A charging module and a charging pile

Abstract

The application discloses a charging module and a charging pile, relates to the technical field of charging, and comprises heat dissipation shells and a heat dissipation air duct. The heat dissipation shells are multiple, and each heat dissipation shell comprises a mounting chamber. First electronic devices such as circuit boards, capacitors and inductors can be arranged in the mounting chamber to realize the charging and discharging function of the charging module. The heat dissipation air duct is formed by the mutual connection of the heat dissipation shells and is in communication with the outside, can be ventilated and heat-dissipated, and the heat-dissipating airflow in the heat dissipation air duct can directly exchange heat with the heat dissipation shells surrounding the heat dissipation air duct and indirectly exchange heat with the first electronic devices in each mounting chamber. The heat dissipation air duct and the mounting chambers of the heat dissipation shells are independently arranged, so that the heat-dissipating airflow is isolated from the mounting chambers of the heat dissipation shells, thereby ensuring the dustproof level of the first electronic devices in each mounting chamber, improving the reliability of the operation of the charging module, and reducing the maintenance frequency and maintenance cost of the charging module.

Description

Technical Field

[0001] This application relates to the field of charging technology, and more specifically, to a charging module and a charging pile. Background Technology

[0002] Currently, most charging piles use direct ventilation chambers for heat dissipation in their charging modules, which have a low protection rating, mostly around IP20. This makes it difficult to guarantee long-term use in harsh outdoor environments, resulting in a high failure rate. Therefore, improving the reliability of charging module operation has become a pressing technical problem for those skilled in the art. Utility Model Content

[0003] The purpose of this application is to provide a charging module to improve the reliability of charging module operation.

[0004] Another objective of this application is to provide a charging station that includes the above-mentioned charging module.

[0005] A charging module, comprising:

[0006] Multiple heat dissipation housings, each heat dissipation housing including a mounting chamber, wherein a first electronic device is disposed within the mounting chamber;

[0007] The heat dissipation duct is formed by connecting and collectively surrounding each of the heat dissipation shells. The heat dissipation duct is connected to the outside world and is independent of the mounting chambers of each of the heat dissipation shells.

[0008] Optionally, in the above-described charging module, the mounting chambers of each of the heat dissipation housings are independent of each other;

[0009] Alternatively, the mounting chambers of the two connected heat sink housings are connected.

[0010] Optionally, in the above-mentioned charging module, there are two heat dissipation housings, namely a first housing and a second housing, wherein the mounting chamber of the first housing is the first chamber and the mounting chamber of the second housing is the second chamber;

[0011] The second housing is connected to the first housing, and the heat dissipation duct is disposed between the first housing and the second housing, and the heat dissipation duct is independent of the first chamber and the second chamber.

[0012] Optionally, in the above-described charging module, the heat dissipation housing includes:

[0013] The housing body, the housing bodies of each of the heat dissipation housings are connected and together form the heat dissipation air duct;

[0014] A cover plate is connected to the housing body to form the mounting chamber, and the cover plate is disposed on the side of the housing body opposite to the heat dissipation duct.

[0015] Optionally, in the charging module described above, a first sealing element is provided at the connection position between the housing body and the cover plate.

[0016] Optionally, the charging module described above also includes a cooling fan, the air inlet or outlet of which is connected to the cooling duct.

[0017] Optionally, the charging module described above also includes a heat sink, which is disposed within the heat dissipation duct and connected to the heat dissipation housing, and the heat sink is in direct or indirect contact with the first electronic device.

[0018] Optionally, in the charging module described above, the first electronic devices in different mounting chambers are electrically connected by connecting cables, and the heat dissipation housing is provided with a clearance hole for the connecting cables to pass through. The connecting cables are connected to the clearance hole by a second sealing element.

[0019] Optionally, in the charging module described above, a second electronic device is provided inside the heat dissipation duct, and the second electronic device is electrically connected to the first electronic device.

[0020] A charging station includes the aforementioned charging module.

