A wet cleaning device

Abstract

This application discloses a wet cleaning apparatus, including a machine with a cleaning chamber, a cleaning tank, a circulation pipeline, and a flow equalizer disposed in the cleaning chamber. The circulation pipeline can form a circulating flow field of cleaning fluid in the cleaning chamber. The flow equalizer is provided with a through-type array of holes. In the embodiment of this application, the above-mentioned wet cleaning apparatus is used, and the flow equalizer is installed in the cleaning tank. At the same time, the flow equalizer is disposed at the inlet and outlet pipe sections of the cleaning fluid in the cleaning tank. The hole array can realize the discrete guidance of the cleaning fluid in the pipe sections in the cleaning tank. That is, when the cleaning fluid inside the cleaning tank flows through the hole array on the flow equalizer plate, the flow velocity and flow direction of the circulating flow field of the cleaning fluid are uniformly distributed in the cleaning tank through the guiding effect of the hole array. This ensures that the cleaning fluid fully reacts with and uniformly replaces the wafer surface, reduces watermarks and corrosion on the wafer surface, improves the organic cleaning effect of the wafer, and improves the appearance yield and performance reliability of the wafer.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and in particular to a wet cleaning apparatus. Background Technology

[0002] In the semiconductor wafer manufacturing industry, cleaning processes are critical steps that directly affect device performance and yield. Wet resist stripping, a crucial step after photolithography, must remove photoresist while avoiding damage to the wafer surface material. Currently, mature technologies exist for resist stripping of traditional silicon-based (Si) wafers, widely employing chemical cleaning solutions centered around EKC cleaning fluid. The main components of EKC include hydroxylamine (HDA), 2-(2-aminoethoxy)ethanol (DGA), catechol, and water. This cleaning fluid primarily relies on hydroxylamine-based active ingredients to efficiently decompose photoresist residues through redox reactions. Due to the chemical properties of hydroxylamine, it can cause slight corrosion to the aluminum-copper alloy (AlCu) metal layer on the wafer surface during the reaction. However, because silicon-based materials have a wide process window, this corrosion is within a controllable range and does not affect the electrical performance and reliability of the final device.

[0003] However, with the widespread application of silicon carbide (SiC) semiconductor materials, the limitations of traditional silicon-based wet photoresist stripping processes are becoming increasingly apparent. Because SiC surfaces have higher reactivity with hydroxylamine-based substances than silicon-based materials, the corrosion rate of the AlCu metal layer by the cleaning solution is significantly accelerated. Traditional cleaning equipment places the wafer-loaded cassette in a cleaning tank, where the wafer is ultrasonically cleaned by the cleaning solution. However, insufficient flow field uniformity within the cleaning tank leads to differences in the contact rate of the cleaning solution with different areas of the wafer surface, resulting in incomplete removal of photoresist residue and AlCu corrosion. Furthermore, the "water ripple" phenomenon caused by the unstable flow field directly reduces surface morphology quality, affecting wafer yield and electrical stability. Utility Model Content

[0004] This application provides a wet cleaning apparatus that can improve the uniformity of wafer surface cleaning.

[0005] To achieve the above objectives, this application provides the following technical solution.

[0006] This application provides a wet cleaning apparatus, including a machine base with a cleaning chamber, a cleaning tank, a circulation pipeline and a flow equalization component disposed in the cleaning chamber;

[0007] The circulation pipeline can form a circulating flow field of cleaning fluid in the cleaning chamber. The circulation pipeline has a pipe section located in the cleaning tank, and the pipe section has an opening for the cleaning fluid to enter and exit.

[0008] The flow equalization element is located inside the cleaning tank. The flow equalization element includes a flow equalization plate and a hole array disposed through the flow equalization plate. The flow equalization plate is located at the pipe section, so that the hole array is located in the flow path of the cleaning liquid to guide the flowing cleaning liquid.

[0009] In some embodiments, the pipe section is located at the bottom of the cleaning tank, the flow equalization element and the inner wall of the cleaning tank form a flow guiding area, and the pipe section is located in the flow guiding area.

[0010] In some embodiments, the hole array includes a plurality of longitudinal flow equalization holes disposed vertically through the flow equalization plate;

[0011] The longitudinal flow equalization holes are arranged in a rectangular array on the flow equalization plate.

