Capacitor device, package structure, circuit board assembly, and electronic device
By placing capacitors within the substrate and electrical connectors on both sides, combined with a redistribution layer, the trade-off between capacitance and electrical interconnection in capacitor components is resolved, achieving a high-efficiency improvement in both capacitance and interconnection performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING X RING TECHNOLOGY CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-07-03
AI Technical Summary
In the prior art, there is a trade-off between meeting capacitance requirements and electrical interconnection requirements in capacitor devices, resulting in low interconnection density and high cost, making it difficult to meet both requirements at the same time.
A capacitor is placed inside the substrate, and electrical connectors are placed on both sides of the substrate. Electrical connection is achieved through the connectors that penetrate the substrate, and the electrical interconnect performance is improved in combination with the rewiring layer.
This allows capacitor components to simultaneously meet both capacitance and electrical interconnection requirements, improving applicability and interconnection density, shortening power supply paths, and reducing costs.
Smart Images
Figure CN224460568U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the semiconductor field, specifically to a capacitor, a packaging structure, a circuit board assembly, and an electronic device. Background Technology
[0002] In recent years, as semiconductor technology has gradually developed towards smaller size and higher performance, the performance requirements for devices such as resistors, capacitors, and inductors have been increasing. As one of the key components in a semiconductor structure, capacitors can perform functions such as filtering, bypassing, energy storage, and temperature compensation. Utility Model Content
[0003] To overcome the problems existing in the related technologies, this disclosure provides a capacitor device, a packaging structure, a circuit board assembly, and an electronic device.
[0004] According to a first aspect of the present disclosure, a capacitor device is provided, the capacitor device comprising:
[0005] A substrate, the substrate including a first side and a second side that are opposite to each other;
[0006] A capacitor, wherein the capacitor is disposed within the substrate;
[0007] At least one first electrical connector is disposed on the first side;
[0008] At least one second electrical connector is disposed on the second side;
[0009] At least one third electrical connector, the third electrical connector extending through the substrate along the thickness direction of the substrate, the third electrical connector being used to electrically connect at least one first electrical connector and at least one second electrical connector.
[0010] In this embodiment, a capacitor is disposed within the substrate, thus configuring the capacitor device with a capacitive function. A first electrical connector and a second electrical connector are respectively disposed on a first side and a second side opposite to each other on the substrate. A third electrical connector penetrating the substrate is provided to electrically connect the first and second electrical connectors, providing an electrical connection path from the first electrical connector to the second electrical connector, thereby configuring the capacitor device with an electrical interconnection function. While performing the capacitance function, the capacitor device can also realize the electrical connection of external circuits or devices on both sides of the substrate. This allows the capacitor device to simultaneously meet the capacitance requirement and the electrical interconnection requirement, improving the applicability of the capacitor device, making full use of the capacitor placement space, and helping to shorten the power supply path of the chip and increase the interconnection density of the packaging structure or circuit board assembly.
[0011] In some embodiments of this disclosure, the capacitor further includes a fourth electrical connector disposed on the first side and electrically connected to the capacitor.
[0012] In this embodiment, a fourth electrical connector is provided on the first side of the substrate and is electrically connected to the capacitor. The fourth electrical connector enables the capacitor to be electrically connected to an external circuit or device located on the first side of the substrate, thereby connecting the capacitor to the signal transmission path between the external circuit or device. This facilitates the realization of the capacitor's function and further improves the applicability of the capacitor.
[0013] In some embodiments of this disclosure, the substrate includes a first surface located on the first side and a second surface located on the second side, and the distance between the capacitor and the first surface is less than the distance between the capacitor and the second surface.
[0014] In this embodiment, the capacitor is configured such that the distance between it and the first surface located on the first side of the substrate is less than the distance between it and the second surface located on the second side of the substrate. This makes the capacitor closer to the external circuit or device disposed on the first side of the substrate, shortens the distance between the capacitor and the external circuit or device, facilitates the electrical connection between the capacitor and the external circuit or device or provides it with capacitance function, and further improves the capacitance performance of the capacitor device.
[0015] In some embodiments of this disclosure, the first electrical connector includes a metal bump or a metal ball.
[0016] In this embodiment, a metal bump or a metal ball is used as a first electrical connector disposed on the first side of the substrate. The metal bump or metal ball enables the electrical connection between the capacitor and the external circuit or device disposed on the first side of the substrate. This allows the first electrical connector to have the characteristics of a metal bump or a metal ball, ensuring the rationality of the structure and the stability of the electrical connection, and further improving the electrical interconnection performance of the capacitor.
[0017] In some embodiments of this disclosure, the second electrical connector includes a metal bump or a metal ball.
[0018] In this embodiment, a metal bump or a metal ball is used as a second electrical connector disposed on the second side of the substrate. The metal bump or the metal ball enables the electrical connection between the capacitor and the external circuit or device disposed on the second side of the substrate. This allows the second electrical connector to have the characteristics of a metal bump or a metal ball, ensuring the rationality of the structure and the stability of the electrical connection, and further improving the electrical interconnection performance of the capacitor.
[0019] In some embodiments of this disclosure, the third electrical connector includes a first connecting portion and a second connecting portion. The two ends of the first connecting portion are electrically connected to the first electrical connector and the second connecting portion, respectively. The end of the second connecting portion opposite to the first connecting portion is electrically connected to the second electrical connector. The projected area of the second connecting portion on the substrate is larger than the projected area of the first connecting portion on the substrate.
[0020] In this embodiment, the first connecting portion and the second connecting portion are used as the third electrical connector. Both ends of the first connecting portion are electrically connected to the first electrical connector and the second connecting portion, respectively. The end of the second connecting portion facing away from the first connecting portion is electrically connected to the second electrical connector. The first and second connecting portions achieve the electrical connection between the first and second electrical connectors, enabling the capacitor to be used for electrical interconnection of external circuits or devices on both sides of the substrate. Configuring the projected area of the second connecting portion on the substrate to be larger than the projected area of the first connecting portion on the substrate ensures the capacitance density of the capacitor and the stability of the electrical connection between the third and second electrical connectors, further improving the capacitance performance and electrical interconnection performance of the capacitor.
