A semiconductor vision inspection light source based on dual-band polarization coordination

Abstract

This invention discloses a semiconductor visual inspection light source based on dual-band polarization coordination, comprising a fixed plate, a first light source plate mounted at one end of the fixed plate, a blue light source component mounted on the first light source plate, a first optical plate mounted at one end of the first light source plate, a diffuse optical component mounted on the first optical plate, a middle partition plate mounted at one end of the middle partition plate, a second light source plate mounted at one end of the middle partition plate, a red light source component mounted on the second light source plate, and a second optical plate mounted at one end of the second light source plate, a polarization optical component mounted on the second optical plate. Observation windows are provided through the fixed plate, the first light source plate, the first optical plate, the middle partition plate, the second light source plate, and the second optical plate. It achieves dual-band polarization coordination through the combination of a blue light source component and a diffuse optical component, and a red light source component and a polarization optical component, effectively avoiding crosstalk between the two light sources and simultaneously realizing surface imaging, subsurface structure imaging, and strong metal reflection suppression.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor visual inspection light sources, and in particular to a semiconductor visual inspection light source based on dual-band polarization coordination. Background Technology

[0002] As semiconductor manufacturing processes advance towards the micro-nano scale, the detection of defects in semiconductors such as wafers and chips faces enormous challenges. Defects such as surface contaminants (e.g., particles, fingerprints), micro-scratches, metal layer defects, uneven film thickness, and subsurface cracks (subsurface refers to the area within an extremely thin depth range below the surface of the material) need to be identified with high precision, high efficiency, and without omission. This places extremely high demands on the illumination technology of visual inspection systems.

[0003] The current limitations of semiconductor vision inspection light sources are as follows:

[0004] 1. Semiconductor vision inspection light sources have the limitation of being used for only one purpose:

[0005] Traditional monochromatic light sources, such as white LED ring lights, cannot meet the detection requirements of surface morphology and subsurface structure. Therefore, white LED ring lights are rarely used in semiconductor vision inspection.

[0006] Traditional monochromatic light sources, such as blue light, are sensitive to surface morphology but have weak penetration, thus making it difficult to detect subsurface structures.

[0007] Traditional monochromatic light sources, such as red light, have good penetration but are not obvious for fine scratches on the surface and have low contrast, so they have the defect of being difficult to detect surface morphology.

[0008] 2. Semiconductor vision inspection light sources have the defect of semiconductor metal reflection interference: The high reflectivity of semiconductor metal wires / pads can cause image overexposure (specular reflection), which can cover up critical defects;

[0009] 3. Although adding a diffuser and polarizer to a semiconductor vision inspection light source can solve the above-mentioned defects of semiconductor metal reflection interference, it cannot simultaneously detect defects in surface morphology and subsurface structure.

[0010] In summary, considering the three shortcomings mentioned above, a light source system capable of surface imaging, subsurface structure imaging, and strong metal reflection suppression is needed to improve the comprehensiveness and accuracy of semiconductor defect detection. Utility Model Content

[0011] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a semiconductor visual inspection light source based on dual-band polarization coordination, which can realize surface imaging, sub-surface structure imaging and strong metal reflection suppression, thereby improving the comprehensiveness and accuracy of semiconductor visual inspection.

[0012] To achieve the above objectives, this utility model provides a semiconductor visual inspection light source based on dual-band polarization coordination, comprising a fixed plate, a first light source plate mounted on one end of the fixed plate, a blue light source component mounted on the first light source plate, a first optical plate mounted on one end of the first light source plate, a diffuse optical component mounted on the first optical plate, a middle partition plate mounted on one end of the middle partition plate, a second light source plate mounted on the second light source plate, a red light source component mounted on the second light source plate, a second optical plate mounted on one end of the second light source plate, and a polarization optical component mounted on the second optical plate. Observation windows are provided through the fixed plate, the first light source plate, the first optical plate, the middle partition plate, the second light source plate, and the second optical plate.

[0013] Preferably, mounting holes are provided at the four corners of the fixing plate, the first light source plate, the first optical plate, the middle partition plate, the second light source plate, and the second optical plate. The mounting holes of the fixing plate, the first light source plate, the first optical plate, the middle partition plate, the second light source plate, and the second optical plate are fixed by long screws and nuts.

[0014] Preferably, the edge of one end of the observation window of the fixed plate is provided with a first annular chamfer.

[0015] Preferably, the blue light source assembly includes a plurality of blue LED beads and a first power supply unit electrically connected to the blue LED beads. The plurality of blue LED beads are arranged around one end of the observation window of the first light source plate, and the first power supply unit is mounted on the first light source plate.

