Blister pack

Abstract

The utility model relates to a blister box belongs to circuit board manufacturing field. A kind of blister box, comprising: multiple blister box bodies, multiple blister box bodies can be stacked arrangement;Blister box body one side is equipped with multiple mounting slots, and the other side of blister box body is equipped with staggered space;One blister box body can be stacked on another blister box body in first direction and second direction;The multiple mounting slots of adjacent blister box body are oppositely arranged when one blister box body is stacked on another blister box body in first direction;The multiple mounting slots of one blister box body are oppositely arranged with the part of staggered space of another blister box body respectively when one blister box body is stacked on another blister box body in second direction.The blister box of the application utilizes staggered space, after upper blister box is rotated 180 degrees, the higher device in product in multiple mounting slots in lower layer can be just placed in the staggered space of upper blister box.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing, and in particular to a blister box. Background Technology

[0002] In the existing technology field, blister packs generally face the problems of low space utilization efficiency and insufficient versatility. Due to the significant differences in height among various components on circuit boards (such as capacitors, chips, heat sinks, etc.), traditional blister packs, in order to ensure that all circuit board components can be stacked safely, usually require the placement slots to be uniformly designed to accommodate the depth of the tallest component on the circuit board. While this "one-size-fits-all" compatibility mode can meet basic protection requirements, it results in serious resource waste—when used to store circuit boards containing small-sized components, a large amount of space in the placement slots remains idle, leading to limited single-load capacity and redundant packaging volume. Utility Model Content

[0003] Therefore, it is necessary to provide a blister box to address the problem of unreasonable structural design.

[0004] A blister pack includes: a plurality of blister pack bodies, which are stackable; each blister pack body has a plurality of mounting slots on one side and a misalignment space on the other side; one blister pack body can be stacked on top of another blister pack body in a first direction and a second direction; when one blister pack body is stacked on top of another blister pack body in the first direction, the mounting slots of adjacent blister pack bodies are arranged opposite each other; when one blister pack body is stacked on top of another blister pack body in the second direction, the mounting slots of one blister pack body are respectively arranged opposite to portions of the misalignment space of the other blister pack body.

[0005] The above-disclosed blister pack effectively solves the problem of low space utilization in traditional packaging through the ingenious design of multiple blister pack stacks, mounting slots, and staggered spaces. Multiple blister packs can be stacked to meet the needs of bulk transportation and storage; the mounting slots and staggered spaces on both sides of the blister packs provide a basis for stacking in different directions. When the blister packs are stacked in the first direction, the mounting slots of adjacent blister packs face each other, suitable for loading products with relatively uniform heights, forming a neat stack that facilitates quick access and automated operation. When stacked in the second direction, the mounting slots and staggered spaces partially face each other, accommodating taller components in the mounting slots of the lower blister packs. The staggered spaces avoid height differences, preventing stacking interference caused by different component heights. This bidirectional stacking design allows the blister pack to efficiently stack products of uniform specifications while also accommodating flexible stacking of products with varying heights, significantly improving space utilization, reducing packaging gaps caused by different product heights, and lowering packaging volume and transportation costs. Meanwhile, the diverse stacking methods enhance the versatility of blister boxes, reduce the need for developing packaging of different specifications, and significantly improve packaging efficiency and management convenience in actual production, warehousing, and logistics.

[0006] In one embodiment, when the blister pack is stacked on top of another blister pack in the second direction, the mounting groove partially cooperates with the misaligned space to form a receiving space, which is used to adapt to the circuit board assembly. By utilizing the partial cooperation between the mounting groove and the misaligned space to form a receiving space, a highly adaptable and flexible placement solution is provided for the circuit board. This design breaks the limitation of the single fixed space of the traditional blister pack. Through the misaligned combination of the upper and lower layers, it can accurately match the staggered layout of components on the circuit board. Specifically, for components on the circuit board whose height exceeds the mounting groove, they can be embedded in the misaligned space of the upper blister pack during stacking, so that the protruding parts that might otherwise cause stacking interference can be properly placed; while the mounting groove firmly supports the main body of the circuit board. The receiving space formed by the two together can not only ensure the horizontal positioning of the circuit board, but also provide vertical limiting protection to avoid collision damage caused by shaking during transportation. Furthermore, the variability of the storage space significantly enhances the versatility of the blister packs. There is no need to customize packaging for circuit boards of different heights; the same structure can accommodate a variety of products, reducing mold development costs. In warehousing and transportation, this close-fitting stacking method greatly reduces the packaging volume. The stacked blister packs form a compact and stable whole, effectively reducing logistics costs. At the same time, it enhances the convenience of operating automated equipment. The robotic arm can quickly complete gripping and placement based on the unified spatial structure, improving packaging efficiency and production flexibility.