[0021] In some embodiments of this disclosure, the first connection portion includes a through-silicon via (TSV), and the second connection portion includes a metal pad.
[0022] In this embodiment, a through-silicon via (TSV) is used as the first connection part, and a metal pad is used as the second connection part. The third electrical connector, which is composed of the TSV and the metal pad, realizes the electrical connection between the first and second electrical connectors. This allows the third electrical connector to have the characteristics of both TSV and metal pad, ensuring the rationality of the structure and the stability of the electrical connection. It also helps to improve the uniformity and flexibility of wiring and further enhances the electrical interconnection performance of the capacitor device.
[0023] In some embodiments of this disclosure, the substrate includes a first surface located on the first side and a second surface located on the second side, each of the first electrical connectors is disposed on the first surface, and each of the second electrical connectors is disposed on the second surface.
[0024] In this embodiment, each first electrical connector is disposed on the first surface of the substrate, and each second electrical connector is disposed on the second surface of the substrate. This arrangement of first and second electrical connectors on both sides of the substrate facilitates electrical interconnection between external circuits or devices facing the first and second surfaces respectively, via a capacitor. The direct placement of the first and second electrical connectors on the substrate surface simplifies their fabrication process and allows for better control of the overall thickness of the capacitor, ensuring the stability of the electrical interconnection between external circuits or devices on both sides of the capacitor and shortening the electrical interconnection distance.
[0025] In some embodiments of this disclosure, multiple first electrical connectors are spaced apart, and the second electrical connectors are arranged in a one-to-one correspondence with the first electrical connectors.
[0026] In this embodiment, multiple first electrical connectors are spaced apart, and the second electrical connectors are arranged in a one-to-one correspondence with the first electrical connectors. This can improve the density and uniformity of electrical interconnection between external circuits or devices at both ends of the capacitor, and also help improve the structural uniformity and rationality of the third electrical connector and capacitor in the substrate, thereby improving the overall performance of the capacitor.
[0027] In some embodiments of this disclosure, the substrate includes a first surface and a second surface that are opposite to each other, and the capacitor further includes a redistribution layer, the redistribution layer including a third surface and a fourth surface that are opposite to each other, the third surface being connected to the second surface;
[0028] The first electrical connector is disposed on the first surface, the second electrical connector is disposed on the fourth surface, and the redistribution layer is used to electrically connect the second electrical connector and the third electrical connector.
[0029] In this embodiment, a redistribution layer is provided, and the third surface of the redistribution layer is connected to the second surface of the substrate, thereby achieving the bonding between the redistribution layer and the substrate. A first electrical connector is disposed on the first surface, and a second electrical connector is disposed on the fourth surface. The redistribution layer electrically connects the second and third electrical connectors, realizing the electrical interconnection function of the capacitor device. Furthermore, the redistribution layer improves the packaging flexibility, electrical interconnection density, and signal performance of the capacitor device, enabling it to be used with more external circuits or devices.
[0030] In some embodiments of this disclosure, the number of the first electrical connector and the number of the second electrical connector are different.
[0031] In this embodiment, the number of the first electrical connector and the second electrical connector are set to be different. The redistribution layer can ensure that each first electrical connector and each second electrical connector can serve as an effective electrical interconnection port for the capacitor. This makes it easy to adjust the number of the first electrical connector and the second electrical connector according to the port situation of the external circuits or devices on both sides of the capacitor, so that the capacitor can be used for more external circuits or devices.
[0032] In some embodiments of this disclosure, the capacitor is characterized in that it comprises a deep trench capacitor.
[0033] In this embodiment, a deep trench capacitor is used as a capacitor disposed within the substrate. The characteristics of the deep trench capacitor are utilized to improve the performance of the capacitor and ensure the density of the capacitor arrangement, thereby further improving the overall performance and applicability of the capacitor device.
[0034] According to a second aspect of the present disclosure, a packaging structure is provided, the packaging structure including a capacitor as described in the first aspect, the packaging structure further including a stacked chip and a packaging substrate, the capacitor being disposed between the chip and the packaging substrate, a first electrical connector being electrically connected to the chip, and a second electrical connector being electrically connected to the packaging substrate.
[0035] In this embodiment, a capacitor is disposed between the chip and the packaging substrate of the packaging structure, and the first and second electrical connectors of the capacitor are electrically connected to the chip and the packaging substrate, respectively. This allows the capacitor to perform its capacitance function while also enabling electrical connection between the chip on both sides of the capacitor and the packaging substrate. As a result, the capacitor can simultaneously meet the capacitance and electrical interconnection requirements of the packaging structure, improving the applicability of the capacitor and the interconnection density of the packaging structure.
[0036] In some embodiments of this disclosure, the fourth electrical connector of the capacitor is electrically connected to the chip.
[0037] In this embodiment, the fourth electrical connector of the capacitor is electrically connected to the chip. The electrical connection between the capacitor and the chip is realized through the fourth electrical connector, which facilitates the realization of the capacitor's function, helps to improve the chip's performance and stability through the function of the capacitor, and reduces the chip's power consumption.
[0038] According to a third aspect of the present disclosure, a circuit board assembly is provided, the circuit board assembly including a capacitor as described in the first aspect, the circuit board assembly further including a packaging structure and a circuit board, the capacitor being disposed between the packaging structure and the circuit board, a first electrical connector being electrically connected to the packaging substrate of the packaging structure, and a second electrical connector being electrically connected to the circuit board.
[0039] In this embodiment, a capacitor is disposed between the packaging structure and the circuit board, and the first and second electrical connectors of the capacitor are electrically connected to the packaging structure and the circuit board, respectively. This allows the capacitor to perform its capacitance function while also enabling electrical connection between the packaging structure and the circuit board on both sides of the capacitor. As a result, the capacitor can simultaneously meet the capacitance requirements and electrical interconnection requirements of the packaging structure, thereby improving the applicability of the capacitor and the interconnection density of the circuit board assembly.