[0021] The charging module provided in this application includes a heat sink housing and a heat dissipation duct. Multiple heat sink housings are included, each containing a mounting chamber. Circuit boards, capacitors, inductors, and other first electronic components can be arranged within the mounting chamber to realize the charging and discharging function of the charging module. The heat dissipation duct is formed by the interconnected heat sink housings and is open to the outside environment, enabling ventilation and heat dissipation. The airflow within the heat dissipation duct can directly exchange heat with the heat sink housings surrounding it and indirectly exchange heat with the first electronic components within each mounting chamber. The heat dissipation duct and the mounting chambers of each heat sink housing are independently configured, isolating the airflow from the mounting chambers and ensuring the dustproof level of the first electronic components within each mounting chamber. Furthermore, the heat sink housing can reduce electromagnetic interference from the first electronic components to the surrounding environment.

[0022] Compared to related technologies, the charging module provided in this application has at least one surface of each heat dissipation shell in direct contact with the heat dissipation duct. Therefore, the first electronic components in each mounting cavity can be cooled by air through the heat dissipation shell, increasing the heat dissipation area and ensuring the heat dissipation effect of the first electronic components in each mounting cavity. At the same time, since the heat dissipation duct is independent of each mounting cavity, the first electronic components in each mounting cavity are isolated from the external environment and there is no risk of exposure. Therefore, the waterproof and dustproof rating of each mounting cavity can be ensured, improving the reliability of the charging module operation and reducing its maintenance frequency and cost. The distance between the first electronic components in the mounting cavity and the outer walls of the heat dissipation shell can be set to be smaller, resulting in lower thermal resistance. This allows the heat dissipation shell to be fully utilized to dissipate heat to the external environment, resulting in higher heat dissipation efficiency. At the same time, the size and total weight of the charging module are reduced, which helps to improve power density. Circuit boards and other electronic components can be installed in different heat dissipation shells, increasing the board area and reducing the difficulty of wiring. In addition, it has the advantages of simple structure, low cost, and long service life, and can be used normally in various harsh environments such as high temperature, dust, salt spray, and condensation.

[0023] The charging pile provided in this application includes the charging module mentioned above, so it also has the structure and beneficial effects described above. Other structures refer to the prior art and will not be described in detail here. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 Isometric view of the first type of charging module disclosed in the embodiments of this application Figure 1 ;

[0026] Figure 2 Isometric view of the first type of charging module disclosed in the embodiments of this application Figure 2 ;

[0027] Figure 3 This is a front view of the first charging module disclosed in the embodiments of this application;

[0028] Figure 4 This is a cross-sectional view of the first charging module disclosed in the embodiments of this application;

[0029] Figure 5 for Figure 4 A magnified view of the connection cable in the middle;

[0030] Figure 6 This is a schematic diagram of the structure of the third sealing element disclosed in the embodiments of this application;

[0031] Figure 7 This is a schematic diagram of the heat dissipation housing of the first type of charging module disclosed in the embodiments of this application;

[0032] Figure 8 This is a schematic diagram of the integrated structure of the first and second housings disclosed in the embodiments of this application. Figure 1 ;

[0033] Figure 9 This is a schematic diagram of the integrated structure of the first and second housings disclosed in the embodiments of this application. Figure 2 ;

[0034] Figure 10 This is a schematic diagram of the structure of the second charging module disclosed in the embodiments of this application;

[0035] Figure 11 This is a schematic diagram of the structure of the third charging module disclosed in the embodiments of this application;

[0036] Figure 12 This is a schematic diagram of the heat dissipation housing of the fourth type of charging module disclosed in the embodiments of this application;

[0037] Figure 13 This is a schematic diagram of the heat dissipation housing of the fifth type of charging module disclosed in the embodiments of this application.

[0038] Among them, 100 is the heat dissipation shell, 101 is the mounting chamber, 102 is the heat sink mounting hole, 103 is the positioning boss, 110 is the shell body, 120 is the cover plate, 130 is the first sealing element, 140 is the first cable, 141 is the copper terminal, 142 is the second cable, and 143 is the waterproof element.

[0039] 200 is for heat dissipation airflow;

[0040] 300 is the heatsink, and 310 is the cooling fan;

[0041] 400 is the second electronic device, 401 is the input terminal, 402 is the output terminal, and 403 is the first electronic device. Detailed Implementation

[0042] The core of this application is to disclose a charging module to improve the reliability of charging module operation.

[0043] Another key aspect of this application is the disclosure of a charging pile that includes the aforementioned charging module.

