A semiconductor etching apparatus

Abstract

This application provides a semiconductor etching apparatus, comprising: a cavity for performing semiconductor etching; the cavity including an upper chamber and a lower chamber, the upper chamber covering the lower chamber; a quartz baffle and an upper electrode coil assembly placed on the quartz baffle within the upper chamber; a quartz cavity located at the back of the cavity, with its opening facing the connection between the upper and lower chambers; a first quartz cover plate, a second quartz cover plate, and a rotary motor within the quartz cavity, the first and second quartz cover plates respectively mounted on the rotating shaft of the rotary motor; and a lifting device located on the side wall of the cavity and connected to the upper chamber, for raising the upper chamber to separate it from the lower chamber. This application enables etching of different products without affecting product performance.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and more particularly to a semiconductor etching apparatus. Background Technology

[0002] In the semiconductor industry, the top of the process chamber of conventional ICP equipment is a single quartz cover plate, and byproducts generated during the etching process will continuously adhere to the cover plate.

[0003] However, as etching time increases, more and more byproducts are adsorbed, requiring frequent cavity opening for maintenance to avoid slag shedding affecting the product. In addition, current ICP equipment can only etch a single product. If different products are etched, the adsorption tightness will vary due to different byproducts, making it easier for slag shedding to affect the product. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a semiconductor etching apparatus to overcome the above problems.

[0005] In a first aspect, this application provides a semiconductor etching apparatus, comprising:

[0006] A cavity for performing semiconductor etching; the cavity includes an upper chamber and a lower chamber, the upper chamber covering the lower chamber;

[0007] The upper chamber is provided with a quartz baffle and an upper electrode coil assembly placed on the quartz baffle;

[0008] A quartz cavity is located on the back of the cavity body, and the opening of the quartz cavity is directly opposite the connection between the upper chamber and the lower chamber.

[0009] The quartz cavity is provided with a first quartz cover plate, a second quartz cover plate, and a rotary motor. The first quartz cover plate and the second quartz cover plate are respectively mounted on the rotating shaft of the rotary motor.

[0010] A lifting device is provided on the side wall of the cavity and connected to the upper chamber, for raising the upper chamber to separate it from the lower chamber;

[0011] The rotary motor is used to rotate the first quartz cover plate or the second quartz cover plate to the cover plate area of ​​the lower chamber when the upper chamber is raised; or to rotate the first quartz cover plate or the second quartz cover plate located in the cover plate area of ​​the lower chamber into the quartz cavity when the upper chamber is raised.

[0012] In one possible embodiment, the rotary motor includes a coupling disposed on the rotating shaft of the rotary motor, and the first quartz cover plate and the second quartz cover plate are respectively mounted on the coupling.

[0013] In one possible embodiment, the lifting device includes a lifting rod, a lifting motor, and a lifting base;

[0014] The lifting motor is located inside the lifting base, and one end of the lifting rod is connected to the lifting motor;

[0015] The other end of the lifting rod is connected to the upper chamber.

[0016] In one possible embodiment, the lower chamber is further provided with a lower electrode chuck and a material tray located on the lower electrode chuck.

[0017] In one possible embodiment, the rotary motor is a linear-rotary hybrid motor.

[0018] In one possible embodiment, it further includes a seal disposed between the quartz cavity and the cavity body.

[0019] In one possible embodiment, the lifting base is fixedly connected to the lower chamber.

[0020] In one possible embodiment, a housing is also included;

[0021] The outer casing is fitted over the cavity, the quartz cavity, and the lifting device.

[0022] In one possible embodiment, the housing is provided with an opening and a baffle for closing the opening.

[0023] In one possible embodiment, the baffle is removably mounted on the opening.

[0024] This application provides a semiconductor etching apparatus. By setting a quartz cavity on the back of the chamber and placing two quartz cover plates inside the quartz cavity, the quartz cover plates can be selectively rotated to the lower chamber by a rotary motor. This allows for switching between quartz cover plates when etching different products, avoiding slag shedding due to differences in the adsorption of different by-products on a single quartz cover plate, which would affect product performance. Attached Figure Description

[0025] Figure 1 This is a side view of a semiconductor etching apparatus provided in one embodiment of this application;

[0026] Figure 2 This is a front cross-sectional view of the semiconductor etching apparatus provided in an embodiment of this application. Detailed Implementation

[0027] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0028] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. The component designations used herein, such as "first," "second," etc., are merely for distinguishing the described objects and have no sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages). Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," "side," etc., are merely for reference to the accompanying illustrations. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising," "may include," "include," or "may include" used in this application indicate the presence of the corresponding disclosed function, operation, element, etc., and do not limit one or more other functions, operations, elements, etc. Moreover, the terms "comprising" or "include" indicate the presence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusion.

[0030] like Figures 1 to 2 As shown, this embodiment provides a semiconductor etching apparatus 10, which includes a cavity 100, a quartz cavity 200, and a lifting device 300.

[0031] The cavity 100 is used for semiconductor etching; the cavity 100 includes an upper chamber 110 and a lower chamber 130; the upper chamber 110 covers the lower chamber 130.

[0032] In this embodiment, the upper chamber 110 is provided with a quartz baffle 111 and an upper electrode coil assembly 113 placed on the quartz baffle 111.

[0033] In this embodiment, the quartz cavity 120 is located on the back of the cavity 100, and the opening of the quartz cavity 120 is directly opposite the connection between the upper chamber 110 and the lower chamber 130.

[0034] In this embodiment, the quartz cavity 200 is provided with a first quartz cover plate 210, a second quartz cover plate 230 and a rotary motor 250, and the first quartz cover plate 210 and the second quartz cover plate 230 are respectively mounted on the rotating shaft of the rotary motor 250.

