A high-performance integrated intelligent BDU

Abstract

A high-performance integrated intelligent BDU includes a lower housing and an upper housing connected by snap-fit. The bottom of the lower housing is integrally injection molded and insulatedly spaced with a first conductive connection bar, a second conductive connection bar, a third conductive connection bar, a shunt body, a first accommodating chamber, a second accommodating chamber, and at least one heat dissipation structure. A main positive contactor and a main negative contactor are respectively disposed in the first and second accommodating chambers in an inverted manner with their housings removed. A passive excitation fuse, the main positive contactor, and the main negative contactor are electrically connected to the first, second, and third conductive connection bars, the shunt body, and the BDU board, respectively. Through integrated design, intelligent control with multiple functions such as intelligent detection and control, overload and short-circuit protection, and measurement is achieved, meeting the requirements of miniaturization, lightweighting, and low cost.

Description

Technical Field

[0001] This invention relates to the field of power battery technology, and in particular to a high-performance integrated intelligent battery duplex (BDU). Background Technology

[0002] Currently, battery disconnect units (BDUs) used in electric vehicles and other applications are mostly assembled, using screws and other fasteners to install and fix copper busbars and components. High-voltage and low-voltage wiring harnesses are used for high-voltage sampling and low-voltage control, and air cooling is the primary method of heat dissipation. To ensure requirements for current carrying capacity, heat dissipation, and insulation distance, this type of BDU requires increasing the cross-sectional area of ​​the copper busbars, increasing the insulation distance, and using larger-sized components to achieve the expected performance indicators. Therefore, it suffers from disadvantages such as heavy weight, large size, poor heat dissipation, and high cost, making it unsuitable for current DC 800V platforms, high-current charging and discharging, and large-scale mass production. In addition, the control section of the BDU is often arranged in a separate unit, which further increases the installation space requirements and the complexity of installation and use. Summary of the Invention

[0003] The purpose of this invention is to propose a high-performance integrated intelligent BDU, which integrates the main positive contactor, main negative contactor, passive excitation fuse and shunt into a single injection-molded lower housing through an integrated design, thereby achieving the goals of lightweighting and miniaturization.

[0004] To achieve the above objectives, the present invention provides a high-performance integrated intelligent BDU, comprising a lower housing and an upper housing connected by snap-fit. The bottom of the lower housing is integrally injection molded with a first conductive connecting bar, a second conductive connecting bar, a third conductive connecting bar, and a shunt body, all separated by an insulating gap. A first receiving chamber and a second receiving chamber are integrally formed on the bottom of the lower housing at opposite ends of the first and second conductive connecting bars and at opposite ends of the third conductive connecting bar and the shunt body, respectively. A main positive contactor and a main negative contactor are respectively disposed in the first and second receiving chambers in an inverted manner with their outer shells removed. The stationary contact of the main positive contactor is electrically connected to one end of the first and second conductive connecting bars located in the first receiving chamber, and the stationary contact of the main negative contactor is electrically connected to one end of the first and second conductive connecting bars located in the first receiving chamber, respectively. The third conductive connection bar in the second accommodating chamber and one end of the shunt body are electrically connected. The ends of the second and third conductive connection bars that are not connected to the main positive contactor and the main negative contactor serve as the connection terminals of the integrated intelligent BDU. One terminal of the passive excitation fuse is electrically connected to the first conductive connection bar, and the other terminal serves as the positive electrode connection terminal connected to the positive terminal of the power supply. The other end of the shunt body that is not connected to the main negative contactor serves as the negative terminal connection terminal of the power supply. The BMU board is disposed on the lower housing. A temperature sampling module is disposed on the shunt body to form a shunt. The signal receiving terminal of the passive excitation fuse, the power supply connection terminals of the drive coils of the main positive contactor and the main negative contactor, the signal sampling area of ​​the shunt body, and the temperature sampling module are respectively electrically connected to the BMU board.

[0005] Preferably, at least one heat dissipation structure is integrally injection molded on the lower housing, and the heat dissipation structure is connected to at least one of the first conductive connection bar, the second conductive connection bar, the third conductive connection bar, the positive terminal of the power supply, and the negative terminal of the power supply.

[0006] Preferably, a first heat dissipation structure, a second heat dissipation structure, and a third heat dissipation structure are respectively provided on the bottom of the lower housing between the positive power connection terminal and the first accommodating chamber and the second accommodating chamber. The positive power connection terminal is fixedly disposed on the first heat dissipation structure, and the second heat dissipation structure and the third heat dissipation structure are respectively fixedly connected to the second conductive connection bar and the third conductive connection bar located outside the first accommodating chamber and the second accommodating chamber.

[0007] Preferably, a thermal pad is provided at any of the heat dissipation structures, the first conductive connection bar, the second conductive connection bar, the third conductive connection bar, and the shunt body exposed on the bottom outer surface of the lower housing.

[0008] Preferably, an insulating film is provided between the thermal pad and the bottom outer surface of the lower housing.

[0009] Preferably, the connection end of the passive excitation fuse is bent and then electrically connected to the first conductive connection bar.

