A lithography machine light intensity test calibration substrate

Abstract

The utility model belongs to the field of semiconductor manufacturing technology especially relates to a photoetching machine light intensity test calibration base plate, including detection base plate, detection base plate is placed on photoetching machine body, is equipped with light intensity detection probe on photoetching machine body, is equipped with fixed groove connected with photoetching machine body on detection base plate, detection base plate is placed below light intensity detection probe, is equipped with metal semicircle ball below light intensity detection probe, is set up semicircle hole on detection base plate corresponding metal semicircle ball, compared with prior art, the utility model can reliably monitor the long -term stability change trend of the same position photoetching machine light energy, provides direct basis for accurate judgement mercury lamp service life, and effectively supports the calibration work of machine platform light intensity, guarantees the exposure uniformity and process stability of production product finally.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, it relates to a photolithography machine light intensity testing and calibration substrate. Background Technology

[0002] Photolithography is the most complex and critical process in semiconductor chip manufacturing, characterized by its long processing time and high cost. The difficulty and key to semiconductor chip production lies in how to create the target circuit pattern on a silicon wafer, a process achieved through a photolithography machine.

[0003] However, the light intensity detection substrate provided by the original lithography machine manufacturer lacks a fixed position mechanism, causing the detection points of the light intensity tester to be inconsistent. This defect results in randomness in the detection position each time, making it impossible to perform long-term, stable, and repeatable light intensity monitoring of a specific illuminated area. Therefore, it is difficult to effectively ensure the uniformity and long-term stability of the illumination intensity throughout the entire exposure area of ​​the lithography machine, and it is also impossible to achieve accurate light intensity monitoring and calibration, directly affecting the stability of the process window. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a lithography machine light intensity testing and calibration substrate suitable for lithography machine light intensity testing and calibration.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A photolithography machine light intensity testing and calibration substrate includes a detection substrate, which is placed on the photolithography machine body. The photolithography machine body is equipped with a light intensity detection probe, and the detection substrate is provided with a fixing groove for connecting to the photolithography machine body.

[0007] The detection substrate is placed below the light intensity detection probe.

[0008] A metal hemisphere is located below the light intensity detection probe. The metal hemisphere is fixedly connected to the light intensity detection probe by welding. A semi-circular hole is opened on the detection substrate corresponding to the metal hemisphere.

[0009] The present invention is further configured such that: there are 17 semicircular holes, and the semicircular holes adopt a multi-layer concentric circle array structure, with the hole positions of each layer evenly distributed along the circumference, forming a radial layout radiating outward from the center. All semicircular holes are 180° rotationally symmetrical around the center point, and the hole spacing on the same circumference is consistent, but the spacing between layers naturally changes as the radius increases.

[0010] The present invention is further configured such that the diameter of both the semicircular hole and the metal hemisphere is 5mm.

[0011] The present invention is further configured such that the thickness of the basic detection element is set to 5 mm.

[0012] Compared with the shortcomings of the existing technology, the beneficial effects of this utility model are as follows:

[0013] By firmly placing the detection substrate below the light intensity detection probe on the lithography machine body and connecting it with a fixing slot, the long-term stability of the substrate position is ensured. A metal hemisphere is placed directly below the light intensity detection probe, and a corresponding hemisphere hole is opened on the detection substrate, allowing the probe to accurately detect the light intensity signal reflected or transmitted by the metal hemisphere through the hemisphere hole. In particular, 17 hemisphere holes arranged on the detection substrate, which adopt a multi-layer concentric circle array structure, exhibit 180° rotational symmetry, and have a layer spacing that gradually changes with the radius, are combined with the corresponding metal hemispheres (all with a diameter of 5mm). With the 5mm thickness of the detection substrate, long-term, stable, and synchronous light intensity monitoring of multiple key points in the lithography machine exposure field is achieved with the substrate in a fixed position. This allows for reliable monitoring of the long-term stability trend of the lithography machine's illumination energy at the same position, providing direct evidence for accurately determining the lifespan of the mercury lamp, effectively supporting the calibration of the machine's light intensity, and ultimately ensuring the exposure uniformity and process stability of the produced products. Attached Figure Description

[0014] Figure 1 This is a perspective view of an embodiment of the present utility model;

[0015] Figure 2 This is a front view of an embodiment of the present utility model. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0018] Working principle: The detection substrate is securely mounted to a designated position on the lithography machine body using its fixing groove, ensuring long-term fixation of the detection substrate and that the semi-circular holes on it are precisely positioned directly below the light intensity detection probe. When the lithography machine is working, the light emitted by the light source illuminates the metal hemisphere placed directly below the light intensity detection probe. The light signal reflected or transmitted by the metal hemisphere is captured by the light intensity detection probe above through the corresponding semi-circular holes on the detection substrate and converted into an electrical signal. The specially designed 17 semi-circular holes adopt a multi-layer concentric circle array structure, presenting a 180° rotational symmetry with consistent hole spacing on the same circumference and gradually changing interlayer spacing with the radius. This allows the light intensity detection probe to automatically scan the metal hemispheres below these fixed holes, thereby enabling long-term and stable multi-point synchronous monitoring of the light energy intensity projected by the lithography machine onto the fixed substrate position.

