An adapter plate and test equipment

Abstract

This utility model discloses an adapter board and testing equipment. The adapter board includes a circuit board with multiple adapter pads for electrical connection with a POGOPIN connector. The distance between each adapter pad and adjacent adapter pads or adjacent electronic components is not less than the electrical clearance. Each adapter pad is elliptical in shape. Because the elliptical adapter pads on the adapter board have a relatively large area, while meeting the electrical clearance requirement, the allowable offset distance of the POGOPIN on the adapter pad is increased. This reduces the probability of poor contact due to POGOPIN misalignment when the adapter pad and POGOPIN are connected, thus increasing the probability of reliable contact. This improves the accuracy of the test results and increases the testing efficiency. Furthermore, it has the advantages of simple structure and ease of implementation.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an adapter board and testing equipment. Background Technology

[0002] POGOPIN connectors are precision connectors widely used in electronic product testing equipment. They enable the transmission of power, control, and test signals between the test board and the product under test (DUT). The application of POGOPIN connectors in testing equipment typically requires an adapter board to convert the POGOPIN connector to a suitable connection method with the DUT.

[0003] The connection between existing POGOPIN connectors and adapter boards is limited by the space constraints of testing equipment, preventing them from being made very large. Therefore, the circular pads on the adapter board that connect to the POGOPIN cannot be designed to be large, causing the POGOPIN to deviate from the pad position during connection, resulting in poor contact. Furthermore, during adapter board manufacturing, ink may protrude above the pad contact surface; in this case, POGOPIN misalignment can cause the pin to bend, leading to poor contact. Additionally, adapter board designs often do not consider flatness; tilting the adapter board can cause the POGOPIN pin to bend during connection, resulting in poor contact. Utility Model Content

[0004] To address the aforementioned shortcomings, the technical problem to be solved by this utility model is to provide an adapter board and a testing device, wherein the pad area on the adapter board is large enough to ensure reliable contact and conduction between the POGOPIN and the pad, thereby ensuring the accuracy of the test results.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0006] An adapter board includes a circuit board with a plurality of adapter pads for electrical connection with a POGOPIN connector. The spacing between each adapter pad and an adjacent adapter pad or an adjacent electronic component is not less than the electrical clearance. Each adapter pad is elliptical in shape.

[0007] In a preferred embodiment, the circuit board is further provided with a solder resist layer, and the filling surface of the solder resist layer and the contact surface of the adapter pad are located on the same plane.

[0008] In a preferred embodiment, the circuit board is further provided with a solder resist layer, and at least the filling surface of the solder resist layer surrounding the adapter pad is located on the same plane as the contact surface of the adapter pad.

[0009] In a preferred embodiment, the circuit board is further provided with a flattening structure, which is located on the back of the adapter pad, and the flattening structure is used to make the back of the adapter pad lie on the same plane.

[0010] In a preferred embodiment, the flat structure is a metal substrate.

[0011] In a preferred embodiment, the metal substrate covers at least the projected area of ​​all the transition pads.

[0012] Preferably, the metal substrate is made of stainless steel.

[0013] In a preferred manner, all the adapter pads are arranged according to the pin positions of the POGOPIN connector.

[0014] The preferred arrangement is that all the adapter pads are evenly arranged.

[0015] A testing device comprising the aforementioned adapter board.