[0035] The rotary motor 250 is used to rotate the first quartz cover plate 210 or the second quartz cover plate 230 to the cover plate area of ​​the lower chamber 130 when the upper chamber 110 is raised; or it is used to rotate the first quartz cover plate 210 or the second quartz cover plate 230 located in the cover plate area of ​​the lower chamber 130 into the quartz cavity 200 when the upper chamber 110 is raised.

[0036] In this embodiment, the lifting device 300 is disposed on the side wall of the cavity 100 and connected to the upper chamber 110, and is used to lift the upper chamber 110 to separate it from the lower chamber 130. For example, when etching is completed in the cavity 100 or when a wafer source to be etched is placed in, the lifting device 300 is controlled to lift the upper chamber 110.

[0037] Understandably, when different products need to be etched in the cavity 100, the quartz cover plate (first quartz cover plate 210 or second quartz cover plate 230) can be replaced by rotating the motor 250 to avoid slag shedding due to the different adsorption of different by-products on a single quartz cover plate, which would affect product performance. In addition, since multiple quartz cover plates can be used interchangeably, they can also be disassembled and maintained in turn during maintenance (the equipment can be used normally during this period), which can improve the efficiency of equipment use.

[0038] In one possible embodiment, the rotary motor 250 includes a coupling 251 disposed on the rotating shaft of the rotary motor 250, and the first quartz cover plate 210 and the second quartz cover plate 230 are respectively mounted on the coupling 251.

[0039] It is understandable that by setting the coupling 251, the first quartz cover plate 210 and the second quartz cover plate 230 can rotate only one cover plate (such as rotating the first quartz cover plate 210 or the second quartz cover plate 230) when the rotary motor 250 rotates. That is to say, the coupling between the first quartz cover plate 210 and the second quartz cover plate 230 and the motor can be engaged or disengaged.

[0040] In one possible embodiment, the lifting device 300 includes a lifting rod 310, a lifting motor (not shown), and a lifting base 330; the lifting motor is located inside the lifting base 330, one end of the lifting rod 310 is connected to the lifting motor, and the other end of the lifting rod 310 is connected to the upper chamber 110.

[0041] Optionally, the lifting base 330 is fixedly connected to the lower chamber 130.

[0042] It should be noted that the selection of the lifting motor can be set according to actual needs, and no specific restrictions are made here.

[0043] In one possible embodiment, the rotary motor 250 may also be installed inside the lifting base 330.

[0044] In one possible embodiment, a lower electrode chuck 131 and a material tray 133 located on the lower electrode chuck 131 are also provided in the lower chamber 130.

[0045] In one possible embodiment, the rotary motor 250 is a linear-rotary hybrid motor.

[0046] In one possible embodiment, the semiconductor etching apparatus further includes a seal disposed between the quartz cavity and the cavity body.

[0047] In one possible embodiment, the semiconductor etching apparatus further includes a housing; the housing is fitted over the cavity, the quartz cavity, and the lifting device.

[0048] Optionally, the housing is provided with an opening and a baffle for closing the opening.

[0049] Optionally, the baffle is removably mounted on the opening.

[0050] It should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0052] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments, and making equivalent changes according to the claims of this application, still falls within the scope of this application.

Claims

1. A semiconductor etching apparatus, characterized by, include: A cavity for performing semiconductor etching; the cavity includes an upper chamber and a lower chamber, the upper chamber covering the lower chamber; The upper chamber is provided with a quartz baffle and an upper electrode coil assembly placed on the quartz baffle; A quartz cavity is located on the back of the cavity body, and the opening of the quartz cavity is directly opposite the connection between the upper chamber and the lower chamber. The quartz cavity is provided with a first quartz cover plate, a second quartz cover plate, and a rotary motor. The first quartz cover plate and the second quartz cover plate are respectively mounted on the rotating shaft of the rotary motor. A lifting device is provided on the side wall of the cavity and connected to the upper chamber, for raising the upper chamber to separate it from the lower chamber; The rotary motor is used to rotate the first quartz cover plate or the second quartz cover plate to the cover plate area of ​​the lower chamber when the upper chamber is raised; Alternatively, it can be used to rotate the first or second quartz cover plate located in the cover plate area of ​​the lower chamber into the quartz cavity when the upper chamber is raised.

2. The semiconductor etching apparatus of claim 1, wherein, The rotary motor includes a coupling, which is disposed on the rotating shaft of the rotary motor, and the first quartz cover plate and the second quartz cover plate are respectively mounted on the coupling.

3. The semiconductor etching apparatus of claim 1, wherein, The lifting device includes a lifting rod, a lifting motor, and a lifting base; The lifting motor is located inside the lifting base, and one end of the lifting rod is connected to the lifting motor; The other end of the lifting rod is connected to the upper chamber.

4. The semiconductor etching apparatus according to any one of claims 1 to 3, characterized by, The lower chamber is also equipped with a lower electrode chuck and a material tray located on the lower electrode chuck.

5. The semiconductor etching apparatus of claim 1, wherein, The rotary motor is a linear-rotary hybrid motor.

6. The semiconductor etching apparatus of claim 4, wherein, Also includes: A sealing element is disposed between the quartz cavity and the cavity body.

7. The semiconductor etching apparatus of claim 3, wherein, The lifting base is fixedly connected to the lower chamber.

8. The semiconductor etching apparatus of claim 7, wherein, It also includes the outer casing; The outer casing is fitted over the cavity, the quartz cavity, and the lifting device.

9. The semiconductor etching apparatus according to claim 8, characterized in that, The outer casing has an opening and a baffle for closing the opening.

10. The semiconductor etching apparatus of claim 9, wherein, The baffle is removably installed on the opening.

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