Semiconductor factory external line voltage drop anti-jamming device

Abstract

This utility model discloses an external voltage drop interference suppression device for semiconductor factories. The technical solution includes: an equipment box and a three-position selector switch. A voltage drop monitoring component is installed near the top center of the front surface of the equipment box. The three-position selector switch is installed near the bottom side of the front surface of the equipment box. An alarm button is installed near the three-position selector switch on the front surface. A connecting harness is installed on one side of the equipment box, and an alarm is installed at the end of the connecting harness. The connecting harness, alarm, alarm button, three-position selector switch, and voltage drop monitoring component are electrically connected. This external voltage drop interference suppression device for semiconductor factories solves the problems of existing voltage drop monitoring components requiring manual removal during maintenance and testing, the potential for accidental triggering of a factory-wide broadcast alarm during wiring, and wiring errors preventing alarm triggering. It reduces the probability of accidental broadcast alarms, thereby ensuring the normal operation of semiconductor equipment.

Description

Technical Field

[0001] This utility model relates to the field of voltage monitoring technology in semiconductor factories, specifically to an anti-interference device for external voltage drop in semiconductor factories. Background Technology

[0002] Semiconductor factory equipment has extremely high requirements for the stability of the power system. Production equipment needs to work 24 hours a day. Unstable power supply will cause abnormal operation of clean rooms, lithography machines and auxiliary equipment. Voltage sag events can cause direct economic losses of more than 100 million yuan for a single shutdown. Secondly, the harmonics generated by the frequency conversion drive equipment may cause the laser frequency of the lithography machine to shift, resulting in a decrease in the positioning accuracy of the exposure pattern.

[0003] Existing voltage drop monitoring components require manual removal during maintenance and testing. The wiring process may accidentally trigger a plant-wide broadcast alarm, and wiring errors are prone to occur, resulting in the inability to trigger the alarm. To address this, we propose an external voltage drop interference suppression device for semiconductor factories. Utility Model Content

[0004] The purpose of this utility model is to provide an anti-interference device for external voltage drop in semiconductor factories, which has the effect of avoiding false alarms. This solves the problems of existing voltage drop monitoring components requiring manual removal during maintenance and testing, the possibility of accidentally triggering a factory-wide broadcast alarm during wiring, and the ease with which wiring errors can lead to the inability to trigger the alarm.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an external voltage drop anti-interference device for a semiconductor factory, comprising an equipment box and a three-position selector switch, wherein a voltage drop monitoring component is installed on the front surface of the equipment box near the top center, a three-position selector switch is installed on the front surface of the equipment box near the bottom side, an alarm button is installed on the front surface of the equipment box near the three-position selector switch, a connecting harness is installed on one side of the equipment box, and an alarm is installed at the end of the connecting harness.

[0006] Preferably, the connecting harness, alarm, alarm button, three-position selector switch, and voltage drop monitoring component are electrically connected.

[0007] Preferably, the equipment box has a shielding chamber near its outer surface, and the shielding chamber has a shielding layer inside.

[0008] Preferably, a cooling box is installed at the bottom of the equipment box, a water tank is installed at the bottom inside the cooling box, and cooling pipes are installed on both sides of the water tank, with the cooling pipes located at the bottom inside the equipment box.

[0009] Preferably, a circulating pump is installed in the middle of the cooling pipe, heat exchange fins A are installed on the outer surface of the cooling pipe inside the equipment box, and heat exchange fins B are installed on both sides of the outer surface of the cooling pipe inside the cooling box.

[0010] Preferably, the cooling box has ventilation holes on both sides, and a radiator is installed inside the cooling box at the location of the ventilation hole.

[0011] Preferably, a connector is provided on one side of the equipment box at the location of the connecting wire harness, an inner thread is provided in the middle of the connecting wire harness, a shielding foil is provided on the outer surface of the inner thread inside the connecting wire harness, a nylon sleeve is provided on the outer surface of the shielding foil inside the connecting wire harness, and a protective spring is installed inside the nylon sleeve near the outer surface.

[0012] Preferably, a temperature sensor is installed on one side inside the equipment box.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model achieves the effect of avoiding accidental alarms by setting up an equipment box, an alarm, an alarm button and a three-position selector switch. It solves the problem that existing voltage drop monitoring components need to be manually removed during maintenance and testing, and may accidentally trigger the whole plant broadcast alarm during wiring. In addition, wiring errors are easy to occur during wiring, which may lead to the failure to trigger the alarm. It reduces the probability of accidental alarms during broadcast, thereby ensuring the normal operation of semiconductor equipment.