[0016] The beneficial effects of this utility model after adopting the above technical solution are:

[0017] The adapter board and testing equipment of this utility model include a circuit board with multiple adapter pads for electrical connection with POGOPIN connectors. The spacing between each adapter pad and adjacent adapter pads or adjacent electronic components is not less than the electrical clearance. Each adapter pad is elliptical in shape. Because the elliptical adapter pads on the adapter board have a relatively large area, while meeting the electrical clearance requirement, the allowable offset distance of the POGOPIN on the adapter pads is increased. This ensures reliable contact between the adapter pads and the POGOPIN during connection, reducing the probability of poor contact due to POGOPIN misalignment. This improves the accuracy of the test results and increases testing efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the adapter pads on the adapter board in the embodiment;

[0019] Figure 2 This is a schematic diagram of the structure of a transition plate in the prior art;

[0020] Figure 3 This is a schematic diagram of the structure of the adapter plate in this utility model;

[0021] Figure 4 This is a comparative diagram of circular transition pads and elliptical conversion pads;

[0022] In the diagram: 1-Circuit board, 2-Adapter pad, 3-Solder resist layer, 4-Metal substrate. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] It should be noted that in the description of this utility model, the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model.

[0025] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] like Figure 1 and Figure 3 As shown, according to an embodiment of the first aspect of the present invention, the adapter board includes a circuit board 1, on which a plurality of adapter pads 2 are provided. The adapter pads 2 are used for electrical connection with a POGOPIN connector. The distance between each adapter pad 2 and the adjacent adapter pad 2 is not less than the electrical clearance, or the distance between each adapter pad 2 and the adjacent electronic component is not less than the electrical clearance. The shape of each adapter pad 2 is elliptical.

[0027] It should be noted that when the adapter pad 2 is elliptical, each adapter pad 2 needs to meet the following requirements when arranging the circuit board 1: Figure 1 In this context, b and c must be no less than the electrical clearance. The electrical clearance refers to the shortest spatial distance measured between two conductive parts or between a conductive part and the protective interface of the equipment, and is typically no less than 0.075 mm.

[0028] like Figure 1 and Figure 3As shown, when the adapter board of this utility model is put into use, because the area of ​​the adapter pad 2 on the adapter board is relatively large, while meeting the electrical clearance requirements, it increases the allowable offset distance of the POGOPIN on the adapter pad 2, thereby increasing the probability of reliable contact. This reduces the likelihood of poor contact caused by POGOPIN misalignment when the adapter plate and POGOPIN are connected, thus improving the accuracy of test results, increasing test efficiency, and improving the efficiency of the connection between the adapter board and the POGOPIN connector. Furthermore, when the adapter pad 2 is set to a regular shape such as an ellipse, the manufacturing of the circuit board 1 can be reduced and simplified, lowering costs.

[0029] In some embodiments of this invention, all the adapter pads 2 are arranged according to the pin positions of the POGOPIN connector. Of course, the adapter pads 2 are not limited to an elliptical shape, as long as the electrical clearance is met. The adapter pads 2 can be set to any shape, as long as the area is large enough to increase the allowable offset distance when the POGOPIN is bonded.

[0030] like Figure 4 As shown, compared with the circular pads in the prior art, the shaded area represents the additional offset distance of the elliptical pads in this invention. The elliptical pads allow for a larger allowable deviation of the POGOPIN in all directions except the vertical direction, thereby reducing the probability of poor bonding caused by POGOPIN offset.

[0031] In some embodiments of this utility model, a solder resist layer 3 is further provided on the circuit board 1, and the filling surface of the solder resist layer 3 and the contact surface of the adapter pad 2 are located on the same plane; wherein the solder resist layer 3 can also be referred to as an ink layer.

[0032] When fabricating the adapter board, if the solder mask layer 3 around the adapter pad 2 is higher than the adapter pad 2, that is, if the filling surface of the solder mask layer 3 and the contact surface of the adapter pad 2 are not on the same plane, please refer to [reference needed]. Figure 2 When the POGOPIN is misaligned, it can cause the pin to bend, leading to poor contact. The adapter board of this invention (see [link to related documentation]) Figure 3 Because the contact surface of the adapter pad 2 and the filling surface of the solder mask layer 3 are on the same plane, the POGOPIN will not bend when it is offset, thus ensuring good contact between the POGOPIN and the adapter pad 2.

