MEMS packaging structure and electronic devices

Abstract

This application provides a MEMS packaging structure and an electronic device. The MEMS packaging structure includes a substrate with a sound inlet hole; a housing disposed on one side of the substrate and forming a receiving cavity with the substrate; a waterproof module disposed in the receiving cavity, the waterproof module including a substrate, a waterproof membrane, and a support structure, the substrate being disposed on the substrate, the waterproof membrane being disposed on the substrate and capable of covering the sound inlet hole, and the support structure being disposed on the side of the waterproof membrane away from the substrate; and an active chip module disposed on the support structure and electrically connected to the substrate. By disposing the waterproof module on the substrate and supporting the active chip module, this application achieves effective waterproofing of the MEMS packaging structure and reduces the overall size of the substrate, which is beneficial for the miniaturization of the MEMS packaging structure.

Description

Technical Field

[0001] This application belongs to the field of microelectromechanical packaging technology, specifically, this application relates to a MEMS packaging structure and an electronic device. Background Technology

[0002] In an environment where electronic devices are increasingly becoming smaller and more integrated, the miniaturization design of MEMS microphones, as key acoustic sensors, is of paramount importance.

[0003] In related technologies, MEMS microphones commonly employ a method of creating a waterproof membrane by cutting grooves in the substrate. However, during the substrate cutting process, it is necessary to avoid the locations of structures such as the outer shell welding ring, resulting in an increase in the overall size of the substrate. This increases the space occupied by the microphone inside the electronic device, which is not conducive to the miniaturization of the product. Utility Model Content

[0004] One objective of this application is to provide a new technical solution for MEMS packaging structures and electronic devices.

[0005] According to a first aspect of the embodiments of this application, a MEMS packaging structure is provided, comprising:

[0006] A substrate having a sound inlet hole;

[0007] A housing, wherein the housing is disposed on one side of the substrate and forms a receiving cavity with the substrate;

[0008] A waterproof module is disposed in the receiving cavity. The waterproof module includes a base, a waterproof membrane, and a support structure. The base is disposed on the substrate. The waterproof membrane is disposed on the base and can cover the sound inlet hole. The support structure is disposed on the side of the waterproof membrane away from the base.

[0009] An active chip module is disposed on the support structure and electrically connected to the substrate.

[0010] Optionally, the active chip module includes a MEMS chip, which is disposed on the side of the support structure away from the waterproof membrane;

[0011] In the thickness direction of the substrate, at least a portion of the MEMS chip is opposite to the waterproof membrane.

[0012] Optionally, the active chip module includes an ASIC chip, which is disposed on the side of the support structure away from the waterproof membrane and is electrically connected to the MEMS chip;

[0013] At least a portion of the ASIC chip is opposite the waterproof membrane.

[0014] Optionally, the support structure is provided with vent holes, which are connected to the internal cavity of the MEMS chip.

[0015] Optionally, the ratio of the area of ​​the waterproof membrane to the area of ​​the sound inlet is (6-20):1.

[0016] Optionally, the SNR of the MEMS packaging structure is greater than or equal to 60dB.

[0017] Optionally, the support structure includes a support ring and a support plate. The support ring is disposed on the side of the waterproof membrane away from the substrate, and the support plate is disposed on the support ring and used to support the active chip module.

[0018] Optionally, the support structure has a vibration cavity inside, and the support structure is fastened to the side of the waterproof membrane away from the substrate and is used to support the active chip module.

[0019] Optionally, the MEMS packaging structure further includes an adhesive element, through which the substrate is bonded and fixed to the side of the substrate facing the housing.

[0020] According to a second aspect of the embodiments of this application, an electronic device is provided, the electronic device including the MEMS packaging structure described in the first aspect.