[0012] In some embodiments, the hole array further includes a plurality of transverse flow equalization holes disposed horizontally through the flow equalization plate body;

[0013] The plurality of transverse flow equalization holes are arranged in a rectangular array on the flow equalization plate.

[0014] In some embodiments, the diameter of the longitudinal flow equalization orifice is larger than the diameter of the transverse flow equalization orifice.

[0015] In some embodiments, the flow equalization plate includes a bottom plate, side plates, and a top plate;

[0016] The top plate is parallel to the bottom plate, and the side plate is fixedly disposed between the top plate and the bottom plate, with the top plate and the bottom plate located on both sides of the side plate;

[0017] The pipe section is located between the side plate and the inner wall of the cleaning tank, the transverse flow equalization hole is disposed through the side plate, and the longitudinal flow equalization hole is disposed through the top plate.

[0018] In some embodiments, at least one connecting plate is fixedly provided between the side plate and the bottom plate;

[0019] The connecting plate has a flow gap with the bottom plate and the side plate.

[0020] In some embodiments, the flow equalization plate includes a bottom plate, side plates, and a top plate. The bottom plate has vertically arranged side plates on both sides, and the top plate extends laterally from the top of the side plates. The top plate is located on the side of the side plates away from the bottom plate.

[0021] The cleaning tank has pipe sections on both sides of its bottom, which are located in the area enclosed by the top plate and the side plate. The top plate and the side plate are also provided with the array of holes.

[0022] In some embodiments, the base plate is provided with a positioning groove for positioning the crystal cell.

[0023] In some embodiments, the flow equalization plate is provided with positioning holes, and the cleaning tank is provided with positioning protrusions that are inserted into the positioning holes.

[0024] This application has at least the following beneficial effects:

[0025] 1. Install a flow equalization device in the cleaning tank. The flow equalization device is set at the inlet and outlet pipes of the cleaning liquid in the cleaning tank. The hole array can realize the discrete guidance of the cleaning liquid in the pipe section of the cleaning tank. That is, when the cleaning liquid inside the cleaning tank flows through the hole array on the flow equalization plate, the flow rate and direction of the cleaning liquid circulation flow field are evenly distributed in the cleaning tank through the guiding effect of the hole array. This ensures that the cleaning liquid fully reacts and uniformly replaces the wafer surface, reduces water marks and corrosion on the wafer surface, improves the organic cleaning effect of the wafer, and improves the appearance yield and performance reliability of the wafer.

[0026] 2. The connecting plate can improve the connection strength between the bottom plate and the side plate, thereby improving the overall structural strength of the flow equalization plate and ensuring the orientation stability of the transverse flow equalization holes on the side plate and the longitudinal flow equalization holes on the top plate.

[0027] 3. The limiting groove can both allow space for the crystal box and limit its position, thereby ensuring the stability of the crystal box's position during the cleaning process and thus ensuring the cleaning effect. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the wet cleaning device according to an embodiment of this application without the "flow equalization element" installed;

[0029] Figure 2 This is a schematic diagram of the structure of the wet cleaning apparatus according to an embodiment of this application when the "flow equalization element" is installed;

[0030] Figure 3 This is a schematic diagram of the "flow equalization element" in the wet cleaning apparatus of this application embodiment;

[0031] Figure 4 This is a partial enlarged schematic diagram of the "flow equalization element" in the wet cleaning apparatus of this application embodiment;

[0032] Figure 5 This is a partial enlarged schematic diagram of the "flow equalization element" in the wet cleaning apparatus of this application embodiment;

[0033] Figure 6 This is a schematic diagram of the flow field of the wet cleaning device according to an embodiment of this application when the "flow equalization element" is not installed;

[0034] Figure 7 This is a schematic diagram of the flow field when the "flow equalization element" is installed in the wet cleaning device of this application embodiment.

[0035] Figure Labels

[0036] Machine base-100, cleaning tank-110, crystal box-200, circulation pipeline-300, support base-400, ultrasonic module-500, flow equalization component-600, flow equalization plate-610, bottom plate-611, side plate-612, top plate-613, positioning hole-620, connecting plate-630, limiting groove-640, clearance groove-650, transverse flow equalization hole-660, longitudinal flow equalization hole-670. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0038] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] The wet cleaning apparatus provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0040] like Figures 1 to 7 As shown in the figure, this application provides a wet cleaning device, including a machine base 100 with a cleaning chamber, a cleaning tank 110, a circulation pipeline 300 and a flow equalization element 600 disposed in the cleaning chamber.