[0007] In one embodiment, the blister pack includes a chassis assembly; a first mounting member disposed on the chassis assembly and having a first mounting slot; a second mounting member disposed on the chassis assembly and having a second mounting slot; a third mounting member disposed on the chassis assembly and having a third mounting slot, the chassis assembly, the first mounting member, the second mounting member, and the third mounting member cooperating to form a misaligned space; and a circuit board assembly placed in the first mounting slot and / or the second mounting slot and / or the third mounting slot, the misaligned space being used to accommodate portions of the stacked blister packs where the horizontal height of the circuit board assembly is greater than the horizontal height of the first mounting slot, the second mounting slot, and the third mounting slot.

[0008] By using a chassis assembly, a first mounting component, a second mounting component, and a third mounting component to create a staggered space, this design effectively solves the space waste problem caused by the different heights of components on the circuit board in traditional blister packs. In existing technologies, traditional blister packs are designed to accommodate the tallest components on the circuit board, requiring the mounting slots to be designed to the corresponding height. This results in wasted space for smaller components and reduced blister pack versatility. This structure utilizes the staggered space. During packaging, the lower blister pack is first packed. After the upper blister pack is rotated 180 degrees, the taller components among the products placed in the first, second, and third mounting slots of the lower blister pack can be precisely placed within the gaps in the mounting compartments of the upper blister pack, i.e., in the staggered space. This design eliminates the need for uniformly fitting the tallest components to the mounting slots. Instead, the staggered stacking of the upper and lower blister packs allows components of different heights to utilize the mounting slots and the staggered space, satisfying the placement needs of components of different heights while avoiding the space wastage caused by a single-height design, thus greatly improving space utilization. Meanwhile, there is no need to design separate blister boxes for devices of different heights, which improves the versatility of blister boxes, reduces mold development costs and production complexity, and ensures stable placement of circuit boards during circuit board packaging and transportation. It also reduces packaging volume and transportation costs through compact stacking, demonstrating significant practicality and economy.

[0009] In one embodiment, the misalignment space includes a first misalignment space, a second misalignment space, and a third misalignment space. There are multiple first mounting components and multiple second mounting components. The first misalignment space is formed by the long sides of the multiple first mounting components and the short sides of the multiple second mounting components. Similarly, there are multiple third mounting components. The second misalignment space is formed by the short sides of the multiple second mounting components and the short sides of the multiple third mounting components. The long sides of two adjacent third misalignment spaces are combined to form the third misalignment space. By dividing the misalignment space into a first misalignment space, a second misalignment space, and a third misalignment space, and through the combination of the edge structures of multiple first, second, and third mounting components, a multi-layered and diverse gap space is constructed, precisely adapting to the stacking requirements of devices of different heights and shapes in the circuit board assembly. The system comprises several components: the long sides of multiple first mounting components combine with the short sides of multiple second mounting components to form a first misaligned space, which can accommodate taller components of the circuit board placed in the third mounting slot; the short sides of multiple second mounting components cooperate with the short sides of the third mounting components to form a second misaligned space, which is used for taller components of the circuit board placed in the second mounting slot; and the long sides of two adjacent third misaligned spaces meet to form a third misaligned space, which is used for taller components of the circuit board placed in the first mounting slot. When the upper and lower blister packs are rotated 180 degrees and stacked, the circuit board components in different mounting slots can be embedded into their corresponding misaligned spaces, avoiding vertical height interference and achieving a three-dimensional misaligned layout in both the planar and vertical directions. This solves the space waste problem caused by the uniform adaptation of tall components in traditional blister packs, and significantly improves packaging density, reduces transportation costs, and optimizes overall packaging efficiency through structured gap design.

[0010] In one embodiment, the cross-sectional area of ​​the third misaligned space is larger than that of the first and second misaligned spaces. By designing the cross-sectional area of ​​the third misaligned space to be larger than that of the first and second misaligned spaces, space utilization efficiency and compatibility can be further improved based on the differentiated requirements of device height and shape in the circuit board assembly. In practical applications, some large and tall devices on the circuit board, such as heat sinks and large-capacity capacitors, often require more space for stacking and avoidance; while the first and second misaligned spaces are mainly suitable for medium-sized devices with medium thickness. By increasing the cross-sectional area of ​​the third misaligned space, sufficient embedding space can be reserved specifically for these large and tall special devices on the circuit board. When the upper and lower blister packs are rotated 180 degrees and stacked, the thicker devices in the lower blister pack can be smoothly embedded into the third misaligned space of the upper layer, avoiding stacking interference caused by insufficient space. Meanwhile, this differentiated spatial design forms a multi-layered containment system from small to large, enabling the blister box to meet the compact placement of small components while also accommodating the storage needs of large components. It maximizes the use of the internal space of the blister box, reduces packaging gaps, and increases packaging density while ensuring that circuit board assemblies of different specifications can be stably stacked and transported in the blister box, reducing transportation costs and losses caused by unreasonable space.