[0021] One technical advantage of this application is:

[0022] This application provides a MEMS packaging structure, which includes a substrate with a sound inlet hole; a housing disposed on one side of the substrate and forming a cavity with the substrate; a waterproof module disposed in the cavity, the waterproof module including a substrate, a waterproof membrane, and a support structure, the substrate being disposed on the substrate, the waterproof membrane being disposed on the substrate and covering the sound inlet hole, and the support structure being disposed on the side of the waterproof membrane away from the substrate; and an active chip module disposed on the support structure and electrically connected to the substrate. By disposing of the waterproof module on the substrate and supporting the active chip module, effective waterproofing of the MEMS packaging structure is achieved on the one hand, and the overall size of the substrate is reduced on the other hand, which is beneficial to the miniaturization of the MEMS packaging structure.

[0023] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0025] Figure 1 A schematic diagram of a MEMS packaging structure provided in one embodiment of this application;

[0026] Figure 2 A schematic diagram of a waterproof module with a MEMS packaging structure provided in one embodiment of this application;

[0027] Figure 3 An exploded view of a waterproof module of a MEMS packaging structure provided in one embodiment of this application;

[0028] Figure 4 A schematic diagram of a MEMS packaging structure provided in another embodiment of this application;

[0029] Figure 5 A schematic diagram of a waterproof module with a MEMS packaging structure provided in another embodiment of this application;

[0030] Figure 6 This is a schematic diagram of the support structure of a waterproof module of a MEMS packaging structure provided in another embodiment of this application.

[0031] in:

[0032] 1. Substrate; 11. Sound inlet; 2. Housing; 3. Waterproof module; 31. Base; 32. Waterproof membrane; 33. Support structure; 331. Vent hole; 332. Support ring; 333. Support plate; 334. Vibration chamber; 4. Active chip module; 41. MEMS chip; 42. ASIC chip; 43. Gold wire; 5. Adhesive component. Detailed Implementation

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0034] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0036] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0039] In related technologies, MEMS microphones commonly employ a method of creating a waterproof membrane by cutting grooves in the substrate. However, during the substrate cutting process, it is necessary to avoid the locations of structures such as the outer shell welding ring, resulting in an increase in the overall size of the substrate. This increases the space occupied by the microphone inside the electronic device, which is not conducive to the miniaturization of the product.

[0040] The MEMS (Micro-Electro-Mechanical System) packaging structure provided in this application embodiment achieves effective waterproofing of the MEMS packaging structure by placing a waterproof module on the substrate and supporting the active chip module. On the other hand, it avoids the need to cut grooves on the substrate to set the waterproof structure, reduces the overall size of the substrate, facilitates the miniaturization of the MEMS packaging structure, and also reduces the space occupied by MEMS packaging structures such as MEMS microphones inside electronic devices.

[0041] Reference Figure 1 This application provides a MEMS packaging structure, which includes:

[0042] Substrate 1, with a sound inlet hole 11 provided on substrate 1;

[0043] The housing 2 is disposed on one side of the substrate 1 and forms a receiving cavity with the substrate 1;

[0044] Waterproof module 3 is disposed in the receiving cavity. Waterproof module 3 includes a base 31, a waterproof membrane 32 and a support structure 33. The base 31 is disposed on the substrate 1. The waterproof membrane 32 is disposed on the base 31 and can cover the sound inlet hole 11. The support structure 33 is disposed on the side of the waterproof membrane 32 away from the base 31.

[0045] Active chip module 4 is disposed on support structure 33 and electrically connected to substrate 1.

[0046] In the above embodiments, substrate 1 serves as the basic support and electrical conduction component of the MEMS packaging structure, and substrate 1 provides an installation platform for modules such as housing 2 and waterproof module 3. The sound inlet 11 allows external sound signals to enter the cavity, and the sound inlet 11 provides a sound input channel for MEMS packaging structures such as MEMS microphones, ensuring effective sound transmission.

[0047] See Figure 1 The housing 2 and the substrate 1 together form a receiving cavity. The housing 2 can be a metal shell. The housing 2 provides protection for the components inside the MEMS packaging structure to prevent external dust, moisture and other substances from entering the receiving cavity, thereby improving the reliability and stability of the MEMS packaging structure and facilitating the normal operation of the modules inside the MEMS packaging structure in various environments.