[0015] 2. This utility model achieves the effect of cooling the inside of the equipment box by setting up a cooling box, cooling pipe, water tank, temperature sensor and radiator, so as to solve the problem that the internal temperature of the existing equipment box is too high and cannot be cooled in time, resulting in the internal temperature of the equipment box rising and affecting the service life of the voltage drop monitoring mechanism. It reduces the operating temperature of the voltage drop monitoring mechanism, thereby improving the service life of the voltage drop monitoring mechanism.

[0016] 3. This utility model achieves the effect of shielding electromagnetic interference by setting up a shielding chamber, a shielding layer, and shielding tin foil. This solves the problem that existing power electromagnetic interference is strong and easily leads to false alarms by voltage drop monitoring mechanisms, affecting the normal operation of semiconductor equipment. It improves the operating effect of voltage drop monitoring mechanisms and thus ensures the normal operation of semiconductor equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0018] Figure 2 This is a connection diagram of the three-position selector switch in this utility model;

[0019] Figure 3 This is a cross-sectional view of the equipment box of this utility model;

[0020] Figure 4 for Figure 3 A magnified structural diagram of A;

[0021] Figure 5 for Figure 3 A magnified structural diagram of B in the diagram;

[0022] Figure 6 This is a partial cross-sectional view of the connecting wire harness of this utility model.

[0023] Attached reference numerals: 1. Equipment box; 2. Three-position selector switch; 3. Alarm button; 4. Connector; 5. Alarm; 6. Wiring harness; 7. Voltage drop monitoring component; 8. Cooling box; 9. Cooling pipe; 10. Circulating pump; 11. Water tank; 12. Heat exchanger A; 13. Shielding chamber; 14. Shielding layer; 15. Temperature sensor; 16. Vent; 17. Radiator; 18. Heat exchanger B; 19. Nylon sleeve; 20. Shielding foil; 21. Inner thread; 22. Protective spring. Detailed Implementation

[0024] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0025] Example 1

[0026] like Figure 1-6 As shown, to achieve the above objectives, this utility model provides the following technical solution: a semiconductor factory external voltage drop anti-interference device, including an equipment box 1 and a three-position changeover switch 2. The three-position changeover switch 2 adopts an LW26 series universal changeover switch. A voltage drop monitoring component 7 is installed on the front surface of the equipment box 1 near the top center. The three-position changeover switch 2 is installed on the front surface of the equipment box 1 near the bottom side. An alarm button 3 is installed on the front surface near the three-position changeover switch 2. A connecting harness 6 is installed on one side of the equipment box 1. An alarm 5 is installed at the end of the connecting harness 6. The connecting harness 6, the alarm 5, the alarm button 3, the three-position changeover switch 2, and the voltage drop monitoring component 7 are electrically connected.

[0027] like Figure 1 and Figure 6 As shown, a connector 4 is provided on one side of the equipment box 1 at the location of the connecting wire harness 6. An inner thread 21 is provided in the middle of the connecting wire harness 6. Shielding foil 20 is provided on the outer surface of the inner thread 21 inside the connecting wire harness 6. A nylon sleeve 19 is provided on the outer surface of the shielding foil 20 inside the connecting wire harness 6. A protective spring 22 is installed inside the nylon sleeve 19 near the outer surface. The protective spring 22 protects the connecting wire harness 6. A shielding chamber 13 is provided inside the equipment box 1 near the outer surface. A shielding layer 14 is provided inside the shielding chamber 13. The shielding layer 14 protects the inside of the equipment box 1.

[0028] The working principle of the semiconductor factory external voltage drop anti-interference device based on Embodiment 1 is as follows: After the device is installed, during normal operation, the three-position selector switch 2 is switched to the automatic position. At this time, points ③ and ④ inside the three-position selector switch 2 remain conductive, while points ① and ② are not conductive. The voltage drop monitoring component 7 monitors the circuit voltage. When the voltage drop monitoring component 7 detects a voltage drop, the internal switch of the voltage drop monitoring component 7 automatically closes, connecting circuit B. The closing signal is transmitted to the alarm 5 through the connecting harness 6. The alarm 5 receives the closing signal and immediately sounds an alarm. During maintenance or testing of the voltage drop monitoring component 7, the three-position selector switch 2 is switched to the shielded position. At this time, points ③ and ④ inside the three-position selector switch 2 are not conductive, as are points ① and ②, thus breaking the circuit of the connecting harness 6. Even if the voltage drop monitoring component 7 detects a voltage drop, the signal will not be transmitted to the alarm 5 because the connecting harness 6 is open, and the alarm 5 will not sound an alarm. When the output module of the voltage drop monitoring component 7 fails accidentally, the three-position selector switch 2 is switched to manual alarm. At this time, points ① and ② inside the three-position selector switch 2 remain conductive, while points ③ and ④ are not conductive. Pressing the alarm button 3 connects circuit A, connecting the connecting harness 6. The closed signal is transmitted to the alarm 5 through the connecting harness 6, thus triggering an alarm. To minimize the impact on semiconductor equipment, the equipment box 1 is shielded by the shielding layer 14, and the connecting harness 6 is protected by the shielding foil 20, thereby reducing electromagnetic interference and ensuring the transmission of current signals. This completes the workflow of the equipment.