[0040] In some embodiments of this disclosure, the fourth electrical connector of the capacitor is electrically connected to the packaging substrate.
[0041] In this embodiment, the fourth electrical connector of the capacitor is electrically connected to the packaging substrate. The fourth electrical connector realizes the electrical connection between the capacitor and the packaging substrate, thereby facilitating the realization of the capacitor's function and improving the signal transmission and heat dissipation effect of the packaging substrate through the function of the capacitor.
[0042] According to a fourth aspect of the present disclosure, an electronic device is provided, the electronic device including a capacitor element as described in the first aspect, or the electronic device including a packaging structure as described in the second aspect, or the electronic device including a circuit board assembly as described in the third aspect.
[0043] In this embodiment, since the electronic device includes capacitors, packaging structures, and circuit board assemblies, all of which have the advantages of balancing capacitance and increasing interconnection density, the electronic device has the same advantages.
[0044] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: while performing the function of capacitance, the capacitor can also realize the electrical connection of external circuits or devices on both sides of the substrate, so that the capacitor can simultaneously meet the capacitance requirements and electrical interconnection requirements, improve the applicability of the capacitor, make full use of the capacitor placement space, and help shorten the power path of the chip and increase the interconnection density of the packaging structure or circuit board assembly.
[0045] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0046] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.
[0047] Figure 1 This is a schematic diagram of the structure of a capacitor device according to an exemplary embodiment.
[0048] Figure 2 This is a schematic diagram of the packaging structure according to an exemplary embodiment.
[0049] Figure 3 This is a schematic diagram of the structure of a circuit board assembly according to an exemplary embodiment.
[0050] Figure 4 This is a schematic diagram of the structure of a capacitor device according to another exemplary embodiment.
[0051] Figure 5 This is a schematic diagram of the structure of a capacitor device according to another exemplary embodiment.
[0052] Figure 6This is a schematic diagram of the structure of a capacitor device according to another exemplary embodiment.
[0053] In the picture:
[0054] 10-Substrate; 20-Capacitor; 30-First electrical connector; 40-Second electrical connector; 50-Third electrical connector; 51-First connection portion; 52-Second connection portion; 53-Passivation layer; 60-Fourth electrical connector; 70-Rewiring layer; 80-Chip; 90-Packaging substrate; 100-Circuit board. Detailed Implementation
[0055] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0056] In recent years, as semiconductor technology has gradually developed towards smaller size and higher performance, the performance requirements of electronic devices for components such as resistors, capacitors, and inductors have been increasing. As one of the key components in semiconductor structures, capacitors can achieve functions such as filtering, bypassing, energy storage, and temperature compensation through their placement.
[0057] In one exemplary embodiment, a capacitor is provided. The capacitor can be disposed in a package structure including a package substrate and a chip, or in a circuit board assembly including a package structure and a circuit board, and can be built into an electronic device such as a mobile phone, tablet computer, or smart bracelet.
[0058] In one embodiment, multi-layer ceramic chip capacitors (MLCCs) or capacitors based on integrated passive devices (IPD) technology are selected as capacitor components. The capacitor components are back-attached to the chip or packaging substrate via metal balls or metal bumps to perform the function of a capacitor.
[0059] Using the above-mentioned capacitors can only meet the capacitance requirements. The capacitors will occupy the space of other devices, resulting in structural limitations and high manufacturing costs for the interconnection devices used for electrical interconnection. This leads to a low interconnection density of circuits or devices on both sides of the capacitors, requiring a trade-off between capacitance requirements and electrical interconnection requirements.
[0060] In another embodiment, reference Figure 1As shown, the capacitor assembly includes a substrate 10, a capacitor 20, at least one first electrical connector 30, at least one second electrical connector 40, and at least one third electrical connector 50. The substrate 10 includes a first side and a second side facing away from each other, and the capacitor 20 is disposed within the substrate 10. The first electrical connector 30 is disposed on the first side, the second electrical connector 40 is disposed on the second side, and the third electrical connector 50 penetrates the substrate 10 along its thickness direction. The third electrical connector 50 is used to electrically connect at least one first electrical connector 30 and at least one second electrical connector 40.
[0061] The substrate 10 provides support and load for the capacitor 20, and also provides electrical insulation and thermal conductivity for the capacitor 20. The material of the substrate 10 can be selected according to requirements. For example, the substrate 10 may include a silicon layer, which can be formed by dicing silicon wafers. It possesses excellent physical, chemical, and electrical properties, and has mature processing technology, exhibiting high compatibility with the capacitor 20. The substrate 10 includes a first side and a second side that are opposite to each other, as shown in... Figure 1 In the capacitor shown, the first side is the upper side of the substrate 10, and the second side is the lower side of the substrate 10.
[0062] Capacitor 20 is disposed within substrate 10, enabling the capacitor to perform functions such as filtering, bypassing, energy storage, and temperature compensation. The number, location, and type of capacitor 20 in substrate 10 can be selected according to requirements. For example, multiple capacitors 20 are disposed in substrate 10, with the capacitors 20 positioned close to the first side of substrate 10. The capacitors 20 can be, for example, deep trench capacitors.
[0063] One or more first electrical connectors 30 are provided on a first side of the substrate 10, and one or more second electrical connectors 40 are provided on a second side of the substrate 10. A third electrical connector 50 is provided that penetrates the substrate 10 along its thickness direction, so that the corresponding first electrical connectors 30 and second electrical connectors 40 are electrically connected through the third electrical connector 50. The first electrical connectors 30 and second electrical connectors 40 provide electrical connection pins for external circuits or devices on both sides of the capacitor substrate 10, and form an electrical connection path of first electrical connector 30-third electrical connector 50-second electrical connector 40 in the capacitor, so that the capacitor can also be used to realize the electrical interconnection of external circuits or devices on both sides of the substrate 10, thereby enabling the capacitor to simultaneously meet the capacitance requirements and electrical interconnection requirements.
