Electrical connectors and high-speed connectors

Abstract

This utility model discloses an electrical connector and a high-speed connector, relating to the field of connector technology. The electrical connector includes a PCB body, solder pads, and a grounding structure. The PCB body has a height direction; the solder pads are disposed on one surface of the PCB body and are used for soldering connections to the conductors of connecting lines; the grounding structure is disposed on the PCB body and is offset from the solder pads in the height direction. The electrical connector provided by this utility model aims to prevent interference and compression between the grounding structure and the connecting lines.

Description

Technical Field

[0001] This utility model relates to the field of connector technology, and in particular to an electrical connector and a high-speed connector. Background Technology

[0002] In high-speed PCB design, the core purpose of optimizing the grounding structure is to solve key problems in high-speed signals and complex systems, and to ensure system stability and performance.

[0003] In existing electrical connectors, the grounding structure is usually located outside the solder pad. When soldering the connecting wire and the solder pad, the connecting wire may interfere with and be squeezed by the grounding structure, resulting in abnormal SI impedance test. Utility Model Content

[0004] The main purpose of this invention is to provide an electrical connector and a high-speed connector designed to prevent interference and compression between the grounding structure and the connecting wires.

[0005] To achieve the above objectives, the present invention proposes an electrical connector comprising a PCB body, solder pads, and a grounding structure. The PCB body has a height direction; the solder pads are disposed on one surface of the PCB body and are used for soldering connections with the wire cores of connecting lines; the grounding structure is disposed on the PCB body and is offset from the solder pads in the height direction.

[0006] In one embodiment, the electrical connector further includes a protrusion disposed on one end face of the PCB body, and the grounding structure is disposed on one side of the protrusion.

[0007] In one embodiment, there are two grounding structures, which are respectively disposed on opposite sides of the protrusion in the height direction.

[0008] In one embodiment, the connecting wire includes a wire core, an outer insulating layer, and an inner insulating layer. The outer insulating layer is sleeved outside the inner insulating layer, and the inner insulating layer is sleeved outside the wire core. The inner insulating layer abuts against the end face of the PCB body.

[0009] In one embodiment, the outer periphery of the outer insulating layer is attached to the grounding structure.

[0010] In one embodiment, the ratio of the length of the protrusion to the length of the PCB body is greater than or equal to 0.03 and less than or equal to 0.24.

[0011] In one embodiment, the grounding structure is located inside the PCB body, with a portion of the grounding structure exposed outside the PCB body for grounding connection.

[0012] In one embodiment, the grounding structure is arranged parallel to the pad.

[0013] In one embodiment, the ratio between the welding length of the wire core to the pad and the length of the pad is greater than or equal to 0.6 and less than or equal to 0.9.

[0014] This invention also proposes a high-speed connector, including the electrical connector described above.

[0015] The electrical connector proposed in this utility model includes a PCB body, solder pads, and a grounding structure. The PCB body has a height direction, and the solder pads are located on one surface of the PCB body. The solder pads are used to solder the wire cores of the connecting lines. The grounding structure and the solder pads are staggered in the height direction. The spatial staggered design eliminates the physical interference between the grounding structure and the connecting lines, which avoids interference and squeezing between the connecting lines and the grounding structure, thereby improving the soldering quality and signal integrity. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the electrical connector provided by this utility model;

[0018] Figure 2 This is a schematic diagram of another embodiment of the electrical connector provided by this utility model.

[0019] Explanation of icon numbers:

[0020] 100. Electrical connector; 10. PCB body; 20. Solder pad; 30. Grounding structure; 40. Connecting wire; 411. Inner insulation layer; 412. Outer insulation layer; 42. Wire core; 50. Protrusion.

[0021] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0023] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0025] In high-speed PCB design, the core purpose of optimizing the grounding structure is to solve key problems in high-speed signals and complex systems, and to ensure system stability and performance.

[0026] In existing electrical connectors, the grounding structure is usually located outside the solder pad. When soldering the connecting wire and the solder pad, the connecting wire may interfere with and be squeezed by the grounding structure, resulting in abnormal SI impedance test.

[0027] This invention proposes an electrical connector and a high-speed connector, designed to prevent interference and compression between the grounding structure and the connecting wire.

[0028] Please see Figure 1 and Figure 2In one embodiment of the present invention, the electrical connector 100 includes a PCB body 10, a solder pad 20, and a grounding structure 30. The PCB body 10 has a height direction. The solder pad 20 is disposed on a surface of the PCB body 10 and is used to solder to the wire core 42 of the connecting line 40. The grounding structure 30 is disposed on the PCB body 10 and is offset from the solder pad 20 in the height direction.

