A heat dissipation structure for heat-generating devices in an energy storage battery pack

Abstract

This utility model relates to the field of battery technology and discloses a heat dissipation structure for a heat-generating device in an energy storage battery pack. The structure includes a printed circuit board and a heat dissipation assembly. The heat dissipation assembly includes a thermally conductive component. The printed circuit board includes a thermally conductive connector and a circuit board body with an inner copper layer. The back of the circuit board body facing away from the thermally conductive component has pads, and surface-mount devices are connected to the circuit board body via the pads. A front outer copper layer is laid on the front of the circuit board body facing the thermally conductive component. The thermally conductive connector penetrates the circuit board body and sequentially connects the pads to the inner copper layer and the front outer copper layer. An insulating thermally conductive layer is sandwiched between the thermally conductive component and the front outer copper layer, allowing heat from the front outer copper layer to be transferred to the thermally conductive component through the insulating thermally conductive layer. This heat dissipation structure has high heat dissipation efficiency and is less prone to heat accumulation.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, and in particular to a heat dissipation structure for a heat-generating device in an energy storage battery pack. Background Technology

[0002] With the continuous maturation and development of new energy technologies, the demand for energy storage battery packs in the energy storage field is growing rapidly. Printed circuit boards (PCBs) are the core carriers for electrical connections and control within energy storage battery packs. In high-power energy storage scenarios, surface-mount devices such as toll-free circuit boards integrated on PCBs generate a large amount of heat during rapid charging and discharging and energy conversion, which can easily lead to heat accumulation. Utility Model Content

[0003] To address the technical problem of heat accumulation in the aforementioned heat-generating devices, this invention provides a heat dissipation structure for heat-generating devices in energy storage battery packs, which can efficiently dissipate heat from the heat-generating devices.

[0004] The specific technical solution of this utility model is as follows: a heat dissipation structure for a heat-generating device in an energy storage battery pack, comprising a printed circuit board and a heat dissipation assembly. The heat dissipation assembly includes a heat-conducting component. The printed circuit board includes a heat-conducting connector and a circuit board body with an inner copper layer. The back of the circuit board body away from the heat-conducting component is provided with pads, and surface-mount devices are connected to the circuit board body through the pads. A front outer copper layer is laid on the front of the circuit board body facing the heat-conducting component. The heat-conducting connector penetrates the circuit board body and sequentially connects the pads to the inner copper layer and the front outer copper layer. An insulating heat-conducting layer is sandwiched between the heat-conducting component and the front outer copper layer so that the heat of the front outer copper layer is transferred to the heat-conducting component through the insulating heat-conducting layer.

[0005] In the aforementioned heat dissipation structure, the surface-mount device (SMD) is located on the back of the circuit board. Heat from the SMD is first conducted to the pads, which then conduct the heat sequentially to the inner copper layer via thermally conductive connectors. The inner copper layer reduces local temperature through its large-area diffusion and, with the help of the thermally conductive connectors, conducts the heat to the outer copper layer on the front side. The heat on the outer copper layer passes through the insulating thermally conductive layer sandwiched between it and the thermally conductive component, ultimately reaching the thermally conductive component, which dissipates the heat, thus forming the shortest vertical heat dissipation path and improving heat dissipation efficiency. Simultaneously, the heat in the inner copper layer is conducted away through the thermally conductive connectors, reducing the risk of heat transfer to the printed circuit board and causing the overall temperature of the printed circuit board to rise, thereby extending its lifespan. The heat from the SMD can be directly transferred through the pads attached to the bottom, eliminating the need for an additional dedicated thermally conductive surface on its surface, resulting in a relatively simple structure. Furthermore, this structure creates a temperature gradient: heating element > inner copper layer > outer copper layer > thermally conductive component. Heat generated by the contacts of other components on the circuit board can also be directly conducted to the thermally conductive component through the inner copper layer, achieving efficient heat dissipation.

[0006] Optionally, the thermally conductive connector, the inner copper layer, and the outer copper layer on the front are all made of the same material, and all are copper.