[0041] The cleaning tank 110 can hold wafers, and the circulation pipe 300 can form a circulating flow field of cleaning fluid in the cleaning chamber. The circulation pipe 300 has a pipe section located in the cleaning tank 110, and the pipe section has an opening for the cleaning fluid to enter and exit.

[0042] The flow equalizer 600 is located inside the cleaning tank 110. The flow equalizer 600 includes a flow equalizer plate 610 and a hole array disposed through the flow equalizer plate 610. The flow equalizer plate 610 is located in the pipe section inside the cleaning tank 110, so that the hole array is located in the flow path of the cleaning liquid to guide the flowing cleaning liquid.

[0043] It is understandable that, such as Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, the cleaning tank 110 is located inside the cleaning chamber, and the cleaning fluid forms a circulating flow field inside the cleaning chamber. That is, the circulating flow field includes the area inside the cleaning tank 110 and the area outside the cleaning tank 110. The cleaning fluid flows in a unidirectional state inside the cleaning tank 110, and the circulation pipeline 300 can realize the circulation of cleaning fluid inside and outside the cleaning tank 110.

[0044] like Figure 1 , Figure 6 As shown, when the flow equalization component 600 is not installed in the cleaning tank 110, the flow direction and velocity distribution of the cleaning fluid circulation field will be uneven due to changes in the flow velocity, local flow direction, and interference from the internal structural components of the cleaning tank 110. Figure 6 The red area represents areas with relatively fast flow rates, while the blue and green areas represent areas with relatively slow flow rates. It can be seen that the cleaning fluid has a high flow rate at the orifice of the pipe section, while the flow rate is slower and more dispersed at the wafer placement position in the center of the cleaning tank 110. This results in uneven flow rates between the cleaning fluid and the wafer surface, affecting the cleaning effect. It can also lead to watermarks on the wafer surface or uneven AlCu surface corrosion, posing potential risks in subsequent processes.

[0045] In this embodiment, a wet cleaning device as described above is used, such as... Figure 2 , Figure 7 As shown, a flow equalization element 600 is installed inside the cleaning tank 110. The flow equalization element 600 is positioned at the inlet and outlet pipe sections of the cleaning liquid within the cleaning tank 110. Through the perforation array, the cleaning liquid at the pipe sections within the cleaning tank 110 can be dispersed and guided. That is, when the cleaning liquid inside the cleaning tank 110 flows through the perforation array on the flow equalization plate 610, the guiding effect of the perforation array ensures that the flow velocity and direction of the circulating flow field of the cleaning liquid are uniformly distributed within the cleaning tank 110. Figure 7It can be seen that the cleaning fluid transported to the cleaning tank 110 by the pipe section flows more evenly after passing through the flow equalization component 600, and the flow rate is evenly distributed (the blue area covers the wafer placement position in the center of the cleaning tank 110), thereby ensuring that the cleaning fluid fully reacts with the wafer surface and is evenly replaced, reducing watermarks and corrosion on the wafer surface, improving the organic cleaning effect on the wafer, and improving the appearance yield and performance reliability of the wafer.

[0046] In one implementation, such as Figure 3 , Figure 4 As shown, the hole array includes a plurality of longitudinal flow equalization holes 670 disposed vertically through the flow equalization plate 610.

[0047] In one implementation, such as Figure 3 , Figure 4 As shown, the hole array includes a plurality of transverse flow equalization holes 660 that are arranged horizontally through the flow equalization plate 610.

[0048] In one implementation, such as Figure 3 , Figure 4 As shown, the transverse flow equalization holes 660 and / or the longitudinal flow equalization holes 670 are specifically arranged in a rectangular array on the flow equalization plate 610.

[0049] It is understandable that the array gap, number, and array uniformity of the transverse flow equalization holes 660 and the longitudinal flow equalization holes 670 are not limited. They are specifically determined based on the flow area of ​​the circulating flow field inside the cleaning tank 110, as long as the guiding effect on the circulating flow field of the cleaning liquid can be guaranteed. This will not be elaborated here.