[0029] Example 2

[0030] like Figure 3-4 As shown, the present invention proposes a semiconductor factory external voltage drop anti-interference device. Compared with Embodiment 1, this embodiment further includes: a cooling box 8 installed at the bottom of the equipment box 1, a water tank 11 installed at the bottom of the cooling box 8, cooling pipes 9 installed on both sides of the water tank 11, the cooling pipes 9 being located at the bottom of the equipment box 1, a circulating pump 10 installed in the middle of the cooling pipes 9, heat exchange plates A12 installed on the outer surface of the cooling pipes 9 inside the equipment box 1, and heat exchange plates B18 installed on both sides of the outer surface of the cooling pipes 9 inside the cooling box 8. The heat exchange effect between the cooling pipes 9 and the coolant is improved by the heat exchange plates A12 and B18. Vent holes 16 are provided on both sides of the cooling box 8, a heat sink 17 is installed at the vent hole 16 inside the cooling box 8, and a temperature sensor 15 is installed on one side inside the equipment box 1 to monitor the internal temperature of the equipment box 1.

[0031] In this embodiment, when the temperature sensor 15 senses that the internal temperature of the equipment box 1 is too high, the circulation pump 10 is started. The water inside the water tank 11 is drawn out through the circulation pump 10 and the cooling pipe 9 and circulated back into the water tank 11. The cooling water and heat exchange fins A12 are used to cool the inside of the equipment box 1. The radiator 17 is started. The radiator 17 on one side blows air into the cooling box 8 and the radiator 17 on the other side exhausts air into the cooling box 8, thereby cooling the cooling water inside the cooling pipe 9.

[0032] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A semiconductor factory external line voltage drop anti-jamming device comprising a device box (1) and a three-position change-over switch (2), characterized in that: A voltage drop monitoring component (7) is installed on the front surface of the equipment box (1) near the top center. A three-position selector switch (2) is installed on the front surface of the equipment box (1) near the bottom side. An alarm button (3) is installed on the front surface of the equipment box (1) near the three-position selector switch (2). A connecting harness (6) is installed on one side of the equipment box (1). An alarm (5) is installed at the end of the connecting harness (6).

2. A semiconductor fab external line pressure drop anti-jamming device according to claim 1, characterized in that: The connecting harness (6), alarm (5), alarm button (3), three-position selector switch (2) and voltage drop monitoring component (7) are electrically connected.

3. A semiconductor fab external line pressure drop anti-jamming device as claimed in claim 1, characterized by: The equipment box (1) has a shielding chamber (13) located inside near the outer surface, and the shielding chamber (13) has a shielding layer (14) inside.

4. A semiconductor fab external line pressure drop anti-jamming device as claimed in claim 1, characterized by: A cooling box (8) is installed at the bottom of the equipment box (1), and a water tank (11) is installed at the bottom inside the cooling box (8). Cooling pipes (9) are installed on both sides of the water tank (11), and the cooling pipes (9) are located at the bottom inside the equipment box (1).

5. A semiconductor fab external line pressure drop anti-jamming device according to claim 4, characterized in that: A circulating pump (10) is installed in the middle of the cooling pipe (9). A heat exchange plate A (12) is installed on the outer surface of the cooling pipe (9) inside the equipment box (1). Heat exchange plates B (18) are installed on both sides of the outer surface of the cooling pipe (9) inside the cooling box (8).

6. The semiconductor factory external voltage drop anti-interference device according to claim 4, characterized in that: The cooling box (8) has ventilation holes (16) on both sides, and a radiator (17) is installed inside the cooling box (8) at the ventilation hole (16).

7. A semiconductor fab external line pressure drop anti-jamming device as claimed in claim 1, wherein: A connector (4) is provided on one side of the equipment box (1) at the location of the connecting wire harness (6). An inner wire (21) is provided in the middle of the connecting wire harness (6). Shielding foil (20) is provided on the outer surface of the inner wire (21) inside the connecting wire harness (6). A nylon sleeve (19) is provided on the outer surface of the shielding foil (20) inside the connecting wire harness (6). A protective spring (22) is installed inside the nylon sleeve (19) near the outer surface.

8. A semiconductor fab external line pressure drop anti-jamming device as claimed in claim 1, further comprising: A temperature sensor (15) is installed on one side inside the equipment box (1).

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