Chip printer

Abstract

The utility model discloses a chip printing machine relates to semiconductor chip technical field, wherein, chip printing machine is used for printing tin paste to chip board, and chip board has the step structure, and the step structure extends along the X axle direction, and sets the lands on the step structure, and chip printing machine includes: frame, steel net subassembly is located at the frame, and steel net subassembly has the boss that extends along the X axle direction, and is equipped with the through -hole in the boss, and the chip board is located at the below of steel net subassembly, and is closely contacted with steel net subassembly, makes the boss cooperate with the step structure, and the lands are set up with the through -hole correspondingly, scraper subassembly includes first drive structure and scraper shaft, and first drive structure drives scraper shaft and moves on the upper portion of steel net subassembly along the X axle direction, makes the tin paste on steel net subassembly extrude to the lands from the through -hole. The utility model provides technical scheme can apply the even pressure to tin paste, makes the printing thickness of tin paste consistent, improves the printing accuracy, satisfies the printing demand to the step shape chip board.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, and in particular to a chip printing machine. Background Technology

[0002] Semiconductor chip manufacturing is highly complex and precise, and the products often have stepped structures. Conventional printing presses, which are mainly used for front and back printing, are not suitable for this stepped chip shape, resulting in poor printing quality. For some semiconductor chips, which are highly complex and precise, some manufacturers use dispensing to produce them. However, dispensing can lead to uneven distribution of solder paste, affecting the electrical performance and connection reliability of the chip. In addition, dispensing efficiency is low, which limits the capacity increase of semiconductor chip manufacturing. Utility Model Content

[0003] The main purpose of this invention is to propose a chip printing machine that aims to solve the technical problem of the inconvenience of printing stepped chips.

[0004] To achieve the above objectives, the present invention proposes a chip printing machine for printing solder paste onto a chip board. The chip board has a stepped structure that extends along the X-axis, and at least one solder pad is provided on the stepped structure. The chip printing machine includes:

[0005] frame;

[0006] A stencil assembly is disposed on the frame. The stencil assembly has a boss extending along the X-axis direction, and at least one through hole is provided in the boss. The chip board is disposed below the stencil assembly and is in close contact with the stencil assembly, such that the boss mates with the stepped structure, and the pads are correspondingly arranged with respect to the through hole.

[0007] A scraper assembly is disposed on the frame. The scraper assembly includes a first drive structure and a scraper shaft. The first drive structure drives the scraper shaft to move along the X-axis direction on the upper part of the stencil assembly, so that the solder paste on the stencil assembly is squeezed from the through-hole to the pad.

[0008] In one embodiment, the chip printing machine further includes a carrier assembly, the carrier assembly comprising:

[0009] The conveying structure includes two conveyor belts arranged opposite to each other, the conveyor belts being rotatably mounted on the frame, and the conveyor belts being used to convey the chip board along the X-axis direction;

[0010] A support block is disposed between the two conveyor belts;

[0011] A lifting structure is driven and connected to the support block to drive the support block to rise so that the chip board is away from the conveyor belt, or to drive the support block to fall so that both ends of the chip board land on the conveyor belt.

[0012] In one embodiment, the chip printing machine further includes a calibration assembly, the calibration assembly comprising:

[0013] A CCD camera is positioned between the stencil assembly and the chip board, with its two ends capturing images of the through-hole and the pad, respectively.

[0014] A second drive structure is disposed on the frame. The second drive structure is connected to the CCD camera drive to drive the CCD camera to move between the steel mesh assembly and the support assembly, and to move the CCD camera along the X-axis direction.

[0015] In one embodiment, the chip printing machine further includes a position compensation component, which is disposed on the frame and drivenly connected to the carrier component to drive the carrier component to move on the frame, so that the pads on the chip board correspond one-to-one with the vias.

[0016] In one embodiment, the chip printing machine further includes a lifting assembly disposed on the frame. The lifting assembly is drivenly connected to the position compensation assembly to drive the carrying assembly to rise below the stencil assembly, so that the chip board is tightly attached to the bottom of the stencil assembly.

[0017] In one embodiment, the chip printing machine further includes a loading assembly disposed on one side of the frame, the loading assembly being used to transport the chip board and convey the chip board to the conveyor belt.

