An inverter cooling structure

Abstract

This utility model belongs to the field of inverter cooling technology, and discloses an inverter cooling structure. The inverter circuit board is arranged with a control circuit area, a high-voltage power area, and a capacitor bank area in sequence according to the gas flow order. The housing has a first stepped air guide plate above the inverter circuit board. The first stepped air guide plate has a first guide slope inclined towards the control circuit area above it, and a second guide slope inclined towards the high-voltage power area at its end. The second guide slope has a horizontally arranged first air vane parallel to the high-voltage power area at its end, and the first air vane and the high-voltage power area form a narrow air duct. This utility model guides the airflow towards the side of the inverter circuit board, forming a narrow air duct in the high-voltage power area, resulting in higher airflow velocity and better ventilation and heat dissipation for the high-voltage power area.

Description

Technical Field

[0001] This utility model relates to the field of inverter cooling technology, and in particular to an inverter cooling structure. Background Technology

[0002] An inverter is a power electronic device that converts direct current (DC) to alternating current (AC). Its core functions include: power conversion: achieving DC→AC conversion through power semiconductor switches (such as IGBTs / MOSFETs); due to the large number of electronic components inside the inverter, such as current sensors, capacitors, inductors, and IGBTs, the performance of these components is usually closely related to their temperature. When the inverter operates for a long time, its internal electronic components will dissipate a lot of heat; most existing inverters use cooling fans for heat dissipation because of their cost-effectiveness. However, existing cooling fans are placed at the inlet and outlet, which creates airflow on the inverter casing. This can easily lead to poor local airflow on the uneven surface of the circuit board, resulting in poor heat dissipation and causing localized overheating. Utility Model Content

[0003] To overcome the technical defects of the existing technology, this utility model provides an inverter cooling structure that guides the airflow towards the side of the inverter circuit board. A narrow air duct is formed between the first air plate and the high-voltage power area, resulting in a higher air velocity and thus a better ventilation and heat dissipation effect on the high-voltage power area.

[0004] The technical solution adopted by this utility model is: an inverter cooling structure, including an inverter circuit board and a housing, wherein the inverter circuit board is disposed inside the housing, and a channel is formed between the upper and lower sides of the inverter circuit board and the housing, and the inverter circuit board is provided with a control circuit area, a high voltage power area and a capacitor bank area in sequence according to the order of gas passage.

[0005] The housing has a first stepped air guide plate above the inverter circuit main board. The first stepped air guide plate has a first air guide slope that is inclined towards the control circuit area above the control circuit area. The end of the air guide slope is also provided with a second air guide slope that is inclined towards the high voltage power area. The end of the second air guide slope is provided with a first air plate that is horizontally arranged and parallel to the high voltage power area. The first air plate and the high voltage power area form a narrow air duct.

[0006] The first air plate has an outwardly inclined second air plate located above the capacitor bank area at its end, and the second air plate has a horizontally arranged air guide plate at its end.

[0007] The housing is equipped with a cooling fan that directs airflow toward the inverter circuit motherboard, and the airflow direction of the cooling fan is parallel to the orientation of the inverter circuit motherboard.

[0008] Preferably, the bottom of the first air plate is provided with 2mm hemispherical protrusions arranged in a dot matrix.

[0009] Preferably, the housing has a second stepped air guide plate located below the inverter circuit main board, the second stepped air guide plate has a third air guide slope inclined towards the control circuit area below the control circuit area, and the end of the third air guide slope has a third air plate located below the high voltage power area.

[0010] Preferably, it also includes a temperature sensor for detecting the temperature of the high-voltage power area, a controller located inside the housing, and both the temperature sensor and the cooling fan are connected to the controller.

[0011] Preferably, the cooling fan is a variable frequency fan.

[0012] Preferably, the width of the narrow air duct is 1cm-2cm.

