A cloud computing power server

Abstract

The utility model discloses a kind of cloud computing power servers, the server includes cabinet, backplane, control management module, network switching module and data processing module;The backplane is arranged in the cabinet, the space in the cabinet is divided into first placement area and second placement area;The control management module and the network switching module are electrically connected;The control management module and the network switching module are located in the first placement area, and are electrically connected with the backplane;The data processing module is located in the second placement area;Wherein, the data processing module includes multiple computing units, multiple computing units are pull-out type structure, and are electrically connected with the backplane.The utility model is through reasonable module layout and connection mode, realizes efficient calculation and management function, and computing unit in data processing module is pull-out type structure, can be replaced in cabinet, can save the difficulty and cost of maintenance, can improve maintenance efficiency.

Description

Technical Field

[0001] This utility model relates to the field of cloud server technology, and in particular to a cloud computing server applied to the consumer market. Background Technology

[0002] Cloud servers are hubs that provide cloud computing services. They are virtualized computing power services based on cloud computing technology, providing users with dynamic and scalable shared resources by integrating computing and storage resources. Due to the demand for massive cloud data processing, it is desirable to adopt high-density designs to improve space utilization, reduce operating costs through low-energy solutions, and achieve centralized management through cloud platform interfaces.

[0003] Currently, with the development of personal user applications such as cloud gaming, cloud phones, and cloud video, the ability to meet the needs of cloud gaming and cloud phones with low-cost solutions in the consumer market, and to provide them with a stable and efficient operating environment, is a promising development direction and a high-performance technology for the field of computing power acceleration.

[0004] Most existing cloud computing servers utilize professional-grade servers to serve the aforementioned consumer-level needs, such as high-end NVIDIA 5090 series graphics cards, which possess ultra-high-speed computing resources. This increases the difficulty and cost of equipment maintenance, reduces maintenance efficiency, and affects the normal operation of other professional-grade business applications, thus degrading the user experience. Utility Model Content

[0005] The purpose of this utility model is to provide a cloud computing server to solve the technical problem that existing cloud computing servers can no longer meet actual usage needs. The various technical effects of the preferred solutions among the many technical solutions provided by this utility model are detailed below.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] This utility model provides a cloud computing server, which includes: a chassis, a backplane, a control and management module, a network switching module, and a data processing module;

[0008] The back panel is installed inside the chassis, dividing the space inside the chassis into a first placement area and a second placement area;

[0009] The control management module and the network switching module are electrically connected; the control management module and the network switching module are located in the first placement area and are both electrically connected to the backplane;

[0010] The data processing module is located in the second placement area; wherein the data processing module includes multiple computing units, all of which are pull-out structures and are electrically connected to the back plate.

[0011] Optionally, each computing unit includes a blade base plate and multiple core boards. The blade base plate is electrically connected to the backplane, and the multiple core boards are located on the blade base plate and are communicatively connected to the blade base plate.

[0012] Optionally, in each computing unit, the blade base plate is provided with multiple sets of connection ports, and each core board is communicatively connected to the blade base plate through a set of connection ports.

[0013] Optionally, each set of connection interfaces includes a network interface, an I2C interface, a USB interface, and a UART interface.

[0014] Optionally, the first placement area is provided with N placement positions, and each placement position is provided with M placement slots; wherein, one placement slot is used to accommodate one computing unit, and the computing unit in the placement slot can be replaced.

[0015] Optionally, the cloud computing server further includes a power module located in the second placement area and electrically connected to the backplane. The power module supplies power to the control management module, network switching module, and data processing module through the backplane.

[0016] Optionally, the cloud computing server further includes a heat dissipation module located inside the chassis and electrically connected to the backplane. The heat dissipation module is used to dissipate the heat generated by the control management module, network switching module, and data processing module during operation.

[0017] Optionally, a third placement area is also provided inside the chassis; the third placement area is located at the bottom of the second placement area and is used to accommodate the heat dissipation module.