[0018] In one embodiment, the feeding assembly includes:

[0019] A support frame is provided on one side of the frame;

[0020] An adsorption module is slidably disposed on the support frame, and the adsorption module is used to adsorb the chip board;

[0021] The third driving structure is connected to the adsorption module to drive the adsorption module to move on the support frame, so that the adsorption module adsorbs the chip board and transports the chip board to the conveyor belt.

[0022] In one embodiment, the chip printing machine further includes a cleaning assembly, the cleaning assembly comprising:

[0023] Cleaning roller;

[0024] A fourth drive structure is provided on the frame and is connected to the cleaning roller drive. The fourth drive structure is used to drive the cleaning roller to move below the stencil assembly and cause the cleaning roller to move along the X-axis direction so that the cleaning roller cleans the solder paste on the side of the stencil assembly facing the chip board.

[0025] In one embodiment, the steel mesh assembly includes:

[0026] The outer casing has an opening;

[0027] The main body of the steel mesh is movably covered within the opening, and the protrusion is located on the side of the main body of the steel mesh facing the chip board;

[0028] An elastic element is disposed between the outer shell and the steel mesh body, and the elastic element is used to abut against the steel mesh body.

[0029] In one embodiment, a groove is provided on the side of the boss away from the chip board, and the through hole is provided in the groove.

[0030] In the technical solution of this utility model, the chip printing machine includes a frame, and a squeegee assembly and a stencil assembly mounted on the frame. The stencil assembly is used to press the chip board firmly, preventing the chip board from moving during the printing process and affecting accuracy. The chip board has a stepped structure extending along the X-axis, and the pads are set on the stepped structure. Correspondingly, a boss is provided on one side of the stencil assembly. The boss is adapted to the stepped structure so that the boss can better limit the stepped structure. Multiple through holes are provided in the boss. When the boss and the stepped structure are engaged, the through holes are correspondingly set with the pads on the chip board. The chip board has multiple pads, which are spaced apart along the X-axis. Correspondingly, the through holes are also provided. Multiple squeegee assemblies extend along the X-axis to allow solder paste to flow precisely from the through-holes to the solder joints for convenient subsequent soldering. The squeegee assembly includes a squeegee shaft and a first drive structure. The first drive structure drives the squeegee shaft to reciprocate along the X-axis on the side of the stencil assembly away from the chip board, that is, along the length of the stepped structure. The squeegee shaft discharges the solder paste from the stencil assembly through the through-holes onto the chip board below, completing the solder paste printing on the chip board. During the movement of the squeegee shaft, uniform pressure can be applied to the solder paste, resulting in a consistent solder paste printing thickness, improving printing accuracy, meeting the printing requirements of stepped chip boards, avoiding uneven solder paste distribution, and improving solder paste utilization. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the structure of an embodiment of the chip printing machine provided by this utility model;

[0033] Figure 2 This is a schematic diagram of the front view of the chip printing machine provided by this utility model;

[0034] Figure 3 A schematic diagram of the structure of the chip board provided by this utility model;

[0035] Figure 4 A schematic diagram of the steel mesh assembly provided by this utility model;

[0036] Figure 5 This is another structural schematic diagram of the steel mesh assembly provided by this utility model;

[0037] Figure 6 This is a schematic diagram of the cross-sectional structure of the steel mesh assembly provided by this utility model;

[0038] Figure 7 for Figure 6 A magnified view of a section at point A in the middle;

[0039] Figure 8 A schematic diagram of the second drive structure provided by this utility model;

[0040] Figure 9 A schematic diagram of the cleaning assembly provided by this utility model.

[0041] Explanation of icon numbers:

[0042] 10. Rack;

[0043] 20. Chip board; 201. Pad; 202. Stepped structure;

[0044] 30. Scraper assembly; 31. First drive structure; 32. Scraper shaft; 33. Lifting drive structure;

[0045] 40. Steel mesh assembly; 401. Through hole; 41. Fixing module; 42. Outer shell; 43. Steel mesh body; 44. Elastic element; 45. Spring piece; 46. Boss; 47. Groove;

[0046] 50. Correction component; 51. Second drive structure;

[0047] 60. Cleaning assembly; 61. Cleaning roller; 62. Fourth drive structure;

[0048] 70. Feeding assembly.

[0049] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0050] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0051] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0052] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0053] Semiconductor chip manufacturing is highly complex and precise, and the products often have stepped structures. Conventional printing presses, which are mainly used for front and back printing, are not suitable for this stepped chip shape, resulting in poor printing quality. For some semiconductor chips, which are highly complex and precise, some manufacturers use dispensing to produce them. However, dispensing can lead to uneven distribution of solder paste, affecting the electrical performance and connection reliability of the chip. In addition, dispensing efficiency is low, which limits the capacity increase of semiconductor chip manufacturing.