[0007] In the above technical solution, copper has low thermal resistance and high thermal conductivity, resulting in high thermal conductivity efficiency. The thermally conductive connector, inner copper layer, and front outer copper layer are made of the same material. During the heat transfer process of "thermally conductive connector → inner copper layer → front outer copper layer", no additional contact thermal resistance will be generated due to material differences, thus improving the heat transfer efficiency. In addition, the use of the same copper material for all three avoids process compatibility issues caused by different materials and also facilitates the integrated molding through multilayer board lamination and metallized via processes.

[0008] Optionally, the circuit board body is provided with a through hole penetrating the circuit board body, and the heat-conducting connector is hollow and attached to the side wall of the through hole.

[0009] In the above technical solution, through holes are used for electrical connections between different plate layers. Hollow thermally conductive connectors are attached to the sidewalls of the through holes. The contact area between the thermally conductive connectors and the through holes is large, which improves the heat transfer efficiency. At the same time, the hollow thermally conductive connectors can be directly formed through metallization hole process, which reduces the processing complexity.

[0010] Optionally, the number of thermally conductive connectors is multiple, and the multiple thermally conductive connectors are spaced apart on the circuit board body.

[0011] In the above technical solution, compared with a single thermally conductive connector, multiple thermally conductive connectors have a larger total thermally conductive cross-sectional area, which can improve heat transfer efficiency. The spaced arrangement can make the heat distribution more uniform and avoid local heat accumulation. At the same time, the aperture of multiple thermally conductive connectors is reduced, which can reduce the risk of solder leaking into the through hole during welding and ensure welding quality and electrical connection reliability.

[0012] Optionally, the surface-mount device is connected to the back of the printed circuit board via a TOLL package structure.

[0013] In the above technical solution, the exposed pads at the bottom of the TOLL package can be directly and tightly attached to the pads on the back of the printed circuit board, increasing the heat conduction contact area and enabling the heat generated by the device to be quickly transferred to the pads, laying the foundation for subsequent heat dissipation through multiple thermally conductive connectors; at the same time, the heat dissipation path design of the package itself complements the vertical heat dissipation channel of the circuit board, further reducing thermal resistance and improving overall heat dissipation efficiency.

[0014] Optionally, the insulating thermally conductive layer is insulating silicone grease; or, the insulating thermally conductive layer is a silicone pad; or, the insulating thermally conductive layer is an alumina ceramic sheet; or, the insulating thermally conductive layer is an aluminum nitride ceramic sheet.

[0015] In the above technical solution, the insulating and thermally conductive layer uses the above four materials, which can effectively block the current conduction between the front outer copper layer and the thermally conductive component, avoid the risk of short circuit, and at the same time efficiently transfer the heat of the front outer copper layer to the thermally conductive component.

[0016] Optionally, the area of ​​the front outer copper layer covering the front of the circuit board body is greater than the area of ​​the surface mount device covering the pads; and / or, the area of ​​the front outer copper layer covering the front of the circuit board body is greater than the area of ​​the pads covering the back of the circuit board body.

[0017] In the above technical solution, the area of ​​the outer copper layer covering the front of the circuit board body is relatively large, which allows the heat transferred from the thermally conductive connector to quickly diffuse on the outer copper layer, avoiding the heat concentration in local areas and the formation of thermal resistance. At the same time, the larger heat dissipation area can form more sufficient contact with the insulating thermally conductive layer, improve the efficiency of heat transfer, further enhance the overall thermal conductivity, and ensure that the heat generated by the surface-mount device can be efficiently dissipated.

[0018] Optionally, the heat dissipation assembly further includes a heat exchanger and a fan. The heat exchanger includes an integrally formed heat exchange plate and heat exchange fins. The heat conduction component includes an integrally formed heat conduction plate and heat conduction block. The heat exchange plate and the heat conduction plate are in close contact and thermal grease is applied between them. The heat conduction block protrudes from the heat conduction plate towards the side closer to the printed circuit board and contacts the insulating thermal conduction layer. The fan faces the heat exchange fins and dissipates heat from the heat exchange fins.