[0010] Preferably, welding holes are provided on the first conductive connection bar, the second conductive connection bar, the third conductive connection bar, and the shunt body, and welding bosses are provided on the connection end of the passive excitation fuse, the stationary contact of the main positive contactor and the main negative contactor, respectively. The welding bosses are connected to the outer peripheral surface of the welding holes by welding.

[0011] Preferably, a first electromagnetic shielding component and a second electromagnetic shielding component are respectively provided on the inner and outer sides of the BMU board. The first electromagnetic shielding component is provided on the lower housing by a snap-fit ​​connection, and the second electromagnetic shielding component is nested on the upper housing by an integral injection molding method.

[0012] Preferably, a grounding conductive bus is integrally injection molded on the lower housing, and the grounding conductive bus is electrically connected to the first electromagnetic shield and the second electromagnetic shield respectively.

[0013] Preferably, the end of the grounding busbar that is conductively connected to the first electromagnetic shield and the second electromagnetic shield is provided with a first branch end and a second branch end, the first branch end being conductively connected to the first electromagnetic shield; the second branch end is provided with an elastic protrusion structure, which makes conductive contact with the second electromagnetic shield through the elastic protrusion structure.

[0014] Preferably, the elastic protrusion structure is located in the opening groove of the lower housing, and a wedge-shaped guide surface is provided in the opening groove. The elastic protrusion structure is disposed opposite to the wedge-shaped guide surface. A spring is provided on the second electromagnetic shielding member, and the spring is inserted into the opening groove along the wedge-shaped guide surface and makes conductive contact with the elastic protrusion structure.

[0015] Preferably, a high-voltage power supply bus is integrally injection molded on the lower housing. One end of the high-voltage power supply bus is conductively connected to one end of the passive excitation fuse as the positive terminal of the power supply, and the other end is conductively connected to the BMU board. The high-voltage power supply bus supplies power to the main positive contactor and the main negative contactor.

[0016] Preferably, the outer periphery of the grounding conductor and the high-voltage power supply conductor where no conductive connection is required is integrally injection molded and covered with an insulating layer, and positioning holes are reserved; the grounding conductor and the high-voltage power supply conductor with the insulating layer are integrally injection molded in the bottom of the lower housing.

[0017] Preferably, a terminal block is provided on the bottom of the lower housing as the negative terminal of the power supply, and the terminal block is electrically connected to the end of the shunt body that is not connected to the main negative contactor.

[0018] Preferably, the temperature sampling module includes a first mounting bracket and a second mounting bracket. The first mounting bracket has a signal connection terminal of the temperature sampling module integrally injection molded on it. The second mounting bracket has a conductive stud integrally injection molded on it. The second mounting bracket is mounted on the first mounting bracket by a snap-fit ​​connection. A thermistor is disposed between the first mounting bracket and the second mounting bracket. The two ends of the thermistor are conductively connected to the signal connection terminal through wires. The signal connection terminal is conductively connected to the BMU through a conductive sheet.

[0019] Preferably, a plurality of high-voltage shielding rails are provided on the upper and lower housings in a snap-fit ​​connection manner, and the high-voltage shielding rails cover one end of the main positive contactor, the main negative contactor, and the second and third conductive connection bars between the main positive and main negative contactors.

[0020] Preferably, mounting nesting members for connection and installation are integrally injection molded at at least four corners of the lower housing, and the mounting nesting members penetrate the bottom of the lower housing.

[0021] Preferably, the signal receiving end of the passive excitation fuse, the power supply connection end of the drive coil of the main positive contactor and the main negative contactor, the signal sampling area of ​​the shunt body, and the temperature sampling module are all electrically connected to the BMU board through conductive sheets.

[0022] By separating the contactor from its outer casing and sharing a housing with the lower casing, the BMU and BDU are integrated into a single unit, further reducing the overall size and material usage, thus lowering costs. Furthermore, by removing the outer casing from the contactor and installing it upside down, using integrated injection molding of the conductive connector and the lower casing, and employing bottom heat dissipation, the cross-section of the conductive connector and the contactor specifications are reduced. Finally, through integrated injection molding, solid insulation is formed at the gaps between components requiring insulation, further reducing insulation distance and lowering weight and volume.

[0023] This solution uses passive excitation fuses, which can achieve integrated active and passive protection. It is suitable for DC1000V high-voltage platforms and fast charging (with external liquid cooling). The whole machine uses laser welding and snap-fit ​​connection, which improves reliability and is also suitable for mass automated production.

[0024] Electromagnetic shielding components are used to reduce interference from various components and the external environment to the BMU.

[0025] A heat dissipation structure is integrally injection molded on the lower shell, which dissipates heat quickly. An insulating heat dissipation pad is set at the bottom of the heat dissipation structure, which can dissipate heat quickly while ensuring insulation performance.

[0026] By setting a first electromagnetic shielding layer, the electromagnetic interference from various components installed on the lower housing to the BMU board inside the housing is shielded by the second electromagnetic shielding layer, and at the same time, electrostatic interference is eliminated by the grounding busbar. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the external structure of the integrated intelligent BDU.

[0028] Figure 2 This is a schematic diagram of the lower shell and components after removing the upper shell.

[0029] Figure 3 This is a schematic diagram of the lower shell structure from the BMU direction.

[0030] Figure 4 This is a top view of the lower housing after it has been injection molded as a single unit, before all components are installed.