[0018] Optionally, the cloud computing server further includes a status indicator module, which is electrically connected to the backplane and is used to display the working status of each module in the cloud computing server.

[0019] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:

[0020] The cloud computing server described in this embodiment achieves efficient computing and management functions through a reasonable module layout and connection method. It is suitable for scenarios that require the operation and processing of a large number of Android applications. It features a multi-modal design for CPUs, GPUs, etc., which can replace professional-grade servers and meet the main cloud service needs of the consumer market at a lower cost. Furthermore, the computing units in the data processing module have a pull-out structure that can be replaced within the chassis, which can save on maintenance difficulty and cost and improve maintenance efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0022] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0023] Figure 2 This is an overall structural framework diagram of an embodiment of the present utility model;

[0024] Figure 3 This is an exploded view of the overall structure of an embodiment of this utility model;

[0025] Figure 4 This is a schematic diagram of the bottom shell structure in an embodiment of this utility model.

[0026] In the diagram: 1. Chassis; 11. First placement area; 111. Placement position; 112. Placement slot; 12. Second placement area; 13. Third placement area; 14. Partition; 15. Bottom shell; 16. Top cover; 2. Backplate; 21. Connection port; 3. Control and management module; 4. Network switching module; 5. Data processing module; 51. Computing unit; 511. Blade baseplate; 512. Core board; 6. Power supply module; 7. Heat dissipation module; 8. Status indicator module. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.

[0028] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.

[0030] Example:

[0031] This invention provides a cloud computing server for application scenarios based on the Android system. It features a multi-modal design for CPUs, GPUs, etc., and can replace professional-grade servers, enabling the fulfillment of major cloud service needs in the consumer market at a lower cost.

[0032] like Figure 1-4As shown, the cloud computing server includes: a chassis 1, a backplane 2, a control and management module 3, a network switching module 4, and a data processing module 5; the backplane 2 is located inside the chassis 1, dividing the space inside the chassis 1 into a first placement area 11 and a second placement area 12; the control and management module 3 and the network switching module 4 are electrically connected; the control and management module 3 and the network switching module 4 are located in the first placement area 11 and are both electrically connected to the backplane 2; the data processing module 5 is located in the second placement area 12; wherein, the data processing module 5 includes multiple computing units 51, all of which are pull-out structures and are all electrically connected to the backplane 2.

[0033] Specifically, the cloud computing server described in this embodiment includes a chassis 1, which integrates a backplane 2, a control and management module 3, a network switching module 4, and a data processing module 5. The backplane 2 is located inside the chassis 1 and is used to divide the space inside the chassis 1 into a first placement area 11 and a second placement area 12, which facilitates the placement of the control and management module 3, the network switching module 4, and the data processing module 5, and also isolates the control and management module 3, the network switching module 4, and the data processing module 5, ensuring a more reasonable spatial layout inside the chassis 1.

[0034] Among them, the control and management module 3, the network switching module 4, and the data processing module 5 are all electrically connected to the backplane 2. Under the action of the backplane 2, a complete cloud computing server system architecture is formed. The backplane 2 enables efficient data transmission and signal exchange, ensuring that the various components of the system work together and share resources, thereby improving overall performance and reliability.

[0035] The data processing module 5 includes multiple computing units 51, and these computing units have a pull-out structure, which can be removed or installed from the chassis, facilitating subsequent disassembly, maintenance and replacement.

[0036] The cloud computing server described in this embodiment achieves efficient computing and management functions through a reasonable module layout and connection method. It is suitable for scenarios that require the operation and processing of a large number of Android applications. It features a multi-modal design for CPUs, GPUs, etc., which can replace professional-grade servers and meet the main cloud service needs of the consumer market at a lower cost. Furthermore, the computing units in the data processing module have a pull-out structure that can be replaced within the chassis, which can save on maintenance difficulty and cost and improve maintenance efficiency.

[0037] Below, we will combine Figure 1-4 The cloud computing server described in this embodiment will be described in detail.