[0048] See Figure 1 and Figure 2The waterproof module 3 is mounted on the side of the substrate 1 near the housing 2 via a base 31. The base 31 provides support and a mounting platform for the waterproof membrane 32, and facilitates the vibration of the waterproof membrane 32 within the space enclosed by the base 31. The waterproof membrane 32 is suspended above and covers the sound inlet 11. Specifically, the projection of the waterproof membrane 32 on the substrate 1 covers the sound inlet 11. The waterproof membrane 32 prevents liquids such as moisture from entering the cavity through the sound inlet 11, thereby protecting the module inside the cavity.

[0049] In the above embodiments, the support structure 33 and the base 31 are matched on the upper and lower sides of the waterproof membrane 32, which can fix the waterproof membrane 32 and prevent the waterproof membrane 32 from deforming or shifting due to external pressure or vibration. At the same time, the cavity inside the support structure 33 can facilitate the reciprocating vibration of the waterproof membrane 32 and avoid interfering with the vibration of the waterproof membrane 32.

[0050] See Figure 1 The active chip module 4 can convert sound signals into electrical signals, and process and transmit these electrical signals. Supported and fixed by the support structure 33, the active chip module 4 can operate stably within the cavity. Simultaneously, the electrical connection between the active chip module 4 and the substrate 1 enables communication and data transmission between the active chip module 4 and external circuits, improving the reliability of the MEMS packaging structure.

[0051] In this embodiment, by placing the waterproof module 3 on the substrate 1 and enabling the waterproof module 3 to support the active chip module 4, the effective waterproofing of the MEMS packaging structure is achieved on the one hand, and the waterproof structure is not required to be set in a groove on the substrate 1 on the other hand, thus reducing the overall size of the substrate 1. This is beneficial for the miniaturization of the MEMS packaging structure and reduces the space occupied by MEMS packaging structures such as MEMS microphones inside electronic devices.

[0052] In one embodiment, the housing 2 is soldered to the substrate 1 using solder paste or other soldering materials to form a stable mechanical connection between the housing 2 and the substrate 1, ensuring that the MEMS packaging structure can maintain its structural integrity when subjected to external vibration or impact.

[0053] In one embodiment, the waterproof membrane 32 can be an EPTFE (expanded polytetrafluoroethylene) membrane. The microporous structure of the EPTFE membrane can effectively block water molecules from passing through while allowing air molecules to pass freely, thereby achieving a waterproof and breathable effect. In addition, the cooperation between the substrate 31 and the support structure 33 plays a role in supporting and constituting the vibration space of the waterproof membrane 32.

[0054] In the embodiments of this application, the waterproof module 3 is fixed to the inner surface of the substrate 1, thus avoiding the waterproof module being disposed in the groove of the substrate, reducing the size of the substrate 1 in the X and Y directions, with the Y direction being... Figure 1The direction is perpendicular to the XOZ plane. Since MEMS microphones transmit sound through the vibration of the waterproof membrane, a small waterproof membrane size will reduce the amplitude of the membrane, resulting in increased sound loss and a lower SNR (Signal-to-Noise Ratio) for the MEMS microphone. However, in this embodiment, the waterproof module 3 is placed within a large-space cavity, which increases the size of the waterproof membrane 32. This allows the MEMS packaging structure to maintain waterproofing while reducing sound loss and ensuring a high SNR.

[0055] In some embodiments, see Figure 1 The active chip module 4 includes a MEMS chip 41, which is disposed on the side of the support structure 33 away from the waterproof membrane 32.

[0056] In the thickness direction of the substrate 1, at least a portion of the MEMS chip 41 is opposite to the waterproof membrane 32.

[0057] In the above embodiments, the thickness direction of substrate 1 can be... Figure 1 In the vertical direction, the MEMS chip 41 can convert sound signals into electrical signals. By placing the MEMS chip 41 on the side of the support structure 33 away from the waterproof membrane 32, it helps to reduce the size of the entire MEMS packaging structure and improve the space utilization of the MEMS packaging structure. Moreover, the support structure 33 can provide support for the MEMS chip 41, ensuring the reliability and stability of the MEMS chip 41. At the same time, the presence of the waterproof membrane 32 protects the MEMS chip 41 from corrosion by moisture and other harmful substances.

