A cold plate of a uniform temperature plate base structure for heat dissipation of a high-power consumption chip

Abstract

The utility model provides a cold plate of the base structure of the even temperature plate for high -power consumption chip heat dissipation, including cold plate lower cover, cold plate spade tooth bottom board and cold plate upper cover, wherein, cold plate lower cover is opposite with high -power consumption chip, cold plate lower cover is away from high -power consumption chip one end with cold plate spade tooth bottom board fixed connection, cold plate spade tooth bottom board is away from cold plate lower cover one end with cold plate upper cover fixed connection, and cold plate spade tooth bottom board is equipped with cold plate spade tooth fin, the utility model discloses a cold plate of the base structure of the even temperature plate for high -power consumption chip heat dissipation, utilizes the base structure of even temperature plate to replace pure copper base plate and is more applicable to high -power consumption high heat flux density's chip to high -power consumption chip surface even temperature nature is better, in addition directly takes cold plate spade tooth bottom board as even temperature plate upper cover, has saved traditional even temperature plate upper cover and the thermal resistance of soldering tin cream, has reduced the thermal resistance of whole heat transfer path, has improved heat transfer efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a cold plate for a vapor chamber substrate structure for heat dissipation of high-power chips. Background Technology

[0002] With the continuous development of artificial intelligence and cloud computing, the power consumption of chips has increased dramatically. Common heat dissipation methods for high-power chips are traditional air cooling and liquid cooling. However, traditional air cooling is no longer sufficient to meet the heat dissipation challenges brought by future high-power chips.

[0003] However, existing liquid cooling devices suffer from problems such as cumbersome structure, high cost, lack of simplicity, and low heat dissipation efficiency, which urgently need to be addressed. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a cold plate for a vapor chamber substrate structure for heat dissipation of high-power chips, in order to solve the problems of how to reduce costs and improve heat dissipation efficiency in liquid cooling in the prior art.

[0005] To achieve the above and other related objectives, this utility model provides a cold plate for a vapor chamber substrate structure for heat dissipation of high-power chips, comprising a lower cold plate cover, a cold plate toothed base plate, and a upper cold plate cover, wherein the lower cold plate cover abuts against the high-power chip; the end of the lower cold plate cover away from the high-power chip is fixedly connected to the cold plate toothed base plate; the end of the cold plate toothed base plate away from the lower cold plate cover is fixedly connected to the upper cold plate cover, and the cold plate toothed base plate is provided with cold plate toothed fins.

[0006] In one embodiment of this utility model, the cold plate cover is provided with a refrigerant inlet and a refrigerant outlet.

[0007] In one embodiment of this utility model, the cold plate cover and the cold plate shovel tooth bottom plate are fixedly connected by brazing.

[0008] In one embodiment of the present invention, the cold plate shovel tooth fin is located between the cold plate upper cover and the cold plate shovel tooth bottom plate.

[0009] In one embodiment of this utility model, the materials of the cold plate shovel fins, the cold plate cover, and the cold plate shovel base plate include copper.

[0010] In one embodiment of the present invention, a refrigerant is filled between the top cover of the cold plate and the bottom plate of the cold plate shovel teeth.

[0011] In one embodiment of this utility model, the refrigerant includes PG25 coolant.

[0012] In one embodiment of this utility model, the lower cover of the cold plate and the bottom plate of the cold plate shovel teeth are fixedly connected by diffusion welding.

[0013] In one embodiment of this utility model, the lower cover of the cold plate and the bottom plate of the cold plate spade form a temperature equalization plate.

[0014] In one embodiment of this utility model, the material of the lower cover of the cold plate includes copper.

