A type of high-brightness Micro-LED lamp bead

Abstract

This utility model discloses a high-brightness Micro-LED lamp bead, comprising: a base, an LED chip substrate, a light-transmitting component, and a conductive component. The LED chip substrate is disposed within the inner cavity of the base; the light-transmitting component is disposed on the top of the base and serves to protect the LED chip substrate from light transmission; the conductive component serves to conduct electricity to the LED chip substrate and includes multiple pads disposed at the positive and negative ends of the LED chip substrate; multiple sets of pins are symmetrically disposed at the bottom of the base, and locking parts for connecting the pads are provided at the bottom of the pins; this utility model uses locking parts at the connection between the pins and the pads to fix the pins and pads. Compared with the direct planar contact solder bonding of the pins and pads, the locking parts of this design increase the welding surface area between the pins and the pads, allowing the solder to wet the interface between the pins and the pads, thereby improving the mechanical bonding force of the pins and reducing the possibility of the solder joint falling off due to vibration.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and in particular to a high-brightness Micro-LED lamp bead. Background Technology

[0002] Micro-LED lamp beads are widely used in display, lighting and optical communication fields due to their high brightness, low power consumption and high resolution. However, their miniaturized size and high-density integration characteristics put forward extremely high requirements for packaging reliability. In traditional packaging processes, the connection between the pin and the pad is mostly done by planar contact welding, that is, the pin end face and the pad surface are directly bonded and fixed by solder.

[0003] However, in the planar contact mode, the effective welding area between the pin and the pad is limited, and the solder is difficult to fully wet the interface between the two. Especially under high-frequency vibration or thermal cycling conditions, the solder joint is prone to cracking or desoldering. Micro-LED lamp beads are often used in the vibration environment of outdoor displays or vehicle equipment. The shear strength of the traditional planar contact welding structure is insufficient. Long-term vibration can easily cause the pin and the pad to separate, affecting the circuit conductivity and luminous stability.

[0004] Therefore, in order to achieve a reliable connection between the pins and the pads through structural optimization, a high-brightness Micro-LED lamp bead is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a high-brightness Micro-LED lamp bead to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-brightness Micro-LED lamp bead, comprising:

[0007] Base;

[0008] LED chip substrate, wherein the LED chip substrate is disposed in the inner cavity of the base;

[0009] A light-transmitting component is disposed on the top of the base and is used for light transmission protection of the LED chip substrate.

[0010] A conductive component is used for conducting electricity in an LED chip substrate. The conductive component includes multiple pads disposed at the positive and negative ends of the LED chip substrate. Multiple sets of pins are symmetrically disposed at the bottom of the base, and the bottom of the pins is provided with locking parts for connecting to the pads.

[0011] Preferably, the locking part includes:

[0012] A plug-in block is disposed at the bottom of the pin, and the side of the plug-in block is inserted and connected to the bottom of the pad;

[0013] An adhesive portion is provided at the connection between the pin and the pad, and the adhesive portion is used to assist in fixing the pin.

[0014] Preferably, the bottom of the pad is provided with a fixing groove for the insertion of the insert.

[0015] Preferably, the insert is T-shaped, and the inner wall of the fixing groove has a groove for the insert to pass through.

[0016] Preferably, the bonding portion includes solder, which is used to bond and fix the pads and leads.

[0017] Preferably, the top of the pin has multiple fixing grooves, which are used to increase the wetting area of ​​the pin.

[0018] Preferably, the light-transmitting component includes an encapsulation sheet disposed on the top of the base.

[0019] The technical effects and advantages of this utility model are as follows:

[0020] This invention features a locking part at the connection between the pin and the pad, which secures the pin to the pad. Compared to direct plane contact and solder bonding, the locking part increases the welding surface area between the pin and the pad, allowing the solder to wet the interface and thus improving the mechanical bonding force of the pin and reducing the possibility of the solder joint falling off due to vibration. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0022] Figure 2 This is a bottom view of the entire utility model.

[0023] Figure 3 This is a cross-sectional view of the entire utility model.

[0024] Figure 4 This utility model Figure 3 Enlarged view of the structure at point A in the middle.

[0025] Figure 5 This is a schematic diagram of the pins and plugs of this utility model.

[0026] In the diagram: 1. Base; 2. LED chip substrate; 3. Pad; 301. Fixing groove; 4. Pin; 401. Fixing groove; 5. Solder; 6. Package plate; 7. Insert. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] This utility model provides, for example Figure 1-5 As shown:

[0029] Example 1: A high-brightness Micro-LED lamp bead, comprising: a base 1, an LED lamp chip substrate 2, a light-transmitting component, and a conductive component;

[0030] Specifically, the LED chip substrate 2 is disposed in the inner cavity of the base 1, the light component is disposed on the top of the base 1, the light-transmitting component is used for light transmission protection of the LED chip substrate 2, and the conductive component is used for conductivity of the LED chip substrate 2.

[0031] It should be noted that the conductive component includes multiple pads 3 disposed on the positive and negative ends of the LED chip substrate 2, and multiple sets of pins 4 are symmetrically disposed on the bottom of the base 1, with locking parts for connecting the pads 3 disposed on the bottom of the pins 4.