[0044] The embodiments will now be described with reference to the accompanying drawings. Furthermore, the embodiments shown below do not limit the scope of the utility model as described in the claims. Additionally, the complete composition represented by the embodiments below is not limited to what is necessary as the solution of the utility model as described in the claims. It should be noted that, for ease of description, only the parts relevant to the utility model are shown in the drawings. Unless otherwise specified, the embodiments and features described in this application can be combined with each other. In the description of this application, "a plurality of" means two or more.

[0045] Some related technologies employ independent air duct technology to meet the heat dissipation requirements of high-protection-level charging modules; however, this approach suffers from problems such as large size, high thermal resistance, and low heat dissipation efficiency. Therefore, this application discloses the following charging module.

[0046] Combination Figure 1 and Figure 3 The charging module disclosed in this application includes a heat dissipation housing 100 and a heat dissipation duct 200. There are multiple heat dissipation housings 100, and each heat dissipation housing 100 includes a mounting chamber 101. Circuit boards, capacitors, inductors and other first electronic devices 403 can be arranged in the mounting chamber 101 to realize the charging and discharging function of the charging module. The heat dissipation duct 200 is formed by the interconnection of the heat dissipation housings 100 and is connected to the outside world to ventilate and dissipate heat. The heat dissipation airflow in the heat dissipation duct 200 can directly exchange heat with the heat dissipation housings 100 that form the heat dissipation duct 200, and indirectly exchange heat with the first electronic devices 403 in each mounting chamber 101. The heat dissipation duct 200 and the mounting chamber 101 of each heat dissipation housing 100 are set independently, so that the heat dissipation airflow is isolated from the mounting chamber 101 of each heat dissipation housing 100, thereby ensuring the dustproof level of the first electronic device 403 in each mounting chamber 101, and the heat dissipation housing 100 can reduce the electromagnetic interference of the first electronic device 403 to the surrounding environment.

[0047] The dimensions of each heat sink 100 can be adaptively adjusted according to the type and size of the first electronic device 403 arranged in its own mounting chamber 101, so as to ensure that the first electronic device 403 in each mounting chamber 101 fits as closely as possible to the heat sink 100, thereby reducing thermal resistance during heat dissipation and improving heat dissipation efficiency.

[0048] Compared to related technologies, in the charging module disclosed in this application, each heat sink 100 has at least one surface in direct contact with the heat dissipation duct 200. Therefore, the first electronic device 403 in each mounting chamber 101 can be cooled by air through the heat sink 100, increasing the heat dissipation area and ensuring the heat dissipation effect of the first electronic device 403 in each mounting chamber 101. Simultaneously, since the heat dissipation duct 200 is independent of each mounting chamber 101, the first electronic device 403 in each mounting chamber 101 is isolated from the external environment and there is no risk of exposure. Therefore, the waterproof and dustproof rating of each mounting chamber 101 can be ensured, improving the operation of the charging module. This application improves reliability while reducing maintenance frequency and costs. The distance between the first electronic component 403 within the mounting chamber 101 and the outer walls of the heat sink 100 can be made smaller, resulting in lower thermal resistance. This allows the heat sink 100 to fully dissipate heat to the external environment, leading to higher heat dissipation efficiency. It also reduces the size and weight of the charging module, contributing to increased power density. Circuit boards and other electronic components can be installed within different heat sinks 100, increasing the board area and reducing wiring difficulty. Furthermore, it boasts advantages such as simple structure, low cost, and long service life, enabling normal operation in harsh environments such as high temperature, dust, salt spray, and condensation.

[0049] In some embodiments, the mounting chambers 101 of the two connected heat sink housings 100 can be interconnected to facilitate heat transfer between the different mounting chambers 101, ensuring temperature consistency across the charging module, preventing localized overheating, and optimizing heat dissipation. In other embodiments, the mounting chambers 101 of each heat sink housing 100 are independently configured, and different first electronic devices 403 are arranged within different mounting chambers 101, thereby effectively reducing circuit interference and electromagnetic interference between different first electronic devices 403. For example, AC (alternating current) / DC (direct current) converters and DC (direct current) / DC (direct current) converters can be placed in different mounting chambers 101 to improve electromagnetic compatibility.

