A chassis and board assembly for a superconducting quantum bit measurement and control system

Abstract

This invention discloses a chassis and board assembly for a superconducting quantum bit measurement and control system, including a chassis shell and a chassis base plate. The chassis shell contains multiple board slots, a power supply, and a backplate. A connector is fixedly connected to one surface of the backplate, and the board assembly is interconnected with the backplate via the connector. The board assemblies are housed within the board slots, each including at least one distribution board, one or more merging boards, and one or more reading boards. The distribution board, merging board, and reading board each integrate radio frequency circuitry for quantum bit measurement and control. This invention's chassis integrates the functions of discrete radio frequency devices onto pluggable board assemblies, thereby reducing system size, simplifying internal wiring, and facilitating the maintenance of multi-qubit quantum measurement and control systems.

Description

Technical Field

[0001] This utility model belongs to the field of quantum measurement and control technology, and in particular relates to a chassis and board assembly for a superconducting quantum bit measurement and control system. Background Technology

[0002] In superconducting quantum computing, precise control and readout of qubits are required. This process necessitates the use of numerous radio frequency (RF) devices (such as filters, amplifiers, attenuators, mixers, and power dividers) to process the signals. Currently, the mainstream solution is to purchase commercial discrete RF instruments and equipment and manually build the system using RF connectors such as SMA and SSMP and coaxial cables.

[0003] This traditional approach has significant drawbacks: It is bulky: the manipulation and readout links for each bit require dozens of independent devices, causing the size and complexity of an N-bit system to increase by O(N) or even O(N²), severely limiting the expansion of quantum computer bit scale; the large number of cables and connectors not only introduces insertion loss and phase instability but also reduces system reliability and makes troubleshooting extremely difficult; each additional qubit requires the manual introduction of a new set of devices and rewiring, a cumbersome process with low flexibility; the cost of numerous commercial instruments and precision cables is high, and system integration and maintenance costs are enormous. Therefore, there is an urgent need in this field for a highly integrated, modular, and scalable solution to overcome these shortcomings. Utility Model Content

[0004] The purpose of this invention is to provide a chassis and board assembly for a superconducting quantum bit measurement and control system, thereby solving the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a chassis and board assembly for a superconducting quantum bit measurement and control system, comprising a chassis shell and a chassis base plate. The chassis shell contains multiple board slots, a power supply, and a backplate. A connector is fixedly connected to one surface of the backplate, and the board assembly is interconnected with the backplate via the connector. The board assembly is housed within each board slot, and includes at least one distribution board, one or more merging boards, and one or more reading boards. Each distribution board, merging board, and reading board integrates radio frequency circuitry for quantum bit measurement and control. By integrating the functions of discrete radio frequency devices onto pluggable board assemblies, the chassis shell reduces system size, simplifies internal wiring, and facilitates the maintenance of multi-qubit quantum measurement and control systems.

[0007] Preferably, the distribution board has a side-mounted RF connector on one side for receiving external signals; and an inter-board RF connector on the other side for connecting to the merging board downwards.

[0008] Preferably, the merging board integrates a mixer, filter, amplifier, and attenuator; the top of the merging board has an interface that matches the inter-board RF connector of the distribution board for receiving signals; the bottom of the merging board has a side-mounted RF connector for outputting microwave control signals.

[0009] Preferably, the read board integrates a low-noise amplifier, a mixer, and an intermediate frequency amplifier and filter circuit; the read board is used to receive and process the read signals returned from the quantum chip, and its signal processing flow is the reverse of that of the allocation board.

[0010] Preferably, the merging board is electrically connected to the distribution board, and the distribution board, the merging board, and the reading board are connected by board connectors, and the electrical connection between the boards is achieved through board connectors.

[0011] Preferably, the distribution board and the merging board are vertically connected via a high-speed, high-density board connector to achieve signal and power transmission.