[0064] For example, the substrate 10 may include a silicon layer, the capacitor 20 may include a deep trench capacitor (DTC), the first electrical connector 30 and the second electrical connector 40 may include metal bumps or metal balls, and the third electrical connector 50 may include a through-silicon via. Figure 2 As shown, the capacitor can be disposed between the chip 80 and the packaging substrate 90, so that the capacitor can not only perform the function of capacitance, but also increase the interconnection density between the chip 80 and the packaging substrate 90. Figure 3 As shown, the capacitor can also be disposed between the packaging substrate 90 and the circuit board 100, so that the capacitor can not only perform the function of capacitance, but also increase the interconnection density between the chip 80 and the packaging substrate 90.
[0065] In this embodiment, a capacitor 20 is disposed within the substrate 10, providing a capacitor function. A first electrical connector 30 and a second electrical connector 40 are disposed on a first side and a second side opposite to each other on the substrate 10, respectively. A third electrical connector 50 is disposed through the substrate 10 to electrically connect the first electrical connector 30 and the second electrical connector 40, providing an electrical connection path from the first electrical connector 30 to the second electrical connector 40, thus providing an electrical interconnection function for the capacitor. While performing the capacitance function, the capacitor can also realize the electrical connection of external circuits or devices on both sides of the substrate 10, enabling the capacitor to simultaneously meet capacitance and electrical interconnection requirements. This improves the applicability of the capacitor, fully utilizes the space of the capacitor 20, and helps to shorten the power path of the chip 80 and increase the interconnection density of the packaging structure or circuit board assembly.
[0066] In some embodiments, capacitor 20 can be independently disposed in substrate 10 without being electrically connected to other devices; for example, capacitor 20 may be an energy storage capacitor. In other embodiments, the capacitor may further include a fourth electrical connector 60 disposed on a first side of substrate 10, and capacitor 20 may be electrically connected to the fourth electrical connector 60; for example, capacitor 20 may be a decoupling capacitor, a filtering capacitor, etc., so as to electrically connect capacitor 20 to an external circuit or device disposed on the first side of substrate 10 through the fourth electrical connector 60, thereby connecting capacitor 20 to the signal transmission path of the external circuit or device, facilitating the implementation of functions such as decoupling or filtering of capacitor 20. Exemplarily, in the extending direction of substrate 10, the position of the fourth electrical connector 60 on the first side of substrate 10 corresponds to the position of capacitor 20 within substrate 10; the fourth electrical connector 60 may, for example, include a metal bump or a metal ball.
[0067] In this embodiment, a fourth electrical connector 60 is provided on the first side of the substrate 10, and the fourth electrical connector 60 is electrically connected to the capacitor 20. The fourth electrical connector 60 realizes the electrical connection between the capacitor 20 and the external circuit or device provided on the first side of the substrate 10, so as to connect the capacitor 20 to the signal transmission path between the external circuit or device, thereby facilitating the realization of the function of the capacitor 20 and further improving the applicability of the capacitor device.
[0068] In some embodiments, the substrate 10 includes a first surface located on a first side and a second surface located on a second side, and the distance between the capacitor 20 and the first surface is less than the distance between the capacitor 20 and the second surface.
[0069] The substrate 10 includes a first surface located on the first side, i.e. Figure 1 Surface A and the second surface located on the second side are shown as follows: Figure 1 As shown on surface B, the distance between the geometric center of capacitor 20 disposed in substrate 10 and the first surface is less than the distance between the geometric center of capacitor 20 and the second surface. That is, capacitor 20 is positioned closer to the first surface of substrate 10 on the first side, facilitating electrical connection between capacitor 20 and external circuits or devices located on the first side of substrate 10, or providing capacitive functionality to external circuits or devices located on the first side of substrate 10. For example, capacitor 20 may include a deep trench capacitor, the trench of which may be formed on the first surface of substrate 10, such that the distance between capacitor 20 and the first surface is less than the distance between capacitor 20 and the second surface.
[0070] In this embodiment, the capacitor 20 is configured such that the distance between it and the first surface located on the first side of the substrate 10 is less than the distance between it and the second surface located on the second side of the substrate 10. This makes the capacitor 20 closer to the external circuit or device disposed on the first side of the substrate 10, shortens the distance between the capacitor 20 and the external circuit or device, facilitates the electrical connection of the capacitor 20 with the external circuit or device or provides it with capacitance function, and further improves the capacitance performance of the capacitor device.
[0071] In some embodiments, the first electrical connector 30 includes a metal bump or a metal ball.
[0072] The first electrical connector 30 disposed on the first side of the substrate 10 may include metal bumps or metal balls. The capacitor can be electrically connected to an external circuit or device disposed on the first side of the substrate 10 via the metal bumps or metal balls. The metal bumps or metal balls have excellent conductivity, thermal performance, and reliability, facilitating the formation of high-density, low-resistance electrical interconnections. For example, the metal bumps may be copper pillar bumps (Cu bumps), and the metal balls may be ball grid arrays (BGAs) made of lead-tin alloy. The capacitor can be electrically connected to the chip 80 or the package substrate 90 disposed on the first side of the substrate 10 via the first electrical connector 30.
[0073] In this embodiment, a metal bump or a metal ball is used as the first electrical connector 30 disposed on the first side of the substrate 10. The metal bump or the metal ball realizes the electrical connection between the capacitor and the external circuit or device disposed on the first side of the substrate 10, and enables the first electrical connector 30 to have the characteristics of a metal bump or a metal ball, ensuring the rationality of the structure and the stability of the electrical connection, and further improving the electrical interconnection performance of the capacitor.
[0074] In some embodiments, the second electrical connector 40 includes a metal bump or a metal ball.
