A capacitor heat dissipation structure and a photovoltaic inverter

Abstract

This utility model discloses a capacitor heat dissipation structure and a photovoltaic inverter, relating to the field of photovoltaic equipment technology. The capacitor heat dissipation structure includes several capacitors, several heat-conducting sleeves, and a heat dissipation base with several fixing slots. Each heat-conducting sleeve contains a capacitor, and all heat-conducting sleeves are correspondingly fixed in all fixing slots. The heat dissipation base is fixed inside a housing, and a cooling fan is fixed to the side wall of the housing. Several cooling fins are provided on the outer surface of the heat dissipation base. The heat generated by the capacitors is transferred to the heat dissipation base through the heat-conducting sleeves. The added cooling fins on the heat dissipation base effectively increase the heat dissipation area and improve the natural convection heat transfer efficiency. Driven by the cooling fan, forced turbulence is formed inside the housing, and the turbulent air undergoes forced convection heat transfer with the cooling fins, improving the forced convection heat transfer efficiency. This utility model combines the dual advantages of extended surface heat transfer and forced convection heat transfer to achieve efficient heat dissipation in a limited space, thereby improving the heat dissipation performance of the photovoltaic inverter.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic equipment technology, and in particular to a capacitor heat dissipation structure and a photovoltaic inverter. Background Technology

[0002] As the core equipment of a photovoltaic system, the photovoltaic inverter converts the direct current (DC) generated by solar panels into alternating current (AC) that meets grid requirements. Against the backdrop of rapid development in the photovoltaic industry, photovoltaic inverters are evolving towards miniaturization, lightweight design, and high power density. While the size of the equipment continues to shrink, the output power continues to rise, leading to a significant increase in heat generation from internal electronic components. This rapid increase in heat generation directly causes the operating temperature of internal electronic components to rise, seriously affecting the lifespan and reliability of core components. Therefore, how to maintain high power output while optimizing heat dissipation design to solve the heat dissipation problem caused by miniaturization has become a core key to breakthroughs in photovoltaic inverters.

[0003] As a key passive component of photovoltaic inverters, the heat dissipation performance of capacitors directly affects the reliability of the entire unit. Taking plug-in packaged electrolytic capacitors as an example, these capacitors are typically mounted vertically on the power board. Their heat dissipation methods mainly fall into two categories: fanless and fan-equipped. In fanless inverters, the heat generated by the capacitors is transferred directly to the external environment through natural convection of air within the enclosure. In fan-equipped inverters, the heat generated by the capacitors is forced through convection by a fan within the enclosure, transferring the heat to the outer casing and then to the external environment.

[0004] Since forced convection has a significantly higher heat transfer coefficient than natural convection, using a built-in fan for cooling can significantly improve the overall heat exchange efficiency of the system. However, with the continuous increase in the power density of photovoltaic inverters, the electronic components within the limited volume of the enclosure are arranged more compactly, and the airflow channels are narrower, exacerbating the heat dissipation challenge. Built-in fans typically need to cool multiple electronic components simultaneously, while capacitors, due to their large size, are often placed at the end of the airflow path to avoid obstructing the heat dissipation of other components. This arrangement results in a significant reduction in the actual airflow velocity received by the capacitors, affecting the heat dissipation performance of the photovoltaic inverter. Utility Model Content

[0005] The purpose of this invention is to provide a capacitor heat dissipation structure and a photovoltaic inverter. The capacitor is fixed in each fixed slot of the heat sink by a heat-conducting sleeve. The heat generated by the capacitor exchanges heat with the heat dissipation fins of the heat sink, and then exchanges heat with the turbulent air blown out by the cooling fan. This achieves efficient heat dissipation in a limited space, effectively improves heat dissipation performance, and solves the technical problem of poor heat dissipation performance of existing photovoltaic inverters.