[0011] In one embodiment, the openings of the first, second, and third mounting slots face the same direction. By designing the openings of the first, second, and third mounting slots to face the same direction, a unified opening orientation facilitates standardized operation of automated production line equipment during actual production and packaging. Robotic arms or workers can use consistent gripping and placing actions to quickly and accurately place circuit board assemblies into their corresponding mounting slots, reducing operational errors and time waste caused by inconsistent opening orientations, and significantly improving assembly efficiency. Simultaneously, it ensures that misaligned spaces can be precisely aligned during stacking, allowing taller components in the circuit board assembly to be reliably embedded in their corresponding misaligned spaces, avoiding stacking misalignment or interference caused by inconsistent opening orientations.

[0012] In one embodiment, the first, second, and third misaligned spaces are oriented in the same direction. By ensuring that the first, second, and third misaligned spaces are all oriented in the same direction, the stacking and usability performance of the blister packs can be systematically optimized. In a stacking scenario, the uniform orientation ensures that when the upper and lower blister packs are rotated 180 degrees and stacked, the misaligned spaces can precisely correspond and seamlessly connect. This allows components of different heights in the circuit board assembly to be stably embedded within their respective misaligned spaces, avoiding embedding deviations or interference problems caused by inconsistent spatial misalignment directions, thereby improving the compactness and stability of the stack.

[0013] In one embodiment, the openings of the first, second, and third placement slots face opposite directions to the first, second, and third misaligned spaces. Utilizing this structure, during actual stacking, when the upper and lower blister packs are rotated 180 degrees, the taller components of the circuit board in the placement slot of the lower blister pack can precisely embed into the misaligned space of the upper blister pack. Because the orientations are opposite, the taller components fall accurately into the corresponding gap area, avoiding collisions or failure to embed due to inconsistent orientations. This design not only fully utilizes the internal space of the blister packs but also ensures the stability of the circuit board assembly during transportation and storage, preventing damage to components due to shaking.

[0014] In one embodiment, the misalignment space further includes a fourth misalignment space and a fifth misalignment space. The fourth misalignment space is formed by the cooperation of the short sides of two adjacent first mounting components, and the fifth misalignment space is formed by the cooperation of the long sides of two adjacent second mounting components. By further including the fourth and fifth misalignment spaces, the misalignment space system is refined, greatly improving the adaptability of the blister pack to circuit board assemblies and the space utilization rate. Complementing the original first, second, and third misalignment spaces, a comprehensive, multi-layered three-dimensional misalignment space network is constructed, covering the placement requirements of components of different sizes, shapes, and heights on the circuit board assemblies. Whether it is a large, tall component or a small, medium-height component, a corresponding embedding position can be found in this blister pack stacking system, further eliminating the idle and wasteful problems caused by the single space design of traditional blister packs. At the same time, the rich misalignment space layout allows the blister pack to be compatible with more types of circuit board assemblies, improving product versatility. In automated production and logistics transportation, a more compact and stable stacking effect can be achieved, significantly reducing packaging volume and transportation costs, and enhancing the practicality and competitiveness of the overall packaging solution.

[0015] In one embodiment, the blister pack body also includes multiple lifting and placing spaces, which are located on the sides of the blister pack body. By providing multiple lifting and placing spaces on the sides of the blister pack body, significant convenience is provided for the operation and handling of the blister pack. During actual production, warehousing, and transportation, operators can directly insert their fingers or tools into the lifting and placing spaces to easily lift or move the blister pack. Compared to the smooth sides of traditional blister packs, this design greatly reduces the risk of slipping during handling, improving operational safety and efficiency. For automated equipment, robotic arms or grippers can also accurately grasp the lifting and placing spaces, achieving standardized and rapid blister pack handling actions, adapting to the needs of assembly line production.

[0016] In one embodiment, there are multiple first mounting members, which are spaced apart along the length of the chassis assembly with their long sides aligned. This arrangement of multiple first mounting members along the length of the chassis assembly provides a basis for the formation of a first misaligned space. The orientation of the long sides of the first mounting members determines the extension direction of the first misaligned space, allowing for targeted adaptation to tall components distributed along the length of the circuit board. This facilitates efficient misaligned stacking when upper and lower blister packs are rotated 180 degrees and stacked, ensuring that tall components on the circuit board in the lower first mounting slot are accurately embedded into the upper first misaligned space.

[0017] In one embodiment, there are multiple second mounting members, which are spaced apart along the length of the chassis assembly with their short sides. By arranging the multiple second mounting members spaced apart along the length of the chassis assembly with their short sides, the shape and extension direction of the first and second misalignment spaces are precisely determined. This allows for the adaptation of medium-height components distributed along the length of the circuit board, ensuring that when the upper and lower blister packs are rotated 180 degrees and stacked, the components on the circuit board in the lower second mounting slot can be precisely embedded into the corresponding misalignment space in the upper layer, achieving efficient misalignment stacking.