[0013] The beneficial effects of this utility model are: 1. This utility model arranges the control circuit area, high-voltage power area, and capacitor bank area sequentially on the inverter circuit main board according to the order of gas flow. This orderly arrangement places the control circuit area, which generates less heat, at the front, ensuring that the air temperature remains low after ventilation. This maintains good heat dissipation when the air enters the high-voltage power area. The larger capacitor bank area is placed at the rear to avoid obstructing the airflow, ensuring good overall heat dissipation and cooling efficiency. The inverter circuit main board... Above the inverter circuit board is a first stepped air guide plate. Under the action of the first air guide slope, the air is guided towards the side of the inverter circuit board. The first air guide plate and the high-voltage power area form a narrow air channel, which has a high air velocity and thus has a good ventilation and heat dissipation effect on the high-voltage power area. The bottom of the first air guide plate has a dot matrix of 2mm hemispherical protrusions, which turbulent the airflow in the narrow air channel and thus have a good heat dissipation effect on the devices in the high-voltage power area. The hemispherical protrusions are 2mm in size, so they will not generate a large air resistance. Attached Figure Description

[0014] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0015] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the hemispherical protrusion distribution of this utility model;

[0017] Figure 3 This is a schematic diagram of the internal structure of the shell of this utility model.

[0018] Explanation of reference numerals in the attached diagram: 1. Inverter circuit main board; 101. Control circuit area; 102. High voltage power area; 103. Capacitor bank area; 2. Housing; 3. First stepped air guide plate; 4. First air guide slope; 5. Second air guide slope; 6. First air vane; 7. Narrow air duct; 8. Second air vane; 9. Air intake plate; 10. Cooling fan; 12. Hemispherical protrusion; 13. Second stepped air guide plate; 14. Third air guide slope; 15. Third air vane; 16. Temperature sensor. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0020] like Figures 1 to 3 As shown, this embodiment provides an inverter circuit board 1 and a housing 2, with the inverter circuit board 1 disposed inside the housing 2. Channels are formed between the upper and lower sides of the inverter circuit board 1 and the housing 1. The inverter circuit board 1 is arranged in sequence according to the order of gas flow, including a control circuit area 101, a high-voltage power area 102, and a capacitor bank area 103. By arranging the control circuit area 101, high-voltage power area 102, and capacitor bank area 103 in an orderly manner, and placing the less heat-generating control circuit area 101 at the front, the air temperature after ventilation remains low, ensuring good heat dissipation when entering the high-voltage power area 102. The larger capacitor bank area 103 is placed at the rear to avoid obstructing the airflow, thus ensuring good overall heat dissipation and cooling efficiency.

[0021] The housing 2 has a first stepped air guide plate 3 above the inverter circuit main board 1. The first stepped air guide plate 3 has a first air guide slope 4 inclined towards the control circuit area 101 above the control circuit area 101, and the end of the air guide slope 4 is also provided with a second air guide slope 5 inclined towards the high voltage power area 102. The end of the second air guide slope 5 is provided with a first air plate 6 horizontally arranged and parallel to the high voltage power area 102, and the first air plate 6 and the high voltage power area 102 form a narrow air duct 7; wherein the first stepped air guide plate 3 is provided above the inverter circuit main board 1. Under the action of the first air guide slope 4, the air can be guided and blown towards the side of the inverter circuit motherboard 1. The first air plate 6 and the high-voltage power area 102 form a narrow air channel 7, which has a high wind speed and thus has a good ventilation and heat dissipation effect on the high-voltage power area 102. Furthermore, the bottom of the first air plate 6 is provided with a dot matrix of 2mm hemispherical protrusions 12, which plays a role in turbulence in the narrow air channel 7, disturbing the airflow and thus having a good heat dissipation effect on the devices in the high-voltage power area 102. Moreover, the hemispherical protrusions 12 are 2mm, so they will not generate a large wind resistance.

[0022] The first air plate 6 has a second air plate 8 that is inclined outward and located above the capacitor bank area 103 at its end, and the second air plate has a horizontally arranged air guide plate 9 at its end; the housing 2 is equipped with a cooling fan 10 that blows air towards the inverter circuit main board 1, and the airflow direction of the cooling fan 10 is parallel to the setting direction of the inverter circuit main board 1.