[0054] This utility model proposes a chip printing machine.

[0055] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the chip printing machine is used to print solder paste on a chip board 20. The chip board 20 has a stepped structure 202 that extends along the X-axis. At least one pad 201 is provided on the stepped structure 202. The chip printing machine includes a frame 10, a stencil assembly 40, and a squeegee assembly 30. The stencil assembly 40 is disposed on the frame 10 and has a boss 46 extending along the X-axis. At least one through hole 401 is provided in the boss 46. The plate 20 is located below the stencil assembly 40 and is in close contact with the stencil assembly 40, so that the boss 46 cooperates with the step structure 202, and the solder pad 201 is correspondingly arranged with the through hole 401; the scraper assembly 30 is located on the frame 10, and the scraper assembly 30 includes a first drive structure 31 and a scraper shaft 32. The first drive structure 31 drives the scraper shaft 32 to move along the X-axis direction on the upper part of the stencil assembly 40, so that the solder paste on the stencil assembly 40 is squeezed from the through hole 401 to the solder pad 201.

[0056] In the technical solution of this utility model, the chip printing machine includes a frame 10, and a squeegee assembly 30 and a stencil assembly 40 disposed on the frame 10. The stencil assembly 40 is used to press the chip board 20 to prevent the chip board 20 from moving during the printing process and affecting accuracy. The chip board 20 has a stepped structure 202 extending along the X-axis, and the pads 201 are disposed on the stepped structure 202. Correspondingly, a boss 46 is provided on one side of the stencil assembly 40. The boss 46 is adapted to the stepped structure 202 so that the boss 46 can better limit the stepped structure 202. Multiple through holes 401 are provided in the boss 46. When the boss 46 is engaged with the stepped structure 202, the through holes 401 are correspondingly disposed with the pads 201 on the chip board 20. The chip board 20 is provided with multiple pads 201, which are spaced apart along the X-axis. Correspondingly, multiple through-holes 401 are also provided, spaced apart along the X-axis, so that solder paste can flow precisely from the through-holes 401 to the pads 201 for convenient subsequent soldering. The squeegee assembly 30 includes a squeegee shaft 32 and a first drive structure 31. The first drive structure 31 drives the squeegee shaft 32 to reciprocate along the X-axis on the side of the stencil assembly 40 away from the chip board 20, that is, along the length of the stepped structure 202. The squeegee shaft 32 prints the solder paste on the stencil assembly 40 through the through-holes 401 onto the chip board 20 below, completing the solder paste printing on the chip board 20. During the movement of the squeegee shaft 32, uniform pressure can be applied to the solder paste, making the solder paste printing thickness consistent, improving printing accuracy, meeting the printing requirements of the stepped chip board 20, avoiding uneven solder paste, and improving the utilization rate of solder paste.

[0057] Specifically, the frame 10 has a printing worktable to support the chip board 20. The stencil assembly 40 is fixedly mounted on the worktable via a fixing module 41 and is located above the chip board 20. The fixing module 41 can be, but is not limited to, a cylinder or similar structure. The stencil assembly 40 has multiple through holes 401, each corresponding to a solder pad 201 on the chip board 20, allowing solder paste to be applied onto the solder pads 201 of the chip board 20. Figure 3 As shown, the chip board 20 has a stepped structure 202 extending along the X-axis. The stepped structure 202 forms a deep groove on the chip board 20 for mounting components of a certain height. A boss 46 protrudes from the side of the stencil assembly 40 facing the chip board 20. The boss 46 extends along the X-axis. When the chip board 20 needs to be printed, the chip board 20 is in close contact with the stencil assembly 40, that is, the boss 46 is set in the deep groove formed by the stepped structure 202 so that the through hole 401 on the boss 46 can correspond exactly to the pad 201, improving the soldering accuracy.