[0018] In one embodiment, there are multiple third mounting components, which are spaced apart along the length of the chassis assembly with their short sides aligned. This arrangement of multiple third mounting components with their short sides aligned along the length of the chassis assembly directly influences the shape and extension direction of the second and third misaligned spaces. This allows for precise adaptation to taller or thicker components distributed along the length of the circuit board. When the upper and lower blister packs are rotated 180 degrees and stacked, the components on the circuit board in the lower third mounting slot can be embedded into the corresponding second or third misaligned space in the upper layer through the misaligned space channel formed by the arrangement of their short sides, avoiding height interference and achieving compact stacking.

[0019] In one embodiment, there are multiple first mounting components, which are asymmetrically distributed relative to the central axis of the chassis assembly. By utilizing this asymmetrical distribution of the multiple first mounting components relative to the central axis of the chassis assembly, the actual shape and component distribution characteristics of the circuit board can be better matched, allowing the first mounting slot to precisely accommodate components in specific areas of the circuit board, avoiding space waste or component mismatch issues caused by symmetrical layouts. Simultaneously, this layout, combined with the second and third mounting components, further optimizes the structure of the misaligned space.

[0020] In one embodiment, there are multiple second mounting components, which are asymmetrically distributed relative to the central axis of the chassis assembly. By utilizing an asymmetrical distribution structure of multiple second mounting components relative to the central axis of the chassis assembly, the position of the second mounting slot can be flexibly planned according to the actual shape of the circuit board, accurately fitting the local structure of the circuit board and avoiding invalid space or component mismatch problems caused by symmetrical layout.

[0021] In one embodiment, there are multiple third mounting components, which are asymmetrically distributed relative to the central axis of the chassis assembly. By utilizing an asymmetrical distribution structure of multiple third mounting components relative to the central axis of the chassis assembly, the layout of the third mounting slots can be flexibly adjusted to precisely accommodate these tall and uniquely shaped devices on the circuit board, avoiding space redundancy or device placement problems caused by symmetrical layouts.

[0022] In one embodiment, a circuit board assembly is further included. This circuit board assembly is placed on the first and / or the second and / or the third mounting slots. The misalignment space is used to accommodate a portion of the stacked blister pack where the horizontal height of the circuit board assembly is greater than the horizontal height of the first, second, and third mounting slots. The circuit board assembly includes a circuit board body and a high plate. The circuit board body is placed on the first and / or the second and / or the third mounting slots. The high plate is disposed on the circuit board body, and its horizontal height is greater than the horizontal height of the first, second, and third mounting slots. A portion of the high plate is located in the misalignment space. By placing the high plate on the circuit board body, the layered structure of the circuit board body and the high plate, and its design in conjunction with the mounting slots and misalignment space, fundamentally solves the problem of protecting and stacking irregularly shaped components on the circuit board. The main body of the circuit board is stably fixed to the chassis assembly by the support structure of the first, second, and third mounting slots. These mounting slots, through precise dimensional design and asymmetrical / spaced layout, provide horizontal positioning and support for the main body of the circuit board, ensuring that it will not shift during transportation. The taller components, whose horizontal height exceeds the mounting slots, have a portion of their structure embedded in the staggered space, forming a misaligned space. The shape of this misaligned space precisely matches the contour of the taller components, preventing collision damage caused by shaking inside the blister pack. Furthermore, when the upper and lower blister packs are rotated 180 degrees and stacked, the interlocking of the misaligned spaces ensures that the taller components of the lower blister pack fall precisely into the corresponding misaligned space of the upper blister pack, forming a convex-concave interlocking stacking structure. This design not only utilizes the misaligned space to provide vertical limiting protection for the taller components but also achieves compact stacking of the blister packs through a layered layout, maximizing the number of circuit boards that can be accommodated within a limited space.

[0023] In one embodiment, the chassis assembly, the first mounting component, the second mounting component, and the third mounting component are integrally molded. By integrally molding the chassis assembly, the first mounting component, the second mounting component, and the third mounting component, the seams and weak points of traditional splicing structures are eliminated, making the blister box a sturdy and stable whole. During transportation, it can effectively resist external impacts, prevent parts from falling off or deforming, and better protect the circuit board assembly. In addition, integral molding simplifies the production process, reduces manual assembly steps and material waste, lowers production costs and scrap rates, and is especially suitable for large-scale mass production. Attached Figure Description

[0024] Figure 1 This is the first 3D view of the blister pack;

[0025] Figure 2 This is a second perspective view of the blister pack;

[0026] Figure 3 for Figure 2 A magnified view of a portion of region A;

[0027] Figure 4 This is a first cross-sectional view of the blister pack;

[0028] Figure 5 for Figure 4 A magnified view of a portion of region B;

[0029] Figure 6 This is the first perspective view of the blister pack.