[0031] Figure 5 yes Figure 1 Exploded view of the structure.

[0032] Figure 6 This is a schematic cross-sectional view of the lower shell along its length.

[0033] Figure 7 This is a schematic diagram of the grounding conductor bus structure.

[0034] Figure 8 This is a schematic diagram of the connection between the grounding conductor and the first electromagnetic shield.

[0035] Figure 9 This is a schematic diagram of the structure of the grounding conductive busbar and the spring of the second electromagnetic shield.

[0036] Figure 10 This is a schematic diagram of the high-voltage power supply busbar.

[0037] Figure 11 This is a schematic diagram of the structure with BMU fixing buckle 32 on the side of the lower housing.

[0038] Figure 12 This is a schematic diagram of the structure with BMU positioning posts 33 on the side of the lower housing.

[0039] Figure 13 This is a schematic diagram of the temperature sampling module.

[0040] Figure 14This is a schematic diagram of the temperature sampling module from another perspective.

[0041] Figure 15 This is a schematic diagram of the upper shell structure.

[0042] Figure 16 This is a schematic diagram of the main positive / main negative contactor structure with the outer casing removed.

[0043] Figure 17 This is a schematic diagram of a passively activated fuse.

[0044] Figure 18 This is a schematic diagram of the main structure of the splitter.

[0045] Figure Labels

[0046] 1. Lower housing; 2. Upper housing; 3. Main positive contactor; 4. Main negative contactor; 5. Passive excitation fuse; 6. Shunt body; 7. BMU; 8. Thermally conductive insulating pad; 9. Temperature sampling module; 10. First electromagnetic shield; 11. Second electromagnetic shield; 12. Nested mounting component; 14. First heat sink; 15. Second heat sink; 16. Third heat sink; 17. Grounding busbar; 18. High-voltage power supply busbar; 19. Terminal block; 20. Spring; 21. First high-voltage barrier; 22. Second high-voltage barrier; 23. Third high-voltage barrier; 24. First mounting bracket; 25. Second mounting bracket; 26, 27. Signal connection terminals; NT C Thermistor 28, Welding stud 29, First accommodating chamber 30, Second accommodating chamber 31, BMU fixing buckle 32, BMU positioning post 33, Wedge-shaped guide surface 34, Buckle structure 35, Conductive sheet 36, Power positive terminal connection 37, Connecting protrusion 38, Resistance alloy area 61, Current bus 62, Signal sampling area 63, Welding holes (64, 65, 66), First conductive connection bus 131, Second conductive connection bus 132, Third conductive connection bus 133, First branch connection end 171, Second branch connection end 172, Elastic protrusion structure 173, Welding hole 1311. Detailed Implementation

[0047] The high-performance integrated intelligent BDU of the present invention includes a lower housing and an upper housing connected by snap-fit. The bottom of the lower housing is integrally injection molded and insulatedly spaced with a first conductive connecting bar, a second conductive connecting bar, a third conductive connecting bar, and a shunt body. A first receiving chamber and a second receiving chamber are integrally formed on the bottom of the lower housing at opposite ends of the first and second conductive connecting bars and at opposite ends of the third conductive connecting bar and the shunt body, respectively. A main positive contactor and a main negative contactor are respectively disposed in the first and second receiving chambers in an inverted manner with the outer shell removed. The stationary contact of the main positive contactor is electrically connected to one end of the first and second conductive connecting bars located in the first receiving chamber, respectively. The stationary contact of the main negative contactor is electrically connected to one end of the first and second conductive connecting bars located in the first receiving chamber, respectively. The third conductive connection bar located in the second accommodating chamber and one end of the shunt body are electrically connected. The ends of the second and third conductive connection bars that are not connected to the main positive contactor and the main negative contactor serve as the connection terminals of the integrated intelligent BDU. One end of the passive excitation fuse is electrically connected to the first conductive connection bar, and the other end serves as the positive electrode connection terminal connected to the positive terminal of the power supply. The other end of the shunt body that is not connected to the main negative contactor serves as the negative terminal connection terminal of the power supply. The BMU board is mounted on the lower housing. A temperature sampling module is mounted on the shunt body to form the shunt. The signal receiving end of the passive excitation fuse, the power supply connection terminals of the drive coils of the main positive contactor and the main negative contactor, the signal sampling area of ​​the shunt body, and the temperature sampling module are electrically connected to the BMU board.

[0048] The following describes preferred embodiments in detail with reference to the accompanying drawings. The directional terms used are for reference only and do not constitute a limitation on the technical solution of this invention.

[0049] The high-performance integrated intelligent BDU provided by this invention is described in the following figure. Figures 1 to 18 It includes a lower housing 1 and an upper housing 2, a main positive contactor 3, a main negative contactor 4, a passive excitation fuse 5, a shunt, a BMU7, and a thermally conductive insulating pad 8. Among them, the BMU7 is a control board, whose main functions include supplying power to the contactor after high-voltage power is drawn, integrating an electronic pre-charge circuit, data acquisition, data transmission, and sending action commands to the contactor and the passive excitation fuse.