[0019] In the above technical solution, heat is collected by the heat-conducting block and then passes sequentially through the heat-conducting plate and heat exchange plate to the heat exchange fins. The fan blows air onto the heat exchange fins to achieve heat dissipation. The integrated heat-conducting plate and heat-conducting block, and the heat exchange plate and heat exchange fins avoid the thermal resistance caused by the connection gaps in the split structure, enhancing structural stability and thermal conductivity. The fan blowing air towards the heat exchange fins accelerates the heat exchange between the heat exchange fins and the surrounding air, improving the heat dissipation rate.

[0020] Optionally, the front side of the circuit board body is provided with multiple electrical components, which are in contact with or connected to the heat-conducting components through a heat-conducting structure.

[0021] In the above technical solution, the heat generated by the electrical components is directly transferred to the heat-conducting component, which greatly shortens the heat transfer distance and improves the heat removal efficiency. At the same time, the heat generated by the electrical components and the heat generated by the surface-mount devices are both transferred to the heat-conducting component. As a unified heat dissipation terminal, the heat-conducting component can dissipate heat from different areas in a coordinated manner, resulting in high heat dissipation efficiency and reducing the temperature of the printed circuit board, thereby improving its service life.

[0022] Optionally, there are multiple front outer copper layers, which are spaced apart and are in close contact with the same insulating and thermally conductive layer.

[0023] In the above technical solution, each front outer copper layer can respectively receive the heat transferred by different thermally conductive connectors, and then the heat is concentrated and transferred to the thermally conductive component with the help of the same insulating thermally conductive layer. This not only realizes the dispersed collection of heat, but also ensures the concentrated discharge, thereby improving the heat dissipation efficiency.

[0024] Compared with the prior art, the present invention has at least the following advantages:

[0025] (1) High heat dissipation efficiency: The surface-mount device is located on the back of the circuit board body. The heat of the surface-mount device is first conducted to the pad. The pad conducts the heat to the inner copper layer and the outer copper layer on the front side through the thermally conductive connector. The heat on the outer copper layer on the front side passes through the insulating thermally conductive layer sandwiched between it and the thermally conductive component, and is finally transferred to the thermally conductive component. The thermally conductive component dissipates the heat, thus forming the shortest vertical heat dissipation path. At the same time, the thermally conductive connector, the inner copper layer and the outer copper layer on the front side are all made of copper, which reduces thermal resistance and significantly improves heat dissipation efficiency.

[0026] (2) Easy to process: The thermally conductive connector, inner copper layer and front outer copper layer are made of the same material, avoiding the process compatibility problem caused by different materials. It is also easy to achieve integrated molding through multilayer board lamination and electroplating copper process. The circuit board body is provided with through holes that penetrate the circuit board body. The thermally conductive connector is hollow and attached to the side wall of the through hole. The hollow thermally conductive connector can be directly formed through the metallization hole process.

[0027] (3) Long service life: Multiple electrical components are provided on the front side of the circuit board body. The electrical components are in contact with the heat-conducting components. The heat generated by the electrical components and the heat generated by the surface-mount devices are transferred to the heat-conducting components, reducing the temperature of the printed circuit board and improving its service life. Attached Figure Description

[0028] Figure 1 This is a cross-sectional view of Embodiment 1 of this utility model;

[0029] Figure 2 This is a cross-sectional view of Embodiment 2 of this utility model;

[0030] Figure 3 This is a schematic diagram of the heat dissipation structure of this utility model;

[0031] Figure 4 This is an isometric view of the heat dissipation structure of this utility model.

[0032] The reference numerals in the attached figures are as follows: 1. Printed circuit board; 1.0. Circuit board body; 1.0.1. Inner copper layer; 1.2. Thermally conductive connector; 1.3. Solder pad; 1.4. Surface mount device; 1.5. Front outer copper layer; 1.6. Through hole; 1.7. Electrical component; 2.1. Thermally conductive component; 2.1.1. Thermal plate; 2.1.2. Thermal block; 2.2. Heat exchanger; 2.2.1. Heat exchange plate; 2.2.2. Heat exchange fins; 2.3. Fan; 3. Insulating thermally conductive layer. Detailed Implementation

[0033] The present invention will be further described below with reference to embodiments. Unless otherwise specified, all devices, connection structures, and methods involved in this invention are known in the art.