[0029] In this embodiment, the PCB body 10 has a defined height extension direction, and the pads 20 are fixed to the surface area of ​​the body, specifically for soldering the wire cores 42 of the connecting lines 40. The grounding structure 30 is disposed inside or on the surface of the PCB body 10, and its spatial position forms a non-overlapping arrangement with the pads 20 in the height direction.

[0030] The pads 20 and the grounding structure 30 are staggered along the height of the PCB body 10. During PCB lamination, the embedding position of the grounding structure 30 is pre-planned to create a height difference between it and the surface pads 20. When the connecting line 40 is soldered to the pads 20, its insulating sheath maintains a safe distance from the plane of the grounding structure 30 along its height direction. This spatial isolation design ensures that the connecting line 40 does not come into contact with the grounding structure 30 during soldering, thereby maintaining the integrity of the signal transmission path.

[0031] The electrical connector 100 proposed in this utility model includes a PCB body 10, a solder pad 20, and a grounding structure 30. The PCB body 10 has a height direction, and the solder pad 20 is disposed on one surface of the PCB body 10. The solder pad 20 is used to solder and connect with the wire core 42 of the connecting line 40. The grounding structure 30 and the solder pad 20 are staggered in the height direction. The spatial staggered design eliminates the physical interference between the grounding structure 30 and the connecting line 40, which avoids interference and squeezing between the connecting line 40 and the grounding structure 30, thereby improving the soldering quality and signal integrity.

[0032] In an embodiment of this utility model, the electrical connector 100 further includes a protrusion 50, which is disposed on one end face of the PCB body 10, and the grounding structure 30 is disposed on one side of the protrusion 50.

[0033] In this embodiment, the protrusion 50 refers to a block-shaped or strip-shaped structure extending horizontally from the end face of the PCB body 10. Specifically, it can be implemented using a copper substrate integrally formed with the PCB body 10 or a metal sheet fixed by welding. Its function is to provide an independent mounting surface for the grounding structure 30 to avoid spatial overlap with the pad 20. The grounding structure 30 refers to a conductive component used to achieve circuit grounding. Specifically, it can be implemented using metal foil, conductive coating, or embedded copper layer. Its function is to form a stable grounding loop by contacting the outer insulation layer 412 of the connecting line 40.

[0034] In an embodiment of this utility model, there are two grounding structures 30, which are respectively disposed on opposite sides of the protrusion 50 in the height direction.

[0035] In this embodiment, the two grounding structures 30 are respectively provided on opposite sides of the protrusion 50 in the height direction. Which grounding structure 30 can be selected to be used as needed, so that the grounding structure 30 and the pad 20 are separated in three-dimensional space, and the welding path of the connecting line 40 and the contact area of ​​the grounding structure 30 form a non-overlapping three-dimensional arrangement, fundamentally eliminating the risk of physical interference between the two.

[0036] In an embodiment of this utility model, the connecting wire 40 includes a wire core 42, an outer insulation layer 412 and an inner insulation layer 411. The outer insulation layer 412 is sleeved outside the inner insulation layer 411, and the inner insulation layer 411 is sleeved outside the wire core 42. The inner insulation layer 411 abuts against the end face of the PCB body 10.

[0037] In this embodiment, the wire core 42 refers to the conductive part of the connecting wire 40 used for transmitting electrical signals. It can be made of copper or tin-plated copper and is directly soldered to the pad 20 to achieve electrical connection. The outer insulation layer 412 is an insulating protective layer wrapped around the inner insulation layer 411. It can be made of polyvinyl chloride or polytetrafluoroethylene and is used to prevent physical damage to the inner insulation layer 411 and the wire core 42 from the external environment. The inner insulation layer 411 is an insulating layer wrapped around the wire core 42 and can be made of polyimide or polyethylene. The inner insulation layer 411 abutting against the end face of the PCB body 10 solves the problem of insulation layer deformation caused by interference from the grounding structure 30 during the soldering of the connecting wire 40. Simultaneously, the contact between the inner insulation layer 411 and the PCB end face enhances the structural stability of the connecting wire 40 after soldering and reduces the risk of short circuits during signal transmission.

[0038] In an embodiment of this utility model, the outer periphery of the outer insulating layer 412 is attached to the grounding structure 30.

[0039] In this embodiment, when the connecting line 40 is assembled to the PCB body 10, the end face of its inner insulating layer 411 contacts the end face of the PCB body 10 to form a limit, and the outer insulating layer 412 maintains surface contact with the grounding structures 30 on both sides of the protrusion 50 through its outer periphery. This structure allows the outer insulating layer 412 to be directly constrained by the grounding structure 30, preventing the connecting line 40 from undergoing lateral displacement during the soldering process. At the same time, the supporting effect of the grounding structure 30 on the outer insulating layer 412 can limit the deformation range of the connecting line 40 in the height direction.