[0050] The shunt includes the shunt body 6 and the temperature sampling module 9. The passive excitation fuse 5 is shown in the attached diagram. Figure 17Its basic structure includes an electronic ignition assembly, a piston, a conductive busbar, a signal fuse, and a self-excited trigger circuit. The conductive busbar and the signal fuse are connected in series, and the series-connected conductive busbar and signal fuse are connected in series to the main circuit. The self-excited trigger circuit is conductively connected to the signal receiving end of the electronic ignition assembly, and the two ends of the self-excited trigger circuit are connected in parallel with the two ends of the signal fuse. Under normal operating conditions, the self-excited trigger circuit is not conducting. Only when there is an overcurrent, the signal fuse is opened, causing the self-excited trigger circuit to conduct, providing a trigger signal to the electronic ignition assembly. This causes the electronic ignition assembly to activate, releasing high-pressure gas as a driving force to drive the piston to move, breaking the conductive busbar and disconnecting the main circuit. The signal receiving end of the electronic ignition assembly is connected to the self-excited trigger circuit, or it can be connected to an external active trigger circuit on the passive excitation fuse 5. The active trigger circuit is located on BMU7. The passively excited fuse 5 can receive trigger signals sent by its internal self-excited trigger circuit when the signal fuse breaks, and it can also receive trigger signals sent by an external active trigger circuit. This gives the passively excited fuse 5 dual trigger protection, ensuring that the passively excited fuse can act in a timely manner.

[0051] In the following description, the BMU7 is connected to each component via conductive sheets, and the conductive sheets involved are all marked as conductive sheets 36.

[0052] Lower casing 1, see Figures 1 to 6 It is integrally injection molded, and the material is based on PA66 (polyamide, glass fiber content 20%-35%) or PBT (Polybutylene terephthalate, glass fiber content 20%-35%). At the bottom of the lower housing 1, the following components are integrally injection molded and sequentially insulated: a first heat sink 14, a first conductive connection bar 131, a second conductive connection bar 132, a second heat sink 15, a third heat sink 16, a third conductive connection bar 133, a shunt body 6, a grounding conductive bar 17, a high-voltage power take-off conductive bar 18, and a terminal block 19.

[0053] To facilitate heat dissipation, the bottom of the lower housing does not completely cover the first heat sink 14, the first conductive connection bar 131, the second conductive connection bar 132, the second heat sink 15, the third heat sink 16, the third conductive connection bar 133, and the shunt body 6; some of these components are exposed at the bottom of the lower housing. Since the integrated intelligent BDU is installed by connecting and fixing the bottom of the lower housing to the external mounting structure, thermally conductive insulating pads 8 are affixed to the exposed areas of the components. These pads 8 must possess both thermal conductivity and insulation properties to insulate the components from the external mounting structure, thus improving safety. The thermally conductive insulating pads 8 are constructed using a combination of a thermally conductive adhesive pad and an insulating film. The insulating film can be placed on the outermost layer or between the thermally conductive pad and the components. If, during installation, the insulation distance between the lower housing and the external mounting structure is sufficient, and the insulation performance of the thermally conductive adhesive pad is adequate, a thermally conductive adhesive pad can also be used alone.

[0054] A first receiving chamber 30 for accommodating the main positive contactor 3 is integrally formed on the base of the lower housing 1 above the end of the first conductive busbar 131 and the second conductive busbar 132 which are insulated from each other. A second receiving chamber 31 for accommodating the main negative contactor 4 is integrally formed on the bottom of the lower housing 1 above the end of the shunt body 6 which is insulated from the third conductive busbar 133. The second heat sink 15 and the third heat sink 16 are integrally injection molded between the first receiving chamber 30 and the second receiving chamber 31, so that heat energy can be dissipated to the space outside the lower housing 1 through the heat sink. The insulated ends of the first conductive connection bar 131 and the second conductive connection bar 132 are located inside the first accommodating chamber 30. Welding holes for the stationary contact of the main positive contactor 3 are respectively opened on the insulated ends of the first conductive connection bar 131 and the second conductive connection bar 132 inside the first accommodating chamber 30. The insulated ends of the shunt body 6 and the third conductive connection bar 133 are located inside the second accommodating chamber 31. Welding holes for the stationary contact of the main negative contactor 4 are respectively opened on the insulated ends of the shunt body 6 and the third conductive connection bar 133 inside the second accommodating chamber 31. The signal sampling area of ​​the shunt body 6 is located outside the second accommodating chamber 31. The connection point between the first conductive connection bar 131 and the terminal of the passive excitation fuse 5 is located outside the first accommodating chamber 30. A welding hole 1311 is opened at the connection point of the first conductive connection bar 131 for the terminal of the passive excitation fuse 5.

[0055] One end of the passive ignition fuse 5 is bent towards the bottom of the lower housing 1. The bent end has a welding boss that matches the welding hole 1311 of the first conductive connection bar 131. A trigger control pad is provided at the signal contact end of the electronic ignition assembly. During installation, the end of the passive ignition fuse 5 with the welding boss is inserted into the welding hole 1311, with the welding boss abutting against the surface of the first conductive connection bar 131. The connection is made by laser welding. The other end of the passive ignition fuse 5 serves as the positive power connection end 37 and is fixed to the first heat sink 14 by a nut and stud. The signal receiving end of the electronic ignition assembly of the passive ignition fuse 5 faces towards the top of the lower housing 1. A trigger control pad is provided at the signal receiving end of the electronic ignition assembly of the passive ignition fuse 5. The signal receiving end of the electronic ignition assembly of the passive ignition fuse 5 is electrically connected to the BMU7 via a conductive sheet through the trigger control pad. The trigger control pad facilitates welding with the BMU7 via a conductive sheet. The first heat sink 14, the second heat sink 15, and the third heat sink 16 are all made of aluminum.