[0034] Example 1

[0035] Reference Figure 1 and Figure 3 , Figure 4 As shown, this utility model provides a heat dissipation structure for a heat-generating device in an energy storage battery pack. The energy storage battery pack includes a housing with an opening. The heat dissipation structure includes a printed circuit board 1 located inside the housing and a heat dissipation component that partially extends out of the housing through the opening and contacts the air. The heat dissipation component includes a thermally conductive element 2.1. The printed circuit board 1 includes a thermally conductive connector 1.2 and a circuit board body 1.0 with an inner copper layer 1.0.1. The back of the circuit board body 1.0, facing away from the thermally conductive element 2.1, has solder pads 1.3. The circuit board 10 includes a surface-mount device 1.4 connected to the circuit board body 1.0 via pads 1.3. A front outer copper layer 1.5 is laid on the front side of the circuit board body 1.0 facing the heat-conducting component 2.1. A thermally conductive connector 1.2 penetrates the circuit board body 1.0 and sequentially connects the pads 1.3 to the inner copper layer 1.0.1 and the front outer copper layer 1.5. An insulating thermally conductive layer 3 is sandwiched between the heat-conducting component 2.1 and the front outer copper layer 1.5, so that the heat from the front outer copper layer 1.5 is transferred to the heat-conducting component 2.1 through the insulating thermally conductive layer 3. In this embodiment, the back side of the circuit board body 1.0 refers to the side facing away from the heat-conducting component 2.1, and the front side refers to the side facing the heat-conducting component 2.1.

[0036] In the aforementioned heat dissipation structure, the surface-mount device 1.4 is located on the back of the circuit board body 1.0, and its main heat-generating component is the gate pin (G), from which heat is conducted outwards. For example... Figure 1As shown, the heat transfer process of this heat dissipation structure is as follows: the heat from the surface-mount device 1.4 is first conducted to the pad 1.3. The pad 1.3 then conducts the heat sequentially to the inner copper layer 1.0.1 through the thermally conductive connector 1.2. The inner copper layer 1.0.1 reduces the local temperature through its large-area diffusion and, with the help of the thermally conductive connector 1.2, conducts the heat to the front outer copper layer 1.5. The heat on the front outer copper layer 1.5 passes through the insulating thermally conductive layer 3 sandwiched between it and the thermally conductive component 2.1, and is finally transferred to the thermally conductive component 2.1, where it dissipates the heat, thus forming the shortest vertical heat dissipation path and improving heat dissipation efficiency. Simultaneously, the heat in the inner copper layer 1.0.1 is conducted away through the thermally conductive connector 1.2, reducing the risk of heat transfer to the printed circuit board 1, which could cause the temperature of the entire printed circuit board 1 to rise, and thus extending its service life. The heat from the surface-mount device 1.4 can be directly transferred through the bottom-mounted pad 1.3 without the need for an additional dedicated heat-conducting surface on its surface, resulting in a relatively simple structure. Furthermore, the above structure can create a temperature gradient of heating element > inner copper layer > front outer copper layer > heat-conducting component. Heat generated by the contacts of other components on the circuit board can also be directly conducted to the heat-conducting component through the inner copper layer, thereby achieving efficient heat dissipation.

[0037] like Figure 3 As shown, the heat dissipation assembly also includes a heat exchanger 2.2 and a fan 2.3. The heat exchanger 2.2 includes an integrally formed heat exchange plate 2.2.1 and heat exchange fins 2.2.2. The heat conduction component 2.1 includes an integrally formed heat conduction plate 2.1.1 and heat conduction block 2.1.2. The heat exchange plate 2.2.1 and the heat conduction plate 2.1.1 are in close contact and thermally conductive grease is applied between them. The heat conduction block 2.1.2 protrudes from the heat conduction plate 2.1.1 towards the side closer to the printed circuit board 1 and contacts the insulating thermally conductive layer 3. The fan 2.3 faces the heat exchange fins 2.2.2 and dissipates heat from them. In the heat dissipation assembly, the heat exchange fins 2.2.2 at least partially extend out of the housing and contact the air. The fan 2.3 is used to increase the airflow velocity on the surface of the heat exchange fins 2.2.2. Heat is collected by the heat-conducting block 2.1.2 and then passes sequentially through the heat-conducting plate 2.1.1 and the heat exchange plate 2.2.1 to the heat exchange fins 2.2.2. The fan 2.3 blows air onto the heat exchange fins 2.2.2 to achieve heat dissipation. The integrated design of the heat-conducting plate 2.1.1 and the heat-conducting block 2.1.2, and the heat exchange plate 2.2.1 and the heat exchange fins 2.2.2, avoids the thermal resistance caused by the connection gaps in the split structure, and enhances the structural stability and thermal conductivity. The fan 2.3 blows air towards the heat exchange fins 2.2.2, accelerating the heat exchange between the heat exchange fins 2.2.2 and the surrounding air, and improving the heat dissipation rate.

