An all-patch module power supply
By using surface mount technology and multi-layer stacked aluminum substrate or PCB design, the space waste and heat dissipation problems caused by protruding power module pins are solved, enabling compact, convenient, and low-cost modular power supply manufacturing.
CN224459613UActive Publication Date: 2026-07-03费米能级(浙江)电子有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 费米能级(浙江)电子有限公司
- Filing Date
- 2024-12-16
- Publication Date
- 2026-07-03
Smart Images
Figure CN224459613U_ABST
Abstract
The utility model relates to power module technical field, concretely refers to a kind of module power supply of full patch, including substrate;The component assembly is electrically connected with copper foil on the substrate, the component assembly is electrically connected with integrated circuit, for driving the opening or closing of component assembly.Adopt full patch process and the mode of multilayer laminated plate, capacitor, resistance, inductance and power device adopt surface mount technology, place these component assemblies on the welding layer of aluminium substrate, then adopt reflow soldering technology, these component assemblies are welded to the welding layer of substrate;The back of the aluminium substrate does not exist patch device, so that bottom is in a horizontal plane, production is simpler, installation is more convenient, and the power module of lower cost, solve the problem that power module installation radiates difficultly;There is no protruding device, the bottom of module power supply can be used to install and fix, and heat is dissipated to external space by heat conduction.
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