[0056] The second conductive connection bar 132 and the third conductive connection bar 133 are located at one end outside the first accommodating chamber 30 and the second accommodating chamber 31, respectively, and serve as connection ends for the integrated intelligent BDU to the load or charging and discharging, etc. They are respectively bent in an inverted L shape and fixed on the second heat sink 15 and the third heat sink 16 by nuts and studs. The second heat sink 15 and the third heat sink 16 are insulated from each other by the lower housing 1.

[0057] The main positive contactor 3 and the main negative contactor 4 are shown in the image with their housings removed. Figure 16 The main positive contactor 3 and the main negative contactor 4 are installed inverted in the first accommodating chamber 30 and the second accommodating chamber 31, respectively. The first accommodating chamber 30 and the second accommodating chamber 31 directly replace the housings of the main positive contactor 3 and the main negative contactor 4, thereby reducing the weight of the main positive contactor 3 and the main negative contactor 4. The stationary contacts of the main positive contactor 3 and the main negative contactor 4 face the bottom of the lower housing 1, and the end where the drive coil is located faces the top of the lower housing 1. Welding bosses are provided on the stationary contacts of the main positive contactor 3 and the main negative contactor 4, and a low-voltage control pad is provided at the end where the drive coil is located. The low-voltage control pad is located at the power supply connection terminal where the drive coil is connected to the power supply circuit, which facilitates the connection between the drive coil and the BMU7 through the conductive sheet.

[0058] This structure and installation method allow the welding bosses of the stationary contacts of the main positive contactor 3 and the main negative contactor 4 to be directly inserted into the welding holes at one end of the first conductive connection bar 131, the second conductive connection bar 132, and the shunt body 6, which are located in the first accommodating chamber 30 and the second accommodating chamber 31. The welding holes define the position of the welding bosses on the stationary contacts and increase the welding connection area between the stationary contacts and the conductive connection bars and the shunt body through the welding bosses. Laser welding is used to fix the conductive connection. Simultaneously, it facilitates the conductive connection between the power supply terminals of the drive coils of the main positive contactor 3 and the main negative contactor 4 and the BMU7 via a conductive sheet through a low-voltage control pad. The passive excitation fuse 5 and the welding between the main positive and main negative contactors and the conductive connection bars are welded using laser welding, with a laser welding power of 3kW or higher.

[0059] The splitter body 6 is integrally injection molded onto the bottom of the lower housing, see reference. Figure 18 The shunt body 6 has a central resistance alloy region 61, with current-carrying busbars 62 integrally connected to both sides to form the shunt body. The central resistance region is made of manganese-copper alloy, and the signal sampling region 63 is located on the manganese-copper alloy to improve sampling accuracy. The signal sampling region of the shunt body 6 is connected to the BMU7 via a conductive sheet. A welding hole 64 at one end of the shunt body 6 located in the second accommodating chamber 31 is electrically connected to the stationary contact of the main negative contactor, and a welding hole 65 at the other end of the shunt body 6 is electrically connected to the terminal 19. The terminal 19 is integrally injection molded with the lower housing and serves as the negative terminal of the power supply. The shunt body 6 is connected to the main negative contactor 4 and the terminal 19 by laser welding, or by riveting or resistance welding.

[0060] Temperature sampling module 9 is located on the shunt body 6, see [link / reference] Figure 13 and Figure 14The system includes a first mounting bracket 24, which is integrally injection molded with the signal connection terminals (26, 27). A hollow portion is pre-reserved in the first mounting bracket 24. A second mounting bracket 25 is integrally injection molded with the welding stud 29. The second mounting bracket 25 is fixedly connected to the first mounting bracket 24 via a snap-fit ​​connector. An NTC thermistor 28 is placed between the first mounting bracket 24 and the second mounting bracket 25, and the thermistor 28 is fixed to the first mounting bracket 24 via the second mounting bracket 25. The two connection wires of the NTC thermistor 28 are respectively passed through the welding holes of the signal connection terminals (26, 27) and electrically connected by soldering or laser welding. The welding stud 29 of the temperature sampling module 9 is inserted into the welding holes 66 opened on the current-passing bars 62 on both sides of the resistor area on the shunt body 6, fixing the temperature sampling module 9 to the shunt body 6 by welding. The signal connection terminals (26, 27) of the temperature sampling module 9 are connected to the BMU7 via conductive sheets.

[0061] As can be seen from the above structure, the passive excitation fuse 5 and the shunt body 6 are located at the two ends of the lower housing 1, respectively, serving as the positive and negative connection terminals of the power supply, facilitating connection to the main battery circuit. The discharge terminal is located between the main positive contactor 3 and the main negative contactor 4, and is cooled by the second and third heat sinks during charging and discharging, which also helps to evenly distribute the circuit resistance.