[0058] The squeegee assembly 30 includes a squeegee shaft 32 and a first drive structure 31. The squeegee shaft 32 is parallel to the surface of the stencil assembly 40 to ensure uniform force application. The squeegee shaft 32 moves reciprocally above the stencil assembly 40 along the X-axis to evenly transfer solder paste from the stencil assembly 40 onto the pads 201. The squeegee shaft 32 can be made of stainless steel or polyurethane, etc., without limitation. The shape of the squeegee shaft 32 can be rectangular or semi-circular, without limitation. The length and width of the squeegee shaft 32 are also not limited; a suitable size can be selected based on actual printing requirements. The first drive structure 31 can be driven by a power source such as a motor. The motor drives the squeegee shaft 32 to move reciprocally along the X-axis on the stencil assembly 40 via a belt or gear structure to complete the printing of solder paste on the chip board 20. When the squeegee shaft 32 moves on the stencil assembly 40, it can adjust the squeegee... The squeegee shaft 32 applies a certain pressure to scrape solder paste from one side to the other. The gap between the squeegee shaft 32 and the stencil assembly 40 is related to the amount of solder paste printed. If the gap is small, the amount of solder paste printed will be reduced; if the gap is large, the amount of solder paste printed will be increased accordingly. During the printing process, the gap between the squeegee shaft 32 and the stencil assembly 40 needs to be adjusted as required to better print on the chip board 20. The squeegee assembly 30 also includes a lifting drive structure 33, which is driven by the first drive structure 31 to drive the first drive structure 31 and the squeegee shaft 32 to rise and fall, adjusting the gap between the squeegee shaft 32 and the stencil assembly 40 so that after the stencil assembly 40 contacts the chip board 20, it descends to press the squeegee shaft 32 against the stencil assembly 40, making it easier to scrape the solder paste when the first drive structure 31 drives the squeegee shaft 32 to move along the X-axis. In one embodiment, the squeegee assembly 30 further includes a translation drive structure (not shown), which is driven to move the lifting drive structure 33 along the Y-axis direction, thereby driving the first drive structure 31 and the squeegee shaft 32 to move along the Y-axis direction. Before solder paste printing, the translation drive structure drives the lifting structure 33, the first drive structure 31, and the squeegee shaft 32 to move along the Y-axis direction, so that the squeegee shaft 32 moves directly above the boss 46 of the stencil assembly 40 to adjust the position of the squeegee shaft 32. When solder paste needs to be printed, the lifting drive structure 33 drives the squeegee shaft 32 to descend, so that the squeegee shaft 32 is close to the stencil assembly 40. Then, the first drive structure 31 drives the squeegee shaft 32 to move along the X-axis direction to print the solder paste. The first drive structure 31, the translation drive structure, and the lifting drive structure 33 enable the squeegee shaft 32 to move along the X-axis direction, the Y-axis direction, and the vertical direction.

[0059] In embodiments of this utility model, such as Figure 1 As shown, the chip printing machine also includes a carrier assembly (not shown), which includes:

[0060] The conveying structure includes two conveyor belts arranged opposite to each other. The conveyor belts are rotatably mounted on the frame 10 and are used to convey the chip board 20 along the X-axis direction.

[0061] A support block is located between the two conveyor belts;

[0062] The lifting structure is connected to the support block drive to drive the support block to rise so that the chip board 20 is away from the conveyor belt, or to drive the support block to fall so that both ends of the chip board 20 fall on the conveyor belt.

[0063] Specifically, a support assembly is provided on the workbench to support the chip board 20 transported from the previous process. The support assembly includes a conveyor structure, a support block, and a lifting structure. The conveyor structure includes a conveyor belt and a motor that drives the conveyor belt to rotate. The motor drives the conveyor belt to move via a synchronous pulley. A support block is provided between the two conveyor belts. The bottom of the support block is driven to rise and fall by a lifting structure. The lifting structure can be a linear structure such as a cylinder or an electric telescopic rod; there are no restrictions here. The two sides of the chip board 20 are placed on the two conveyor belts and move with the conveyor belts. The rotation causes the chip board 20 to move along the X-axis until it reaches below the stencil assembly 40. At this time, the lifting structure drives the support block to rise, and the support block lifts the chip board 20, so that the chip board 20 is away from the conveyor belt. That is, the continuous rotation of the conveyor belt will not affect the position of the chip board 20. The support block lifts the chip board 20, so that the chip board 20 contacts the bottom of the stencil assembly 40, that is, the through hole 401 contacts the pad 201. This makes it easier for the scraper shaft 32 to spray solder paste from the through hole 401 onto the pad 201 when it moves back and forth above the stencil assembly 40, reducing solder paste waste.

