A mobile phone back heat dissipation fin mounting structure

Abstract

This utility model relates to the field of installation structure technology and discloses a mobile phone back heat dissipation fin installation structure, including a heat-conducting back plate, heat dissipation fins fixedly installed on the top of the heat-conducting back plate, a magnetic installation mechanism inside the heat-conducting back plate, and limiting mechanisms on both the front and back of the heat-conducting back plate. This mobile phone back heat dissipation fin installation structure, through the positioning of the positioning blocks and the tightening of the mounting bolts, allows the installation of curved pads on the front and back of the heat-conducting back plate. The combination of the curved pads and friction rubber pads limits the position of the heat-conducting back plate, preventing it from sliding up and down when playing games on a horizontal screen. The high-elasticity silicone rubber and the wavy texture increase friction with the phone frame, while the single-sided adhesive silicone pad, a combination of a flexible silicone substrate and a pressure-sensitive adhesive layer, separates fingers from the curved pads to prevent discomfort, improving user comfort.

Description

Technical Field

[0001] This utility model relates to the field of installation structure technology, specifically to an installation structure for heat dissipation fins on the back of a mobile phone. Background Technology

[0002] The heat dissipation fins on the back of a mobile phone are a physical structure used to enhance the phone's heat dissipation capabilities. They are usually made of highly thermally conductive materials and have a densely packed, thin, sheet-like metal structure (similar to fish fins). By increasing the heat dissipation surface area, they can quickly dissipate the heat generated by internal components (such as the processor and battery), preventing the phone from throttling due to overheating. The heat dissipation fins on the back of the phone are usually installed using a magnetic method, which uses magnetism to make the external heat dissipation fins contact the back panel of the phone and dissipate the heat.

[0003] In existing technologies, when installing heat dissipation fins on the back panel of a mobile phone, it is usually necessary to purchase heat dissipation fins corresponding to the specific phone model. The installation of the heat dissipation fins is completed by attaching the magnetic ring on the heat dissipation fins to the magnetic ring inside the phone. However, in actual use, although the magnetic ring can fix the heat dissipation fins, the heat dissipation fins are located on the back of the phone and will come into contact with the user's fingers. The use of heat dissipation fins is usually when the user is playing mobile games, and the screen is usually horizontal. When playing games, the fingers will frequently apply pressure. While the heat dissipation fins will not detach from the back panel, they will slide up and down, affecting the user experience. Therefore, it is necessary to improve the installation structure of heat dissipation fins on the back of the phone to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a mounting structure for heat dissipation fins on the back of a mobile phone, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a mobile phone back heat dissipation fin mounting structure, including a heat-conducting back plate, heat dissipation fins fixedly mounted on the top of the heat-conducting back plate, a magnetic mounting mechanism provided inside the heat-conducting back plate, and limiting mechanisms provided on both the front and back of the heat-conducting back plate.

[0006] Preferably, the limiting mechanism includes a rectangular groove, which is formed inside the heat-conducting back plate. A positioning block is slidably installed inside the rectangular groove. An installation bolt is provided inside the positioning block. An arc-shaped pad is fixedly installed at the bottom of the positioning block. A friction rubber pad is fixedly installed on the inner side of the arc-shaped pad. A single-sided adhesive silicone sticker is provided on the outer side of the arc-shaped pad.

[0007] Preferably, the heat-conducting backplate has a threaded groove inside, and the threaded groove inside the heat-conducting backplate is located inside the rectangular groove, and the mounting bolt is threaded into the threaded groove inside the heat-conducting backplate.

[0008] Preferably, the positioning insert has a hole at the corresponding position of the mounting bolt, and the center of the hole inside the positioning insert corresponds to the center of the thread groove, and the mounting bolt is movably installed inside the hole inside the positioning insert.

[0009] Preferably, the friction rubber pad is made of high-elasticity silicone rubber by compression molding, and the inner side of the friction rubber pad is provided with a wavy texture.

[0010] Preferably, the single-sided adhesive silicone sticker is composed of a flexible silicone substrate and a pressure-sensitive adhesive layer coated on the outside of the substrate, and the surface of the pressure-sensitive adhesive layer is covered with release paper, and the edges of the release paper are easy to tear.

[0011] Preferably, the magnetic mounting mechanism includes an annular groove, which is formed inside the heat-conducting back plate. There are two annular grooves, and a magnetic ring one is fixedly installed inside the top annular groove, and a magnetic ring two is fixedly installed inside the bottom annular groove.