[0012] Preferably, the upper surface of the chassis base plate is fixedly mounted with a board mounting beam, a fan mounting strip, several panels, and a switch card. The board mounting slot is fixedly mounted above the board mounting beam. Several cooling fans are mounted on the fan mounting strip, and the positions of the cooling fans correspond to the positions of the board components. A heat sink is fixedly provided on the upper surface of the switch card. The board components are connected to functional boards through board connectors. The panels are used to fix the functional boards. Data communication between the functional boards is aggregated to the switch card via the high-speed data bus of the backplane.

[0013] Preferably, the bottom plate of the chassis is provided with a plurality of first air inlets and a plurality of second air inlets on both sides, the chassis shell is provided with a fourth air inlet on both sides, and the front and rear surfaces of the chassis shell are provided with a third air inlet.

[0014] This utility model has the following beneficial effects:

[0015] 1. This utility model has the advantages of compact size, reliable connection, and convenient expansion. Specifically, by integrating the functions of dozens of discrete RF devices onto a single PCB board, the size of the entire measurement and control system is reduced by 1-2 orders of magnitude. High-density inter-board connectors and backplane interconnection replace most external coaxial cables, resulting in a clean internal system, high reliability, and good signal integrity. The modular design allows users to linearly increase the number of bits controlled by the system by adding more integrated boards, simplifying the upgrade process. The integrated design shortens the signal path, reduces loss and interference, and helps improve the overall performance of the measurement and control system (such as fidelity and stability).

[0016] 2. This utility model uses simulation and other methods to rationally plan the air inlet and outlet of the chassis and the airflow, achieving good heat dissipation under limited conditions. The chassis uses symmetrical arrangement of circuit boards to evenly distribute the main heat sources of the chassis shell on the front and rear sides. Parallel cooling fans are installed below the circuit board components as the bottom air inlet. Multiple air inlets are designed to blow the cooling air from the front of the chassis shell to the vertically placed circuit boards, effectively increasing the airflow over the processor chips on the circuit boards. At the same time, large-area dense heat dissipation vents are set in the center of the two side panels, and heat sinks are installed to exhaust the internal heat to the side of the chassis shell. Meanwhile, due to the obstruction of the chassis pillars, it is difficult for the air intake at the front of the chassis and the high air outlet on the side to form a backflow, thus isolating the hot air circulation.

[0017] 3. Due to the front and rear air intake and side air exhaust design, the chassis supports stacking in the overall direction and can be reasonably placed on various types of racks. The heat dissipation effect will not be significantly reduced due to the number of stacked units, which will have a better effect on the measurement and control of quantum computing with more bits.

[0018] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0022] Figure 3 for Figure 2Front view structural diagram;

[0023] Figure 4 for Figure 2 A top-view structural diagram;

[0024] Figure 5 for Figure 2 A magnified schematic diagram of the structure at point A in the middle.

[0025] The components represented by each number in the attached diagram are listed below: 1. Chassis housing; 10. Chassis base plate; 20. Board assembly; 200. Functional board; 201. Board slide; 202. Connector; 203. Board connector; 204. Front panel; 30. Board mounting beam; 40. Fan mounting strip; 401. First air inlet; 402. Second air inlet; 403. Third air inlet; 404. Fourth air inlet; 405. Heat sink; 406. Cooling fan; 50. Switch card; 60. Backplate. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this utility model, it should be understood that the terms "upper", "middle", "outer", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Please see Figures 1-5 As shown, this utility model is a chassis and board assembly for a superconducting quantum bit measurement and control system, including a chassis shell 1 and a chassis base plate 10. A groove is provided between the upper and lower board slide slots 201 of the chassis shell 1 to ensure that the board assembly 20 is accurately inserted and aligned with the connector 202 of the back plate 60. A quick-connect connector (such as a lever-type blind-mating connector) is adopted to ensure that the connector can automatically align and complete engagement during the insertion process, realizing "real-time insertion and removal". The chassis shell 1 provides a back plate 60, which integrates a power distribution network, a low-speed control bus (such as I2C and SPI for monitoring the temperature, power and other status of each board) and a reference clock distribution network. The chassis shell 1 has multiple board slide slots 201, a power supply and a back plate 60 inside. A connector 202 is fixedly connected to one surface of the back plate 60, and the board assembly 20 is interconnected with the back plate 60 through the connector 202.