[0006] To achieve the above objectives, this utility model provides a capacitor heat dissipation structure, including several capacitors, several heat-conducting sleeves, and a heat dissipation base with several fixing slots. Each heat-conducting sleeve contains a capacitor, and all heat-conducting sleeves are fixedly installed in all the fixing slots. The heat dissipation base is fixed inside the housing, and a heat dissipation fan is fixed on the side wall of the housing. Several heat dissipation fins are provided on the outer side of the heat dissipation base.

[0007] In some embodiments, the inner sidewall of the fixing groove is formed with a plurality of receiving grooves, and a raised rib is formed between any two adjacent receiving grooves; a heat-conducting sheet is filled between each receiving groove and the capacitor, and all the heat-conducting sheets of each fixing groove form a heat-conducting sleeve.

[0008] In some embodiments, all capacitors are arranged in a matrix; the capacitors are cylindrical, the heat-conducting plates are arc-shaped, and the fixing grooves are cylindrical; the length of the capacitors, the length of the heat-conducting plates, and the depth of the fixing grooves are all equal.

[0009] In some embodiments, the cooling fan and the heat sink are respectively located at both ends of the housing, and the air outlet of the cooling fan faces the heat sink. The side wall of the housing is provided with an air inlet, and the air inlet of the cooling fan is aligned with the air inlet. A support is fixedly provided on the inner side wall of the housing, and the cooling fan is fixedly mounted on the support.

[0010] In some embodiments, the heat dissipation fins are arc-shaped fins protruding from the outer side of the heat dissipation base, and all heat dissipation fins are evenly distributed along the thickness direction of the heat dissipation base.

[0011] In some embodiments, a first circuit board and a second circuit board are respectively fixed on two opposite sides of the heat sink, and at least one of the first circuit board and the second circuit board is fixedly connected to the heat sink.

[0012] In some embodiments, at least one side of the heat sink has a screw hole for fixing the first circuit board and / or the second circuit board.

[0013] In some embodiments, the first circuit board and the second circuit board are parallel, and a plurality of support columns are fixed between the first circuit board and the second circuit board.

[0014] In some embodiments, the opening of the box is detachably covered.

[0015] This utility model also provides a photovoltaic inverter, including the above-mentioned capacitor heat dissipation structure.

[0016] Compared to the prior art, in this invention, each capacitor is fixed in a fixed slot of the heat sink via a heat-conducting sleeve. The outer surface of the heat sink is provided with several heat-dissipating fins, while a cooling fan is fixed to the side wall of the housing. On one hand, the heat generated by the capacitors is transferred to the heat sink via the heat-conducting sleeve. The added heat-dissipating fins on the heat sink effectively increase the heat dissipation area, thereby improving the efficiency of natural convection heat transfer. On the other hand, driven by the cooling fan, forced turbulence is formed inside the housing. The turbulent air flows rapidly across the surface of the heat sink fins, engaging in forced convection heat transfer with the fins, effectively improving the efficiency of forced convection heat transfer.

[0017] This invention can increase the heat dissipation area by using heat sink fins and force rapid heat exchange by using a cooling fan. Combining the dual advantages of extended surface heat transfer and forced convection heat transfer, it can achieve efficient heat dissipation in a limited space and improve the heat dissipation performance of photovoltaic inverters. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 This is an assembly diagram of the capacitor, heat-conducting sleeve, and heat sink of the capacitor heat dissipation structure provided in this embodiment of the utility model.

[0020] Figure 2 for Figure 1 Exploded view;

[0021] Figure 3 for Figure 1 Axonometric view of the heat sink;

[0022] Figure 4 for Figure 1 Another isometric view of the heat sink;

[0023] Figure 5 This is a schematic diagram of the capacitor heat dissipation structure provided in an embodiment of the present utility model;

[0024] Figure 6 for Figure 5 The main view;

[0025] Figure 7 for Figure 5 Top view;

[0026] Figure 8 This is a schematic diagram of the airflow path of the capacitor heat dissipation structure provided in the embodiment of the present invention.

[0027] The attached figures are labeled as follows:

[0028] 1. Capacitor; 2. Heat sink; 3. Housing; 4. Cooling fan; 5. First circuit board; 6. Second circuit board; 7. Support column; 8. Housing cover; 9.