[0075] The second electrical connector 40 disposed on the second side of the substrate 10 may include metal bumps or metal balls. The capacitor can be electrically connected to an external circuit or device disposed on the second side of the substrate 10 via the metal bumps or metal balls. The metal bumps or metal balls have excellent conductivity, thermal performance, and reliability, facilitating the formation of high-density, low-resistance electrical interconnections. For example, the metal bumps may be copper pillar bumps, and the metal balls may be a ball grid array made of lead-tin alloy. The capacitor can be electrically connected to the packaging substrate 90 or circuit board 100 disposed on the second side of the substrate 10 via the first electrical connector 30.
[0076] In this embodiment, a metal bump or a metal ball is used as a second electrical connector 40 disposed on the second side of the substrate 10. The metal bump or metal ball enables the electrical connection between the capacitor and the external circuit or device disposed on the second side of the substrate 10, and enables the second electrical connector 40 to have the characteristics of a metal bump or a metal ball, ensuring the rationality of the structure and the stability of the electrical connection, and further improving the electrical interconnection performance of the capacitor.
[0077] In some embodiments, the third electrical connector 50 includes a first connecting portion 51 and a second connecting portion 52. The two ends of the first connecting portion 51 are electrically connected to the first electrical connector 30 and the second connecting portion 52, respectively. The end of the second connecting portion 52 that is away from the first connecting portion 51 is electrically connected to the second electrical connector 40. The projected area of the second connecting portion 52 on the substrate 10 is greater than the projected area of the first connecting portion 51 on the substrate 10.
[0078] like Figure 1As shown, the third electrical connector 50, which penetrates the substrate 10 along its thickness direction, includes a first connecting portion 51 and a second connecting portion 52. The first connecting portion 51 extends from the first side of the substrate 10 toward the second side of the substrate 10. One end of the first connecting portion 51 is electrically connected to the first electrical connector 30, and the other end of the first electrical connector 30 is electrically connected to the second connecting portion 52. The end of the second connecting portion 52 facing away from the first connecting portion 51 is electrically connected to the second electrical connector 40. The first electrical connector 30 and the second electrical connector 40 are electrically connected through the third electrical connector 50, thereby forming an electrical connection path of first electrical connector 30 - first connecting portion 51 - second connecting portion 52 - second electrical connector 40, so that the capacitor can be used for electrical interconnection of external circuits or devices on both sides of the substrate 10.
[0079] The projected area of the second connecting portion 52 on the substrate 10 is larger than that of the first connecting portion 51 on the substrate 10. That is, in the extending direction of the substrate 10, the size of the second connecting portion 52 is larger than that of the first connecting portion 51. By configuring the first connecting portion 51 to have a smaller projected area on the substrate 10, the space occupied by the first connecting portion 51 in the substrate 10 can be minimized, facilitating the placement of more capacitors 20 in the substrate 10 and thus ensuring the density of the capacitor arrangement. By configuring the second connecting portion 52 to have a larger projected area on the substrate 10, it is easier to place second electrical connectors 40 on the second side of the substrate 10 that meet the quantity and size requirements, thereby ensuring the electrical connection stability between the third electrical connector 50 and the second electrical connector 40.
[0080] In this embodiment, the first connecting portion 51 and the second connecting portion 52 serve as the third electrical connector 50. Both ends of the first connecting portion 51 are electrically connected to the first electrical connector 30 and the second connecting portion 52, respectively. The end of the second connecting portion 52 facing away from the first connecting portion 51 is electrically connected to the second electrical connector 40. The first connecting portion 51 and the second connecting portion 52 achieve the electrical connection between the first electrical connector 30 and the second electrical connector 40, enabling the capacitor to be used for electrical interconnection of external circuits or devices on both sides of the substrate 10. By configuring the projected area of the second connecting portion 52 on the substrate 10 to be larger than the projected area of the first connecting portion 51 on the substrate 10, the arrangement density of the capacitor 20 in the capacitor and the stability of the electrical connection between the third electrical connector 50 and the second electrical connector 40 can be ensured, further improving the capacitance performance and electrical interconnection performance of the capacitor.
[0081] In some embodiments, the first connection portion 51 includes a through-silicon via, and the second connection portion 52 includes a metal pad.
[0082] The first connection portion 51 includes a through-silicon via (TSV) to penetrate the substrate 10 and electrically connect the first electrical connector 30 to the second connection portion 52. This connection offers advantages such as high signal transmission speed, low power consumption, flexible layout, and high mechanical strength. The second connection portion 52 includes a metal pad to electrically connect the first connection portion 51 and the second electrical connector 40. This pad provides good conductivity and mechanical strength, and facilitates adjustment of the electrical connection position.
[0083] In this embodiment, a through-silicon via (TSV) is used as the first connection part 51, and a metal pad is used as the second connection part 52. The third electrical connector 50, which is composed of the TSV and the metal pad, realizes the electrical connection between the first electrical connector 30 and the second electrical connector 40. This allows the third electrical connector 50 to have the characteristics of both TSV and metal pad, ensuring the rationality of the structure and the stability of the electrical connection. This is beneficial for improving the uniformity and flexibility of wiring and further enhancing the electrical interconnection performance of the capacitor device.
[0084] It should be noted that the second connecting part 52 can have different installation positions and installation methods, such as Figure 1 As shown, the second connecting portion 52 can be disposed inside the base 10, and the third electrical connector 50 penetrates the base 10 through the first connecting portion 51 and the second connecting portion 52, such that one end of the second connecting portion 52 that is electrically connected to the second electrical connector 40 is exposed on the second surface of the base 10 located on the second side. Figure 4 As shown, the second connecting portion 52 can also be disposed on the second surface of the base 10 located on the second side, that is, the second connecting portion 52 is disposed on the outside of the base 10, and the third electrical connector 50 penetrates the base 10 through the first connecting portion 51 and is electrically connected to the second electrical connector 40 through the second connecting portion 52. Figure 5 As shown, a passivation layer 53 connected to the substrate 10 is disposed on the second surface of the substrate 10 on the second side. A second connecting portion 52 is disposed in the passivation layer 53, that is, the second connecting portion 52 is disposed outside the substrate 10. A third electrical connector 50 penetrates the substrate 10 through a first connecting portion 51 and is electrically connected to the second electrical connector 40 through the second connecting portion 52. The passivation layer 53 may, for example, include an organic material layer. The provision of the passivation layer 53 facilitates the manufacturing process of the second connecting portion 52.