[0029] The board slot 201 contains a board assembly 20, which includes at least one distribution board, one or more merging boards, and one or more reading boards.

[0030] The distribution board, acting as the system's "signal scheduling center," primarily receives multi-channel raw control signals (typically intermediate frequency or baseband IQ signals) from a host computer (such as a quantum compiler control system) and distributes and routes them to the corresponding quantum bit manipulation links. The other side of the distribution board has an inter-board RF connector (not shown in the figure) for connecting external signal lines. An inter-board RF connector (not shown in the figure) is also located at the bottom of the board. The top of the merging board has a mating interface that matches the inter-board RF connector of the distribution board, and the bottom has a side-mounted RF connector for output. The distribution board and the merging board are vertically connected and fixed via the inter-board RF connector.

[0031] The merging board, as a "bit-specific signal processing module", is usually responsible for processing the complete control link signal of one or a few qubits. Its core function is to up-convert the control signal sent from the distribution board and the local oscillator signal to generate the microwave pulse that finally acts on the qubit. The bottom of the merging board is equipped with a side-mounted RF connector (not shown in the figure) for outputting microwave control signals.

[0032] The read board is used to process the read signals returned from the quantum chip. The distribution board, merging board and read board each integrate radio frequency circuits to realize the quantum bit measurement and control function. The distribution board, merging board and read board are all multi-layer circuit boards, and their boards integrate several integrated circuit chips, capacitors, inductors and resistors to realize the corresponding signal processing functions. The board structure and connector layout of the read board are similar to those of the distribution board.

[0033] The chassis 1 integrates the functions of discrete RF devices onto a pluggable board assembly 20 to reduce system size, simplify internal wiring, and maintain the multi-bit quantum measurement and control system. The read board integrates a low-noise amplifier, mixer, and intermediate frequency amplifier and filter circuit. The read board is used to receive and process the read signals returned from the quantum chip, and its signal processing flow is the reverse of that of the distribution board.

[0034] The merging board and the distribution board are electrically connected. The distribution board, the merging board and the reading board are connected by board connectors 203. The electrical connection between the boards is achieved through the board connectors 203. The distribution board and the merging board are vertically connected through the high-speed, high-density board connectors 203 to achieve signal and power transmission.

[0035] The upper surface of the chassis base plate 10 is fixedly mounted with a board mounting beam 30, a fan mounting strip 40, several panels 204, and a switch card 50. The board slide 201 is fixedly mounted above the board mounting beam 30. Several cooling fans 406 are mounted on the fan mounting strip 40. The position of the cooling fans 406 corresponds to the position of the board assembly 20. A heat sink 405 is fixedly mounted on the upper surface of the switch card 50. The board assembly 20 is connected to the function board 200 through the board connector 203. The panel 204 is used to fix the function board. The data communication between the function boards is aggregated to the switch card 50 through the high-speed data bus of the backplane 60.

[0036] The chassis bottom plate 10 has several first air inlets 401 and several second air inlets 402 on both sides. The chassis shell 1 has a fourth air inlet 404 on both sides. The chassis shell 1 has a third air inlet 403 on both the front and rear surfaces. The cooling airflow enters from the front, rear and bottom of the chassis shell 1, flows through the board assembly 20 to cool it, and then exits from the fourth air inlets 404 on both sides.