[0038] like Figure 2-4As shown, the backplate 2 is located in the middle of the chassis 1, forming a first placement area 11 and a second placement area 12. The data processing module 5 is located in the first placement area 11, and the control management module 3 and the network switching module 4 are located in the second placement area 12. The backplate 2 is used to separate the control management module 3, the network switching module 4, and the data processing module 5, ensuring a more reasonable spatial layout within the chassis 1. Simultaneously, the backplate 2 is equipped with multiple connection ports 21. These ports facilitate the connection and management between the control management module 3, the network switching module 4, and the data processing module 5, enabling data transmission and communication between the modules. This allows them to work collaboratively to complete the various functions of the server, ensuring the stable operation of each module within the cloud computing server. Furthermore, it makes the connection between the control management module 3, the network switching module 4, and the data processing module 5 more flexible and convenient, improving the scalability and maintainability of the cloud computing server.

[0039] In this embodiment, as Figure 2 As shown, the backplane 2 acts as a central hub, directly impacting reliability, scalability, and performance limits. Specifically, the backplane 2 features multiple connection ports 21, including slots and connectors, used to connect to corresponding modules, linking multiple modules together. For example, it connects to the control and management module 3 and the network switching module 4 via slots, converging signals from the buses of different modules and enabling communication between modules through high-speed wiring. Another example is the connection to the data processing module 5 via connectors, enabling power distribution, centralized power supply, and power allocation to other corresponding modules.

[0040] like Figure 2 As shown, the backplane 2 is connected to the control and management module 3 via a 12V port, an I2C port, a USB port, and a UART port to implement corresponding functions. The backplane 2 is also connected to the network switching module 4 via multiple network ports, I2C ports, UART ports, and a 12V port to implement corresponding functions. The number of network ports when the backplane 2 is connected to the network switching module 4 is related to the number of core boards 512 in the computing unit 51.

[0041] like Figure 2 As shown, the backplane 2 is connected to the data processing module 5 via connectors. Printed circuits are provided on the backplane 2, and printed circuits are also provided at the ends of the computing units 51 in the data processing module 5. The backplane 2 and the computing units 51 are connected via connectors on the printed circuits to achieve plug-in connection. Multiple computing units 51 are connected in series inside the backplane 2, and then the backplane distributes signals to the corresponding network switching module 4 and control management module 3. Connecting the backplane 2 and the computing units 51 using printed circuits facilitates the replacement of the computing units 51 in the data processing module 5 without requiring additional wiring, thus improving replacement efficiency.

[0042] The connectors on the printed circuit board function as network ports, I2C ports, USB ports, UART ports, and 12V ports, ensuring the normal operation of the computing unit 51 in the data processing module 5. The computing unit 51 and the backplane 2 are connected via a printed circuit. Using a printed circuit to achieve this connection enhances the connectivity and communication efficiency between the multiple computing units 51 in the data processing module 5, and also ensures efficient data transmission within the server. The connection between the backplane 2 and the computing unit 51 not only achieves effective series connection between the computing units 51, but also ensures smooth communication between the various modules within the server, thereby improving the overall performance and stability of the server.

[0043] The data processing module 5 is the most important component in this embodiment. Specifically, the data processing module 5 includes multiple computing units 51, each computing unit 51 including a blade base plate 511 and multiple core boards 512. The core boards 512 are located on the blade base plate 511 and are communicatively connected to the blade base plate 511. The data processing module 5 is located in the first placement area 11 inside the chassis 1 and is connected to the backplane 2.

[0044] like Figure 3 As shown, the data processing module 5 includes multiple computing units 51, and each computing unit 51 includes a blade base plate 511 and multiple core boards 512. Specifically, the data processing module 5 includes twelve computing units 51, and each computing unit 51 includes a blade base plate 511 and four core boards 512. Here, a single computing unit 51 is used as an example.