[0064] The two ends of the conveyor belt are defined as the first end and the second end, respectively. The chip board 20 is placed on the conveyor belt from the first end. As the conveyor belt rotates, the chip board 20 moves along the X-axis until it reaches below the stencil assembly 40, where it waits for the support block to lift and print. After printing, the lifting structure drives the support block to descend, and the two sides of the chip board 20 fall onto the conveyor belts on both sides. As the conveyor belt rotates, the chip board 20 continues to move along the X-axis until it reaches the second end, completing the unloading process. The process is continuous, and the two sides of the conveyor belt that contact the chip board 20 are minimized to complete the feeding and unloading of the chip board 20.

[0065] It should be noted that the length of the support block along the X-axis is consistent with the length of the total pad 201 along the X-axis on the chip board 20, which can improve the stability of the support block supporting the chip board 20.

[0066] Optionally, in one embodiment, the carrier assembly includes a carrier frame, a conveyor belt and a synchronous wheel mounted on the carrier frame, two carrier frames arranged opposite each other, a support block disposed between the two carrier frames, and a limiting block disposed above each of the two carrier frames. The limiting blocks can be screwed to the carrier frame. The distance between the two limiting blocks facing each other is consistent with the width of the chip board 20. That is, when the lifting structure drives the support block to rise, the chip board 20 moves away from the conveyor belt, and its two sides abut against the limiting blocks. When in contact with the stencil assembly 40, it can prevent the chip board 20 from shifting horizontally, so that the pads 201 on the chip board 20 can correspond exactly to the through holes 401 on the stencil assembly 40, thereby improving the printing accuracy and efficiency.

[0067] In embodiments of this utility model, such as Figure 1 and Figure 8 As shown, the chip printing machine also includes a calibration assembly 50, which includes:

[0068] A CCD camera is positioned between the stencil assembly 40 and the chip board 20. The two ends of the CCD camera capture images of the through hole 401 and the pad 201, respectively.

[0069] The second drive structure 51 is located on the frame 10. The second drive structure 51 is connected to the CCD camera drive to drive the CCD camera to move between the steel mesh assembly 40 and the support assembly, and to make the CCD camera move along the X-axis.

[0070] Specifically, the calibration component 50 includes a CCD camera and a second driving structure 51. When the conveyor belt drives the chip board 20 to the bottom of the stencil assembly 40, the second driving structure 51 includes a lead screw module and a translation module. The lead screw module drives the CCD camera, and the translation module drives the lead screw module, thereby driving the lead screw module and the CCD camera to move along the Y-axis, so that the CCD camera moves between the stencil assembly 40 and the support block. The lead screw module drives the CCD camera to move along the X-axis between the stencil assembly 40 and the support block, so that the CCD camera performs position detection on the through hole 401 and the pad 201 in the X-axis direction. The CCD camera is a bidirectional camera. Through the cooperation of the lead screw module and the translation module, the CCD... The camera can move along the X and Y axes, covering the entire printing area to comprehensively inspect the chip board 20 and stencil assembly 40 at different locations. Compared to a one-way camera, it can acquire richer and larger-area image information. The CCD camera captures images of the chip board 20 and stencil assembly 40 in real time, transmitting the images to a computer for analysis and processing by vision software. The software calculates the deviation between the via 401 and the pad 201 and adjusts the position of the chip board 20 based on the calculated deviation to ensure precise alignment of the pad 201 and the via 401, improving the quality of solder paste printing and reducing solder paste misalignment, missing prints, or misaligned prints.

[0071] It should be noted that before the CCD camera detects the chip board 20, the support block needs to lift the chip board 20 away from the conveyor belt to prevent the chip board 20 from being directly discharged as the conveyor belt moves. After the position is corrected, the support block will continue to lift the chip board 20 to bring it closer to the stencil assembly 40.

[0072] In an embodiment of this utility model, the chip printing machine further includes a position compensation component, which is disposed on the frame 10 and drivenly connected to the support component to drive the support component to move on the frame 10, so that the pads 201 on the chip board 20 correspond one-to-one with the through holes 401.