[0015] As described above, the cold plate of the vapor chamber substrate structure for heat dissipation of high-power chips of this utility model uses a vapor chamber substrate structure instead of a pure copper substrate, which is more suitable for high-power chips with high heat flux density. In addition, the surface temperature uniformity of high-power chips is better. Furthermore, the cold plate toothed base plate is directly used as the vapor chamber top cover, which eliminates the thermal resistance of the traditional vapor chamber top cover and solder paste, reduces the thermal resistance of the entire heat transfer path, and improves the heat transfer efficiency. Attached Figure Description

[0016] Figure 1 The diagram shown is a cross-sectional view of the cold plate of a vapor chamber substrate structure for heat dissipation of high-power chips according to this utility model.

[0017] Figure 2 The diagram shown is a cross-sectional view of the mounting structure of a heat spreader substrate for heat dissipation of high-power chips according to this invention.

[0018] Component designation explanation

[0019] 1. Cold plate bottom cover

[0020] 2 Cold-rolled steel scraper base plate

[0021] 3 Cold plate top

[0022] 4 High-power chips

[0023] 5 Cold-rolled steel plate spade-tooth fins

[0024] 6 PCB boards

[0025] 7 screws

[0026] 8. Refrigerant import

[0027] 9. Refrigerant outlet Detailed Implementation

[0028] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0029] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0030] Please see Figure 1 This utility model provides a cold plate for a heat dissipation vapor chamber substrate structure for high-power chips, comprising: a lower cold plate cover 1, a cold plate toothed base plate 2, and a upper cold plate cover 3, wherein the lower cold plate cover 1 abuts against the high-power chip 4; one end of the lower cold plate cover 1 away from the high-power chip 4 is fixedly connected to the cold plate toothed base plate 2; one end of the cold plate toothed base plate 2 away from the lower cold plate cover 1 is fixedly connected to the upper cold plate cover 3, and the cold plate toothed base plate 2 is provided with cold plate toothed fins 5.

[0031] It should be noted that, in this embodiment, the cold plate is made of a vapor chamber substrate structure for heat dissipation of the high-power chip 4. Therefore, the lower cover 1 of the cold plate, the bottom plate 2 of the cold plate with toothed teeth, and the upper cover 3 of the cold plate together constitute the cold plate. Specifically, the upper cover 3 of the cold plate and the bottom plate 2 of the cold plate with toothed teeth are fixedly connected by brazing, and the lower cover 1 of the cold plate and the bottom plate 2 of the cold plate with toothed teeth are fixedly connected by diffusion welding, thereby forming an integral cold plate.

[0032] In actual application installation, refer to Figure 2 The high-power chip 4 is mounted on the PCB board 6. Since the cold plate, consisting of the lower cover 1, the bottom plate 2, and the upper cover 3, is a single unit, the cold plate can be directly fixed to the PCB board 6 using screws 7. This allows the lower cover 1 to contact the high-power chip 4 for heat dissipation. The lower cover 1 and the high-power chip 4 are not in direct contact, but rather through a thermally conductive interface material. This material fills the gaps to reduce the thermal resistance of the interface. Furthermore, the screws 7 pass through the screw holes on the bottom plate 2 and the lower cover 1, and are ultimately positioned within the screw holes on the PCB board 6 that mate with the screws 7.

[0033] Furthermore, the cold plate toothed fin 5 is located between the cold plate upper cover 3 and the cold plate toothed bottom plate 2, while the cold plate lower cover 1 and the cold plate toothed bottom plate 2 form a heat spreader. The heat spreader has the same function and working principle as a heat pipe. It is equipped with copper mesh, copper pillars and working fluid components inside. It is closed in a plate-shaped cavity to allow the evaporation and condensation of the working fluid to circulate, so as to have the characteristics of rapid heat spreader. Thus, it has the functions of rapid heat conduction and heat diffusion. Accordingly, the materials of the cold plate toothed fin 5, the cold plate upper cover 3, the cold plate toothed bottom plate 2 and the cold plate lower cover 1 include copper. Specifically, the cold plate cover 3 is provided with a refrigerant inlet 8 and a refrigerant outlet 9 to allow refrigerant to flow between the cold plate cover 3 and the cold plate toothed bottom plate 2. Correspondingly, the space between the cold plate cover 3 and the cold plate toothed bottom plate 2 is filled with refrigerant. For example, the refrigerant includes PG25 coolant. In practical applications, the temperature of the PG25 refrigerant entering from the refrigerant inlet 8 can be 40°C. The low-temperature refrigerant flows from the refrigerant inlet 8 into the internal space between the cold plate cover 3 and the cold plate toothed bottom plate 2, where it exchanges heat with the high-temperature cold plate toothed fins 5, carrying away heat and flowing out from the refrigerant outlet 9. This ensures that the contact surface between the cold plate bottom cover 1 and the high-power chip 4 is always maintained at a low temperature level.