[0085] In some embodiments, the substrate 10 includes a first surface located on a first side and a second surface located on a second side, each first electrical connector 30 is disposed on the first surface, and each second electrical connector 40 is disposed on the second surface.
[0086] like Figure 1As shown, the substrate 10 includes a first surface on a first side and a second surface on a second side. Each first electrical connector 30 is disposed on the first surface of the substrate 10, and each second electrical connector 40 is disposed on the second surface of the substrate 10, thus realizing the arrangement of the first electrical connectors 30 and the second electrical connectors 40 on both sides of the substrate 10. The capacitor provides an electrical connection path of first electrical connector 30-third electrical connector 50-second electrical connector 40 for external circuits or devices facing the first and second surfaces respectively, enabling the capacitor to provide electrical interconnection for external circuits or devices facing the first and second surfaces respectively.
[0087] In this embodiment, each first electrical connector 30 is disposed on the first surface of the substrate 10, and each second electrical connector 40 is disposed on the second surface of the substrate 10. This arrangement of the first electrical connectors 30 and the second electrical connectors 40 on both sides of the substrate 10 facilitates electrical interconnection between external circuits or devices facing the first and second surfaces respectively via the capacitor. The direct placement of the first electrical connectors 30 and the second electrical connectors 40 on the surface of the substrate 10 simplifies the forming process of the first electrical connectors 30 and the second electrical connectors 40, and facilitates control of the overall thickness of the capacitor, thereby ensuring the stability of the electrical interconnection between external circuits or devices on both sides of the capacitor and shortening the electrical interconnection distance.
[0088] In some embodiments, a plurality of first electrical connectors 30 are provided at intervals, and a second electrical connector 40 is provided in a one-to-one correspondence with a first electrical connector 30.
[0089] Multiple first electrical connectors 30 are spaced apart on the first side of the substrate 10. The number and position of second electrical connectors 40 on the second side of the substrate 10 correspond to the number and position of the first electrical connectors 30, so that each first electrical connector 30 can form the two ends of an electrical connection path with a corresponding second electrical connector 40, thereby improving the density and uniformity of electrical interconnection between external circuits or devices at both ends of the capacitor.
[0090] Understandably, the spacing between each first electrical connector 30 can be set according to the density requirements of electrical interconnection. For example, a fourth electrical connector 60 electrically connected to a capacitor 20 can be set between adjacent first electrical connectors 30. The spacing of multiple first electrical connectors 30 and the corresponding arrangement of second electrical connectors 40 with first electrical connectors 30 allow third electrical connectors 50 to also be spaced apart in the substrate 10. Each capacitor 20 in the substrate 10 can be set between adjacent third electrical connectors 50, thus improving structural uniformity and rationality while ensuring the density of electrical interconnection and the arrangement density of capacitors 20.
[0091] In this embodiment, multiple first electrical connectors 30 are spaced apart, and the second electrical connectors 40 are arranged in a one-to-one correspondence with the first electrical connectors 30. This can improve the density and uniformity of electrical interconnection between external circuits or devices at both ends of the capacitor, and also help improve the structural uniformity and rationality of the third electrical connector 50 and capacitor 20 in the substrate 10, thereby improving the overall performance of the capacitor.
[0092] In some embodiments, reference Figure 6 As shown, the substrate 10 includes a first surface and a second surface that are opposite to each other. The capacitor also includes a redistribution layer 70, which includes a third surface and a fourth surface that are opposite to each other, with the third surface connected to the second surface. A first electrical connector 30 is disposed on the first surface, and a second electrical connector 40 is disposed on the fourth surface. The redistribution layer 70 is used to electrically connect the second electrical connector 40 and the third electrical connector 50.
[0093] The substrate 10 includes a first surface and a second surface facing away from each other. The first surface of the substrate 10 is located on a first side of the substrate 10, and the second surface of the substrate 10 is located on a second side of the substrate 10. The capacitor device also includes a redistribution layer 70, which includes a metal layer and a dielectric layer. The redistribution layer 70 can form a wiring network through the metal layer to redistribute the number or location of electrical interconnects, thereby improving packaging flexibility, electrical interconnect density, and signal performance. The redistribution layer 70 includes a third surface and a fourth surface. The third surface of the redistribution layer 70 is connected to the second surface of the substrate 10, so that the redistribution layer 70 and the substrate 10 are bonded to each other.
[0094] The first electrical connector 30 is disposed on the first surface of the substrate 10, and the second electrical connector 40 is disposed on the fourth surface of the redistribution layer 70, so that the first electrical connector 30 and the second electrical connector 40 can be located on opposite sides of the substrate 10, respectively. The redistribution layer 70 is used to electrically connect the second electrical connector 40 and the third electrical connector 50, thereby forming an electrical connection path of first electrical connector 30 - third electrical connector 50 - redistribution layer 70 - second electrical connector 40. Based on realizing the electrical interconnection function of capacitor components, the redistribution layer 70 realizes the redistribution of electrical interconnection ports, which facilitates the adjustment of the position and size of the second electrical connector 40 and the third electrical connector 50 according to requirements.
[0095] In this embodiment, a redistribution layer 70 is provided, and the third surface of the redistribution layer 70 is connected to the second surface of the substrate 10, thereby achieving the mutual bonding between the redistribution layer 70 and the substrate 10. A first electrical connector 30 is disposed on the first surface, and a second electrical connector 40 is disposed on the fourth surface. The redistribution layer 70 electrically connects the second electrical connector 40 and the third electrical connector 50, realizing the electrical interconnection function of the capacitor device. Furthermore, the redistribution layer 70 improves the packaging flexibility, electrical interconnection density, and signal performance of the capacitor device, enabling it to be used with more external circuits or devices.