[0012] Compared with the prior art, this utility model provides a mobile phone back heat dissipation fin mounting structure, which has the following beneficial effects:

[0013] 1. The heat dissipation fin mounting structure on the back of this mobile phone, through a set limiting mechanism, allows for the installation of curved pads on the front and back of the heat-conducting backplate during use. The combination of the curved pads and friction rubber pads limits the heat-conducting backplate, preventing it from sliding up and down when playing games with the screen horizontally. The high-elasticity silicone rubber and the wavy texture increase friction with the phone frame while preventing scratches. The single-sided adhesive silicone pad, combining a flexible silicone substrate and a pressure-sensitive adhesive layer, separates fingers from the curved pads to avoid discomfort, and can be easily removed and replaced, improving user comfort.

[0014] 2. The heat dissipation fin mounting structure on the back of the mobile phone uses a magnetic mounting mechanism. During use, magnetic ring one and magnetic ring two are used. Magnetic ring two can magnetically fix the heat-conducting back plate to the back plate of the mobile phone, while magnetic ring one can magnetically install the external heat dissipation fan. This realizes the function of installing the heat-conducting back plate and heat dissipation fins to the back of the mobile phone. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the appearance and structure of this utility model;

[0017] Figure 2 This is an exploded view of the external structure of this utility model;

[0018] Figure 3 This is a cross-sectional view and exploded view of the limiting mechanism of this utility model;

[0019] Figure 4 This is an exploded view of the external structure of the magnetic mounting mechanism of this utility model.

[0020] In the diagram: 1. Heat-conducting backplate; 2. Limiting mechanism; 21. Rectangular groove; 22. Positioning block; 23. Mounting bolt; 24. Arc-shaped pad; 25. Friction rubber pad; 26. Single-sided adhesive silicone sticker; 3. Magnetic mounting mechanism; 31. Annular groove; 32. Magnetic ring one; 33. Magnetic ring two; 4. Heat dissipation fins. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] Example:

[0024] Please see Figure 1-3This utility model provides a technical solution: a heat dissipation fin mounting structure for the back of a mobile phone, including a heat-conducting back plate 1, heat dissipation fins 4 fixedly mounted on the top of the heat-conducting back plate 1, a magnetic mounting mechanism 3 provided inside the heat-conducting back plate 1, and a limiting mechanism 2 provided on both the front and back of the heat-conducting back plate 1.

[0025] Furthermore, the limiting mechanism 2 includes a rectangular groove 21, which is formed inside the heat-conducting back plate 1. A positioning block 22 is slidably installed inside the rectangular groove 21. An installation bolt 23 is provided inside the positioning block 22. An arc-shaped pad 24 is fixedly installed at the bottom of the positioning block 22. A friction rubber pad 25 is fixedly installed on the inner side of the arc-shaped pad 24. A single-sided adhesive silicone sticker 26 is provided on the outer side of the arc-shaped pad 24. Through the limiting mechanism 2, the arc-shaped pad 24 can be added to the front and back of the heat-conducting back plate 1 for limiting, which can prevent the heat-conducting back plate 1 from sliding on the back of the phone and avoid affecting the user experience.

[0026] Furthermore, the heat-conducting backplate 1 has a threaded groove inside, and the threaded groove inside the heat-conducting backplate 1 is located inside the rectangular groove 21. The mounting bolt 23 is threaded into the threaded groove inside the heat-conducting backplate 1. Through the threaded groove inside the heat-conducting backplate 1, after the positioning block 22 is inserted into the rectangular groove 21, the positioning block 22 can be fixed by the mounting bolt 23, thus avoiding the situation where the arc-shaped pad 24 becomes loose.

[0027] Furthermore, the positioning insert 22 has holes at the corresponding positions of the mounting bolt 23, and the center of the hole inside the positioning insert 22 corresponds to the center of the thread groove. The mounting bolt 23 is movably installed inside the hole inside the positioning insert 22. Through the hole corresponding to the center of the thread groove, the mounting bolt 23 can pass normally through the interior of the positioning insert 22 and enter the interior of the thread groove for threaded installation.

[0028] Furthermore, the friction rubber pad 25 is made of high-elasticity silicone rubber through molding, and the inner side of the friction rubber pad 25 is provided with a wavy texture. By using the high-elasticity silicone rubber and the texture on the surface, it can provide anti-slip friction function for the curved pad 24, while preventing scratches on the phone frame by contacting the friction rubber pad 25 with the phone frame.