[0029] Heat-conducting sheet 21;

[0030] Fixing slot 31, heat dissipation fins 32 and screw holes 33;

[0031] 311 raised ribs;

[0032] Support base 51. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] This utility model discloses a capacitor heat dissipation structure, as shown in the attached figure. Figure 1 and 2 As shown, it includes several capacitors 1, several heat-conducting sleeves 2 and a heat sink 3. The heat sink 3 has several fixing slots 31. Each heat-conducting sleeve 2 has a capacitor 1 fixed inside it. All the heat-conducting sleeves 2 are fixed in all the fixing slots 31 in a one-to-one correspondence, so that all the capacitors 1 are fixed in all the fixing slots 31 of the heat sink 3 in a one-to-one correspondence, thereby achieving reliable fixing of the capacitors 1.

[0036] As attached Figures 2 to 4 As shown, the outer side of the heat sink 3 is provided with several heat dissipation fins 32. The heat generated by the capacitor 1 is transferred to the heat sink 3 through the heat-conducting sleeve 2. The heat dissipation fins 32 added to the heat sink 3 effectively increase the heat dissipation area, thereby improving the natural convection heat transfer efficiency.

[0037] As attached Figures 5 to 7 As shown, the heat sink 3 is fixed inside the housing 4, and the side wall of the housing 4 is fixed with a heat sink 5. Driven by the heat sink 5, a forced turbulence is formed inside the housing 4. The turbulent air flows quickly over the surface of the heat sink fins 32 and performs forced convection heat exchange with the heat sink fins 32, effectively improving the forced convection heat exchange efficiency.

[0038] In summary, this utility model can both increase the heat dissipation area by utilizing the heat dissipation fins 32 and force rapid heat exchange by utilizing the cooling fan 5. Combining the dual advantages of extended surface heat transfer and forced convection heat transfer, it can achieve efficient heat dissipation in a limited space and provide heat dissipation performance for photovoltaic inverters.

[0039] As a preferred embodiment, as shown in the appendix Figure 2 As shown, the inner wall of the fixing groove 31 has several receiving grooves, and a raised rib 311 is formed between any two adjacent receiving grooves. A heat-conducting sheet 21 is filled between each receiving groove and the capacitor 1. Both sides of the heat-conducting sheet 21 abut against the raised rib 311. The raised rib 311 defines the position of the heat-conducting sheet 21 along the circumference of the fixing groove 31. All the heat-conducting sheets 21 in each fixing groove 31 form a heat-conducting sleeve 2, which reliably fixes the capacitor 1 in the fixing groove 31 and ensures that both ends of the heat-conducting sheet 21 are in contact with the capacitor 1 and the fixing groove 31 respectively, reducing contact thermal resistance and achieving efficient heat transfer. In other words, the heat-conducting sleeve 2 in this invention has a discrete structure, formed by several ring-shaped heat-conducting sheets 21, which helps reduce the installation difficulty of the heat-conducting sleeve 2, prevents jamming or deformation during installation, and improves installation accuracy and efficiency.

[0040] As a preferred embodiment, as shown in the appendix Figure 1 and 2 As shown, all capacitors 1 are arranged in a matrix to ensure a compact arrangement and avoid excessive space occupation. Preferably, the heat sink 3 has four rows and three columns of fixing slots 31. The capacitor 1 is cylindrical, the heat-conducting plate 21 is arc-shaped, and the fixing slot 31 is cylindrical, ensuring that both sides of the heat-conducting plate 21 completely match the outer side of the capacitor 1 and the inner side of the fixing slot 31, respectively, improving conduction efficiency. It should be noted that the capacitor 1, the heat-conducting sleeve 2, and the heat sink 3 are all heat-conducting components made of aluminum or copper. The length of the capacitor 1, the length of the heat-conducting plate 21, and the depth of the fixing slot 31 are equal to ensure that the two sides of the heat sink 3 are flush, so that one of the circuit boards is tightly attached to the heat sink 3, avoiding uneven fixing of the two circuit boards, reducing the risk of loosening of the electronic components of the two circuit boards due to excessive vibration and impact, and ensuring more reliable operation of the two circuit boards.