[0016] Preferably, the blue light source assembly further includes a first power line electrically connected to the first power supply unit, the first power line being externally connected to the bottom of the first optical plate.

[0017] Preferably, the diffuse optical component includes a diffuse plate and a diffuse top block. The diffuse plate is mounted on a first optical plate, and the observation window of the first optical plate is opened on the diffuse plate. The first optical plate has a first placement groove for the blue light source component to be placed at the end near the blue light source component. The diffuse top block is respectively inserted into the observation window of the first light source plate and the observation window of the diffuse plate.

[0018] Preferably, the edge of one end of the observation window of the intermediate partition is provided with a second annular chamfer.

[0019] Preferably, the red light source assembly includes a plurality of red LED beads and a second power supply unit electrically connected to the red LED beads. The plurality of red LED beads are arranged around one end of the observation window of the second light source plate, and the second power supply unit is mounted on the second light source plate.

[0020] Preferably, the red light source assembly further includes a second power line electrically connected to the second power supply unit, the second power line being externally connected to the bottom of the second optical plate.

[0021] Preferably, the polarizing optical component includes a polarizing plate and a polarizing top block. The polarizing plate is mounted on a second optical plate, and the observation window of the second optical plate is opened on the polarizing plate. The second optical plate has a second placement groove for the red light source component to be placed at one end. The diffusing top block is inserted into the observation window of the second light source plate and the observation window of the polarizing plate, respectively.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] 1. This utility model has the following features:

[0024] The first layer of the light source structure is: fixed plate → first light source plate → blue light source assembly → first optical plate → diffuse optical assembly, thereby realizing high-precision imaging and detection of semiconductor surface. The diffuse optical assembly ensures uniform blue light source and can provide high-precision imaging of semiconductor surface with high uniformity.

[0025] The second-layer light source structure consists of: a middle partition plate → a second light source plate → a red light source assembly → a second optical plate → a diffuse optical assembly, thereby achieving high-precision imaging and detection of the semiconductor subsurface and suppressing strong metal reflections.

[0026] 2. In summary, the semiconductor visual inspection light source based on dual-band polarization coordination of this utility model achieves dual-band polarization coordination through the above-mentioned first-layer light source structure + second-layer light source structure, effectively avoiding crosstalk between the two light sources, and simultaneously realizing surface imaging, imaging of subsurface structures, and suppression of strong metal reflections. It has high detection efficiency, high detection accuracy, and more comprehensive detection. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is an exploded structural diagram of a semiconductor vision inspection light source based on dual-band polarization coordination provided by this utility model;

[0029] Figure 2This is a front cross-sectional view of a semiconductor vision inspection light source based on dual-band polarization coordination provided by this utility model;

[0030] Figure 3 This is an exploded structural diagram of the first light source board, blue light source assembly, first optical board, and diffuse optical assembly provided by this utility model from one perspective.

[0031] Figure 4 This is an exploded structural diagram from another perspective of the first light source board, blue light source assembly, first optical board, and diffuse optical assembly provided by this utility model;

[0032] Figure 5 This is an exploded structural diagram of the second light source plate, red light source assembly, second optical plate, and polarization optical assembly provided by this utility model from one perspective.

[0033] Figure 6 This is an exploded structural diagram of the second light source plate, red light source assembly, second optical plate, and polarization optical assembly provided by this utility model from another perspective.

[0034] The diagram includes:

[0035] 1. Fixing plate; 100. Observation window; 11. First annular chamfer; 110. Mounting hole; 120. Long screw; 2. First light source plate; 20. Blue light source assembly; 201. Blue LED bead; 202. First power supply unit; 203. First power cord; 3. First optical plate; 30. Diffusing optical assembly; 301. Diffusing plate; 302. Diffusing top block; 31. First placement groove; 4. Middle partition plate; 41. Second annular chamfer; 5. Second light source plate; 50. Red light source assembly; 501. Red LED bead; 502. Second power supply unit; 503. Second power cord; 6. Second optical plate; 60. Polarizing optical assembly; 601. Polarizing plate; 602. Polarizing top block; 61. Second placement groove. Detailed Implementation

[0036] The technical solution of this embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiment is one embodiment of the present invention, and not all embodiments thereof. Based on this embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Please see Figures 1 to 6This utility model provides a semiconductor visual inspection light source based on dual-band polarization coordination, including a fixed plate 1, a first light source plate 2 mounted on one end of the fixed plate 1, a blue light source component 20 mounted on the first light source plate 2, a first optical plate 3 mounted on one end of the first light source plate 2, a diffuse optical component 30 mounted on the first optical plate 3, a middle partition plate 4 mounted on one end of the middle partition plate 4, a second light source plate 5 mounted on the second light source plate 5, a red light source component 50 mounted on the second light source plate 5, and a second optical plate 6 mounted on one end of the second light source plate 5, a polarization optical component 60 mounted on the second optical plate 6. Observation windows 100 are connected through the fixed plate 1, the first light source plate 2, the first optical plate 3, the middle partition plate 4, the second light source plate 5, and the second optical plate 6.

