Support portion of wafer support for semiconductor manufacturing

Abstract

1. Name of the design product: support portion of wafer support for semiconductor manufacturing. 2. Use of the design product: The article to which the present design relates is a support portion of a wafer support for semiconductor manufacturing used for placing a semiconductor wafer on the upper surface of a support plate in a semiconductor manufacturing apparatus. 3. Design points of the design product: The shape of the portion indicated by solid lines in each figure. 4. Picture or photograph best indicating the design points: Front view.

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