[0058] See Figure 1 By setting at least a portion of the MEMS chip 41 to be vertically aligned with the waterproof membrane 32 in the thickness direction of the substrate 1, for example, the MEMS chip 41 is vertically aligned with the waterproof membrane 32 in the thickness direction of the substrate 1, it is ensured that the sound signal can be effectively transmitted to the MEMS chip 41 through the vibration of the waterproof membrane 32, thus ensuring the efficiency and accuracy of the sound signal conversion of MEMS packaging structures such as MEMS microphones.

[0059] In some embodiments, see Figure 1 The active chip module 4 includes an ASIC chip 42, which is disposed on the side of the support structure 33 away from the waterproof membrane 32 and is electrically connected to the MEMS chip 41.

[0060] At least a portion of the ASIC chip 42 is opposite the waterproof membrane 32.

[0061] In the above embodiments, the ASIC chip 42 can process the electrical signals converted by the MEMS chip 41 and perform operations such as signal amplification, filtering, and analog-to-digital conversion to meet the needs of subsequent circuits or systems. By placing the ASIC chip 42 on the side of the support structure 33 away from the waterproof membrane 32, the active chip module 4, jointly formed by the ASIC chip 42 and the MEMS chip 41, is located on the side of the support structure 33 away from the waterproof membrane 32. This achieves a reasonable layout of the internal space of the MEMS packaging structure, helping to reduce the overall size of the MEMS packaging structure and improve space utilization. Simultaneously, the electrical connection between the ASIC chip 42 and the MEMS chip 41 ensures the stability and reliability of signal transmission.

[0062] See Figure 1 The ASIC chip 42 is positioned vertically opposite the waterproof membrane 32 in the thickness direction of the substrate 1, which helps maintain the overall compactness of the MEMS packaging structure. Moreover, the larger waterproof membrane 32 can simultaneously face both the ASIC chip 42 and the MEMS chip 41, increasing the amplitude of the waterproof membrane 32, reducing the sound loss of MEMS packaging structures such as MEMS microphones, and ensuring that the MEMS packaging structure has a high SNR value.

[0063] In one embodiment, see Figure 1 The MEMS chip 41 and the ASIC chip 42 are bonded to the support structure 33 with MEMS adhesive and ASIC adhesive, respectively. At the same time, the MEMS chip 41 and the ASIC chip 42 are connected by a gold wire 43, and the ASIC chip 42 is connected to the substrate 1 by another gold wire 43, which ensures the efficiency of acoustic-electric conversion and signal transmission in the MEMS packaging structure.

[0064] In some embodiments, see Figure 2 and Figure 3 The support structure 33 is provided with a vent 331, which is connected to the internal cavity of the MEMS chip 41.

[0065] In MEMS packaging structures such as MEMS microphones, when sound enters the containment cavity and causes the waterproof membrane 32 to vibrate, the vent 331 facilitates the transmission of the vibration signal from the waterproof membrane 32 to the interior of the MEMS chip 41, preventing damage to the waterproof membrane 32 due to sudden changes in air pressure on both sides. Furthermore, the vent 331 is connected to the internal cavity of the MEMS chip 41, allowing the internal cavity to receive signals of air pressure changes through the vent 331. This helps to precisely regulate the air pressure inside the MEMS chip 41 and improve the accuracy of converting sound signals into electrical signals.

[0066] In some embodiments, the ratio of the area of ​​the waterproof membrane 32 to the area of ​​the sound inlet 11 is 6:1 to 20:1, for example, the ratio of the area of ​​the waterproof membrane 32 to the area of ​​the sound inlet 11 is set to 8:1, 10:1, 12:1 or 16:1.

[0067] In the above embodiments, the area of ​​the waterproof membrane 32 can be its area on the XOY plane (specifically, the portion of the waterproof membrane 32 that can vibrate), and the area of ​​the sound inlet 11 can be its cross-sectional area on the XOY plane. Setting the area of ​​the waterproof membrane 32 to be much larger than the area of ​​the sound inlet 11 ensures that the waterproof membrane 32 has sufficient area to cover the sound inlet 11, thereby effectively preventing moisture and other liquids from entering the MEMS packaging structure.