[0038] Mounting holes 110 are provided at the four corners of the fixing plate 1, the first light source plate 2, the first optical plate 3, the middle partition plate 4, the second light source plate 5, and the second optical plate 6. The mounting holes 110 of the fixing plate 1, the first light source plate 2, the first optical plate 3, the middle partition plate 4, the second light source plate 5, and the second optical plate 6 are fixed by long screws 120 and nuts (not shown in the attached drawings).

[0039] In this process, the long screw 120 is passed through the mounting holes 110 of the fixing plate 1, the first light source plate 2, the first optical plate 3, the intermediate partition plate 4, the second light source plate 5, and the second optical plate 6 in sequence, and then the nut is tightened on one end of the long screw 120 to achieve fixation.

[0040] The observation window 100 of the fixed plate 1 has a first annular chamfer 11 at one end of its edge. The first annular chamfer 11 helps the imaging mechanism avoid astigmatic interference and improve the image signal-to-noise ratio during shooting.

[0041] The blue light source assembly 20 includes a plurality of blue LED beads 201 and a first power supply unit 202 electrically connected to the blue LED beads 201. The plurality of blue LED beads 201 are arranged around one end of the observation window 100 of the first light source plate 2, and the first power supply unit 202 is mounted on the first light source plate 2.

[0042] The blue light source assembly 20 also includes a first power line 203 electrically connected to the first power supply unit 202, and the first power line 203 is externally connected to the bottom of the first optical plate 3.

[0043] The diffuse optical component 30 includes a diffuser plate 301 and a diffuser top block 302. The diffuser plate 301 is mounted on the first optical plate 3. The observation window 100 of the first optical plate 3 is opened on the diffuser plate 301. The first optical plate 3 has a first placement groove 31 for the blue light source component 20 to be placed at the end near the blue light source component 20. The diffuser top block 302 is inserted into the observation window 100 of the first light source plate 2 and the observation window 100 of the diffuser plate 301 respectively. The diffuser top block 302 and the diffuser plate 301 ensure that the blue light of the blue light source component 20 is uniformly diffused and directed to the observation window 100 of the diffuser plate 301, avoiding the blue light from being reflected onto the imaging mechanism or the semiconductor to be tested without being diffused.

[0044] The observation window 100 of the intermediate partition 4 has a second annular chamfer 41 at one end. The second annular chamfer 41 helps to prevent the diffuse blue light emitted by the blue light source assembly 20 from being interfered with by the returning astigmatism and improves the image signal-to-noise ratio.

[0045] The red light source assembly 50 includes several red LED beads 501 and a second power supply unit 502 electrically connected to the red LED beads 501. The several red LED beads 501 are arranged around one end of the observation window 100 of the second light source plate 5, and the second power supply unit 502 is mounted on the second light source plate 5.

[0046] The red light source assembly 50 also includes a second power line 503 electrically connected to the second power supply unit 502, and the second power line 503 is externally connected to the bottom of the second optical plate 6.

[0047] The polarization optical component 60 includes a polarizing plate 601 and a polarizing top block 602. The polarizing plate 601 is mounted on the second optical plate 6, and the observation window 100 of the second optical plate 6 is opened on the polarizing plate 601. The second optical plate 6 has a second placement groove 61 for the red light source component 50 to be placed at the end near the red light source component 50. The polarizing top block 602 is respectively inserted into the observation window 100 of the second light source plate 5 and the observation window 100 of the polarizing plate 601. The polarizing top block 602 and the polarizing plate 601 ensure that the red light from the red light source component 50 is uniformly polarized and guided to the observation window 100 of the polarizing plate 601, thus preventing the red light from being reflected onto the imaging mechanism or the semiconductor to be tested without polarization.