[0073] Specifically, the calibration component 50 and the position compensation component are respectively connected to a computer. The calibration component 50 sends the captured image information to the computer. The computer's vision software analyzes and processes the image to obtain the positional deviation between the via 401 and the pad 201. The position compensation component adjusts the position of the carrier component so that the pad 201 on the chip board 20 corresponds to the via 401. After adjustment, the calibration component 50 performs a second inspection. If there is still a positional deviation, the calibration continues until the pad 201 and the via 401 are completely one-to-one. The position compensation component is connected to the carrier component via a drive connection. The drive-bearing component is rotated and adjusted in the X, Y, and θ directions to correct the positional deviation between the pads 201 and the through-holes 401 of the chip board 20, ensuring printing accuracy. Specifically, the position compensation component can use a motor and lead screw or guide rail to drive the carrier component to translate in the X and Y directions, and rotate it through a rotary cylinder to achieve precise alignment, ensuring that the solder paste is accurately printed onto the pads 201, reducing printing defects, improving soldering quality, and driving the movement through a structure such as a motor, which makes the entire structure highly automated and precise, greatly reducing errors and improving efficiency.

[0074] In an embodiment of this utility model, the chip printing machine further includes a lifting assembly, which is disposed on the frame 10. The lifting assembly is driven to be connected to the position compensation assembly to drive the bearing assembly to rise below the stencil assembly 40, so that the chip board 20 is tightly attached to the bottom of the stencil assembly 40.

[0075] Specifically, the lifting assembly can employ, but is not limited to, structures such as cylinders, hydraulic cylinders, and electric telescopic cylinders. The lifting assembly drives the position compensation assembly, causing the entire supporting assembly to rise. This can be understood as follows: a conveyor belt transports the chip board 20 to below the stencil assembly 40, and then the lifting structure drives the support block upwards, causing the support block to lift the chip board 20, moving it away from the conveyor belt. Limiting blocks abut the sides of the chip board 20 to prevent positional shift. The CCD camera moves between the support block and the stencil assembly 40 to detect the position of the pads 201 and the through-holes 401. After detection, the position compensation assembly adjusts the position of the entire supporting assembly so that the pads 201 and through-holes 401 correspond. At this point, the lifting assembly drives the supporting assembly to rise, causing the chip board 20 to contact the bottom of the stencil assembly 40 for precise printing. Furthermore, by using the lifting assembly to move the entire supporting assembly up and down, the chip board 20 is brought closer to the stencil assembly 40. Compared to using the support block to drive the chip board 20 closer to the stencil assembly 40, this avoids the limiting blocks affecting the movement of the CCD camera during position correction, thus preventing interference with the correction process.

[0076] In an embodiment of this utility model, the chip printing machine further includes a loading assembly 70, which is located on one side of the frame 10. The loading assembly 70 is used to transport the chip board 20 and convey the chip board 20 to the conveyor belt. The loading assembly 70 can use a combination of a robotic arm and a gripper. The robotic arm drives the gripper to pick up the chip board 20 and place it on the conveyor belt, so that the chip board 20 is transported along the X-axis direction, reducing manual intervention and improving the efficiency and accuracy of handling.

[0077] Optionally, such as Figure 1 and Figure 2 As shown, in one embodiment, the feeding assembly 70 includes a support frame, an adsorption module, and a third driving structure. The support frame is disposed on one side of the frame 10; the adsorption module is slidably disposed on the support frame and is used to adsorb the chip board 20; the third driving structure is drivenly connected to the adsorption module to drive the adsorption module to move on the support frame, so that the adsorption module adsorbs the chip board 20 and transports the chip board 20 to the conveyor belt. The chip boards 20 are transported from the previous processes and are stacked. The adsorption module approaches the chip board 20 and adsorbs the topmost chip board 20. The adsorption module is driven by the third driving structure to approach the conveyor belt. When it reaches above the conveyor belt, the adsorption module is lowered. The chip board 20 and the adsorption module include a vacuum suction cup and an adsorption plate. The vacuum suction cup adsorbs the chip board 20 through negative pressure, and the adsorption plate provides stable support and positioning for the chip board 20, ensuring that the chip board 20 will not shift during movement. The third drive structure can adopt a motor and a transmission structure. The transmission structure can adopt, but is not limited to, a lead screw, a guide rail, or a belt. These drive methods are all conventional and will not be described in detail here. The whole process reduces manual intervention, improves production efficiency and consistency, and the feeding process is stable. The feeding component 70 works in conjunction with the bearing component, the correction component 50, and the position compensation component to form a fully automated production line, improving printing efficiency.

