A carrierless automated wafer handling system

Abstract

This utility model discloses a carrierless automated wafer handling system. The horizontal movement of the main structure mounting box and gripping mechanism is guided by horizontal linear rails and driven by a servo motor through a horizontal gear and rack transmission, resulting in smooth and high-precision horizontal movement. By analyzing the center of gravity of the main structure mounting box and gripping mechanism, the positions of the T-shaped aluminum profiles fixed on the frame are rationally distributed, reducing the stress on the horizontal linear rails and frame, thus minimizing deformation and making the structure more stable. The gripping mechanism can directly grip wafers without a carrier, thereby eliminating the cost associated with wafer carriers and saving on carrier costs. The gripping mechanism is compatible with gripping wafers of 6 to 15 inches, demonstrating strong compatibility and solving the compatibility problem of handling wafers of different sizes.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a wafer carrierless automated handling system. Background Technology

[0002] Currently, in semiconductor wafer wet process tank equipment, the handling system requires wafer carriers to transport wafers. Different wafer specifications require different carriers. The carriers are expensive and are consumable parts, resulting in high carrier costs and an inability to flexibly switch wafer specifications. In the handling system, the vertical guide rails of the robot are mounted on the back plate of the main structure mounting box, resulting in poor force distribution. The horizontal movement of the upper and lower guide rails has a small interval, resulting in high force on the slide rails and unstable structural operation. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the existing defects and provide a wafer carrierless automated handling system, including a frame;

[0004] At least two T-shaped aluminum profiles are horizontally arranged side by side on the frame. Each T-shaped aluminum profile is horizontally arranged with a horizontal rail, and one of the T-shaped aluminum profiles is horizontally arranged with a horizontal rack.

[0005] It also includes a main structure mounting box that is slidably mounted to the horizontal rail via a horizontal slider; the main structure mounting box includes a box body, a second servo motor disposed in the box body, a horizontal gear driven by the second servo motor and meshing with the horizontal rack, and a lifting drive assembly disposed in the box body;

[0006] It also includes a gripping mechanism mounted on top of the lifting drive assembly via a supporting steel pipe; the gripping mechanism includes a support base plate horizontally mounted on top of the supporting steel pipe, a flipping drive assembly mounted on the support base plate, and a gripper that is synchronously driven and flipped by the flipping drive assembly to achieve opening and closing, thereby gripping workpieces of different specifications by means of the gripper with different opening and closing angles.

[0007] Wherein: the flipping drive assembly includes a first rotating shaft and a second rotating shaft symmetrically mounted on the support base plate via bearing seats, a third servo motor mounted on the support base plate, a small gear disposed at the drive end of the third servo motor, a first large gear disposed on the first rotating shaft or the second rotating shaft and meshing with the small gear, and a second large gear and a third large gear respectively disposed on the first rotating shaft and the second rotating shaft and meshing with each other.

[0008] Wherein: the gripper includes symmetrically arranged support vertical rods, a toothed rod horizontally arranged between the support vertical rods, and toothed grooves equidistantly arranged on the toothed rods, and the toothed grooves of the two grippers that realize opening and closing are symmetrically arranged. The grippers are symmetrically installed on the first rotating shaft and the second rotating shaft through the support vertical rods to realize opening and closing.

[0009] Wherein: the lifting drive assembly includes vertical linear rails arranged symmetrically in the housing, a vertical lifting box that is slidably connected to the vertical linear rails by a vertical slider, a lead screw mechanism set at the bottom of the vertical lifting box, and a servo motor set in the housing and driven by a transmission assembly to drive the lead screw mechanism, and the support steel pipe is vertically installed on the top of the vertical lifting box.

[0010] The horizontal linear guide, horizontal slider, horizontal rack, and horizontal gear are all made of high-molecular plastic, which reduces metal ion contamination from the overall handling system and ensures wafer cleanliness. High-molecular plastic can adapt to acid and alkaline gas environments, is corrosion-resistant, has a long service life, high stability, and saves costs.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The horizontal movement of the main structure mounting box and gripping mechanism is guided by horizontal linear rails and driven by servo motors to drive horizontal gears and horizontal racks, resulting in smooth and high-precision horizontal movement;

[0013] 2. By analyzing the center of gravity of the main structure mounting box and the gripping mechanism, the position of the T-shaped aluminum profile fixed on the frame is reasonably distributed to reduce the stress on the horizontal rail and the frame, so that the deformation of the main structure mounting box and the gripping mechanism is smaller and the structure is more stable.