[0050] In one embodiment, the transverse flow equalization hole 660 and the longitudinal flow equalization hole 670 are specifically configured as circular holes.

[0051] It is understandable that the orifice shape of the transverse flow equalization orifice 660 and the longitudinal flow equalization orifice 670 is not limited to the above one. For example, they can also be provided with square holes, pentagonal holes, arc holes, etc. Among them, setting it as a circular hole can ensure the flow stability of the flowing cleaning liquid and further improve the guiding effect on the circulating flow field of the cleaning liquid.

[0052] In one embodiment, the diameter of the longitudinal flow equalization orifice 670 is larger than the diameter of the transverse flow equalization orifice 660.

[0053] It is understandable that the diameter of the vertically penetrating longitudinal flow equalization hole 670 is larger than the diameter of the horizontally penetrating transverse flow equalization hole 660, which results in a faster flow velocity in the vertical direction and a lower flow velocity in the horizontal direction. Since the wafer is placed vertically in the cleaning tank 110, the reaction rate of the cleaning solution on the wafer surface can be improved, while ensuring the uniformity of the cleaning solution circulation flow field in the horizontal direction.

[0054] In one embodiment, the diameter of the longitudinal flow equalization hole 670 is specifically set to 2 cm, and the diameter of the transverse flow equalization hole 660 is specifically set to 1.5 cm.

[0055] It is understandable that the aperture configuration of the transverse flow equalization hole 660 and the longitudinal flow equalization hole 670 is not limited to the one mentioned above, as long as it can ensure the flow guiding effect on the circulating flow field of the cleaning liquid, it will not be elaborated here.

[0056] In one implementation, such as Figures 2 to 5 , Figure 7 As shown, the pipe section is located at the bottom of the cleaning tank 110, and the flow equalization element 600 and the inner wall of the cleaning tank 110 form a flow guiding area, in which the pipe section is located.

[0057] In one implementation, such as Figures 2 to 5 , Figure 7 As shown, the flow uniform plate 610 includes a bottom plate 611, a side plate 612, and a top plate 613.

[0058] The top plate 613 is parallel to the bottom plate 611, and the side plate 612 is fixedly disposed between the top plate 613 and the bottom plate 611, with the top plate 613 and the bottom plate 611 located on both sides of the side plate 612.

[0059] The pipe section is located between the side plate 612 and the inner wall of the cleaning tank 110. The transverse flow equalization hole 660 is installed through the side plate 612, and the longitudinal flow equalization hole 670 is installed through the top plate 613.

[0060] It is understandable that the top plate 613, the side plate 612, and the inner wall of the cleaning tank 110 form a flow guiding area. The pipe section is located in the flow guiding area. The cleaning fluid delivered by the pipe section to the cleaning tank 110 will flow through the transverse flow equalization hole 660 on the side plate 612 and the longitudinal flow equalization hole 670 on the top plate 613. On the one hand, the side plate 612 and the top plate 613 form the accommodating space of the pipe section, which improves the space utilization rate inside the cleaning tank 110. On the other hand, the cleaning fluid output by the pipe section can flow towards the side closer to the wafer through the transverse flow equalization hole 660 and the longitudinal flow equalization hole 670, so that the hole array on the flow equalization plate 610 can guide the cleaning fluid with different flow directions in the circulating flow field, further improving the reaction uniformity between the wafer and the flowing cleaning fluid.

[0061] In one implementation, such as Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, a nozzle is installed at the orifice of the circulation pipeline 300.

[0062] In this process, cleaning fluid is introduced into the cleaning tank 110 through a nozzle, thereby forming a cleaning fluid flow field within the cleaning tank 110.

[0063] Understandably, during the cleaning process, it is necessary to adjust the inlet velocity of the cleaning fluid in the cleaning tank 110, as well as the nozzle angle, to adjust the cleaning parameters. When the inlet velocity or nozzle angle changes, if the flow equalizer 600 is not installed in the cleaning tank 110, watermarks and corrosion will form on the surface of the wafer due to the local differential velocity of the cleaning fluid. When the flow equalizer 600 is installed in the cleaning tank 110, the cleaning fluid output from the nozzle to the cleaning tank 110 will first have its flow rate and direction adjusted by the array of holes on the flow equalizer 610, and then flow through the wafer in the cleaning tank 110, thereby achieving a uniform reaction between the cleaning fluid and the wafer surface.