[0029] Furthermore, the single-sided adhesive silicone sticker 26 is composed of a flexible silicone substrate and a pressure-sensitive adhesive layer coated on the outside of the substrate. The surface of the pressure-sensitive adhesive layer is covered with release paper, and the edges of the release paper are easy to tear. By using the flexible silicone substrate to pad the outside of the curved pad 24, the fingers can come into contact with the flexible silicone substrate when using the mobile phone, preventing the discomfort caused by direct contact between the fingers and the curved pad 24. At the same time, through the combination of the pressure-sensitive adhesive layer and the release paper, the single-sided adhesive silicone sticker 26 can be replaced by using a replaceable adhesive method.

[0030] Please see Figure 4 Furthermore, the magnetic mounting mechanism 3 includes an annular groove 31, which is opened inside the heat-conducting back plate 1. There are two annular grooves 31, and a magnetic ring 32 is fixedly installed inside the top annular groove 31, and a magnetic ring 33 is fixedly installed inside the bottom annular groove 31. Through the magnetic mounting mechanism 3, the heat-conducting back plate 1 can be fixed to the back plate of the mobile phone.

[0031] In actual operation, when using this device, before using the heat-conducting backplate 1 and heat dissipation fins 4, first insert the positioning block 22 into the rectangular slot 21, so that the arc-shaped pad 24 faces away from the heat dissipation fins 4. Then, pass the mounting bolt 23 through the positioning block 22 and rotate the mounting bolt 23 to install it with the internal thread of the heat-conducting backplate 1. After installation, peel off the release paper on the surface of the single-sided adhesive silicone sticker 26 to allow the pressure-sensitive adhesive layer to adhere to the surface of the arc-shaped pad 24. The assembly is now complete. In use, pass the phone frame through the inside of the friction rubber pad 25 and attach it to the bottom of the heat-conducting backplate 1. The magnetic ring 33 then magnetically contacts the phone backplate to complete the installation. The magnetic ring 32 can also magnetically attract an external cooling fan. It should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A mobile phone back heat dissipation fin mounting structure comprising a heat-conducting back plate (1), characterized in that: The heat dissipation fins (4) are fixedly installed on the top of the heat-conducting back plate (1), and a magnetic mounting mechanism (3) is provided inside the heat-conducting back plate (1). Limiting mechanisms (2) are provided on both the front and back of the heat-conducting back plate (1). The limiting mechanism (2) includes a rectangular groove (21), which is opened inside the heat-conducting back plate (1). A positioning block (22) is slidably installed inside the rectangular groove (21). An installation bolt (23) is provided inside the positioning block (22). An arc-shaped pad (24) is fixedly installed at the bottom of the positioning block (22). A friction rubber pad (25) is fixedly installed on the inner side of the arc-shaped pad (24). A single-sided adhesive silicone sticker (26) is provided on the outer side of the arc-shaped pad (24).

2. The mobile phone back heat dissipation fin mounting structure according to claim 1, characterized in that: The heat-conducting backplate (1) has a threaded groove inside, and the threaded groove inside the heat-conducting backplate (1) is located inside the rectangular groove (21), and the mounting bolt (23) is threaded inside the threaded groove inside the heat-conducting backplate (1).

3. The mobile phone back heat dissipation fin mounting structure according to claim 1, characterized in that: The positioning plug (22) has holes at the corresponding positions of the mounting bolt (23), and the center of the hole inside the positioning plug (22) corresponds to the center of the thread groove, and the mounting bolt (23) is movably installed inside the hole inside the positioning plug (22).

4. The mobile phone back heat dissipation fin mounting structure according to claim 1, characterized in that: The friction rubber pad (25) is made of high elastic silicone rubber by compression molding, and the inner side of the friction rubber pad (25) is provided with a wavy texture.

5. The mobile phone back heat dissipation fin mounting structure according to claim 1, characterized in that: The single-sided adhesive silicone sticker (26) is composed of a flexible silicone substrate and a pressure-sensitive adhesive layer coated on the outside of the substrate, and the surface of the pressure-sensitive adhesive layer is covered with release paper, and the edges of the release paper are easy to tear.

6. The mobile phone back heat dissipation fin mounting structure according to claim 1, characterized in that: The magnetic mounting mechanism (3) includes an annular groove (31), which is opened inside the heat-conducting back plate (1). There are two annular grooves (31), and a magnetic ring one (32) is fixedly installed inside the top annular groove (31), and a magnetic ring two (33) is fixedly installed inside the bottom annular groove (31).

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