[0030] Figure 7 This is a second perspective view of the blister pack.

[0031] Figure 8 This is a second cross-sectional view of the blister pack;

[0032] Figure 9 This is the third cross-sectional view of the blister pack;

[0033] Figure 10 This is a third-dimensional view of the blister box.

[0034] The correspondence between the reference numerals and the component names is as follows:

[0035] 100 Blister box body, 101 misaligned space, 1011 first misaligned space, 1012 second misaligned space, 1013 third misaligned space, 1014 fourth misaligned space, 1015 fifth misaligned space, 102 lifting and placing space, 1001 mounting slot.

[0036] 1. Chassis components;

[0037] 2. First mounting component, 201. First mounting slot;

[0038] 3. Second mounting component, 301. Second mounting slot;

[0039] 4. Third mounting component, 401. Third mounting slot;

[0040] 5. Circuit board assembly, 51. Circuit board body, 52. High board component. Detailed Implementation

[0041] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0042] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0043] The following describes some embodiments of the blister pack according to the present invention with reference to the accompanying drawings.

[0044] Example

[0045] like Figures 1 to 10 As shown, this embodiment discloses a blister box, including: a plurality of blister box bodies 100, which can be stacked; one side of each blister box body 100 is provided with a plurality of mounting slots 1001, and the other side of each blister box body 100 is provided with a misalignment space 101; one blister box body 100 can be stacked on top of another blister box body 100 in a first direction and a second direction; when one blister box body 100 is stacked on top of another blister box body 100 in the first direction, the plurality of mounting slots 1001 of adjacent blister box bodies 100 are arranged opposite to each other; when one blister box body 100 is stacked on top of another blister box body 100 in the second direction, the plurality of mounting slots 1001 of one blister box body 100 are respectively arranged opposite to portions of the misalignment space 101 of the other blister box body 100.

[0046] This application discloses a blister pack, which effectively solves the problem of low space utilization in traditional packaging through the ingenious design of multiple blister pack bodies 100 stacked together, mounting slots 1001, and staggered spaces 101. Multiple blister pack bodies 100 can be stacked to meet the needs of bulk transportation and storage; the mounting slots 1001 and staggered spaces 101 respectively provided on both sides of the blister pack bodies 100 provide a basis for stacking in different directions. When the blister pack bodies 100 are stacked in a first direction, the mounting slots 1001 of adjacent blister pack bodies 100 face each other, suitable for loading products with relatively uniform heights, forming a neat stack, facilitating quick access and automated operation; when stacked in a second direction, the mounting slots 1001 and staggered spaces 101 partially face each other, which can accommodate taller components in the mounting slots of the lower blister packs, and utilize the staggered spaces to avoid height differences, preventing stacking interference caused by different component heights. This two-way stacking design allows blister packs to be efficiently stacked for products of uniform size, while also accommodating the flexible stacking of products with varying heights. This significantly improves space utilization, reduces packaging gaps caused by differences in product height, and lowers packaging volume and transportation costs. At the same time, the diverse stacking methods enhance the versatility of blister packs, reducing the need to develop packaging for different sizes. In actual production, warehousing, and logistics, this significantly improves packaging efficiency and management convenience.

[0047] like Figures 2 to 6As shown, in addition to the features of the above embodiments, this embodiment further specifies that when the blister box 100 is stacked on top of another blister box 100 in a second direction, the mounting groove 1001 and the misalignment space 101 partially cooperate to form a receiving space, which is used to adapt to the circuit board assembly 5. By utilizing the partial cooperation between the mounting groove 1001 and the misalignment space 101 to form a receiving space, a highly adaptable and flexible placement scheme is provided for the circuit board. This design breaks the limitation of the single fixed space of the traditional blister box. Through the misalignment combination of the upper and lower layers, it can accurately match the staggered layout of components on the circuit board. Specifically, for components on the circuit board whose height exceeds the mounting groove 1001, they can be embedded in the misalignment space 101 of the upper blister box when stacked, so that the protruding parts that may have caused stacking interference can be properly placed; while the mounting groove 1001 firmly supports the main body of the circuit board. The receiving space formed by the two together can not only ensure the horizontal positioning of the circuit board, but also provide vertical limiting protection to avoid collision damage caused by shaking during transportation. Furthermore, the variability of the storage space significantly enhances the versatility of the blister packs. There is no need to customize packaging for circuit boards of different heights; the same structure can accommodate a variety of products, reducing mold development costs. In warehousing and transportation, this close-fitting stacking method greatly reduces the packaging volume. The stacked blister packs form a compact and stable whole, effectively reducing logistics costs. At the same time, it enhances the convenience of operating automated equipment. The robotic arm can quickly complete gripping and placement based on the unified spatial structure, improving packaging efficiency and production flexibility.