[0064] In one implementation, such as Figures 2 to 5 , Figure 7 As shown, at least one connecting plate 630 is fixedly provided between the side plate 612 and the bottom plate 611.

[0065] It is understandable that the connection strength between the bottom plate 611 and the side plate 612 can be improved by the connecting plate 630, thereby improving the overall structural strength of the flow equalization plate 610 and ensuring the orientation stability of the transverse flow equalization hole 660 on the side plate 612 and the longitudinal flow equalization hole 670 on the top plate 613.

[0066] In one implementation, such as Figures 2 to 5 , Figure 7 As shown, the connecting plate 630, the bottom plate 611, and the side plate 612 surround each other to form a flow gap.

[0067] It is understandable that by forming a flow gap through the connecting plate 630, the bottom plate 611, and the side plate 612, the cleaning liquid flowing through the transverse uniform flow holes 660 is not interfered with, thereby further improving the guiding effect of the hole array on the uniform flow plate 610 on the circulating flow field of the cleaning liquid.

[0068] In one implementation, such as Figure 3 As shown, a clearance groove 650 for accommodating the circulation pipe 300 is provided through the vertical direction on the flow uniform plate 610.

[0069] It is understandable that the clearance groove 650 can be set at the edge of the flow equalization plate 610 or it can be set entirely on the flow equalization plate 610, as long as it can provide clearance space for the arrangement of the circulation pipe 300. This will not be elaborated here.

[0070] In one implementation, such as Figure 3 As shown, the clearance groove 650 is specifically set on the base plate 611.

[0071] In one implementation, such as Figure 1 , Figure 2 , Figure 6 , Figure 7As shown, side plates 612 are vertically provided on both sides of the base plate 611, and a top plate 613 extending laterally is provided on the top of the side plate 612, and the top plate 613 is located on the side of the side plate 612 away from the base plate 611.

[0072] The bottom of the cleaning tank 110 is provided with pipe sections on both sides. The pipe sections are located in the area enclosed by the top plate 613 and the side plate 612, and the top plate 613 and the side plate 612 are provided with an array of holes.

[0073] It is understandable that the arrangement of the pipe sections in the cleaning tank 110 can further improve the uniformity of the cleaning fluid flow in the cleaning tank 110. At the same time, side plates 612 and top plates 613 are set at both pipe section positions, so as to guide the flow of the cleaning fluid through the transverse flow equalization holes 660 and the longitudinal flow equalization holes 670, thereby improving the cleaning effect of the wafer.

[0074] In one implementation, such as Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, a support base 400 for placing the crystal box 200 is fixedly provided inside the cleaning tank 110.

[0075] Understandably, the wafer cassette 200 is used to load wafers. When the wafer cassette 200 is placed on the support base 400, the circulating flow of the cleaning fluid in the cleaning tank 110 can clean the wafers loaded on the wafer cassette 200.

[0076] In one implementation, such as Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, the flow equalizer 600 is disposed on the side of the support base 400 away from the ground, and the flow equalizer plate 610 is provided with a limiting groove 640 for accommodating the crystal cell 200.

[0077] The limiting groove 640 can limit the horizontal displacement of the internal crystal cell 200 relative to the uniform flow plate 610.

[0078] Understandably, the limiting groove 640 can both allow space for the crystal box 200 and limit its position, thereby ensuring the stability of the crystal box 200's position during the cleaning process and thus ensuring the cleaning effect.

[0079] In one embodiment, the flow equalizer 600 is placed on top of the support base 400.

[0080] It is understood that the arrangement of the flow equalizer 600 in the cleaning tank 110 is not limited to the one mentioned above. For example, the flow equalizer 600 can be detachably connected to the support base 400 or the inner wall of the cleaning tank 110. Specifically, a snap-fit ​​structure can be provided between the support base 400 and the flow equalizer 600, or the flow equalizer 600 can be fixedly connected to the inner wall of the cleaning tank 110 by bolts. As long as the positioning of the flow equalizer 600 in the cleaning tank 110 can be achieved, it will not be elaborated here.