[0019] Working steps: First, the detection substrate is precisely installed and fixed onto the lithography machine body through its fixing groove, ensuring that the light intensity detection probe is positioned above the detection substrate and a corresponding metal hemisphere is positioned directly below it, with the metal hemisphere located in the semi-circular hole of the detection substrate. The lithography machine and light intensity detection probe are started, and the light emitted by the lithography machine's light source illuminates the metal hemisphere. The light intensity detection probe receives the light signal reflected or transmitted by the metal hemisphere through the semi-circular hole. The probe automatically scans the metal hemispheres below the 17 semi-circular holes arranged in a multi-layered concentric array on the detection substrate with 180° rotational symmetry, measuring and recording the light intensity data at each point. By long-term, repeated monitoring of the light intensity data changes at these fixed spatial positions, the stability of the lithography machine's illumination energy is evaluated, thereby determining the mercury lamp's lifespan, used to calibrate the machine's light intensity, and ensuring the uniform and stable exposure of the produced products.

[0020] like Figures 1 to 2 As shown,

[0021] The system includes a detection substrate, which is placed on the lithography machine body. The basic thickness of the detection substrate is set to 5mm. The 5mm thickness ensures that the detection substrate has sufficient rigidity to stably support the metal hemisphere and maintain the hemisphere hole structure without deformation over a long period of time. At the same time, it maintains the accurate distance between the hemisphere hole and the light intensity detection probe, avoiding optical path deviation or measurement inaccuracy caused by deformation due to excessively thin substrate.

[0022] The lithography machine body is equipped with a light intensity detection probe, and the detection substrate is equipped with a fixing groove that connects to the lithography machine body. The fixing groove securely mounts the detection substrate to the designated position on the lithography machine body.

[0023] The detection substrate is placed below the light intensity detection probe and fixed directly below the light intensity detection probe. This ensures that the probe can accurately receive the reflected / transmitted light signal from the metal hemisphere directly below through the semicircular hole, eliminating positional deviation and ensuring that long-term, repeated measurements are always performed at the same spatial point, thereby accurately monitoring the stability of light intensity.

[0024] A metal hemisphere is located below the light intensity detection probe. The metal hemisphere is fixedly connected to the light intensity detection probe by welding. The detection substrate has a semi-circular hole corresponding to the metal hemisphere, so that the probe can accurately detect the light intensity signal reflected or transmitted by the metal hemisphere through the semi-circular hole.

[0025] Both the diameter of the semicircular hole and the metal hemisphere are set to 5mm to ensure that the metal hemisphere and the semicircular hole fit together perfectly to form a stable optical path structure.

[0026] There are 17 semicircular holes, which adopt a multi-layer concentric circle array structure. The holes in each layer are evenly distributed along the circumference, forming a radial layout radiating outward from the center. All semicircular holes are 180° rotationally symmetrical around the center point. The hole spacing on the same circumference is consistent, but the interlayer spacing naturally changes as the radius increases. The specially designed 17 semicircular holes adopt a multi-layer concentric circle array layout, with 180° rotational symmetry and intelligently gradual interlayer spacing (dense at the center and sparse at the edges) to simultaneously cover key points in the entire exposure field, realize efficient and accurate light intensity stability monitoring, thereby reliably judging the mercury lamp life, calibrating the light intensity of the machine, and ensuring the uniformity of product exposure.

[0027] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A photolithography machine light intensity testing and calibration substrate, characterized in that: The system includes a detection substrate, which is placed on the lithography machine body. The lithography machine body is equipped with a light intensity detection probe, and the detection substrate is equipped with a fixing groove for connection with the lithography machine body. The detection substrate is placed below the light intensity detection probe. A metal hemisphere is located below the light intensity detection probe. The metal hemisphere is fixedly connected to the light intensity detection probe by welding. A semi-circular hole is opened on the detection substrate corresponding to the metal hemisphere.

2. The light intensity test calibration substrate of claim 1, wherein: There are 17 semicircular holes. The semicircular holes adopt a multi-layer concentric circle array structure. The holes in each layer are evenly distributed along the circumference, forming a radial layout radiating outward from the center. All semicircular holes are 180° rotationally symmetrical around the center point. The hole spacing on the same circumference is consistent, but the spacing between layers naturally changes as the radius increases.

3. The light intensity test calibration substrate of claim 1, wherein: The diameters of both the semicircular hole and the metal hemisphere are set to 5 mm.

4. The light intensity test calibration substrate of claim 1, wherein: The basic thickness for the test is set to 5mm.

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