[0068] Meanwhile, precisely controlling the area ratio of the waterproof membrane 32 to the sound inlet 11 ensures that the sound signal can smoothly pass through the waterproof membrane 32 into the MEMS chip 41 for signal conversion, while maintaining waterproof performance. This guarantees the waterproof performance, sound transmission efficiency, and structural stability of the MEMS packaging structure. However, if the area ratio of the waterproof membrane 32 to the sound inlet 11 is too large, the vibration amplitude of the waterproof membrane 32 will be weak, making it difficult to effectively transmit the sound signal.

[0069] In one embodiment, the area ratio of the waterproof membrane 32 to the area of ​​the sound inlet 11 is 14:1. While covering the sound inlet 11, the waterproof membrane 32 can be positioned opposite most of the ASIC chip 42 and most of the MEMS chip 41, thus ensuring the vibration efficiency of the waterproof membrane 32.

[0070] In one embodiment, the SNR of the MEMS packaging structure is greater than or equal to 60dB.

[0071] In the above embodiment, the support structure 33 is disposed on the side of the waterproof membrane 32 away from the substrate 31; the active chip module 4 is disposed on the support structure 33 and electrically connected to the substrate 1, and at least a portion of the MEMS chip 41 and at least a portion of the ASIC chip 42 are opposite to the waterproof membrane 32, so that the SNR of the MEMS package structure is greater than or equal to 60dB, ensuring the signal quality of the MEMS package structure. The MEMS package structure can capture and transmit sound signals more clearly and resist interference from external noise.

[0072] In one specific embodiment, the ratio of the area of ​​the waterproof membrane 32 to the area of ​​the sound inlet 11 is set to 14:1, and the SNR of the MEMS packaging structure reaches 64dB. This enables clearer and more accurate sound capture and transmission through the MEMS packaging structure, thereby improving the user's auditory experience.

[0073] In some embodiments, see Figure 2 and Figure 3The support structure 33 includes a support ring 332 and a support plate 333. The support ring 332 is disposed on the side of the waterproof membrane 32 away from the substrate 31, and the support plate 333 is disposed on the support ring 332 and is used to support the active chip module 4.

[0074] In the above embodiment, the support ring 332 is disposed on the side of the waterproof membrane 32 away from the substrate 31, so that the support ring 332 and the substrate 31 fix and position the waterproof membrane 32 on both sides of the waterproof membrane 32; moreover, the substrate 31 and the support ring 332 can be ring-shaped bodies made of PI (polyimide) material, which has good electrical insulation properties. The internal cavity of the support ring 332 and the internal cavity of the substrate 31 provide vibration space for the reciprocating vibration of the waterproof membrane 32, ensuring the vibration efficiency of the waterproof membrane 32 and preventing the waterproof membrane 32 from deforming or being damaged due to external pressure or excessive vibration.

[0075] See Figure 2 Ventilation holes 331 are provided on the support plate 333. The support plate 333 is set on the support ring 332 and is used to support the active chip module 4, ensuring the stability and reliability of the MEMS chip 41 and ASIC chip 42 in the packaging structure. The support plate 333 can be made of metal or plastic to ensure the support effect of the support plate 333 and meet the requirements of lightweight design.

[0076] In some embodiments, see Figures 4 to 6 The support structure 33 has a vibration cavity 334 inside. The support structure 33 is fastened to the side of the waterproof membrane 32 away from the substrate 31 and is used to support the active chip module 4.

[0077] In the above embodiments, the support structure 33 can have an internal groove to form a vibration cavity 334, which facilitates the provision of vibration space for the waterproof membrane 32; moreover, the groove wall of the support structure 33 can fix and position the waterproof membrane 32 on the side away from the substrate 31.

[0078] Meanwhile, the side of the support structure 33 away from the waterproof membrane 32 serves to support the active chip module 4, ensuring the stability and reliability of the active chip module 4 in the packaging structure and guaranteeing the compactness of the MEMS packaging structure.