[0045] In the computing unit 51, the blade base plate 511 serves as the basic support component of the computing unit 51, providing a physical mounting location and electrical connection for the core board 512, which can meet the needs of intensive computing and ensure the stable operation and efficient collaboration of the core board 512.

[0046] Four core boards 512 are located on the blade base plate 511 and establish a communication connection with the blade base plate 511. Specifically, the core boards 512 achieve physical connection and electrical communication with the blade base plate 511 through connection interfaces, support hot-swapping operation, and facilitate maintenance and expansion.

[0047] Each core board 512 independently integrates a processor, memory, and storage unit, forming a basic computing node. The core board 512 is a computing core based on the Android system, capable of running Android applications. Multiple core boards 512 can process tasks in parallel on the blade baseboard 511 to improve the server's computing power and processing efficiency, meeting the needs of different users. In this embodiment, the core board 512 is an Android core board, which is a data processing module carrying a processing chip.

[0048] More specifically, the connection interfaces include a network interface, an I2C interface, a USB interface, and a UART interface. The design of these interfaces makes data transmission between the core board 512 and the blade baseboard 511 more efficient and stable. The network interface enables high-speed data transmission, allowing the core board 512 to quickly exchange data with other computing units 51 or other modules within the server. The I2C interface connects low-speed peripherals, such as sensors, enabling data synchronization and control between devices. The USB interface provides flexible expandability, allowing connection to various external devices, such as storage devices and cameras. The UART interface is used for serial communication, facilitating debugging and maintenance. Through these connection interfaces, the core board 512 can fully utilize its computing power, working collaboratively with the blade baseboard 511 and other modules to improve the overall performance of the server.

[0049] like Figure 2-3 As shown, the control and management module 3 is connected to the network switching module 4 and the backplane 2, respectively. Specifically, the control and management module 3 and the network switching module 4 are connected via a gigabit port, a UART port, and an I2C port.

[0050] More specifically, the control and management module 3 is located in the second placement area 12 within the chassis 1. The control and management module 3 is a BMC (Baseboard Management Controller), responsible for tasks such as overall system monitoring, remote control, and fault maintenance. It is directly connected to the backplane 2 and is used to manage and control the operating status of all modules on the device, including the working status of each module, temperature monitoring, and energy consumption management, ensuring the efficient and secure operation of the server. The control and management module 3 is an indispensable hardware management unit, equipped with abundant monitoring and management interfaces. Besides connecting to the network connection module and the backplane 2, it can also be used for secondary development through its monitoring and management interfaces to implement customized functions.

[0051] like Figure 2-3As shown, the network switching module 4 is connected to the control and management module 3, the backplane 2, and the external network. Specifically, the network switching module 4 is connected to the backplane 2 and to the control and management module 3 via a gigabit port, a UART interface, and an I2C interface. In this embodiment, the network switching module 4 is located in the second placement area 12 within the chassis 1. The network switching module 4 is responsible for network data switching and transmission, ensuring smooth communication between the server and the external network or other devices. It employs a high-speed network interface, supports multiple network protocols, and ensures high-speed and stable data transmission. Specifically, the network switching module 4 in this embodiment uses the CTC7132 chip, which has Layer 3 switching capabilities, complete 10G access capabilities, and a 100G uplink core router, demonstrating excellent performance.

[0052] Furthermore, the CTC7132 chip supports VLAN (Virtual Local Area Network) segmentation, which can effectively isolate data from different network areas, meeting the application requirements of telecom network operators or campus Ethernet aggregation or access layers, and improving network security and flexibility. In addition, the CTC7132 chip also has powerful data processing capabilities, which can meet the needs of large-scale concurrent data processing, ensuring that cloud computing servers can still operate stably under high load.