[0014] 3. The gripping mechanism can directly grip the wafer without the need for a carrier, thus eliminating the cost associated with wafer carriers and saving on carrier costs;

[0015] 4. The gripping mechanism is compatible with gripping wafers of 6 to 15 inches, which solves the compatibility problem of handling wafers of different sizes. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a side view of the structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the main structure of this utility model;

[0019] Figure 4 for Figure 3Schematic diagram of the cross-sectional structure along the middle AA direction;

[0020] Figure 5 for Figure 4 Enlarged structural diagram of section II;

[0021] Figure 6 This is a three-dimensional structural diagram of the gripping mechanism in this utility model;

[0022] Figure 7 This is a side view of the gripping mechanism in this utility model.

[0023] Figure 8 for Figure 7 Enlarged structural diagram of the middle section (I);

[0024] Figure 9 This is a front view schematic diagram of the gripping mechanism in this utility model.

[0025] In the diagram: 10. Frame; 20. T-shaped aluminum profile; 30. Horizontal linear guide; 40. Horizontal slider; 50. Main structure mounting box; 51. Box body; 52. Servo motor one; 53. Transmission assembly; 54. Screw mechanism; 55. Vertical linear guide; 56. Vertical slider; 57. Vertical lifting box; 60. Horizontal rack; 71. Servo motor two; 72. Horizontal gear; 80. Supporting steel pipe; 90. Gripping mechanism; 91. Supporting base plate; 92. Bearing seat; 931. Rotating shaft one; 932. Rotating shaft two; 94. Servo motor three; 95. Small gear; 96. Large gear one; 97. Large gear two; 98. Large gear three; 991. Supporting vertical rod; 992. Gear rack; 993. Gear groove; 100. Workpiece. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Example 1:

[0027] Please see Figure 1-9 The wafer carrierless automatic handling system provided in this embodiment 1 is mainly applicable to the wet tank batch production process of semiconductor wafers. It is used to automatically move wafers from the loading platform to various wet reaction tanks, cleaning tanks or drying tanks, until the unloading platform. It includes a frame 10; at least two T-shaped aluminum profiles 20 are horizontally arranged side by side on the frame 10. Horizontal linear rails 30 are arranged on each T-shaped aluminum profile 20, and a horizontal rack 60 is arranged on one of the T-shaped aluminum profiles 20.

[0028] It also includes a main structure mounting box 50 that is slidably installed on a horizontal slider 40 and a horizontal rail 30; the main structure mounting box 50 includes a box body 51 (the box body 51 is mainly spliced ​​together by a back plate, side wall plates, and upper and lower bottom plates, and the structural rigidity is reliable), a servo motor 71 set in the box body 51, a horizontal gear 72 driven by the servo motor 71 and meshing with the horizontal rack 60, and a lifting drive assembly set in the box body 51.

[0029] It also includes a gripping mechanism 90 mounted on top of the lifting drive assembly via a support steel pipe 80; the gripping mechanism 90 includes a support base plate 91 horizontally mounted on top of the support steel pipe 80, a flipping drive assembly mounted on the support base plate 91, and a gripper that is synchronously driven and flipped by the flipping drive assembly to achieve opening and closing, thereby gripping workpieces 100 of different specifications through grippers with different opening and closing angles.

[0030] The flip drive assembly includes a first rotating shaft 931 and a second rotating shaft 932 symmetrically mounted on a support base plate 91 via bearing seats 92, a third servo motor 94 mounted on the support base plate 91, a small gear 95 disposed at the drive end of the third servo motor 94, a first large gear 96 disposed on the first rotating shaft 931 or the second rotating shaft 932 and meshing with the small gear 95, and a second large gear 97 and a third large gear 98 respectively disposed on the first rotating shaft 931 and the second rotating shaft 932 and meshing with each other.

[0031] The gripper includes symmetrically arranged support vertical rods 991, horizontally arranged toothed rods 992 between the support vertical rods 991, and toothed grooves 993 equidistantly arranged on the toothed rods 992. The toothed grooves 993 of the two grippers that enable opening and closing are symmetrically arranged. The grippers are symmetrically mounted on rotating shaft one 931 and rotating shaft two 932 via the support vertical rods 991 to achieve opening and closing.

[0032] The lifting drive assembly includes a vertical linear rail 55 symmetrically arranged in the housing 51, a vertical lifting box 57 that is slidably connected to the vertical linear rail 55 by a vertical slider 56, a lead screw mechanism 54 located at the bottom of the vertical lifting box 57, a servo motor 52 located in the housing 51 and driven by a transmission assembly 53 to the lead screw mechanism 54, and a support steel pipe 80 vertically installed on the top of the vertical lifting box 57.

[0033] The working principle of Example 1:

[0034] First, the servo motor 71 drives the horizontal gear 72 to mesh with the horizontal rack 60, thereby driving the main structure mounting box 50 and the horizontal slider 40 to slide along the horizontal rail 30, thereby driving the gripping mechanism 90 to move above the designated gripping position of the wet reaction tank, cleaning tank or drying tank.