[0048] An embodiment of this utility model provides a semiconductor visual inspection light source based on dual-band polarization coordination. One operating mode involves placing the semiconductor visual inspection light source vertically, with a fixing plate 1 at the top and a second optical plate 6 at the bottom. An imaging mechanism is placed directly above the observation window 100 of the fixing plate 1, and a semiconductor to be inspected is placed directly below the observation window 100 of the second optical plate 6.

[0049] When performing surface inspection on a semiconductor, the electrical signal of the first power line 203 can be controlled independently to control the blue light source component 20 to emit blue light of a certain intensity. The blue light is then diffused through the first light source plate 2 → blue light source component 20 → first optical plate 3 → diffuse optical component 30 to form uniform blue light diffused light, which finally shines onto the semiconductor through the observation window 100.

[0050] When performing subsurface detection on a semiconductor, the electrical signal of the second power line 503 can be controlled independently to control the red light source component 50 to emit red light of a certain intensity. The red light is then transmitted through the second light source plate 5 → red light source component 50 → second optical plate 6 → polarization optical component 60 to form uniform red polarized light, which finally shines onto the semiconductor through the observation window 100.

[0051] When performing surface and subsurface inspection on a semiconductor, the electrical signals of the first power line 203 and the second power line 503 can be controlled simultaneously, thereby controlling the blue light source component 20 to emit blue light of a certain intensity and the red light source component 50 to emit red light of a certain intensity. The blue and red light, with dual-band polarization, pass through the observation window 100 and illuminate the semiconductor.

[0052] The technical advantages of a semiconductor vision inspection light source based on dual-band polarization coordination according to an embodiment of this utility model are as follows:

[0053] The first-layer light source structure is: fixed plate 1 → first light source plate 2 → blue light source component 20 → first optical plate 3 → diffuse optical component 30, thereby achieving high-precision imaging and detection of the semiconductor surface. The diffuse optical component 30 ensures uniform blue light source and can provide highly uniform high-precision imaging of the semiconductor surface.

[0054] The second-layer light source structure, consisting of a middle partition 4, a second light source board 5, a red light source assembly 50, a second optical board 6, and a diffuse optical assembly 30, enables high-precision imaging and detection of semiconductor subsurface surfaces and suppresses strong metal reflections.

[0055] By using the first-layer light source structure plus the second-layer light source structure, dual-band polarization coordinated operation is achieved, effectively avoiding crosstalk between the two light sources. This enables simultaneous surface imaging, subsurface structure imaging, and suppression of strong metal reflections, resulting in higher detection efficiency, higher detection accuracy, and more comprehensive detection.

[0056] The more specific technical application advantages of the semiconductor vision inspection light source based on dual-band polarization coordination of this utility model are as follows:

[0057] Existing semiconductor vision inspection light sources have the drawbacks of single light source application, while the simple combination of multiple light sources has the disadvantages of low light source switching efficiency, complex structure and installation, high debugging cost, and easy to cause dual-band optical crosstalk, resulting in image signal-to-noise ratio problems.

[0058] Therefore, the embodiment of this utility model of a semiconductor visual inspection light source based on dual-band polarization coordination simultaneously achieves the technical effects of high uniformity surface imaging, strong metal reflection suppression, subsurface structure visualization, dual-band polarization coordination, dual-band light non-crosstalk, compact structure layout, and easy integration and installation.

[0059] Specifically:

[0060] 1. Achieved dual-band synergistic effect: Through the independent layered control of the upper blue diffuse light source (wavelength 450-470nm) and the lower red polarized light source (wavelength 630-660nm), the following was achieved:

[0061] 1. Simultaneous detection of surface and subsurface defects:

[0062] The blue light diffuse layer improves the sensitivity to surface particles and scratches by ≥40% (compared to single red light);

[0063] The red polarization layer improves the detection rate of cracks under the metal layer by ≥35% (compared to blue light alone).

[0064] 2. Features polarization-based anti-glare technology: The lower-layer red light source, combined with an orthogonal linear polarization design (light source polarizer (i.e., polarization optical component 60) + camera analyzer (i.e., a camera analyzer is installed on the shooting mechanism)), achieves:

[0065] 1. The specular reflection suppression rate in the metal area is >95%, eliminating overexposure.

[0066] 2. Subsurface scattering signal enhancement: Improves the contrast of invisible defects such as thin film bubbles and silicon-based microcracks by ≥50%.

[0067] 3. Enhanced optical path design: Vertical spatial arrangement of diffuser plate 301 (upper layer) and polarizer plate (lower layer):

[0068] 1. Avoid crosstalk between two light sources, improving the signal-to-noise ratio (SNR) by ≥20%;

[0069] 2. Supports fast switching between single and dual light sources (<10ms), compatible with bright field / polarization imaging modes, improving detection efficiency by 30%.