[0053] As an optional implementation method, such as Figure 2-3 As shown, the cloud computing server also includes a power supply module 6, which is located within the second placement area 12 and electrically connected to the backplane 2. The power supply module 6 supplies power to the control and management module 3, the network switching module 4, and the data processing module 5 through the backplane 2. Specifically, the power supply module 6 is located inside the chassis 1 and is positioned within the second placement area 12 of the chassis 1. The power supply module 6 is connected to the backplane 2 via slots on the connection port 21 of the backplane 2. These slots include I2V and I2C ports. The power supply module 6 distributes its power to each module through the I2V and I2C ports. Furthermore, the connection port 21 between the power supply module 6 and the backplane 2 is designed to be very compact, ensuring stable power transmission while saving space inside the chassis 1. This approach achieves higher energy efficiency and a smaller physical footprint while maintaining the performance of the cloud computing server, thereby improving the overall cost-effectiveness and availability of the server.

[0054] In this embodiment, the power module 6 uses two 1300W CRPS AC-DC power supplies, providing a high power output of 1300W, suitable for demanding applications. It adopts a redundant design to ensure high reliability and minimum downtime of critical systems, allowing users to maintain continuous operation even in the event of a power failure. The input voltage range is 100-240V, making it usable in various environments worldwide.

[0055] As an optional implementation method, such as Figure 2-4 As shown, the cloud computing server also includes a heat dissipation module 7, which is located inside the chassis 1 and connected to a connection port 21 on the backplane 2. The heat dissipation module 7 is used to dissipate the heat generated by the control and management module 3, the network switching module 4, and the data processing module 5 during operation. The heat dissipation module 7 is also connected to the backplane 2 via a connection port 21, which specifically includes a 12V port and an I2C port.

[0056] In this embodiment, the heat dissipation module 7 is preferably a high-efficiency cooling fan, preferably five DC12V 3.15A 60x60x38MM 60386CM 4-wire inverter cooling fans, and the fan module speed can be dynamically adjusted in subsequent use.

[0057] The heat dissipation module 7 can quickly reduce the internal temperature of the chassis 1, ensuring that each module maintains a normal temperature even under high load operation, avoiding performance degradation or hardware damage due to overheating. Simultaneously, the heat dissipation module 7 is placed separately in the third placement area 13, without actual contact with the data processing module 5 in the first placement area 11, or the control and management module 3, network switching module 4, and power supply module 6 in the second placement area 12, resulting in smoother airflow and improved heat dissipation efficiency. In this embodiment, the heat dissipation module 7 enhances the stability and reliability of the cloud computing server, extends the lifespan of the hardware, and provides users with a more reliable and efficient cloud service experience.

[0058] Additionally, it should be noted that a third placement area 13 is also provided inside the chassis 1; the third placement area 13 is located at the bottom of the second placement area 12, and the third placement area 13 is used to accommodate the heat dissipation module 7. More specifically, the second placement area 12 and the third placement area 13 are separated by a partition 14.

[0059] As can be seen from the above records, such as Figure 4 As shown, the chassis 1 is provided with a first placement area 11, a second placement area 12 and a third placement area 13; the first placement area 11 is used to accommodate the data processing module 5; the second placement area 12 is used to accommodate the control and management module 3, the network switching module 4 and the power supply module 6; the third placement area 13 is located below the second placement area 12 and is used to accommodate the heat dissipation module 7.

[0060] In this embodiment, the chassis 1 includes a bottom shell 15 and a top cover 16, which are connected to form an accommodating space. A first placement area 11, a second placement area 12, and a third placement area 13 are all located within this accommodating space. In this embodiment, the first placement area 11, the second placement area 12, and the third placement area 13 are separated by a back panel 2. The first placement area 11 is located on one side of the back panel 2, and the second placement area 12 and the third placement area 13 are located on the other side of the back panel 2. The second placement area 12 and the third placement area 13 are arranged in the longitudinal direction and are separated by a partition 14.

[0061] The first placement area 11 is used to accommodate the data processing module 5. Specifically, the first placement area 11 has N placement positions 111, and each placement position has M placement slots 112; one placement slot 112 is used to accommodate one computing unit 51. Each computing unit 51 communicates and transmits data with the backplane 2 through specific printed circuits, enabling the computing units 51 to work together efficiently and meet the needs of high-performance computing. In addition, the arrangement of the placement positions 111 and placement slots 112 not only optimizes space utilization but also facilitates the installation, maintenance, and upgrading of the computing units 51, improving overall operability and flexibility.