[0048] like Figures 1 to 10As shown, in addition to the features of the above embodiments, this embodiment further defines the following: the blister box 100 includes: a chassis assembly 1; a first mounting member 2, which is disposed on the chassis assembly 1 and has a first mounting groove 201; a second mounting member 3, which is disposed on the chassis assembly 1 and has a second mounting groove 301; and a third mounting member 4, which is disposed on the chassis assembly 1 and has a third mounting groove 401. The chassis assembly 1, the first mounting member 2, the second mounting member 3, and the third mounting member 4 cooperate to form a misaligned space 101. By utilizing the cooperation of the chassis assembly 1, the first mounting member 2, the second mounting member 3, and the third mounting member 4 to form the misaligned space 101, the space waste problem caused by the different heights of circuit board components in traditional blister boxes can be effectively solved. In existing technologies, traditional blister packs are designed to accommodate the tallest components on circuit boards, requiring the placement slots to be tailored to that height. This results in wasted space for smaller components and reduced blister pack versatility. This new structure utilizes a staggered space 101. During packaging, the lower blister pack is first assembled. After the upper blister pack is rotated 180 degrees, the taller components among the products placed in the first placement slot 201, second placement slot 301, and third placement slot 401 of the lower blister pack can be precisely positioned within the gaps in the upper blister pack's mounting compartments, i.e., the staggered space 101. This design eliminates the need for uniformly fitting the tallest components to the placement slots. Instead, the staggered stacking of the upper and lower blister packs allows components of different heights to utilize both the placement slots and the staggered space 101, satisfying the placement needs of components of varying heights while avoiding the space wastage caused by a single-height design, thus significantly improving space utilization. Meanwhile, there is no need to design separate blister boxes for devices of different heights, which improves the versatility of blister boxes, reduces mold development costs and production complexity, and ensures stable placement of circuit boards during circuit board packaging and transportation. It also reduces packaging volume and transportation costs through compact stacking, demonstrating significant practicality and economy.

[0049] like Figures 2 to 10As shown, in addition to the features of the above embodiments, this embodiment further defines: the misaligned space 101 includes a first misaligned space 1011, a second misaligned space 1012 and a third misaligned space 1013, the number of first placement members 2 is multiple, the number of second placement members 3 is multiple, the multiple first placement members 2 cooperate with the short sides of the multiple second placement members 3 to form the first misaligned space 1011, the number of third placement members 4 is multiple, the multiple second placement members 3 cooperate with the short sides of the multiple third placement members 4 to form the second misaligned space 1012, and the long sides of two adjacent third misaligned spaces 1013 cooperate to form the third misaligned space 1013. By dividing the misalignment space 101 into a first misalignment space 1011, a second misalignment space 1012, and a third misalignment space 1013, and through the cooperation of the edge structures of multiple first mounting components 2, second mounting components 3, and third mounting components 4, a multi-layered and diverse gap space is constructed to precisely adapt to the stacking requirements of devices of different heights and shapes in the circuit board assembly 5. Specifically, the long sides of multiple first mounting components 2 and the short sides of multiple second mounting components 3 combine to form the first misalignment space 1011, which can accommodate taller devices placed on the circuit board in the third mounting slot 401; the short sides of multiple second mounting components 3 and third mounting components 4 combine to form the second misalignment space 1012, which is used for taller devices placed on the circuit board in the second mounting slot 301; and the long sides of two adjacent third misalignment spaces 1013 are joined together to form the third misalignment space 1013, which is used for taller devices placed on the circuit board in the first mounting slot 201. When the upper and lower blister boxes are rotated 180 degrees and stacked, the circuit board components in different placement slots can be embedded into the corresponding misaligned spaces, avoiding vertical height interference and realizing a three-dimensional misaligned layout in both the planar and vertical directions. This not only solves the space waste problem caused by the uniform adaptation of tall components in traditional blister boxes, but also significantly improves packaging density, reduces transportation costs, and optimizes overall packaging efficiency through structured gap design.