[0079] In some embodiments, see Figure 1 and Figure 4 The MEMS packaging structure also includes an adhesive 5, and the substrate 31 is bonded and fixed to the side of the substrate 1 facing the housing 2 by the adhesive 5.

[0080] In the above embodiments, the substrate 31 of the waterproof module 3 can be glued to the substrate 1, enabling a compact layout of the MEMS packaging structure within a limited space, thus ensuring the miniaturization and integration of the MEMS packaging structure. Using adhesive 5 to fix the substrate 31 to the substrate 1 simplifies the assembly process between the MEMS packaging structure and the substrate 1.

[0081] The adhesives mentioned in the embodiments of this application include, but are not limited to, HAF adhesive (hot melt acrylic adhesive), PSA adhesive (pressure sensitive adhesive), epoxy adhesive and silicone, to meet the usage requirements of MEMS packaging structures under different performance requirements and improve the production efficiency, reliability and durability of MEMS packaging structures.

[0082] This application provides an electronic device that includes the aforementioned MEMS packaging structure.

[0083] In the above embodiments, the MEMS packaging structure of the electronic device has the support structure 33 disposed on the side of the waterproof membrane 32 away from the substrate 31; the active chip module 4 is disposed on the support structure 33 and electrically connected to the substrate 1. On the one hand, it achieves effective waterproofing of the MEMS packaging structure, and on the other hand, it avoids the need to cut grooves on the substrate 1 to set the waterproof structure, reduces the overall size of the substrate 1, which is conducive to the miniaturization of the MEMS packaging structure and reduces the space occupied by MEMS packaging structures such as MEMS microphones inside the electronic device.

[0084] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A MEMS package structure, characterized by, include: A substrate (1) is provided with a sound inlet hole (11). A housing (2) is disposed on one side of the substrate (1) and forms a receiving cavity with the substrate (1); A waterproof module (3) is disposed in the receiving cavity. The waterproof module (3) includes a base (31), a waterproof membrane (32), and a support structure (33). The base (31) is disposed on the substrate (1). The waterproof membrane (32) is disposed on the base (31) and can cover the sound inlet (11). The support structure (33) is disposed on the side of the waterproof membrane (32) away from the base (31). An active chip module (4) is disposed on the support structure (33) and electrically connected to the substrate (1).

2. The MEMS package structure of claim 1, wherein, The active chip module (4) includes a MEMS chip (41), which is disposed on the side of the support structure (33) away from the waterproof membrane (32). In the thickness direction of the substrate (1), at least a portion of the MEMS chip (41) is opposite to the waterproof membrane (32).

3. The MEMS package structure of claim 2, wherein, The active chip module (4) includes an ASIC chip (42), which is disposed on the side of the support structure (33) away from the waterproof membrane (32) and electrically connected to the MEMS chip (41). At least a portion of the ASIC chip (42) is opposite the waterproof membrane (32).

4. The MEMS package structure of claim 2, wherein, The support structure (33) is provided with a vent hole (331), which is connected to the internal cavity of the MEMS chip (41).

5. The MEMS package structure of claim 1, wherein, The ratio of the area of ​​the waterproof membrane (32) to the area of ​​the sound inlet (11) is (6-20):

1.

6. The MEMS package structure of claim 1, wherein, The SNR of the MEMS packaging structure is greater than or equal to 60dB.

7. The MEMS package structure of claim 1, wherein, The support structure (33) includes a support ring (332) and a support plate (333). The support ring (332) is disposed on the side of the waterproof membrane (32) away from the substrate (31). The support plate (333) is disposed on the support ring (332) and is used to support the active chip module (4).

8. The MEMS package structure of claim 1, wherein, The support structure (33) has a vibration cavity (334) inside. The support structure (33) is fastened to the side of the waterproof membrane (32) away from the substrate (31) and is used to support the active chip module (4).

9. The MEMS package structure of claim 1, wherein, It also includes an adhesive (5), through which the substrate (31) is bonded and fixed to the side of the substrate (1) facing the housing (2).

10. An electronic device, comprising: Includes the MEMS packaging structure described in any one of 1-9.

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