[0070] 4. Structural layout optimization: Integrated layered modular design:

[0071] (1) Thickness reduced by 40% (compared to split light source), suitable for compact semiconductor testing equipment;

[0072] (2) No need to adjust the optical path, reducing installation and debugging time by 60%.

[0073] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A semiconductor visual inspection light source based on dual-band polarization synergy, characterized in that, The system includes a fixed plate (1), a first light source plate (2) mounted on one end of the fixed plate (1), a blue light source component (20) mounted on the first light source plate (2), a first optical plate (3) mounted on one end of the first light source plate (2), a diffuse optical component (30) mounted on the first optical plate (3), a middle partition plate (4) mounted on one end of the first optical plate (3), a second light source plate (5) mounted on one end of the middle partition plate (4), a red light source component (50) mounted on the second light source plate (5), a second optical plate (6) mounted on one end of the second light source plate (5), and a polarization optical component (60) mounted on the second optical plate (6). The fixed plate (1), the first light source plate (2), the first optical plate (3), the middle partition plate (4), the second light source plate (5), and the second optical plate (6) are all connected by an observation window (100). 2.The dual-band polarization synergy based semiconductor visual inspection light source of claim 1, wherein Mounting holes (110) are provided at the four corners of the fixed plate (1), the first light source plate (2), the first optical plate (3), the middle partition plate (4), the second light source plate (5), and the second optical plate (6). The mounting holes (110) of the fixed plate (1), the first light source plate (2), the first optical plate (3), the middle partition plate (4), the second light source plate (5), and the second optical plate (6) are fixed by long screws (120) and nuts. 3.The dual-band polarization synergy based semiconductor visual inspection light source of claim 1, wherein The edge of one end of the observation window (100) of the fixed plate (1) is provided with a first annular chamfer (11). 4.The dual-band polarization synergy based semiconductor visual inspection light source of claim 1, wherein, The blue light source assembly (20) includes a plurality of blue LED beads (201) and a first power supply unit (202) electrically connected to the blue LED beads (201). The plurality of blue LED beads (201) are arranged around one end of the observation window (100) of the first light source plate (2), and the first power supply unit (202) is mounted on the first light source plate (2).

5. The dual-band polarization synergy based semiconductor visual inspection light source of claim 4, wherein, The blue light source assembly (20) also includes a first power line (203) electrically connected to the first power supply unit (202), and the first power line (203) is externally connected to the bottom of the first optical plate (3). 6.The dual-band polarization synergy based semiconductor visual inspection light source of claim 1, wherein, The diffuse optical component (30) includes a diffuse plate (301) and a diffuse top block (302). The diffuse plate (301) is mounted on a first optical plate (3). The observation window (100) of the first optical plate (3) is opened on the diffuse plate (301). The first optical plate (3) has a first placement groove (31) for the blue light source component (20) to be placed at one end near the blue light source component (20). The diffuse top block (302) is respectively inserted into the observation window (100) of the first light source plate (2) and the observation window (100) of the diffuse plate (301). 7.The dual-band polarization synergy based semiconductor visual inspection light source of claim 1, wherein, The observation window (100) of the intermediate partition (4) has a second annular chamfer (41) at one end.

8. A semiconductor visual inspection light source based on dual-band polarization coordination according to claim 1, characterized in that, The red light source assembly (50) includes a plurality of red LED beads (501) and a second power supply unit (502) electrically connected to the red LED beads (501). The plurality of red LED beads (501) are arranged around one end of the observation window (100) of the second light source plate (5), and the second power supply unit (502) is mounted on the second light source plate (5).

9. The dual-band polarization synergy based semiconductor visual inspection light source of claim 8, wherein, The red light source assembly (50) also includes a second power line (503) electrically connected to the second power supply unit (502), and the second power line (503) is externally connected to the bottom of the second optical plate (6).

10. The dual-band polarization synergy based semiconductor visual inspection light source of claim 1, wherein, The polarization optical component (60) includes a polarizing plate (601) and a polarizing top block (602). The polarizing plate (601) is mounted on a second optical plate (6). The observation window (100) of the second optical plate (6) is opened on the polarizing plate (601). The second optical plate (6) has a second placement groove (61) for the red light source component (50) to be placed at one end near the red light source component (50). The polarizing top block (602) is respectively inserted into the observation window (100) of the second light source plate (5) and the observation window (100) of the polarizing plate (601).

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