[0032] Specifically, pin 4 is made of copper alloy, and the locking part includes the insert 7 and the adhesive part;

[0033] It should be noted that the plug 7 is located at the bottom of the pin 4, and the side of the plug 7 is inserted and connected to the bottom of the pad 3. The adhesive part is located at the connection between the pin 4 and the pad 3, and the adhesive part is used to help fix the pin 4.

[0034] Specifically, the plug 7 and the pin 4 are integrally cast. The bottom of the pad 3 is provided with a fixing groove 301 for the plug 7 to pass through. The plug 7 is T-shaped. The inner wall of the fixing groove 301 is provided with a groove for the plug 7 to pass through.

[0035] It should be noted that after the insert 7 is inserted into the groove, a mechanical interlocking fixation is formed. The bonding part includes solder 5, which is used to bond and fix the pad 3 and the pin 4. The solder 5 fills the inner cavity of the fixing groove 301 and fixes it. The operation of inserting the insert 7 into the inner wall groove of the fixing groove 301 also has a positioning function. Before the solder 5 is soldered, the pad 3 and the pin 4 are initially positioned.

[0036] Furthermore, pin 4 is limited and fixed by insert block 7 and fixing groove 301, and then filled and solidified by solder 5. The effective welding area of ​​pin 4 and pad 3 is increased, and the solder can fully wet the interface between the two. Especially under high frequency vibration or thermal cycling conditions, the interlocking design of insert block 7 and fixing groove 301 can reduce the occurrence of solder joint cracking or desoldering, so the lamp is suitable for vibration environment such as outdoor display screen or vehicle equipment.

[0037] Specifically, multiple fixing grooves 401 are provided on the top of pin 4. The fixing grooves 401 are used to increase the wetting area of ​​pin 4, which facilitates the subsequent soldering and fixing of pin 4. The solder 5 is made of nano silver solder paste. The silver particles of solder 5 have a particle size of <50nm and a sintering temperature of 150-200℃, thus forming a dense conductive network. It replaces traditional solder, solves the bridging problem, and thus improves conductivity.

[0038] Example 2: A light-transmitting component applied to the high-brightness Micro-LED lamp beads in Example 1;

[0039] Specifically, the light-transmitting component includes an encapsulation sheet 6, which is disposed on the top of the base 1;

[0040] It should be noted that the encapsulation sheet 6 is made of silicone resin, which has excellent ultraviolet light transmittance (>88% at 320nm), excellent heat resistance (transmittance decreases by less than 5% after 14 days of aging at 150℃), and adjustable refractive index (1.40-1.70). By introducing phenyl groups, the refractive index is increased to 1.57, reducing light reflection loss. It also has strong anti-yellowing properties, making it suitable for long-term outdoor use. It is applicable to high-power LEDs, automotive lights, and outdoor display encapsulation. The encapsulation sheet 6 is bonded and fixed to the top of the base 1 with high-temperature resistant adhesive.

[0041] In practical use, a locking part is provided at the connection between pin 4 and pad 3 to fix pin 4 and pad 3. Compared with the direct plane contact of pin 4 and pad 3 to bond solder 5, the locking part of this design increases the welding surface area of ​​pin 4 and pad 3, allowing solder 5 to wet the interface between pin 4 and pad 3, thereby improving the mechanical interlocking force of pin 4 and reducing the possibility of the solder joint falling off due to vibration.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A highlight Micro-LED lamp bead, characterized in that, include: Base (1); LED chip substrate (2), wherein the LED chip substrate (2) is disposed in the inner cavity of the base (1); A light-transmitting component is disposed on the top of the base (1) and is used for light transmission protection of the LED chip substrate (2). The conductive component is used for the conduction of the LED chip substrate (2). The conductive component includes a plurality of pads (3) disposed at the positive and negative ends of the LED chip substrate (2). The base (1) has a plurality of pins (4) symmetrically disposed at the bottom. The bottom of the pins (4) is provided with a locking part for connecting the pads (3).

2. The highlight Micro-LED lamp bead according to claim 1, wherein, The locking part includes: Insert (7), the insert (7) is disposed at the bottom of the pin (4), and the side of the insert (7) is inserted and connected to the bottom of the pad (3); An adhesive portion is provided at the connection between the pin (4) and the pad (3), and the adhesive portion is used to assist in fixing the pin (4).

3. The highlight Micro-LED lamp bead according to claim 2, characterized in that, The bottom of the pad (3) is provided with a fixing groove (301), which is used for the insertion of the plug (7).

4. A high-brightness Micro-LED lamp bead according to claim 3, characterized in that, The insert (7) is T-shaped, and the inner wall of the fixing groove (301) is provided with a groove for the insert (7) to pass through.

5. The highlight Micro-LED lamp bead according to claim 2, characterized in that, The bonding portion includes solder (5) for bonding and fixing the pad (3) and the pin (4).

6. The highlight Micro-LED lamp bead according to claim 5, characterized in that, The top of the pin (4) is provided with a plurality of fixing grooves (401), which are used to increase the wetting area of ​​the pin (4).

7. The highlight Micro-LED lamp bead according to claim 1, wherein, The light-transmitting component includes an encapsulation sheet (6), which is disposed on the top of the base (1).

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