[0062] The aforementioned BMU7 is electrically connected to the passive excitation fuse, main positive contactor, main negative contactor, shunt body, temperature sampling module, etc. through corresponding conductive plates. The conductive plates are pre-welded onto the BMU7. This type of welding is generally done by tin soldering, and the soldering gun power is usually between 30W and 80W.

[0063] See Figure 11 and Figure 12 The lower housing 1 has several BMU fixing buckles 32 and BMU positioning posts 33 integrally injection molded on its side. The BMU7 has corresponding locking holes and positioning holes for the BMU fixing buckles 32 and BMU positioning posts 33, respectively. The BMU positioning posts 33 pass through the positioning holes on the BMU7, and the BMU fixing buckles 32 are engaged in the locking holes on the BMU7. The BMU7 is fixedly connected to the side of the lower housing 1 by the BMU fixing buckles 32 and BMU positioning posts 33.

[0064] A first electromagnetic shielding component 10 is installed between the BMU7 and the passive excitation fuse, main positive contactor, main negative contactor, shunt body, and temperature sampling module. The first electromagnetic shielding component 10 is fixedly installed on the lower housing 1 to reduce the influence of the passive excitation fuse, main positive contactor, main negative contactor, shunt, and other devices and conductors on the BMU7. A second electromagnetic shielding component 11 is fixedly installed on one side of the upper housing 2. When the upper housing 2 is snapped onto the lower housing 1, the second electromagnetic shielding component 11 is located outside the BMU7 to reduce interference from external electromagnetic signals to the BMU7.

[0065] See Figures 7 to 10 Before being integrally injection molded with the lower housing 1, the grounding conductor 17 and the high-voltage power supply conductor 18 are first integrally injection molded separately. That is, an insulating layer is integrally injection molded on the outer periphery between the two ends of the grounding conductor 17 and the high-voltage power supply conductor 18 used for conductive connection, to enhance the insulation performance of the grounding conductor 17 and the high-voltage power supply conductor 18. During the individual integral injection molding of the grounding conductor 17 and the high-voltage power supply conductor 18, a certain number of pre-reserved positioning holes are made at the injection molding location to facilitate positioning during integral injection molding with the lower housing 1. After the integral injection molding of the grounding conductor 17 and the high-voltage power supply conductor 18 is completed, they are then integrally injection molded together with the lower housing 1 and other components, so that the grounding conductor 17 and the high-voltage power supply conductor 18 are integrally injection molded into the lower housing 1.

[0066] See Figures 7 to 9 One end of the grounding conductor 17 is located at the nested mounting part 12 of the lower housing 1. When the base of the lower housing 1 is fixedly connected to the external mounting end, the grounding conductor 17 is also connected to the external mounting end to achieve grounding.

[0067] The other end of the grounding conductive bus 17 has a first branch connection end 171 and a second branch connection end 172, which are respectively connected to the first electromagnetic shield 10, BMU7, and the second electromagnetic shielding layer 11. The first branch connection end 171 extends from the shell wall of the lower housing 1 and is electrically connected to the first electromagnetic shield 10. A connection port is provided on the first branch connection end, and a connection protrusion 38 is provided at the corresponding position of the first electromagnetic shield 10. The connection protrusion of the first electromagnetic shield 10 is engaged in the connection port of the first branch connection end 171, and the grounding conductive bus 17 is electrically connected to the first electromagnetic shield 10 by welding. The second branch connection end 172 has an end of the grounding conductive bus 17 folded in half and stamped to form an elastic protrusion structure 173. The elastic protrusion structure 173 is located in a reserved insertion interface in the lower housing 1. A wedge-shaped guide surface 34 is provided in the insertion interface. The elastic protrusion structure 173 is located on one side of the wedge-shaped guide surface, and the protrusion of the elastic protrusion structure 173 protrudes towards the wedge-shaped guide surface. A spring piece 20 is electrically connected to the second electromagnetic shield 11. The spring piece 20 can be integrally formed on the second electromagnetic shield 11, or it can be set on the second electromagnetic shield 11 by riveting or welding. When the upper housing 2 with the second electromagnetic shield 11 is snapped onto the lower housing 1, the spring piece 20 is inserted into the insertion interface through the wedge-shaped guide surface and makes conductive contact with the elastic protrusion structure 173. Since both the elastic protrusion structure 173 and the spring piece 20 have a certain degree of elasticity, after insertion, the spring piece 20 undergoes a certain elastic deformation. Under the action of elastic force, it presses against one side of the elastic protrusion structure 173 and makes reliable contact with the elastic protrusion structure 173, so that the grounding conductive bus 17 is electrically connected to the second electromagnetic shield 11. Electromagnetic shielding grounding is achieved through the grounding conductive bus 17. The first electromagnetic shield 10 and the second electromagnetic shield 11 are made of ferromagnetic materials, such as electrical pure iron, carbon steel, etc. In some embodiments, the electrostatic grounding on the BMU7 can also be achieved through the grounding conductive bus 17.

[0068] The high-voltage power supply busbar 18 has one end connected to the passive excitation fuse 5 as the positive terminal of the power supply via a nut and stud, and is fixed on the first heat sink 14. The other end is connected to the BMU7 via a conductive sheet to realize the transmission of voltage signals and to supply power to the main positive contactor and the main negative contactor.

