Microfluidic chip pressing device
CN224446595UActive Publication Date: 2026-07-03XINAN MEDICAL TECHNOLOGY (JIANGSU) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINAN MEDICAL TECHNOLOGY (JIANGSU) CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-07-03
AI Technical Summary
Technical Problem
Traditional microfluidic chip bonding devices are prone to chip microstructure damage or delamination during the bonding process, and there are safety hazards during hot bonding.
Method used
The moving seat positioning mechanism, which combines a linear module with an interceptor plate, along with the design of an upper pressing section, a heating section, and a buffer section, ensures that the chip is heated evenly and the pressure is buffered during the pressing process, thus avoiding misoperation.
Benefits of technology
It improves operational safety and chip processing reliability, avoids chip damage, and ensures the safety of the thermoforming process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224446595U_ABST
Abstract
This invention provides a microfluidic chip pressing device, comprising: a worktable with supporting legs at its lower part; linear modules, an upper pressing section, and a heating section mounted on the worktable; a movable seat slidably connected to the linear modules; and an intercepting plate fixedly connected to the worktable between the linear modules, the intercepting plate corresponding to the movable seat; and a carrying section mounted on the movable seat. This microfluidic chip pressing device, through the cooperation of the linear modules and the intercepting plate, positions the movable seat, ensuring that the carrying section is transported inward to the pressing station for processing. It also avoids safety hazards to workers caused by misoperation of the upper pressing section during hot pressing, improving operational safety and reliability. The heating section heats the chip simultaneously from above and below, ensuring uniform heating. The buffer section, working in conjunction with the upper pressing section, buffers pressure during pressing to prevent chip damage.
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