[0078] In embodiments of this utility model, such as Figure 9 As shown, the chip printer also includes a cleaning assembly 60, which includes a fourth drive structure 62 and a cleaning roller 61. The fourth drive structure 62 is located on the frame 10 and is drivenly connected to the cleaning roller 61. The fourth drive structure 62 is used to drive the cleaning roller 61 to move below the stencil assembly 40 and to move the cleaning roller 61 along the X-axis so that the cleaning roller 61 cleans the solder paste on the side of the stencil assembly 40 facing the chip board 20.

[0079] Specifically, the cleaning roller 61 can be made of foam, felt, or a cleaning sponge. The cleaning roller 61 is driven to rotate by the fourth drive structure 62, which can be a motor and gears. This ensures that the cleaning roller 61 can rotate at a suitable speed and pressure at the bottom of the stencil assembly 40 to contact the surface of the stencil assembly 40. When rolling along the bottom of the stencil assembly 40, it can effectively remove solder paste residue from the bottom of the stencil assembly 40 and avoid scratching the bottom of the stencil assembly 40. In addition, a suitable cleaning agent can be sprayed on the outside of the cleaning roller 61 to ensure the cleaning effect, extend the service life of the stencil assembly 40, ensure that the stencil assembly 40 is clean before each printing, and improve printing quality and consistency.

[0080] In an embodiment of this utility model, the steel mesh assembly 40 includes a housing 42, a steel mesh body 43, and an elastic member 44. The housing 42 has an opening, and the steel mesh body 43 is movably covered in the opening. A boss 46 is provided on the side of the steel mesh body 43 facing the chip board 20. The elastic member 44 is provided between the housing 42 and the steel mesh body 43, and the elastic member 44 is used to abut against the steel mesh body 43.

[0081] Please refer to Figure 4 and Figure 5 The outer shell 42 provides support for the stencil body 43. The outer shell 42 has a plate-like structure, with an opening formed by a hollowed-out central part. The stencil body 43 is used to hold solder paste. A boss 46 is located on the side of the stencil body 43 near the chip board 20, and a through hole 401 is located on the boss 46 to engage with the deep groove formed by the stepped structure 202 on the chip board 20. The scraper shaft 32 moves from the side of the stencil body 43 away from the chip board 20 to squeeze the solder paste through the through hole 401 onto the pad 201. The thickness of the printed solder paste is consistent with the depth of the through hole 401. An elastic element 44 provides movement space for the stencil body 43. The elastic element 44 is located on the stencil body 43 facing the opening. One end of the stencil is fixed to the outer shell 42, and the other end abuts against the stencil body 43. The size of the stencil body 43 is larger than the size of the opening so that the stencil body 43 can completely cover the opening while also abutting against the elastic element 44. Since the elastic element 44 has the ability to deform elastically, when the stencil body 43 comes into contact with the chip board 20, it will squeeze the elastic element 44, causing the elastic element 44 to deform. This facilitates the movement of the stencil body 43 relative to the outer shell 42 in the vertical direction. The elastic element 44 gives the stencil body 43 the opposite force, ensuring the stability of the stencil body 43 and making the stencil body 43 completely adhere to the chip board 20, ensuring the consistency of the printed solder paste thickness and improving the printing quality.

[0082] Optionally, such as Figure 6 and Figure 7As shown, in one embodiment, the steel mesh body 43 and the outer shell 42 are connected by a spring piece 45. The two ends of the spring piece 45 are provided with connection holes, and the bottom of the steel mesh body 43 and the outer shell 42 are respectively provided with assembly holes. Screws / rivets are provided to pass through the connection holes and the assembly holes in sequence to fix the two ends of the spring piece 45 to the steel mesh body 43 and the outer shell 42 respectively. The setting of the spring piece 45 ensures the consistency of the position of the steel mesh body 43 and the outer shell 42, and also allows the steel mesh body 43 to move in the vertical direction relative to the outer shell 42 when the elastic member 44 is compressed, so as to ensure the realization of the tension of the steel mesh structure.