[0034] It should be noted that the traditional heat spreader setup requires a heat spreader top cover between the cold plate spade base plate and the cold plate bottom cover. However, in this embodiment, the cold plate spade base plate is directly welded to the cold plate bottom cover, and the bottom of the cold plate spade directly serves as the heat spreader top cover. This eliminates the thermal resistance of the heat spreader top cover and solder paste in the traditional setup, reduces the thermal resistance of the entire heat transfer path, and improves the heat transfer efficiency.

[0035] It should be noted that traditional pure copper base plate setups exhibit relatively large temperature gradients and relatively poor thermal performance in high-power, high-heat-flux-density chip applications due to the limitation of diffusion thermal resistance. Compared to pure copper base plate setups, the vapor chamber base structure used in this embodiment for cold plate setup has higher equivalent thermal conductivity, which greatly reduces the diffusion thermal resistance of the cold plate and enables a more uniform surface temperature between the cold plate and the high-power chip, thereby optimizing the temperature uniformity of the high-power chip surface.

[0036] In summary, the cold plate of this utility model, which is a vapor chamber substrate structure for heat dissipation of high-power chips, is more suitable for high-power chips with high heat flux density by using a vapor chamber substrate structure instead of a pure copper substrate. Furthermore, the surface temperature uniformity of high-power chips is better. In addition, the cold plate with toothed base plate is directly used as the vapor chamber top cover, eliminating the thermal resistance of the traditional vapor chamber top cover and solder paste, reducing the thermal resistance of the entire heat transfer path, and improving the heat transfer efficiency.

[0037] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A cold plate for a uniform heat spreader base structure for heat dissipation of a high power chip, characterized by, Comprise: A cold plate lower cover, a cold plate spade tooth bottom plate and a cold plate upper cover, wherein, The cold plate lower cover is opposite to a high-power chip; One end of the cold plate lower cover away from the high-power chip is fixedly connected with the cold plate spade tooth bottom plate; One end of the cold plate spade tooth bottom plate away from the cold plate lower cover is fixedly connected with the cold plate upper cover, and the cold plate spade tooth bottom plate is provided with a cold plate spade tooth fin.

2. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 1, characterized in that, The cold plate upper cover is provided with a refrigerant inlet and a refrigerant outlet.

3. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 1, characterized in that, The cold plate upper cover and the cold plate spade tooth bottom plate are fixedly connected through brazing.

4. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 3, characterized in that, The cold plate spade tooth fin is located between the cold plate upper cover and the cold plate spade tooth bottom plate.

5. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 4, characterized in that, The material of the cold plate spade tooth fin, the cold plate upper cover and the cold plate spade tooth bottom plate comprises copper material.

6. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 4, wherein The cold plate upper cover and the cold plate spade tooth bottom plate are filled with a refrigerant.

7. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 6, wherein The refrigerant comprises PG25 cooling liquid.

8. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 1, wherein, The cold plate lower cover and the cold plate spade tooth bottom plate are fixedly connected through diffusion welding.

9. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 8, wherein, The cold plate lower cover and the cold plate spade tooth bottom plate form an isothermal plate.

10. The cold plate of a uniform temperature plate base structure for heat dissipation of a high-power chip according to claim 8, wherein, The material of the cold plate lower cover comprises copper material.

Images