixing grooves (120). Limiting grooves (121) are provided on both sides of the inner wall of the fixing grooves (120). An arc-shaped elastic plate (122) is provided in the limiting groove (121). An arc-shaped groove (221) matching the arc-shaped elastic plate (122) is provided on the heat dissipation fins (220).

5. The heat sink profile of claim 4, wherein, The bottom of the fixing groove (120) is provided with a guide groove (123), and the end of the heat dissipation fin (220) near the arc-shaped groove (221) is provided with a guide block (222). The heat dissipation fin (220) is connected to the base plate (100) and the side plate (200) by means of the guide block (222) and the guide groove (123).

6. The heat sink extrusion of claim 1, wherein A limit block (210) is provided at the top of the side plate (200).

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