[0035] Then, the servo motor 52 drives the lead screw mechanism 54 to rotate through the transmission component 53, thereby driving the vertical lifting box 57 and the vertical slider 56 to slide up and down along the vertical rail 55, thereby driving the gripping mechanism 90 to move up and down at the specified gripping position.

[0036] Then, the servo motor 94 drives the pinion 95 to rotate, the pinion 95 drives the meshing large gear 96 to rotate, and then drives the rotating shaft 931 or the rotating shaft 932 to rotate. In turn, the rotation of the rotating shaft 931 or the rotating shaft 932 drives the meshing large gear 97 and the large gear 98 to rotate synchronously, thereby realizing the synchronous rotation of the rotating shaft 931 and the rotating shaft 932.

[0037] Finally, the synchronous rotation of rotating shaft 1 931 and rotating shaft 2 932 drives the gripper to open and close synchronously and adjust to the size of the corresponding workpiece 100. Furthermore, the synchronous rotation of rotating shaft 1 931 and rotating shaft 2 932 drives the tooth bar 992 of the gripper to achieve batch gripping of workpieces 100 such as wafers, and the tooth groove 993 limits the wafers, thereby realizing the function of directly gripping wafers without a carrier, so as to reduce the cost of wafer carriers and can be compatible with gripping 6-15 inch wafers. Example 2:

[0038] Based on Example 1, in this Example 2, the horizontal linear guide 30, horizontal slider 40, horizontal rack 60 and horizontal gear 72 are all made of polymer plastic, thereby reducing metal ion contamination from the overall handling system and ensuring wafer cleanliness; polymer plastic can adapt to acid and alkaline gas environments, is corrosion resistant, has a long service life, high stability and saves costs.

[0039] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A wafer carrierless automated handling system, characterized by: Includes the framework (10); At least two T-shaped aluminum profiles (20) are arranged horizontally on the frame (10), and each T-shaped aluminum profile (20) is provided with a horizontal linear guide (30), and one of the T-shaped aluminum profiles (20) is provided with a horizontal rack (60). It also includes a main structure mounting box (50) that is slidably mounted to the horizontal rail (30) via a horizontal slider (40); the main structure mounting box (50) includes a box body (51), a second servo motor (71) disposed in the box body (51), a horizontal gear (72) driven by the second servo motor (71) and meshing with the horizontal rack (60), and a lifting drive assembly disposed in the box body (51); It also includes a gripping mechanism (90) mounted on top of the lifting drive assembly via a support steel pipe (80); the gripping mechanism (90) includes a support base plate (91) horizontally mounted on top of the support steel pipe (80), a flipping drive assembly mounted on the support base plate (91), and a gripper that is synchronously driven and flipped by the flipping drive assembly to achieve opening and closing, thereby gripping workpieces (100) of different specifications by means of the gripper with different opening and closing angles.

2. The wafer carrierless automated handling system of claim 1, wherein: The flipping drive assembly includes a first rotating shaft (931) and a second rotating shaft (932) symmetrically mounted on the support base plate (91) via a bearing seat (92), a third servo motor (94) mounted on the support base plate (91), a small gear (95) disposed at the drive end of the third servo motor (94), a first large gear (96) disposed on the first rotating shaft (931) or the second rotating shaft (932) and meshed with the small gear (95), and a second large gear (97) and a third large gear (98) respectively disposed on the first rotating shaft (931) and the second rotating shaft (932) and meshed with each other.

3. The wafer carrierless automated handling system of claim 2, wherein: The gripper includes symmetrically arranged support vertical rods (991), a toothed rod (992) horizontally arranged between the support vertical rods (991), and toothed grooves (993) equidistantly arranged on the toothed rods (992). The toothed grooves (993) of the two grippers that enable opening and closing are symmetrically arranged. The grippers are symmetrically mounted on the first rotating shaft (931) and the second rotating shaft (932) via the support vertical rods (991) to enable opening and closing.

4. The wafer carrierless automated handling system of claim 1, wherein: The lifting drive assembly includes a vertical linear rail (55) symmetrically arranged in the housing (51), a vertical lifting box (57) slidably connected to the vertical linear rail (55) via a vertical slider (56), a lead screw mechanism (54) arranged at the bottom of the vertical lifting box (57), and a servo motor (52) arranged in the housing (51) and driven by a transmission assembly (53) to the lead screw mechanism (54). The supporting steel pipe (80) is vertically installed on the top of the vertical lifting box (57).

5. The wafer carrierless automated handling system of claim 1, wherein: The horizontal linear guide (30), horizontal slider (40), horizontal rack (60) and horizontal gear (72) are all made of polymer plastic.

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