[0050] Combination Figure 10 and Figure 11 The multiple heat sink housings 100 can be configured as an integral structure or a separate structure. When it is an integral structure, the multiple heat sink housings 100 can be manufactured by welding, injection molding, or other methods. When it is a separate structure, the different heat sink housings 100 can be connected by screwing, snap-fitting, plugging, or other methods. Correspondingly, positioning protrusions, positioning grooves, or other structures can be provided on the two interconnected heat sink housings 100 to achieve positioning and mating.

[0051] The charging module disclosed in this application ensures the heat dissipation of the first electronic device 403 within each mounting chamber 101 by arranging the mounting chamber 101 around the heat dissipation duct 200. Since the charging module is typically configured as a regular cubic structure and the heat dissipation duct 200 is usually a straight line, therefore, combined with... Figure 10 In some embodiments, the number of heat sink housings 100 can be four, forming a heat dissipation duct 200 with a rectangular cross-section, so that the first electronic device 403 in the mounting chamber 101 of each heat sink housing 100 can exchange heat with one side of the heat dissipation duct 200 in the circumferential direction, thus ensuring heat exchange efficiency.

[0052] In some embodiments disclosed in this application, combined with Figure 3 and Figure 9 There are two heat dissipation housings 100, defined as a first housing and a second housing. The mounting chamber 101 of the first housing is called the first chamber, and the mounting chamber 101 of the second housing is called the second chamber. Identical or different first electronic devices 403 can be arranged in the first and second housings. The second housing is arranged opposite to and connected to the first housing, and a heat dissipation duct 200 is located between the first and second housings. The heat dissipation duct 200 is independent of the first and second chambers to avoid affecting the normal operation of the electronic devices in the first and second chambers. Circuit boards can be arranged in both the first and second chambers, increasing the board area. Combined with... Figure 12 To facilitate the connection between the first and second housings and to enclose the heat dissipation duct 200, the cross-sections of the first and second housings can be U-shaped. The U-shaped openings of the first and second housings are arranged opposite to each other to form the heat dissipation duct 200. In this embodiment, the inner walls of the U-shaped structures of both the first and second housings directly exchange heat with the heat dissipation duct 200, ensuring the heat dissipation area of ​​each heat dissipation housing 100. Furthermore, combined with... Figure 13 The cross-sections of the first and second shells can also be L-shaped, which can also form a rectangular cross-section heat dissipation duct 200.

[0053] The types of first electronic devices 403 in different mounting chambers 101 can be adjusted according to actual conditions, and this application embodiment does not limit this. For example, an LLC (LLC Resonant Unit) unit can be set in the first chamber, and a PFC unit circuit board can be set in the second chamber; in addition, input terminals 401 and output terminals 402 are respectively set on the first housing and the second housing for current transmission.

[0054] Combination Figure 7The heat dissipation housing 100 may include a housing body 110 and a cover plate 120. The cover plate 120 is connected to the housing body 110 and is used to cover the housing body 110, forming an installation chamber 101 together with the housing body 110. The cover plate 120 is located on the side of the housing body 110 facing away from the heat dissipation duct 200 to facilitate the installation and removal of the first electronic device 403 in the installation chamber 101. Each housing body 110 is used to jointly form the heat dissipation duct 200 and install the first electronic device 403, ensuring that the first electronic device 403 is located close to the heat dissipation duct 200 to improve heat dissipation efficiency. The heat dissipation housing 100 disclosed in this application embodiment has a simple structure. To facilitate assembly, a positioning groove may be provided on one of the cover plate 120 and the housing body 110, and a positioning protrusion may be provided on the other, so that the positioning assembly of the housing body 110 and the cover plate 120 can be achieved through the insertion of the positioning groove and the positioning protrusion.

[0055] To ensure the protection level of the installation chamber 101, combined with Figure 4 and Figure 7 A first sealing element 130 is provided at the connection position between the housing body 110 and the cover plate 120 to seal the mounting chamber 101 and ensure the IP65 protection rating of each mounting chamber 101. For example, the first sealing element 130 can be a rubber gasket, waterproof rubber ring, etc., to further improve the waterproof and dustproof effect. The cover plate 120 and the housing body 110 can be fixed by screws, bolts, or other connectors, or connected by snap-fit, resulting in a simple structure and low cost. The connection between the cover plate 120 and the housing body 110 can press the first sealing element 130 tightly, ensuring the sealing effect of the first sealing element 130.