[0081] In one embodiment, the cleaning tank 110 also includes a positioning mechanism for positioning the flow equalizer 600.

[0082] In one implementation, such as Figure 3 As shown, a positioning hole 620 is provided through the flow equalization plate 610 along the vertical direction, and the positioning mechanism includes a positioning protrusion fixedly installed on the inner wall of the support base 400 or the cleaning tank 110.

[0083] The positioning protrusion can be inserted into the positioning hole 620 to achieve the positioning of the flow equalization plate 610 in the cleaning tank 110.

[0084] It is understood that the positioning mechanism is not limited to the above one form. For example, a positioning protrusion can be fixedly set on the flow equalization plate 610, and a positioning hole that can be inserted and cooperated with the positioning protrusion can be set on the inner wall of the support base 400 or the cleaning tank 110. As long as the flow equalization component 600 can be positioned in the cleaning tank 110, it will not be elaborated here.

[0085] In one implementation, such as Figure 3 As shown, multiple positioning holes 620 are provided on the base plate 611.

[0086] In one implementation, such as Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, it also includes an ultrasonic module 500 fixedly mounted on the machine base 100.

[0087] Understandably, the ultrasonic module 500 can perform ultrasonic cleaning on the wafers in the cleaning tank 110 using the cleaning fluid in the cleaning tank 110.

[0088] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0089] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A wet cleaning apparatus, characterized by, It includes a machine with a cleaning chamber, as well as a cleaning tank, circulation pipeline and flow equalization device disposed in the cleaning chamber; The circulation pipeline can form a circulating flow field of cleaning fluid in the cleaning chamber. The circulation pipeline has a pipe section located in the cleaning tank, and the pipe section has an opening for the cleaning fluid to enter and exit. The flow equalization element is located inside the cleaning tank. The flow equalization element includes a flow equalization plate and a hole array disposed through the flow equalization plate. The flow equalization plate is located at the pipe section, so that the hole array is located on the flow path of the cleaning liquid to guide the flowing cleaning liquid. The hole array includes multiple longitudinal flow equalization holes that penetrate the flow equalization plate in the vertical direction and multiple transverse flow equalization holes that penetrate the flow equalization plate in the horizontal direction. The flow equalization plate includes a bottom plate, side plates, and a top plate; The top plate is parallel to the bottom plate, and the side plate is fixedly disposed between the top plate and the bottom plate, with the top plate and the bottom plate located on both sides of the side plate; The pipe section is located between the side plate and the inner wall of the cleaning tank, the transverse flow equalization hole is disposed through the side plate, and the longitudinal flow equalization hole is disposed through the top plate.

2. A wet cleaning apparatus according to claim 1, wherein The pipe section is located at the bottom of the cleaning tank, and the flow equalization element and the inner wall of the cleaning tank form a flow guiding area, with the pipe section located within the flow guiding area.

3. A wet cleaning apparatus as claimed in claim 1, wherein The plurality of longitudinal flow equalization holes are arranged in a rectangular array on the flow equalization plate.

4. A wet cleaning apparatus according to claim 3, wherein The plurality of transverse flow equalization holes are arranged in a rectangular array on the flow equalization plate.

5. A wet cleaning apparatus as claimed in claim 4, wherein The diameter of the longitudinal flow equalization hole is larger than the diameter of the transverse flow equalization hole.

6. A wet cleaning apparatus as claimed in claim 1, wherein At least one connecting plate is fixedly provided between the side plate and the bottom plate; The connecting plate has a flow gap with the bottom plate and the side plate.

7. A wet cleaning apparatus as claimed in claim 1, wherein The base plate has vertically arranged side plates on both sides, and a horizontally extending top plate is provided on the top of the side plates, with the top plate located on the side of the side plates away from the base plate. The cleaning tank has pipe sections on both sides of its bottom, and the pipe sections are located in the area enclosed by the top plate and the side plate.

8. A wet cleaning apparatus according to claim 1 or 7, wherein The base plate is provided with a positioning groove for positioning the crystal box.

9. A wet cleaning apparatus as claimed in claim 1, wherein The flow equalization plate is provided with positioning holes, and the cleaning tank is provided with positioning protrusions that are inserted into the positioning holes.

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