[0038] In this embodiment, the circuit board body 1.0 adopts a multi-layer stacked structure, consisting of a substrate, an inner copper layer 1.0.1, and another substrate. The outer surfaces of the substrates on both sides away from the inner copper layer 1.0.1 are covered with copper foil. The inner copper layer 1.0.1 is also made of copper foil. The thermal conductivity of copper is much greater than that of the substrate. When the circuit board generates heat, the heat will preferentially accumulate in the copper layer and be efficiently conducted along the extension direction of the copper layer.

[0039] In this embodiment, the thermally conductive connector 1.2, the inner copper layer 1.0.1, and the front outer copper layer 1.5 are all made of the same material, namely copper. Copper has low thermal resistance and high thermal conductivity, resulting in high thermal conductivity. Since the thermally conductive connector 1.2, the inner copper layer 1.0.1, and the front outer copper layer 1.5 are made of the same material, the heat transfer process from the thermally conductive connector 1.2 to the inner copper layer 1.0.1 and then to the front outer copper layer 1.5 will not generate additional contact thermal resistance due to material differences, thus improving heat transfer efficiency. Furthermore, using the same copper material for all three avoids process compatibility issues caused by material differences and facilitates integrated molding through multilayer board lamination and metallized via processes.

[0040] like Figure 1 As shown, the circuit board body 1.0 has a through hole 1.6 penetrating through the circuit board body 1.0. A hollow thermally conductive connector 1.2 is hollow and attached to the side wall of the through hole 1.6. The through hole 1.6 is used for electrical connection between different board layers. The hollow thermally conductive connector 1.2 is attached to the side wall of the through hole 1.6, and the contact area between the thermally conductive connector 1.2 and the through hole 1.6 is large, which improves the heat transfer efficiency. At the same time, the hollow thermally conductive connector 1.2 can be directly formed by metallization hole process, which reduces the processing complexity.

[0041] In this embodiment, the thermally conductive connector 1.2, the inner copper layer 1.0.1, and the front outer copper layer 1.5 are integrally formed. This can be achieved through the following process: First, the inner copper layer 1.0.1 and the front outer copper layer 1.5 are based on the same batch of copper-clad laminate and are etched to form a preset circuit and heat dissipation pattern. Then, holes are drilled on the PCB substrate to create through holes 1.6. The hole walls of the through holes 1.6 are metallized through chemical copper plating and electroplating processes to form the thermally conductive connector 1.2. The inner copper layer 1.0.1, the inner copper layer 1.0.1, and the front outer copper layer 1.5 are directly fused into a continuous copper whole. Finally, the thermally conductive connector 1.2, the inner copper layer 1.0.1, and the front outer copper layer 1.5 form an interface-free integral structure, which eliminates the gaps or contact thermal resistance that may exist when connecting dissimilar materials and avoids damage to the strength of the circuit board body 1.0 due to additional processing.

[0042] Understandably, in other embodiments, a separate fabrication and subsequent connection process can also be adopted: First, the thermally conductive connector 1.2, the inner copper layer 1.0.1, and the front outer copper layer 1.5 are fabricated separately. The inner copper layer 1.0.1 and the front outer copper layer 1.5 are individually formed based on copper-clad laminates through an etching process; the thermally conductive connector 1.2 is prefabricated using a pure copper rod or copper tube, the diameter of which matches the subsequent connection hole positions. During connection, holes are first drilled at the corresponding positions on the circuit board body 1.0, and the inner copper layer 1.0.1 and the front outer copper layer 1.5 are assembled on both sides of the substrate according to a preset layer hierarchy, aligning the connection holes of the three; then, the thermally conductive connector 1.2 is inserted into the hole and fixed by bonding with conductive adhesive, ensuring that the thermally conductive connector 1.2 is in close contact with the inner copper layer 1.0.1 and the front outer copper layer 1.5.