[0056] To improve heat dissipation, in some embodiments disclosed in this application, combined with Figure 2 The charging module also includes a cooling fan 310. The air inlet or outlet of the cooling fan 310 is connected to the cooling duct 200 to drive airflow within the cooling duct 200 through suction or exhaust, thereby improving heat dissipation efficiency. Specifically, the cooling fan 310 can be installed at the air inlet or outlet of the cooling duct 200 for easy disassembly and maintenance, or it can be installed inside the cooling duct 200 to avoid interference with other components of the charging pile. The cooling fan 310 and the cooling duct 200 can be fixed by screws, snap-fits, or other methods. Alternatively, the cooling fan 310 can be directly installed on other structures of the charging pile, as long as it can supply airflow into the cooling duct 200.

[0057] In some other embodiments disclosed in this application, the charging module further includes a heat sink 300, which is disposed within the heat dissipation duct 200 and connected to the heat dissipation housing 100 to improve the heat exchange efficiency between the heat dissipation housing 100 and the heat dissipation airflow within the heat dissipation duct 200. The heat sink 300 can be a finned heat sink, which increases the heat exchange area between the heat dissipation duct 200 and the heat dissipation airflow, thereby optimizing the heat dissipation effect. The heat sink 300 can also be a liquid-cooled heat sink, a semiconductor heat sink, etc. Those skilled in the art will understand that, compared to related technologies, the charging module disclosed in this application has higher heat dissipation efficiency. Therefore, under the same power consumption and heat dissipation conditions, the size of the heat sink 300 can be reduced. For example, the height of the heat dissipation fins can be reduced, the pitch of the heat dissipation fins can be reduced, and the thickness of the heat dissipation substrate can be reduced, thereby reducing the total weight of the heat sink 300 and the volume and total weight of the charging module, and increasing the power density. The heat sink 300 and the heat sink housing 100 can be connected in various ways, such as integrally formed by die casting or screwed together; the heat sink 300 and the first electronic device 403 in the mounting chamber 101 can directly contact each other for heat exchange or indirectly contact each other for heat exchange. For example, the heat sink 300 and the first electronic device 403 in the mounting chamber 101 can be separated by the housing body 110 and indirectly contact each other for heat exchange; or, combined with Figure 8 A heat sink mounting hole 102 is provided on the housing body 110, through which the heat sink 300 and the first electronic device 403 can directly contact each other for heat exchange. The aforementioned cooling fan 310 and heat sink 300 can be arranged together to improve heat dissipation efficiency.

[0058] The first electronic devices 403 in different mounting chambers 101 are electrically connected via connecting cables. Correspondingly, clearance holes are provided on the heat sink housing 100 for the connecting cables to pass through. To ensure the protection level of each mounting chamber 101, the connecting cables and clearance holes are sealed together by a second sealing element to ensure the airtightness of the mounting chamber 101 at the clearance holes. For example, the second sealing element can be a sealing ring. Alternatively, sealant, potting compound, or other materials can be used to directly seal the gap between the connecting cables and the clearance holes to prevent air leakage. For example, the first electronic device 403 located in the first chamber is defined as the first device, and the electronic device located in the second chamber is defined as the second device. Figure 5The connecting cables include a first cable 140 and a second cable 142. One end of the first cable 140 is connected to the first device, and the other end extends out of the first chamber through the clearance hole of the first housing and is provided with a copper terminal 141. One end of the second cable is connected to the second device, and the other end extends out of the second chamber through the clearance hole of the second housing and enters the heat dissipation duct 200 and is connected to the copper terminal 141. The aforementioned second sealing element is provided at the locations where the first cable 140 passes through the first housing and the second cable 142 passes through the second housing for sealing. In addition, to prevent leakage, combined with... Figure 5 and Figure 6 A waterproof component 143 is provided at the connection position between the second cable 142 and the copper terminal 141. The waterproof component 143 provides waterproof isolation for the connection position between the copper terminal 141 and the second cable 142.