[0083] In embodiments of this utility model, such as Figure 4 and Figure 6 As shown, a groove 47 is provided on the side of the boss 46 away from the chip board 20. A through hole 401 is provided in the groove 47. The extension direction of the groove 47 is the X-axis direction. Solder paste is placed in the groove 47. The squeegee shaft 32 is provided with a protrusion. The width of the protrusion is the same as the width of the groove 47. At least one protrusion is provided. The number of protrusions is the same as the number of grooves 47. The distance between adjacent protrusions is the same as the distance between adjacent grooves 47. When the first driving structure 31 drives the squeegee shaft 32 to move above the stencil body 43, the protrusion corresponds to the groove 47. The squeegee shaft 32 moves along the X-axis direction. The protrusion moves in the groove 47, so that the solder paste can be accurately printed in the through hole 401 to the solder pad 201 below. It is also convenient to accurately control the thickness of the printed solder paste, realize uniform printing of solder paste, and improve printing quality. Since the solder paste is in the groove 47, when the squeegee shaft 32 is moved, the solder paste can also be prevented from being pressed to other positions, reducing the waste of solder paste.

[0084] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A chip printing machine for printing solder paste onto a chip board, characterized in that, The chip board has a stepped structure extending along the X-axis, and at least one pad is provided on the stepped structure. The chip printing machine includes: frame; A stencil assembly is disposed on the frame. The stencil assembly has a boss extending along the X-axis direction, and at least one through hole is provided in the boss. The chip board is disposed below the stencil assembly and is in close contact with the stencil assembly, such that the boss mates with the stepped structure, and the pads are correspondingly arranged with respect to the through hole. A scraper assembly is disposed on the frame. The scraper assembly includes a first drive structure and a scraper shaft. The first drive structure drives the scraper shaft to move along the X-axis direction on the upper part of the stencil assembly, so that the solder paste on the stencil assembly is squeezed from the through-hole to the pad.

2. The chip printing machine as described in claim 1, characterized in that, The chip printing machine further includes a carrier assembly, which comprises: The conveying structure includes two conveyor belts arranged opposite to each other, the conveyor belts being rotatably mounted on the frame, and the conveyor belts being used to convey the chip board along the X-axis direction; A support block is disposed between the two conveyor belts; A lifting structure is driven and connected to the support block to drive the support block to rise so that the chip board is away from the conveyor belt, or to drive the support block to fall so that both ends of the chip board land on the conveyor belt.

3. The chip printing machine as described in claim 2, characterized in that, The chip printing machine also includes a calibration component, which comprises: A CCD camera is positioned between the stencil assembly and the chip board, with its two ends capturing images of the through-hole and the pad, respectively. A second drive structure is disposed on the frame. The second drive structure is connected to the CCD camera drive to drive the CCD camera to move between the steel mesh assembly and the support assembly, and to move the CCD camera along the X-axis direction.

4. The chip printing machine as described in claim 3, characterized in that, The chip printing machine also includes a position compensation component, which is disposed on the frame and drivenly connected to the carrier component to drive the carrier component to move on the frame, so that the pads on the chip board correspond one-to-one with the through holes.

5. The chip printing machine as described in claim 4, characterized in that, The chip printing machine also includes a lifting assembly, which is located on the frame and is driven to be connected to the position compensation assembly to drive the bearing assembly to rise below the stencil assembly, so that the chip board is in close contact with the bottom of the stencil assembly.

6. The chip printing machine as described in claim 2, characterized in that, The chip printing machine also includes a feeding assembly located on one side of the frame. The feeding assembly is used to transport the chip board and convey the chip board to the conveyor belt.

7. The chip printing machine as described in claim 6, characterized in that, The feeding assembly includes: A support frame is provided on one side of the frame; An adsorption module is slidably disposed on the support frame, and the adsorption module is used to adsorb the chip board; The third driving structure is connected to the adsorption module to drive the adsorption module to move on the support frame, so that the adsorption module adsorbs the chip board and transports the chip board to the conveyor belt.

8. The chip printing machine as described in claim 1, characterized in that, The chip printing machine further includes a cleaning assembly, which comprises: Cleaning roller; A fourth drive structure is provided on the frame and is connected to the cleaning roller drive. The fourth drive structure is used to drive the cleaning roller to move below the stencil assembly and cause the cleaning roller to move along the X-axis direction so that the cleaning roller cleans the solder paste on the side of the stencil assembly facing the chip board.

9. The chip printing machine as described in claim 1, characterized in that, The steel mesh assembly includes: The outer casing has an opening; The main body of the steel mesh is movably covered within the opening, and the protrusion is located on the side of the main body of the steel mesh facing the chip board; An elastic element is disposed between the outer shell and the steel mesh body, and the elastic element is used to abut against the steel mesh body.

10. The chip printing machine as described in claim 9, characterized in that, The boss has a groove on the side away from the chip board, and the through hole is located in the groove.

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