[0043] In this embodiment, the surface-mount device 1.4 is connected to the back of the printed circuit board 1 through a TOLL package structure. The exposed pad 1.3 at the bottom of the TOLL package can directly and tightly fit with the pad 1.3 on the back of the printed circuit board 1, increasing the heat conduction contact area and allowing the heat generated by the device to be quickly transferred to the pad 1.3, laying the foundation for subsequent heat dissipation through multiple thermally conductive connectors 1.2; at the same time, the heat dissipation path design of the package itself complements the vertical heat dissipation channel of the circuit board, further reducing thermal resistance and improving overall heat dissipation efficiency.

[0044] The insulating and thermally conductive layer 3 is used to achieve electrical insulation and heat transfer. Its material is selected from insulating silicone grease, silicone pad, alumina ceramic sheet, aluminum nitride ceramic sheet or other insulating materials with high thermal conductivity to effectively block the current conduction between the front outer copper layer 1.5 and the thermal conductive component 2.1, avoid the risk of short circuit, and at the same time efficiently transfer the heat of the front outer copper layer 1.5 to the thermal conductive component 2.1.

[0045] like Figure 1 As shown, the heat dissipation structure of this embodiment adopts a one-to-one correspondence design, that is, the bottom of a single surface-mount device 1.4 is attached to a pad 1.3. The pad 1.3 forms a heat conduction path with an independent front outer copper layer 1.5 on the front side of the circuit board body 1.0 through a thermally conductive connector 1.2 that penetrates the circuit board body 1.0. The outer side of the front outer copper layer 1.5 is covered with an insulating thermally conductive layer 3 of equal area.

[0046] like Figure 1As shown, in this embodiment, the area of ​​the surface-mount device 1.4 covering the pad 1.3 is the same as the area of ​​the pad 1.3 covering the back of the circuit board body 1.0. The area of ​​the front outer copper layer 1.5 covering the front of the circuit board body 1.0 is larger than the area of ​​the surface-mount device 1.4 covering the pad 1.3. The insulating thermally conductive layer 3 covers the front outer copper layer 1.5 with an equal area, and the thermally conductive component 2.1 is in contact with the insulating thermally conductive layer 3 with an equal area. The relatively large area of ​​the front outer copper layer 1.5 covering the front of the circuit board body 1.0 allows the heat transferred from the thermally conductive connector 1.2 to quickly diffuse on the front outer copper layer 1.5, avoiding heat concentration in local areas and the formation of thermal resistance. At the same time, the larger heat dissipation area allows for more sufficient contact with the insulating thermally conductive layer 3, improving the efficiency of heat transfer, further enhancing the overall thermal conductivity, and ensuring that the heat generated by the surface-mount device 1.4 can be efficiently dissipated.

[0047] It is understandable that as long as the area of ​​the outer copper layer 1.5 covering the front of the circuit board body 1.0 is either greater than the area of ​​the surface mount device 1.4 covering the pad 1.3 or the area of ​​the pad 1.3 covering the back of the circuit board body 1.0, effective heat dissipation can be achieved. As for the relationship between the area of ​​the surface mount device 1.4 covering the pad 1.3 and the area of ​​the pad 1.3 covering the back of the circuit board, they can be equal or they can have a difference in size.