[0059] To further optimize heat dissipation, the first electronic device 403 and the heat sink 100 can be connected via a thermally conductive medium. For example, the type of thermally conductive medium includes, but is not limited to, one or more of heat pipes, vapor chambers, and thermal interface materials. This application does not restrict the installation order of various thermally conductive media between the first electronic device 403 and the heat sink 100. Heat pipes and vapor chambers both have good thermal conductivity. The thermal interface material can fill the space between the first electronic device 403 and the heat sink 100, reducing heat transfer resistance, improving thermal conductivity, reducing the size of the charging module, and increasing power density. In other embodiments, the first electronic device 403 can be directly encapsulated within the mounting chamber 101 using a thermally conductive material, thereby ensuring both heat dissipation and insulation performance.

[0060] In some embodiments, combined with Figure 10 To improve space utilization, a second electronic device 400 is installed within the heat dissipation duct 200. The second electronic device 400 is electrically connected to the first electronic device 403. This embodiment of the application improves the space utilization of the charging module and enhances heat dissipation by directly arranging the second electronic device 400 within the heat dissipation duct 200. For example, the second electronic device 400 can be a device with a high self-protection level, such as a potted inductor or transformer, which has a protective shell and a potting compound layer formed by potting insulating material, making it less susceptible to external environmental influences. Furthermore, in conjunction with… Figure 1 and Figure 9 A positioning boss 103 can be provided on the heat sink housing 100 to limit the installation position of the second electronic device 400 and the heat sink 300. The structure is simple and the assembly is convenient.

[0061] The charging pile disclosed in this application includes the charging module described above, and therefore also has the structure and beneficial effects described above. Other structures refer to the prior art, and will not be described in detail here.

[0062] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order, and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units may include steps or units not listed, but rather steps or units not listed. Additionally, in the description of embodiments in this application, "a plurality of" means two or more.

[0063] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Specific technical means in some embodiments may be incorporated, in whole or in part, into another embodiment unless explicitly excluded by another embodiment. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A charging module, characterized by, include: Multiple heat dissipation housings (100), each heat dissipation housing (100) including a mounting chamber (101), wherein a first electronic device (403) is disposed within the mounting chamber (101); The heat dissipation duct (200) is formed by connecting and collectively surrounding each of the heat dissipation housings (100). The heat dissipation duct (200) is connected to the outside world and is independent of the mounting chambers (101) of each of the heat dissipation housings (100).

2. The charging module of claim 1, wherein, The mounting chambers (101) of each of the aforementioned heat dissipation housings (100) are independent of each other; Alternatively, the mounting chambers (101) of the two connected heat sink housings (100) are connected.

3. The charging module of claim 1, wherein, There are two heat dissipation housings (100), namely a first housing and a second housing, the mounting chamber (101) of the first housing is the first chamber, and the mounting chamber (101) of the second housing is the second chamber; The second housing is connected to the first housing, and the heat dissipation duct (200) is disposed between the first housing and the second housing, and the heat dissipation duct (200) is independent of the first chamber and the second chamber.

4. The charging module of claim 1, wherein, The heat sink (100) includes: The housing body (110) and the housing bodies (110) of each of the heat dissipation housings (100) are connected and together form the heat dissipation duct (200). A cover plate (120) is connected to the housing body (110) to form the mounting chamber (101), and the cover plate (120) is disposed on the side of the housing body (110) facing away from the heat dissipation duct (200).

5. The charging module of claim 4, wherein, A first sealing element (130) is provided at the connection position between the housing body (110) and the cover plate (120).

6. The charging module of any one of claims 1-5, wherein, It also includes a cooling fan (310), the air inlet or air outlet of which is connected to the cooling duct (200).

7. The charging module of any one of claims 1-5, wherein, It also includes a heat sink (300), which is disposed in the heat dissipation duct (200) and connected to the heat dissipation housing (100), and the heat sink (300) is in direct or indirect contact with the first electronic device (403).

8. The charging module of any one of claims 1-5, wherein, The first electronic device (403) in different installation chambers (101) is electrically connected by a connecting cable. The heat dissipation housing (100) is provided with a clearance hole for the connecting cable to pass through. The connecting cable is connected to the clearance hole by a second sealing element.

9. The charging module of any one of claims 1-5, wherein, A second electronic device (400) is provided inside the heat dissipation duct (200), and the second electronic device (400) is electrically connected to the first electronic device (403).

10. A charging post, characterized in that, Includes the charging module as described in any one of claims 1-9.

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