[0096] In some embodiments where the redistribution layer 70 is provided, the number of first electrical connectors 30 and second electrical connectors 40 is the same, while in other embodiments, the number of first electrical connectors 30 and second electrical connectors 40 is different.
[0097] With the redistribution layer 70 in place, since the redistribution layer 70 has the function of redistributing the position and number of electrical interconnection ports, even if the number of first electrical connectors 30 and second electrical connectors 40 is different, it can be ensured that each first electrical connector 30 and each second electrical connector 40 can be in the same electrical connection path, thereby improving the flexibility of electrical interconnection while ensuring the electrical interconnection density.
[0098] In this embodiment, the number of the first electrical connector 30 and the second electrical connector 40 is set to be different. The redistribution layer 70 can ensure that each first electrical connector 30 and each second electrical connector 40 can serve as an effective electrical interconnection port for the capacitor. This makes it easy to adjust the number of the first electrical connector 30 and the second electrical connector 40 according to the port situation of the external circuits or devices on both sides of the capacitor, so that the capacitor can be used for more external circuits or devices.
[0099] In some embodiments, capacitor 20 includes a deep trench capacitor.
[0100] The capacitor 20 disposed within the substrate 10 can be a deep trench capacitor. A deep trench capacitor may include trenches and alternating electrode layers and dielectric layers within the trenches, and is fabricated through processes such as etching, deposition, and planarization. It features high density, low parasitic parameters, good electrical performance, and adjustable capacitance. For example, the trenches of the deep trench capacitor may be formed on the first surface of the substrate 10, and the depth of the trenches can be adjusted according to the thickness of the substrate 10 to balance capacitance performance, stress performance, and fabrication feasibility.
[0101] In this embodiment, a deep trench capacitor is used as the capacitor 20 disposed within the substrate 10. The characteristics of the deep trench capacitor are utilized to improve the performance of the capacitor 20 and ensure the arrangement density of the capacitor 20, thereby further improving the overall performance and applicability of the capacitor device.
[0102] In one exemplary embodiment, a packaging structure is provided, the packaging structure including the capacitor element as described above, the packaging structure further including a stacked chip 80 and a packaging substrate 90, the capacitor element being disposed between the chip 80 and the packaging substrate 90, a first electrical connector 30 being electrically connected to the chip 80, and a second electrical connector 40 being electrically connected to the packaging substrate 90.
[0103] like Figure 2 As shown, the packaging structure includes a stacked chip 80 and a packaging substrate 90, as well as a capacitor element shown in the above embodiment. The capacitor element is disposed between the chip 80 and the packaging substrate 90. A first electrical connector 30 of the capacitor element is electrically connected to the chip 80, and a second electrical connector 40 of the capacitor element is electrically connected to the packaging substrate 90. The capacitor element provides capacitance to the packaging structure and also forms an electrical connection path from chip 80 to the first electrical connector 30, the third electrical connector 50, the second electrical connector 40, and the packaging substrate 90, thereby providing electrical interconnection between the chip 80 and the packaging substrate 90 on both sides of the capacitor element, thus simultaneously meeting the capacitance and electrical interconnection requirements of the packaging structure. The packaging structure may also include an encapsulant that can wrap the chip 80 and the capacitor element to encapsulate the chip 80 and the capacitor element on the packaging substrate 90.
[0104] In this embodiment, a capacitor is disposed between the chip 80 and the packaging substrate 90 of the packaging structure, and the first electrical connector 30 and the second electrical connector 40 of the capacitor are electrically connected to the chip 80 and the packaging substrate 90, respectively. This allows the capacitor to perform its capacitance function while also enabling electrical connection between the chip 80 on both sides of the capacitor and the packaging substrate 90. As a result, the capacitor can simultaneously meet the capacitance requirements and electrical interconnection requirements of the packaging structure, thereby improving the applicability of the capacitor and the interconnection density of the packaging structure.
[0105] In some embodiments, the fourth electrical connector 60 of the capacitor is electrically connected to the chip 80.
[0106] like Figure 2 As shown, the fourth electrical connector 60 of the capacitor is electrically connected to the chip 80, so that the chip 80 and the capacitor 20 in the substrate 10 can be electrically connected through the fourth electrical connector 60, and the capacitor 20 in the substrate 10 of the capacitor can provide decoupling, filtering and other functions for the chip 80.
[0107] In this embodiment, the fourth electrical connector 60 of the capacitor is electrically connected to the chip 80. The fourth electrical connector 60 realizes the electrical connection between the capacitor 20 and the chip 80, thereby facilitating the realization of the function of the capacitor 20. It is beneficial to improve the performance and stability of the chip 80 through the function of the capacitor 20 and reduce the power consumption of the chip 80.
[0108] In one exemplary embodiment, a circuit board assembly is provided, which includes a capacitor as described above. The circuit board assembly also includes a package structure and a circuit board 100. The capacitor is disposed between the package structure and the circuit board 100. A first electrical connector 30 is electrically connected to the package substrate 90 of the package structure, and a second electrical connector 40 is electrically connected to the circuit board 100.
[0109] like Figure 3 As shown, the circuit board assembly includes a packaging structure, a circuit board 100, and a capacitor element shown in the above embodiment. The capacitor element is disposed between the packaging structure and the circuit board 100. The first electrical connector 30 of the capacitor element is electrically connected to the packaging substrate 90 of the packaging structure, and the second electrical connector 40 of the capacitor element is electrically connected to the circuit board 100. The capacitor element provides capacitance to the circuit board assembly and also forms an electrical connection path from the packaging substrate 90 to the first electrical connector 30, the third electrical connector 50, the second electrical connector 40, and the circuit board 100. This provides electrical interconnection between the packaging structure and the circuit board 100 on both sides of the capacitor element, simultaneously meeting the capacitance and electrical interconnection requirements of the circuit board assembly.