[0048] like Figure 1 As shown, in this embodiment, the front side of the circuit board body 1.0 is provided with multiple electrical components 1.7, which are in contact with the heat-conducting component 2.1. In other embodiments, the electrical components 1.7 are connected to the heat-conducting component 2.1 through a heat-conducting structure. The heat-conducting structure can be made of thermally conductive silicone, or a metal heat-conducting pillar can be selected to connect the two depending on the distance between the electrical components 1.7 and the heat-conducting component 2.1. The heat generated by the electrical components 1.7 is directly transferred to the heat-conducting component 2.1, which greatly shortens the heat transfer distance and improves the heat dissipation efficiency. At the same time, the heat generated by the electrical components 1.7 and the heat generated by the surface-mount device 1.4 are both transferred to the heat-conducting component 2.1. As a unified heat dissipation terminal, the heat-conducting component 2.1 can dissipate heat from different areas in a coordinated manner, resulting in high heat dissipation efficiency and reducing the temperature of the printed circuit board 1, thus improving its service life.

[0049] Example 2

[0050] This utility model provides a heat dissipation structure for a heat-generating device in an energy storage battery pack, which differs from Embodiment 1 in that: Figure 2As shown, in this embodiment, the circuit board body 1.0 has a through hole 1.6 penetrating through the circuit board body 1.0, and the thermally conductive connector 1.2 is hollow and attached to the side wall of the through hole 1.6. The bottom of a single surface-mount device 1.4 is attached to a pad 1.3, and each pad 1.3 is connected to the front outer copper layer 1.5 through two thermally conductive connectors 1.2 penetrating the circuit board body 1.0. The two thermally conductive connectors 1.2 are spaced apart on the circuit board body 1.0, which can transfer the heat generated by the surface-mount device 1.4 to the front outer copper layer 1.5 more evenly and quickly.

[0051] Compared to a single thermally conductive connector 1.2 for a surface-mount device 1.4, multiple thermally conductive connectors 1.2 have a larger total thermally conductive cross-sectional area, which can improve heat transfer efficiency. The spaced arrangement can make the heat distribution more uniform and avoid local heat accumulation. At the same time, the aperture of multiple thermally conductive connectors 1.2 is reduced, which can reduce the risk of solder leaking into the through hole 1.6 during soldering, and ensure soldering quality and electrical connection reliability.

[0052] like Figure 2 As shown, in this embodiment, multiple surface-mount devices 1.4 are connected to the back of the circuit board body 1.0. Adjacent devices share the same front outer copper layer 1.5. Multiple front outer copper layers 1.5 can be disposed on the circuit board body 1.0, with the multiple front outer copper layers 1.5 spaced apart. The area of ​​each front outer copper layer 1.5 is designed according to the distribution of the corresponding surface-mount devices 1.4, and must be larger than the area formed by all the corresponding surface-mount devices 1.4 to achieve effective diffusion. Multiple front outer copper layers 1.5 in adjacent areas are in close contact with the same insulating thermal conductive layer 3. The insulating thermal conductive layer 3 completely covers these front outer copper layers 1.5, thereby transferring the heat collected by the multiple surface-mount devices 1.4 through the front outer copper layers 1.5 to the heat conductor 2.1. The heat conductor 2.1 and the insulating thermal conductive layer 3 are in contact with each other with an equal area. Each front outer copper layer 1.5 can respectively receive the heat transferred by different thermally conductive connectors 1.2, and then the heat is concentrated and transferred to the thermally conductive component 2.1 with the help of the same insulating thermally conductive layer 3. This not only realizes the dispersed collection of heat, but also ensures the concentrated discharge, thus improving the heat dissipation efficiency.

[0053] Understandably, in a structure where a single surface-mount device is bonded to a pad at its bottom, and the pad is connected to a thermally conductive connector that runs through the entire circuit board, multiple front-side copper layers can be used to allow adjacent devices to share the same front-side copper layer. Then, multiple front-side copper layers in adjacent areas are tightly bonded to the same insulating thermally conductive layer. The area of ​​the insulating thermally conductive layer needs to cover the entire area of ​​the front-side copper layers in these adjacent areas, and the thermally conductive components and the insulating thermally conductive layer are in contact with each other at equal areas.