[0041] As a preferred embodiment, as shown in the appendix Figure 5 and 6As shown, the cooling fan 5 and the heat sink 3 are respectively located at both ends of the housing 4, with the air outlet of the cooling fan 5 facing the heat sink 3, forming a straight airflow channel between the air outlet and the heat sink 3. This reduces airflow scattering and eddy current losses, ensuring that the airflow is concentrated and blown towards the heat sink 3, maximizing forced convection efficiency and resulting in high heat exchange efficiency. The side wall of the housing 4 has air inlets, and the air inlet of the cooling fan 5 is aligned with these air inlets, forming a straight airflow channel between the air inlets and the cooling fan 5. This avoids turbulence and pressure loss caused by the winding airflow path, effectively increasing the airflow volume of the cooling fan 5. Alternatively, a filter screen can be added at the air inlet to filter out insects and other foreign objects. A support base 51 is fixed to the inner side wall of the housing 4, and the cooling fan 5 is fixed to the support base 51, ensuring that the cooling fan 5 is reliably fixed to the housing 4 and that the air inlet of the cooling fan 5 is aligned with the air inlet of the housing 4.

[0042] As attached Figure 8 As shown, the air outlet of the cooling fan 5 blows the air inside the housing 4, forming turbulent air. The turbulent air flows over the surface of the heat dissipation fins 32 and undergoes forced convection heat exchange with the heat dissipation fins 32. After the turbulent air hits the inner wall of the housing 4, it changes direction and flows to the air inlet of the cooling fan 5. Then, the cooling fan 5 blows the air onto the heat sink 3, forming a circulating flow. The heat generated by the capacitor 1 is conducted through the heat sink 3 and transferred to the external environment of the housing 4 via the turbulent air.

[0043] As a preferred embodiment, as shown in the appendix Figure 3 As shown, the heat dissipation fins 32 are arc-shaped fins protruding from the outer surface of the heat sink 3. Compared to straight fins, the arc-shaped guide surface allows for a smoother airflow transition, reducing airflow separation and turbulence caused by sharp angles. This reduces wind resistance and increases the contact area with turbulent air. Furthermore, all the heat dissipation fins 32 are evenly distributed along the thickness direction of the heat sink 3, preventing excessive local heat buildup and ensuring more even heat transfer from the heat sink 3 to the heat dissipation fins 32 along the thickness direction, thus improving the heat dissipation efficiency of the heat sink 3. The thickness of a single arc-shaped fin is preferably 1 mm, but is not limited to this.

[0044] As a preferred embodiment, as shown in the appendix Figures 5 to 7 As shown, a first circuit board 6 and a second circuit board 7 are fixedly mounted on opposite sides of the heat sink 3, forming a double-sided heat dissipation channel. The heat sink 3 acts as a heat dissipation medium, balancing the temperature of the circuit boards on both sides, preventing heat accumulation on one side, and thus extending the service life of both circuit boards. At least one of the first circuit board 6 and the second circuit board 7 is fixedly connected to the heat sink 3. This double-sided fixation prevents the heat sink 3 from warping due to unilateral force and improves its impact resistance. In addition, the heat sink 3 serves as a structural frame, facilitating independent disassembly and maintenance of the circuit boards on both sides.

[0045] As a preferred embodiment, as shown in the appendix Figure 2As shown, at least one side of the heat sink 3 has a screw hole 33 for fixing the first circuit board 6 and / or the second circuit board 7. Preferably, screw holes 33 are formed on two opposite sides of the heat sink 3, and bolts are passed through both the first circuit board 6 and the second circuit board 7. The bolts cooperate with the screw holes 33 to evenly transmit the preload of the bolts on both sides of the heat sink 3, avoiding twisting deformation caused by unilateral force on the heat sink 3, and thus extending the service life of the heat sink 3.