[0040] In an embodiment of this utility model, the ratio of the length of the protrusion 50 to the length of the PCB body 10 is greater than or equal to 0.03 and less than or equal to 0.24.

[0041] In this embodiment, the ratio of the length of the protrusion 50 to the length of the PCB body 10 is greater than or equal to 0.03 and less than or equal to 0.24, such as 0.03, 0.09, 0.15, 0.18, 0.24 or any value within the above range. The length of the protrusion 50 should not be too small, otherwise the length of the protrusion 50 will be insufficient, which will in turn lead to insufficient length of the grounding structure 30 and affect the grounding effect. The length of the protrusion 50 should also not be too large, otherwise the electrical connector 100 will occupy too large an area and will not be compact enough, affecting the arrangement of other electrical components.

[0042] In an embodiment of this utility model, the grounding structure 30 is disposed inside the PCB body 10, and part of the grounding structure 30 is exposed outside the PCB body 10 for grounding connection.

[0043] In this embodiment, the grounding structure 30 is embedded to avoid overlapping with the pad 20 in the height direction, so that the connecting line 40 will not cause spatial interference with the grounding structure 30 when soldering. Part of the exposed area of ​​the grounding structure 30 is set on the side wall or end face of the PCB body 10 and connected to the external grounding path by surface mounting or crimping.

[0044] In an embodiment of this utility model, the grounding structure 30 is arranged parallel to the pad 20.

[0045] In this embodiment, the grounding structure 30 is located inside the PCB body 10 and partially exposed, while remaining parallel to the pad 20. This parallel relationship ensures that when the connecting line 40 is soldered to the pad 20, it avoids physical contact or compression with the grounding structure 30, thereby eliminating signal integrity abnormalities caused by structural interference. By maintaining the grounding structure 30 and the pad 20 in the same direction of extension, the uniformity of the electromagnetic field distribution is further ensured, reducing impedance discontinuities in the signal transmission path.

[0046] In an embodiment of this utility model, the ratio between the welding length of the wire core 42 and the solder pad 20 and the length of the solder pad 20 is greater than or equal to 0.6 and less than or equal to 0.9.

[0047] In this embodiment, the ratio between the welding length of the wire core 42 and the pad 20 and the length of the pad 20 is greater than or equal to 0.6 and less than or equal to 0.9, for example, 0.6, 0.7, 0.8, 0.9, or any value within the above range. The welding length should not be too large, as this will affect the resistance and thus the signal transmission. Conversely, the welding length should not be too small, as this will result in insufficient strength of the welding connection between the connecting wire 40 and the pad 20, affecting its use.

[0048] This utility model also proposes a high-speed connector including the electrical connector 100 as described above.

[0049] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. An electrical connector (100), characterized in that, include: PCB body (10), the PCB body (10) having a height direction; The pad (20) is disposed on one surface of the PCB body (10) and is used to solder to the core (42) of the connecting line (40); as well as A grounding structure (30) is provided on the PCB body (10), and the grounding structure (30) and the pad (20) are offset in the height direction.

2. The electrical connector (100) of claim 1, wherein, The electrical connector (100) further includes a protrusion (50) located on one end face of the PCB body (10), and the grounding structure (30) located on one side of the protrusion (50).

3. The electrical connector (100) of claim 2, wherein, The number of grounding structures (30) is two, and the two grounding structures (30) are respectively provided on opposite sides of the protrusion (50) in the height direction.

4. The electrical connector (100) of claim 3, wherein, The connecting line (40) includes a wire core (42), an outer insulation layer (412), and an inner insulation layer (411). The outer insulation layer (412) is sleeved outside the inner insulation layer (411), and the inner insulation layer (411) is sleeved outside the wire core (42). The inner insulation layer (411) abuts against the end face of the PCB body (10).

5. The electrical connector (100) as claimed in claim 4, characterized in that, The outer periphery of the outer insulation layer (412) is attached to the grounding structure (30).

6. The electrical connector (100) of claim 5, wherein, The ratio of the length of the protrusion (50) to the length of the PCB body (10) is greater than or equal to 0.03 and less than or equal to 0.

24.

7. The electrical connector (100) of claim 1, wherein, The grounding structure (30) is located inside the PCB body (10), and part of the grounding structure (30) is exposed outside the PCB body (10) for grounding connection.

8. The electrical connector (100) of claim 7, wherein, The grounding structure (30) is arranged in parallel with the pad (20).

9. The electrical connector (100) according to any one of claims 1 to 8, characterized in that The ratio between the welding length of the wire core (42) and the solder pad (20) and the length of the solder pad (20) is greater than or equal to 0.6 and less than or equal to 0.

9.

10. A high speed connector characterized by, Includes the electrical connector (100) as described in any one of claims 1 to 9.

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