[0023] The housing 2 has a second stepped air guide plate 13 located below the inverter circuit main board 1. The second stepped air guide plate 13 has a third air guide slope 14 inclined towards the control circuit area 101 below the control circuit area 101. The end of the third air guide slope 14 has a third air plate 15 located below the high voltage power area 102. This also provides a good heat dissipation effect on the bottom side of the inverter circuit main board 1.

[0024] It also includes a temperature sensor 16 for detecting the temperature of the high-voltage power zone 102, a controller located inside the housing, and both the temperature sensor 16 and the cooling fan 10 are connected to the controller. The cooling fan 10 is a variable frequency fan. This allows for easy adjustment of the cooling fan power based on the temperature detected by the stable sensor, thus adapting to the heat dissipation operation. The width of the narrow air duct 7 is 1cm-2cm.

[0025] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0026] Working principle: The inverter circuit main board 1 is arranged in the order of gas flow, with a control circuit area 101, a high-voltage power area 102, and a capacitor bank area 103 arranged in an orderly manner. The control circuit area 101, which generates less heat, is placed at the front, ensuring that the air temperature remains low after ventilation. This maintains good heat dissipation when the air enters the high-voltage power area 102. The larger capacitor bank area 103 is placed at the rear to avoid obstructing the airflow, ensuring good overall cooling efficiency. A first... The stepped air guide plate 3, under the action of the first air guide slope 4, can guide the air to the side of the inverter circuit main board 1. The first air guide plate 6 and the high-voltage power area 102 form a narrow air duct 7, which has a high wind speed and thus has a good ventilation and heat dissipation effect on the high-voltage power area 102. Furthermore, the bottom of the first air guide plate 6 is provided with a dot matrix of 2mm hemispherical protrusions 12, which plays a turbulence role in the narrow air duct 7, disturbing the airflow and thus having a good heat dissipation effect on the devices in the high-voltage power area 102. Moreover, the hemispherical protrusions 12 are 2mm, so they will not generate large wind resistance.

[0027] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. An inverter cooling structure, comprising an inverter circuit main board (1) and a housing (2), wherein the inverter circuit main board (1) is disposed inside the housing (2), and a channel is formed between the upper and lower sides of the inverter circuit main board (1) and the housing (2), characterized in that: The inverter circuit main board (1) is provided with a control circuit area (101), a high voltage power area (102) and a capacitor bank area (103) in the order of gas passage. The housing (2) has a first stepped air guide plate (3) above the inverter circuit main board (1). The first stepped air guide plate (3) has a first air guide slope (4) that is inclined towards the control circuit area (101) above the control circuit area (101). The end of the air guide slope (4) is also provided with a second air guide slope (5) that is inclined towards the high voltage power area (102). The end of the second air guide slope (5) is provided with a first air plate (6) that is horizontally arranged and parallel to the high voltage power area (102). The first air plate (6) and the high voltage power area (102) form a narrow air duct (7). The end of the first air plate (6) is provided with a second air plate (8) that is inclined outward and located above the capacitor bank area (103), and the end of the second air plate is provided with a horizontally arranged air guide plate (9). The housing (2) is equipped with a cooling fan (10) that directs airflow toward the inverter circuit main board (1), and the airflow direction of the cooling fan (10) is parallel to the setting direction of the inverter circuit main board (1).

2. The inverter cooling structure according to claim 1, characterized by: The bottom of the first air plate (6) is provided with 2mm hemispherical protrusions (12) arranged in a dot matrix.

3. The inverter cooling structure of claim 1, wherein: The housing (2) has a second stepped air guide plate (13) located below the inverter circuit main board (1). The second stepped air guide plate (13) has a third air guide slope (14) inclined towards the control circuit area (101) below the control circuit area (101), and the end of the third air guide slope (14) has a third air plate (15) located below the high voltage power area (102).

4. The inverter cooling structure of claim 1, wherein: It also includes a temperature sensor (16) for detecting the temperature of the high-voltage power zone (102), a controller located inside the housing, and the temperature sensor (16) and the cooling fan (10) are both connected to the controller.

5. The inverter cooling structure of claim 4, wherein: The cooling fan (10) is a variable frequency fan.

6. The inverter cooling structure of claim 1, wherein: The width of the narrow air duct (7) is 1cm-2cm.

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