[0062] The second placement area 12 is used to house the control and management module 3, the network switching module 4, and the power supply module 6. This second placement area 12 is also divided into multiple zones, with the control and management module 3, network switching module 4, and power supply module 6 placed in their respective zones. Specific details are omitted in this embodiment. Furthermore, the correspondence between the third placement area 13 and the heat dissipation module 7 has been described above and will not be elaborated upon here.

[0063] As an optional implementation method, such as Figure 2 As shown, the cloud computing server also includes a status indicator module 8, which is connected to the connection port 21 on the backplane 2 to display the operating status of each module in the cloud computing server. Specifically, the status indicator module 8 is connected to the backplane 2 through the GPIO port in the connection port 21. The status indicator module 8 can be located outside the chassis 1 and includes multiple dual-color LEDs to display the operating status of each module. More specifically, the dual-color LEDs (red and green) are controlled by the GPIO to change color. The color of the LEDs indicates the operating status of each module. The default red indicates an abnormal operation, and green indicates normal operation, facilitating timely detection and feedback of problems during on-site maintenance and inspection.

[0064] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.

[0065] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.

Claims

1. A cloud computing power server, characterized in that, The cloud computing server includes: a chassis (1), a backplane (2), a control and management module (3), a network switching module (4), and a data processing module (5); The back panel (2) is disposed inside the chassis (1), dividing the space inside the chassis (1) into a first placement area (11) and a second placement area (12); The control management module (3) and the network switching module (4) are electrically connected; the control management module (3) and the network switching module (4) are located in the first placement area (11) and are both electrically connected to the backplane (2); The data processing module (5) is located in the second placement area (12); wherein the data processing module (5) includes multiple computing units (51), all of which are pull-out structures and are electrically connected to the back plate (2).

2. The cloud computing power server of claim 1, wherein, Each computing unit (51) includes a blade base plate (511) and multiple core boards (512). The blade base plate (511) is electrically connected to the backplate (2), and the multiple core boards (512) are located on the blade base plate (511) and are communicatively connected to the blade base plate (511).

3. The cloud computing power server of claim 2, wherein, In each computing unit (51), the blade base plate (511) is provided with multiple sets of connection interfaces, and each core board (512) is communicatively connected to the blade base plate (511) through a set of connection interfaces.

4. The cloud computing power server of claim 3, wherein, Each set of connection interfaces includes a network interface, an I2C interface, a USB interface, and a UART interface.

5. The cloud computing power server of claim 1, wherein, The first placement area (11) is provided with N placement positions (111), and each placement position (111) is provided with M placement slots (112); wherein, one placement slot (112) is used to accommodate one computing unit (51), and the computing unit (51) in the placement slot (112) can be replaced.

6. The cloud computing power server of claim 1, wherein, The cloud computing server also includes a power module (6), which is located in the second placement area (12) and electrically connected to the backplane (2). The power module (6) supplies power to the control management module (3), network switching module (4) and data processing module (5) through the backplane (2).

7. The cloud computing server according to claim 1, characterized in that, The cloud computing server also includes a heat dissipation module (7), which is located inside the chassis (1) and electrically connected to the back panel (2). The heat dissipation module (7) is used to dissipate the heat generated by the control management module (3), the network switching module (4) and the data processing module (5) during operation.

8. The cloud computing power server of claim 7, wherein, The chassis (1) is also provided with a third placement area (13); the third placement area (13) is located at the bottom of the second placement area (12), and the third placement area (13) is used to accommodate the heat dissipation module (7).

9. The cloud computing power server of claim 1, wherein, The cloud computing server also includes a status indicator module (8), which is electrically connected to the back panel (2) and is used to display the working status of each module in the cloud computing server.

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