[0050] like Figure 8 and Figure 9As shown, in addition to the features of the above embodiments, this embodiment further specifies that the cross-sectional area of ​​the third misaligned space 1013 is larger than the cross-sectional areas of the first misaligned space 1011 and the second misaligned space 1012. By designing the cross-sectional area of ​​the third misaligned space 1013 to be larger than the cross-sectional areas of the first misaligned space 1011 and the second misaligned space 1012, space utilization efficiency and compatibility can be further improved based on the differentiated requirements of device height and shape in the circuit board assembly. In practical applications, some large and tall devices on the circuit board, such as heat sinks and large-capacity capacitors, often require more space for stacking and avoidance; while the first misaligned space 1011 and the second misaligned space 1012 are mainly adapted to devices of medium thickness. By increasing the cross-sectional area of ​​the third misaligned space 1013, sufficient embedding space can be reserved specifically for these special devices with larger volume and greater height on the circuit board. When the upper and lower blister boxes are rotated 180 degrees and stacked, the thicker devices in the lower blister box can be smoothly embedded into the upper third misaligned space 1013, avoiding stacking interference caused by insufficient space. Meanwhile, this differentiated spatial design forms a multi-layered containment system from small to large, enabling the blister box to meet the compact placement of small components while also accommodating the storage needs of large components. It maximizes the use of the internal space of the blister box, reduces packaging gaps, and increases packaging density while ensuring that circuit board assemblies of different specifications can be stably stacked and transported in the blister box, reducing transportation costs and losses caused by unreasonable space.

[0051] like Figure 7 As shown, in addition to the features of the above embodiments, this embodiment further specifies that the openings of the first placement slot 201, the second placement slot 301, and the third placement slot 401 have the same orientation. By designing the openings of the first placement slot 201, the second placement slot 301, and the third placement slot 401 to have the same orientation, in actual production and packaging processes, the unified opening direction facilitates standardized operation of automated production line equipment. Robotic arms or workers can use consistent gripping and placing actions to quickly and accurately place the circuit board assembly 5 into the corresponding placement slot, reducing operational errors and time waste caused by inconsistent opening directions, and significantly improving assembly efficiency. At the same time, it ensures that the misalignment space 101 can be accurately aligned during stacking, thereby enabling taller components in the circuit board assembly 5 to be reliably embedded in the corresponding misalignment space, avoiding stacking misalignment or interference caused by inconsistent opening directions.

[0052] like Figure 10As shown, in addition to the features of the above embodiments, this embodiment further specifies that the first misalignment space 1011, the second misalignment space 1012, and the third misalignment space 1013 have the same orientation. By ensuring that the first misalignment space 1011, the second misalignment space 1012, and the third misalignment space 1013 have the same orientation, the stacking and usability performance of the blister pack can be systematically optimized. In a stacking scenario, the uniform orientation ensures that when the upper and lower blister packs are rotated 180 degrees and stacked, each misalignment space can accurately correspond and seamlessly connect. This allows components of different heights in the circuit board assembly 5 to be stably embedded in the corresponding misalignment spaces 101, avoiding embedding deviations or interference problems caused by inconsistent spatial misalignment directions, thereby improving the compactness and stability of the stack.

[0053] like Figure 7 and Figure 10 As shown, in addition to the features of the above embodiments, this embodiment further specifies that the opening orientations of the first placement slot 201, the second placement slot 301, and the third placement slot 401 are opposite to the orientations of the first misalignment space 1011, the second misalignment space 1012, and the third misalignment space 1013. By utilizing the above structure, during actual stacking, when the upper and lower blister packs are rotated 180 degrees and stacked, the tall components of the circuit board in the placement slot of the lower blister pack can precisely embed into the misalignment space 101 of the upper blister pack. Because the orientations are opposite, the tall components can accurately fall into the corresponding gap area, avoiding collisions or failure to embed due to inconsistent orientations. This design not only makes full use of the internal space of the blister pack but also ensures the stability of the circuit board assembly during transportation and storage, preventing damage to components due to shaking.

[0054] like Figure 10As shown, in addition to the features of the above embodiments, this embodiment further specifies that the misalignment space 101 also includes a fourth misalignment space 1014 and a fifth misalignment space 1015. The short sides of two adjacent first mounting members 2 cooperate to form the fourth misalignment space 1014, and the long sides of two adjacent second mounting members 3 cooperate to form the fifth misalignment space 1015. By further providing the fourth misalignment space 1014 and the fifth misalignment space 1015, the misalignment space system is further refined, greatly improving the adaptability of the blister box to the circuit board assembly 5 and the space utilization rate. Complementing the original first, second, and third misalignment spaces, a comprehensive, multi-layered three-dimensional misalignment space network is constructed, covering the placement requirements of devices of different sizes, shapes, and heights on the circuit board assembly 5. Whether it is a large tall device or a small medium-height device, a corresponding embedding position can be found in this blister box stacking system, further eliminating the idle and waste problems caused by the single space design of traditional blister boxes. Meanwhile, the varied staggered space layout allows the blister pack to be compatible with more types of circuit board components, improving product versatility. In automated production and logistics transportation, it can achieve a more compact and stable stacking effect, significantly reducing packaging volume and transportation costs, and enhancing the practicality and competitiveness of the overall packaging solution.