[0054] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model in any way. Any simple modifications, alterations, or equivalent structural transformations made to the above embodiments based on the technical essence of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a heat-generating device in an energy storage battery pack, characterized in that, The device includes a printed circuit board (1) and a heat dissipation assembly. The heat dissipation assembly includes a heat-conducting component (2.1). The printed circuit board (1) includes a heat-conducting connector (1.2) and a circuit board body (1.0) with an internal copper layer (1.0.1). The circuit board body (1.0) has pads (1.3) on its back side away from the heat-conducting component (2.1), and surface-mount devices (1.4) connected to the circuit board body (1.0) via the pads (1.3). A front outer copper layer (1.5) is laid on the front side of the heat-conducting component (2.1). The heat-conducting connector (1.2) penetrates the circuit board body (1.0) and connects the pad (1.3) to the inner copper layer (1.0.1) and the front outer copper layer (1.5) in sequence. An insulating heat-conducting layer (3) is sandwiched between the heat-conducting component (2.1) and the front outer copper layer (1.5) so that the heat of the front outer copper layer (1.5) can be transferred to the heat-conducting component (2.1) through the insulating heat-conducting layer (3).

2. A heat dissipating structure for a heat generating device of an energy storage battery pack according to claim 1, characterized in that, The thermally conductive connector (1.2), the inner copper layer (1.0.1), and the front outer copper layer (1.5) are all made of the same material and are all copper.

3. A heat dissipating structure for a heat generating device of an energy storage battery pack according to claim 1, characterized in that, The circuit board body (1.0) is provided with a through hole (1.6) that penetrates the circuit board body (1.0), and the heat-conducting connector (1.2) is hollow and attached to the side wall of the through hole (1.6).

4. A heat dissipating structure for a heat generating device of an energy storage battery pack according to claim 3, characterized in that, The number of thermally conductive connectors (1.2) is multiple, and the multiple thermally conductive connectors (1.2) are spaced apart on the circuit board body (1.0).

5. A heat dissipating structure for heat generating devices of an energy storage battery pack according to claim 1, characterized in that, The surface-mount device (1.4) is connected to the back of the printed circuit board (1) through a TOLL package structure.

6. A heat dissipating structure for a heat generating device of an energy storage battery pack according to any one of claims 1 to 5, characterized in that, The insulating and thermally conductive layer (3) is insulating silicone grease; or, the insulating and thermally conductive layer (3) is a silicone pad; or, the insulating and thermally conductive layer (3) is an alumina ceramic sheet; or, the insulating and thermally conductive layer (3) is an aluminum nitride ceramic sheet.

7. A heat dissipating structure for a heat generating device of an energy storage battery pack according to any one of claims 1 to 5, characterized in that, The area of ​​the front outer copper layer (1.5) covering the front of the circuit board body (1.0) is greater than the area of ​​the surface mount device (1.4) covering the pad (1.3); and / or, the area of ​​the front outer copper layer (1.5) covering the front of the circuit board body (1.0) is greater than the area of ​​the pad (1.3) covering the back of the circuit board body (1.0).

8. A heat dissipating structure for a heat generating device of an energy storage battery pack according to any one of claims 1 to 5, characterized in that, The heat dissipation assembly further includes a heat exchanger (2.2) and a fan (2.3). The heat exchanger (2.2) includes an integrally formed heat exchange plate (2.2.1) and heat exchange fins (2.2.2). The heat conduction component (2.1) includes an integrally formed heat conduction plate (2.2.1). 2.1.1) and heat-conducting block (2.1.2), the heat exchange plate (2.2.1) is in close contact with the heat-conducting plate (2.1.1) and thermal grease is applied between them, the heat-conducting block (2.1.2) protrudes from the heat-conducting plate (2.1.1) towards the side close to the printed circuit board (1), the heat-conducting block (2.1.2) is in contact with the insulating thermally conductive layer (3), the fan (2.3) is directed toward the heat exchange fins (2.2.2) and dissipates heat from the heat exchange fins (2.2.2).

9. A heat dissipation structure for a heat-generating device in an energy storage battery pack according to any one of claims 1 to 5, characterized in that, The front side of the circuit board body (1.0) is provided with a plurality of electrical components (1.7), which are in contact with or connected to the heat-conducting component (2.1) through a heat-conducting structure.

10. A heat dissipating structure for a heat generating device of an energy storage battery pack according to any one of claims 1 to 5, characterized in that, The number of the front outer copper layer (1.5) is multiple, and the multiple front outer copper layers (1.5) are spaced apart and are in close contact with the same insulating and heat-conducting layer (3).

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