[0069] Nested mounting parts 12 are integrally injection molded at the four corners of the bottom of the lower housing 1 to form nested mounting holes. Rigid support connectors with through-holes at both ends of the nested mounting parts are used for the fixed installation of the lower housing 1.

[0070] Upper shell 2, see Figure 15The material is based on PA66 (glass fiber content 20%-35%) or PBT (glass fiber content 20%-35%). A second electromagnetic shielding component 11 is integrally injection molded and nested within the upper housing 2. The second electromagnetic shielding component 11 is located on the inner side of one side of the upper housing 2. When the upper housing 2 is mounted on the lower housing 1, the second electromagnetic shielding component 11 is located on the outer side of the BMU7. The upper housing 2 is connected and fixed to the lower housing 1 via guide grooves and snap-fit ​​mechanisms. For example, snap-fit ​​structures 35 are provided on the outer sides of both ends of the upper housing 2, which fix the upper housing 2 to the corresponding positions on the lower housing 1. Simultaneously, the snap-fit ​​structures 35 cover the connection terminals of the positive and negative power supplies, improving operational safety.

[0071] The upper housing 2 covers one end of the passive excitation fuse and shunt. The first high-voltage barrier 21, the second high-voltage barrier 22, and the third high-voltage barrier 23 are each L-shaped and snap-fitted to one end of the upper housing 2. They form a cover above the main positive contactor, the main negative contactor, and the connection points with the load or charging / discharging terminals to provide high-voltage isolation, preventing unauthorized contact between operators and the high-voltage terminals, thus improving safety performance. The upper housing 2 and the high-voltage barriers also cover the top of the lower housing 1 and the side where the BMU7 is located.

[0072] The BMU7 mentioned above can be located on the side of the lower housing 1, or it can be located on the top of the lower housing 1.

[0073] This invention integrates passive excitation fuses, main positive / main negative contactors, and current detection into a single injection-molded lower housing, comprising conductive connecting blocks, shunt bodies, grounding conductive blocks, high-voltage power supply conductive blocks, electromagnetic shielding components, and a heat dissipation structure. A BMU (Browser Controller Unit) is also integrated into the lower housing for connection to these components, achieving integrated design of the BDU and BMU. This enables intelligent control with multiple functions, including intelligent detection and control, overload and short-circuit protection, and measurement (voltage, current, temperature). The integrated injection molding and laser welding of the conductive connecting blocks and shunt bodies achieves a wireless design. Bottom heat dissipation and convenient snap-fit ​​installation eliminate the need for screws (except for external client connections), meeting the requirements for miniaturization, lightweighting, and low cost, while also being suitable for mass automated production. Large-area bottom heat dissipation and liquid cooling in conjunction with the client enable high-current super-fast charging and high-power DC charging. The matching application of passive excitation fuses and DC contactors achieves integrated active and passive protection, collision protection (zero-current cut-off), and full-range current protection, ensuring protection without blind spots.

Claims

1. A high-performance integrated intelligent BDU, characterized in that, The device includes a lower housing and an upper housing connected by snap-fit. The bottom of the lower housing is integrally injection molded and insulatedly spaced with a first conductive connecting bar, a second conductive connecting bar, a third conductive connecting bar, and a shunt body. A first accommodating chamber and a second accommodating chamber are integrally formed on the bottom of the lower housing at the ends opposite to the insulating intervals of the first and second conductive connecting bars, and at the ends opposite to the insulating intervals of the third conductive connecting bar and the shunt body. A main positive contactor and a main negative contactor are respectively disposed in the first and second accommodating chambers in an inverted manner with the outer shell removed. The stationary contact of the main positive contactor is electrically connected to one end of the first and second conductive connecting bars located in the first accommodating chamber. The stationary contact of the main negative contactor is electrically connected to one end of the third conductive connecting bar and the shunt body located in the second accommodating chamber. The ends of the second and third conductive connecting bars that are not connected to the main positive and main negative contactors serve as the connection ends of the integrated intelligent BDU. One end of the passive excitation fuse is electrically connected to the first conductive connection bar, and the other end serves as the positive electrode connection terminal connected to the positive terminal of the power supply; the other end of the shunt body not connected to the main negative contactor serves as the negative terminal connection terminal of the power supply; the BMU board is mounted on the lower housing; a temperature sampling module is mounted on the shunt body to form a shunt; the signal receiving end of the passive excitation fuse, the power supply connection terminals of the drive coils of the main positive contactor and the main negative contactor, the signal sampling area of ​​the shunt body, and the temperature sampling module are all electrically connected to the BMU board.

2. The high-performance integrated intelligent BDU according to claim 1, characterized in that, At least one heat dissipation structure is integrally injection molded on the lower housing, and the heat dissipation structure is connected to at least one of the first conductive connection bar, the second conductive connection bar, the third conductive connection bar, the positive power supply connection terminal, and the negative power supply connection terminal.