[0033] In some embodiments of this utility model, at least the filler surface of the solder mask layer 3 surrounding the adapter pad is located on the same plane as the contact surface of the adapter pad 2, so as to meet other design requirements of the adapter board.

[0034] In some other embodiments of this invention, the filling surface of the solder mask layer 3 on the adapter board and the contact surface of the adapter pad 2 are located on the same plane. This design simplifies the manufacturing of the adapter board and reduces costs.

[0035] like Figure 3 As shown, in some embodiments of this utility model, a flat structure is also provided on the circuit board 1. The flat structure is located on the back of the adapter pad 2. The flat structure is used to make the back of the adapter pad 2 lie on the same plane.

[0036] In this invention, the flat structure is a metal substrate 4. In a preferred embodiment, the metal substrate 4 is made of stainless steel. This metal substrate 4 not only ensures the flatness of the back of the adapter pad 2 on the adapter board, but also improves the structural strength, making it less prone to bending when the POGOPIN is connected to the adapter pad 2, thus maintaining good contact. Of course, the metal substrate 4 is not limited to the stainless steel material listed above.

[0037] In some embodiments of this utility model, the metal substrate 4 covers at least the orthographic projection area of ​​all the adapter pads 2. In other embodiments, the metal substrate 4 can cover the entire surface of the circuit board 1. For example, when the circuit board 1 is a single-sided board, the metal substrate 4 can be fully covered on the back of the single-sided board.

[0038] In summary, the adapter board of this utility model increases the allowable offset distance of the POGOPIN on the pad by designing the circular adapter pad 2 as an elliptical adapter pad 2, thereby reducing the probability of poor contact caused by POGOPIN misalignment. During the fabrication of the adapter board, ensuring that the contact surface of the adapter pad 2 and the filling surface of the solder mask layer 3 are on the same plane can prevent the pin from bending when the POGOPIN is misaligned. At the same time, the metal substrate 4 provided on the back of the adapter pad 2 of the circuit board 1 ensures the flatness of the circuit board 1 and prevents the pin from bending when the POGOPIN is connected.

[0039] According to an embodiment of the second aspect of the present invention, the testing equipment includes the adapter plate of the first aspect of the present invention.

[0040] When the testing equipment of this utility model is used for product testing, the adapter board can make good contact with the POGOPIN connector, thereby ensuring the accuracy of the test results and indirectly improving the testing efficiency.

[0041] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, improvements to equivalent adapter boards and testing equipment made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An adapter board comprising a circuit board having a plurality of adapter pads disposed thereon, the adapter pads being configured to electrically connect with a POGOPIN connector, characterized in that, The distance between each adapter pad and an adjacent adapter pad or adjacent electronic component is not less than the electrical clearance, and each adapter pad is elliptical in shape.

2. The adapter plate of claim 1, wherein, The circuit board is also provided with a solder mask layer, and the filling surface of the solder mask layer and the contact surface of the adapter pad are located on the same plane.

3. The adapter board according to claim 1, characterized in that, The circuit board is also provided with a solder mask layer, and at least the filling surface of the solder mask layer surrounding the adapter pad is located on the same plane as the contact surface of the adapter pad.

4. The adapter plate of claim 1, wherein, The circuit board is also provided with a flattening structure, which is located on the back of the adapter pad. The flattening structure is used to make the back of the adapter pad lie on the same plane.

5. The adapter plate of claim 4, wherein, The flat structure is a metal substrate.

6. The adapter plate of claim 5, wherein, The metal substrate at least covers the projected area of ​​all the adapter pads.

7. The adapter plate of claim 5, wherein, The metal substrate is made of stainless steel.

8. The adapter plate of claim 1, wherein, All the aforementioned adapter pads are arranged according to the pin positions of the POGOPIN connector.

9. The adapter plate of claim 1, wherein, All the aforementioned adapter pads are evenly arranged.

10. A testing device, characterized in that, Includes the adapter plate as described in any one of claims 1 to 9.

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