[0037] Working principle:

[0038] Different board components 20 are inserted into the chassis along the grooves between the board slides 201. The connectors on them automatically blind-mating with the connectors 202 on the backplane 60 to complete the access for power supply, control, and data communication. The input and output of radio frequency signals are completed through the side-mounted radio frequency connectors on each board. When the system is working, the cooling fan 406 operates, forming a heat dissipation airflow from the front, rear, and bottom of the chassis to both sides, achieving efficient heat dissipation for high-power components. Multiple air inlets are designed to blow cooling air from the front of the chassis 1 to the vertically placed board components 20, effectively increasing the airflow over the board processor chip. At the same time, large-area dense heat dissipation vents are set in the center of the two side panels, and heat sinks 405 are installed to exhaust the internal accumulated heat to the sides of the chassis 1. Meanwhile, due to the obstruction of the chassis pillars, it is difficult for the air intake at the front of the chassis 1 and the high air outlet on the side to form a backflow, thus isolating the hot air circulation.

[0039] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A superconducting quantum bit measurement and control system chassis and board assembly, comprising a chassis housing (1) and a chassis backplane (10), characterized in that, The chassis housing (1) is provided with multiple board slots (201), power supply and back plate (60) inside. A connector (202) is fixedly connected to one surface of the back plate (60). The board assembly (20) is interconnected with the back plate (60) through the connector (202). The board slot (201) is provided with a board assembly (20), which includes at least one distribution board, one or more merging boards and one or more reading boards. The distribution board serves as a signal scheduling center for receiving and distributing multi-channel quantum control signals. The merging board, which serves as a dedicated signal processing module for qubits, connects to the distribution board and is used to generate the microwave pulses that ultimately act on the qubits. The readout board is used to process the readout signals returned from the quantum chip; The distribution board, merging board and reading board are respectively integrated with radio frequency circuits that realize quantum bit measurement and control functions. The chassis (1) integrates the functions of discrete radio frequency devices into pluggable board components (20) to reduce system size, simplify internal wiring and maintain multi-bit quantum measurement and control system.

2. The superconducting quantum bit measurement and control system chassis and board assembly of claim 1, wherein, The distribution board has a side-mounted RF connector on one side for receiving external signals; the distribution board has an inter-board RF connector on the other side for connecting to the merging board downwards.

3. The system-in-a-package and board assembly of claim 2, wherein, The merging board integrates a mixer, filter, amplifier, and attenuator; the top of the merging board has an interface that matches the inter-board RF connector of the distribution board for receiving signals; the bottom of the merging board has a side-mounted RF connector for outputting microwave control signals.

4. The superconducting quantum bit measurement and control system chassis and board assembly of claim 1, wherein, The read board integrates a low-noise amplifier, a mixer, and an intermediate frequency amplifier and filter circuit; the read board is used to receive and process the read signals returned from the quantum chip, and its signal processing flow is the reverse of that of the allocation board.

5. The superconducting quantum bit measurement and control system chassis and board assembly of claim 3, wherein, The merging board is electrically connected to the distribution board, and a board connector (203) connects the distribution board, the merging board, and the reading board. The electrical connection between the boards is achieved through the board connector (203).

6. The superconducting quantum bit measurement and control system chassis and board assembly of claim 5, wherein, The distribution board and the merging board are vertically connected through a high-speed, high-density board connector (203) to achieve signal and power transmission.

7. The system-in-a-package and board assembly of claim 1, wherein: The upper surface of the chassis base plate (10) is fixedly installed with a board mounting beam (30), a fan mounting strip (40), several panels (204) and a switch card (50). The board slide (201) is fixedly installed above the board mounting beam (30). Several cooling fans (406) are installed on the fan mounting strip (40). The position of the cooling fans (406) corresponds to the position of the board assembly (20). The upper surface of the switch card (50) is fixedly provided with a heat sink (405). The board assembly (20) is connected to a functional board (200) through a board connector (203). The panel (204) is used to fix the functional board. The data communication between the functional boards is converged to the switch card (50) via the high-speed data bus of the backplane (60).

8. The system-in-package and board assembly of claim 1, wherein, The two sides of the chassis bottom plate (10) are provided with a plurality of first air inlets (401) and a plurality of second air inlets (402), the two sides of the chassis shell (1) are provided with fourth air inlets (404), and the front and back surfaces of the chassis shell (1) are provided with third air inlets (403).

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