[0110] In this embodiment, a capacitor is disposed between the packaging structure and the circuit board 100, and the first electrical connector 30 and the second electrical connector 40 of the capacitor are electrically connected to the packaging structure and the circuit board 100, respectively. This allows the capacitor to perform its capacitance function while also enabling the packaging structure on both sides of the capacitor to be electrically connected to the circuit board 100. As a result, the capacitor can simultaneously meet the capacitance requirements and electrical interconnection requirements of the packaging structure, thereby improving the applicability of the capacitor and the interconnection density of the circuit board assembly.
[0111] In some embodiments, the fourth electrical connector 60 of the capacitor is electrically connected to the packaging substrate 90.
[0112] like Figure 3 As shown, the fourth electrical connector 60 of the capacitor is electrically connected to the packaging substrate 90 of the packaging structure, so that the packaging substrate 90 and the capacitor 20 in the substrate 10 can be electrically connected through the fourth electrical connector 60, and the capacitor 20 in the substrate 10 of the capacitor can provide the packaging substrate 90 with functions such as power distribution network optimization, signal integrity protection and thermal management assistance.
[0113] In this embodiment, the fourth electrical connector 60 of the capacitor is electrically connected to the packaging substrate 90. The fourth electrical connector 60 realizes the electrical connection between the capacitor 20 and the packaging substrate 90, thereby facilitating the realization of the function of the capacitor 20 and improving the signal transmission and heat dissipation effect of the packaging substrate 90 through the function of the capacitor 20.
[0114] In one exemplary embodiment, an electronic device is provided, which includes at least one of the capacitor, packaging structure and circuit board assembly as described above. The electronic device may be, for example, a mobile phone, a tablet computer, a wristband, etc.
[0115] In this embodiment, since the electronic device includes capacitors, packaging structures, and circuit board assemblies, all of which have the advantages of balancing capacitance and increasing interconnection density, the electronic device has the same advantages.
[0116] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered illustrative only, and the true scope and spirit of this disclosure are indicated by the following claims.
[0117] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.
Claims
1. A capacitor device, characterized by, The capacitor includes: A substrate, the substrate including a first side and a second side that are opposite to each other; A capacitor, wherein the capacitor is disposed within the substrate; At least one first electrical connector is disposed on the first side; At least one second electrical connector is disposed on the second side; At least one third electrical connector, the third electrical connector extending through the substrate along the thickness direction of the substrate, the third electrical connector being used to electrically connect at least one first electrical connector and at least one second electrical connector.
2. The electrical capacitor device of claim 1, wherein, The capacitor further includes a fourth electrical connector, which is disposed on the first side and is electrically connected to the capacitor.
3. The electrical capacitor device of claim 1, wherein, The substrate includes a first surface located on the first side and a second surface located on the second side, wherein the distance between the capacitor and the first surface is less than the distance between the capacitor and the second surface.
4. The electrical capacitor device of claim 1, wherein, The first electrical connector includes a metal bump or a metal ball.
5. The electrical capacitor device of claim 1, wherein, The second electrical connector includes a metal bump or a metal ball.
6. The electrical capacitor device of claim 1, wherein, The third electrical connector includes a first connecting portion and a second connecting portion. The two ends of the first connecting portion are electrically connected to the first electrical connector and the second connecting portion, respectively. The end of the second connecting portion opposite to the first connecting portion is electrically connected to the second electrical connector. The projected area of the second connecting portion on the substrate is larger than the projected area of the first connecting portion on the substrate.
7. The electrical capacitor device of claim 6, wherein, The first connection portion includes a through-silicon via, and the second connection portion includes a metal pad.
8. The electrical capacitor device of any one of claims 1 to 7, wherein, The substrate includes a first surface located on the first side and a second surface located on the second side, with each of the first electrical connectors disposed on the first surface and each of the second electrical connectors disposed on the second surface.
9. The electrical capacitor device according to any one of claims 1 to 7, wherein, The first electrical connector is provided at intervals, and the second electrical connector is provided in a one-to-one correspondence with the first electrical connector.
10. The electrical capacitor device according to any one of claims 1 to 7, wherein, The substrate includes a first surface and a second surface that are opposite to each other, and the capacitor further includes a redistribution layer, which includes a third surface and a fourth surface that are opposite to each other, and the third surface is connected to the second surface. The first electrical connector is disposed on the first surface, the second electrical connector is disposed on the fourth surface, and the redistribution layer is used to electrically connect the second electrical connector and the third electrical connector.
11. The electrical capacitor device of claim 9, wherein, The number of the first electrical connector and the number of the second electrical connector are different.
12. The electrical capacitor device of any one of claims 1 to 7, wherein, The capacitors include deep trench capacitors.
13. A package structure, comprising: The packaging structure includes a capacitor as described in any one of claims 1 to 12, and the packaging structure further includes a stacked chip and a packaging substrate, the capacitor being disposed between the chip and the packaging substrate, the first electrical connector being electrically connected to the chip, and the second electrical connector being electrically connected to the packaging substrate.
14. The package structure of claim 13, wherein, The fourth electrical connector of the capacitor is electrically connected to the chip.
15. A circuit board assembly, characterized by The circuit board assembly includes a capacitor as described in any one of claims 1 to 12, the circuit board assembly further includes a package structure and a circuit board, the capacitor is disposed between the package structure and the circuit board, the first electrical connector is electrically connected to the package substrate of the package structure, and the second electrical connector is electrically connected to the circuit board.
16. The circuit board assembly of claim 15, wherein, The fourth electrical connector of the capacitor is electrically connected to the packaging substrate.
17. An electronic device, comprising: The electronic device includes a capacitor as described in any one of claims 1 to 12, or the electronic device includes a package structure as described in claim 13 or 14, or the electronic device includes a circuit board assembly as described in claim 15 or 16.