[0046] As a preferred embodiment, as shown in the appendix Figure 5 and 6 As shown, the first circuit board 6 and the second circuit board 7 are parallel to each other. Several support columns 8 are fixed between the first circuit board 6 and the second circuit board 7. The support columns 8 serve as rigid connectors to prevent relative displacement between the two circuit boards, improve their fatigue resistance, and make them suitable for high-frequency vibration environments, thus enhancing their adaptability. The support columns 8 are fixed by welding or bolts, enabling rapid alignment and assembly of the two circuit boards, reducing assembly difficulty, and improving assembly efficiency.

[0047] As a preferred embodiment, as shown in the appendix Figure 5 and 6 As shown, the opening of the enclosure 4 is detachably equipped with a cover 9, which facilitates the installation and removal of the cover 9 and reduces maintenance difficulty. A sealing ring can be added between the opening and the cover 9 to improve the sealing performance of the enclosure 4, meet the usage requirements of rain, snow or dusty environments, and improve adaptability.

[0048] This utility model also provides a photovoltaic inverter, which includes the above-mentioned capacitor heat dissipation structure and has the same beneficial effects.

[0049] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0050] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A capacitive heat spreading structure, characterized by, It includes several capacitors (1), several heat-conducting sleeves (2) and a heat sink (3) with several fixing grooves (31). Each heat-conducting sleeve (2) has a capacitor (1) fixed inside it. All the heat-conducting sleeves (2) are fixed in all the fixing grooves (31) in a corresponding manner. The heat sink (3) is fixed inside the box (4). The side wall of the box (4) is fixed with a heat dissipation fan (5). The outer side of the heat sink (3) is provided with several heat dissipation fins (32).

2. The capacitive heat spreading structure of claim 1, wherein, The inner sidewall of the fixing groove (31) is formed with a plurality of receiving grooves, and a protruding rib (311) is formed between any two adjacent receiving grooves; a heat-conducting sheet (21) is filled between each receiving groove and the capacitor (1), and all the heat-conducting sheets (21) of each fixing groove (31) form the heat-conducting sleeve (2).

3. The capacitive heat spreading structure of claim 2, wherein, All of the capacitors (1) are arranged in a matrix; the capacitors (1) are cylindrical, the heat-conducting sheet (21) is arc-shaped, and the fixing groove (31) is cylindrical.

4. The capacitive heat spreading structure according to any one of claims 1 to 3, wherein, The cooling fan (5) and the cooling base (3) are respectively located at both ends of the housing (4), and the air outlet of the cooling fan (5) faces the cooling base (3). The side wall of the housing (4) is provided with an air inlet, and the air inlet of the cooling fan (5) is aligned with the air inlet. The inner side wall of the housing (4) is fixedly provided with a support base (51), and the cooling fan (5) is fixedly mounted on the support base (51).

5. The capacitive heat spreading structure according to any one of claims 1 to 3, wherein, The heat dissipation fins (32) are arc-shaped fins that protrude from the outer side of the heat dissipation base (3), and all the heat dissipation fins (32) are evenly distributed along the thickness direction of the heat dissipation base (3).

6. The capacitive heat spreading structure according to any one of claims 1 to 3, wherein, The heat sink (3) has a first circuit board (6) and a second circuit board (7) fixedly mounted on its two opposite sides, and at least one of the first circuit board (6) and the second circuit board (7) is fixedly connected to the heat sink (3).

7. The capacitive heat spreading structure of claim 6, wherein, At least one side of the heat sink (3) is provided with a screw hole (33) for fixing the first circuit board (6) and / or the second circuit board (7).

8. The capacitor heat dissipation structure according to claim 6, characterized in that, The first circuit board (6) is parallel to the second circuit board (7), and a plurality of support columns (8) are fixed between the first circuit board (6) and the second circuit board (7).

9. The capacitive heat spreading structure according to any one of claims 1 to 3, wherein, The opening of the box (4) is detachably covered with a box cover (9).

10. A photovoltaic inverter, characterized by Includes the capacitor heat dissipation structure according to any one of claims 1 to 9.

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