3. The high-performance integrated intelligent BDU according to claim 2, characterized in that, A first heat dissipation structure, a second heat dissipation structure, and a third heat dissipation structure are respectively provided on the bottom of the lower housing between the positive terminal of the power supply and the first and second accommodating chambers. The positive terminal of the power supply is fixedly disposed on the first heat dissipation structure, and the second and third heat dissipation structures are fixedly connected to the second and third conductive connecting blocks located outside the first and second accommodating chambers, respectively.

4. The high-performance integrated intelligent BDU according to claim 3, characterized in that, A thermal pad is provided on any of the heat dissipation structures, the first conductive connection bar, the second conductive connection bar, the third conductive connection bar, and the shunt body exposed on the bottom outer surface of the lower housing.

5. The high-performance integrated intelligent BDU according to claim 4, characterized in that, An insulating film is provided between the thermal pad and the bottom outer surface of the lower housing.

6. The high-performance integrated intelligent BDU according to claim 1, characterized in that, The connection end of the passive excitation fuse is bent and then electrically connected to the first conductive connection bar.

7. The high-performance integrated intelligent BDU according to claim 1, characterized in that, Welding holes are provided in the first conductive connection bar, the second conductive connection bar, the third conductive connection bar, and the shunt body. Welding bosses are provided in the connection end of the passive excitation fuse, the stationary contact of the main positive contactor and the main negative contactor. The welding bosses are connected to the outer peripheral surface of the welding hole by welding.

8. The high-performance integrated intelligent BDU according to claim 1, characterized in that, A first electromagnetic shielding component and a second electromagnetic shielding component are respectively provided on the inner and outer sides of the BMU board. The first electromagnetic shielding component is provided on the lower housing by a snap-fit ​​connection, and the second electromagnetic shielding component is nested on the upper housing by an integral injection molding method.

9. The high-performance integrated intelligent BDU according to claim 8, characterized in that, A grounding conductive busbar is integrally injection molded on the lower housing, and the grounding conductive busbar is electrically connected to the first electromagnetic shielding component and the second electromagnetic shielding component respectively.

10. The high-performance integrated intelligent BDU according to claim 9, characterized in that, The grounding busbar is electrically connected to the first electromagnetic shield and the second electromagnetic shield at one end, and is provided with a first branch end and a second branch end. The first branch end is electrically connected to the first electromagnetic shield. The second branch end is provided with an elastic protrusion structure, which makes conductive contact with the second electromagnetic shield through the elastic protrusion structure.

11. The high-performance integrated intelligent BDU according to claim 10, characterized in that, The elastic protrusion structure is located in the opening groove of the lower housing, and a wedge-shaped guide surface is provided in the opening groove. The elastic protrusion structure is disposed opposite to the wedge-shaped guide surface. A spring piece is provided on the second electromagnetic shielding component. The spring piece is inserted into the opening groove along the wedge-shaped guide surface and makes conductive contact with the elastic protrusion structure.

12. The high-performance integrated intelligent BDU according to claim 1, characterized in that, A high-voltage power supply bus is integrally injection molded on the lower housing. One end of the high-voltage power supply bus is conductively connected to one end of the passive excitation fuse as the positive terminal of the power supply, and the other end is conductively connected to the BMU board. The high-voltage power supply bus supplies power to the main positive contactor and the main negative contactor.

13. The high-performance integrated intelligent BDU according to claim 9 or 12, characterized in that, The outer periphery of the grounding conductor and the high-voltage power take-off conductor, where no conductive connection is required, is integrally injection molded and covered with an insulating layer, with pre-reserved positioning holes; the grounding conductor and the high-voltage power take-off conductor, which are provided with insulating layers, are integrally injection molded in the bottom of the lower housing.

14. The high-performance integrated intelligent BDU according to claim 1, characterized in that, A terminal block is provided on the bottom of the lower housing as the negative terminal of the power supply. The terminal block is electrically connected to the end of the shunt body that is not connected to the main negative contactor.

15. The high-performance integrated intelligent BDU according to claim 1, characterized in that, The temperature sampling module includes a first mounting bracket and a second mounting bracket. The signal connection terminal of the temperature sampling module is integrally injection molded on the first mounting bracket. The conductive stud is integrally injection molded on the second mounting bracket. The second mounting bracket is set on the first mounting bracket by a snap-fit ​​connection. A thermistor is set between the first mounting bracket and the second mounting bracket. The two ends of the thermistor are conductively connected to the signal connection terminal through wires. The signal connection terminal is conductively connected to the BMU through a conductive sheet.

16. The high-performance integrated intelligent BDU according to claim 1, characterized in that, Several high-voltage shielding barriers are provided on the upper and lower housings by means of snap-fit ​​connection. The high-voltage shielding barriers cover one end of the main positive contactor, the main negative contactor, and the second and third conductive connection bars between the main positive and main negative contactors.

17. The high-performance integrated intelligent BDU according to claim 1, characterized in that, At least four corners of the lower housing are integrally injection molded with mounting nesting members for connection and installation, and the mounting nesting members penetrate the bottom of the lower housing.

18. The high-performance integrated intelligent BDU according to claim 1, characterized in that, The signal receiving end of the passive excitation fuse, the power supply connection end of the drive coil of the main positive contactor and the main negative contactor, the signal sampling area of ​​the shunt body, and the temperature sampling module are all electrically connected to the BMU board through conductive sheets.

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