[0055] like Figure 4 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the blister box body 100 is also provided with lifting and placing spaces 102, and the number of lifting and placing spaces 102 is multiple, which are arranged on the side of the blister box body 100. By providing multiple lifting and placing spaces 102 on the side of the blister box body 100, the operation and circulation of the blister box are significantly facilitated. In actual production, warehousing and transportation processes, operators can directly insert their fingers or tools into the lifting and placing spaces 102 to easily lift or move the blister box. Compared with the smooth sides of traditional blister boxes, this design greatly reduces the risk of slipping during handling and improves the safety and efficiency of operation; for automated equipment, robotic arms or clamps can also accurately grasp the lifting and placing spaces 102 to realize standardized and rapid blister box picking and placing actions, adapting to the needs of assembly line production.

[0056] like Figure 6 and Figure 10As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of first mounting members 2 is multiple, and the multiple first mounting members 2 are spaced apart along the length direction of the chassis assembly 1 with their long sides apart. By arranging the multiple first mounting members 2 spaced apart along the length direction of the chassis assembly 1 with their long sides apart, a basis is provided for the formation of the first misalignment space 1011. The arrangement direction of the long sides of the first mounting members 2 determines the extension direction of the first misalignment space 1011, which can be specifically adapted to tall components distributed along the length direction on the circuit board. This facilitates the accurate embedding of tall components of the circuit board in the lower first mounting slot 201 into the upper first misalignment space 1011 when the upper and lower blister boxes are rotated 180 degrees and stacked, thus achieving efficient misalignment stacking.

[0057] like Figure 6 and Figure 10 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of second mounting members 3 is multiple, and the multiple second mounting members 3 are spaced apart along the length direction of the chassis assembly 1 with their short sides. By arranging the multiple second mounting members 3 spaced apart along the length direction of the chassis assembly 1 with their short sides, the shape and extension direction of the first misalignment space 1011 and the second misalignment space 1012 are precisely determined, which can accommodate medium-height devices distributed along the length direction on the circuit board, ensuring that when the upper and lower blister boxes are rotated 180 degrees and stacked, the devices on the circuit board in the lower second mounting slot 301 can be accurately embedded into the corresponding misalignment space in the upper layer, achieving efficient misalignment stacking.

[0058] like Figure 6 and Figure 10 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of third mounting members 4 is multiple, and the multiple third mounting members 4 are spaced apart along the length direction of the chassis assembly 1 with their short sides. By having multiple third mounting members 4 spaced apart along the length direction of the chassis assembly 1 with their short sides, the shape and extension direction of the second misalignment space 1012 and the third misalignment space 1013 are directly affected, which can accurately adapt to taller or thicker devices distributed along the length direction on the circuit board. When the upper and lower blister boxes are rotated 180 degrees and stacked, the devices on the circuit board in the lower third mounting slot 401 can be embedded into the corresponding second or third misalignment space in the upper layer through the misalignment space channel formed by the arrangement of short sides, avoiding height interference and achieving compact stacking.

[0059] like Figure 6As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of first mounting members 2 is multiple, and the multiple first mounting members 2 are asymmetrically distributed relative to the central axis of the chassis assembly 1. By utilizing the asymmetrical distribution structure of the multiple first mounting members 2 relative to the central axis of the chassis assembly 1, the actual shape and device distribution characteristics of the circuit board can be better matched, allowing the first mounting slot 201 to accurately accommodate devices in a specific area on the circuit board, avoiding space waste or device incompatibility problems caused by symmetrical layout. At the same time, this layout, in conjunction with the second and third mounting members, can further optimize the structure of the misalignment space 101.

[0060] like Figure 6 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of second mounting members 3 is multiple, and the multiple second mounting members 3 are asymmetrically distributed relative to the central axis of the chassis assembly 1. By utilizing the asymmetrical distribution structure of multiple second mounting members 3 relative to the central axis of the chassis assembly 1, the position of the second mounting slot 301 can be flexibly planned according to the actual shape of the circuit board, accurately matching the local structure of the circuit board, and avoiding the problem of invalid space or mismatch of components caused by symmetrical layout.

[0061] like Figure 6 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of third mounting components 4 is multiple, and the multiple third mounting components 4 are asymmetrically distributed relative to the central axis of the chassis assembly 1. By utilizing the asymmetrical distribution structure of multiple third mounting components 4 relative to the central axis of the chassis assembly 1, the layout of the third mounting slot 401 can be flexibly adjusted to accurately adapt to these tall and specially shaped devices on the circuit board, avoiding the problems of space redundancy or inability to place devices caused by symmetrical layout.

[0062] like Figures 2 to 5As shown, in addition to the features of the above embodiments, this embodiment further includes: a circuit board assembly 5, which is placed on the first mounting slot 201 and / or the second mounting slot 301 and / or the third mounting slot 401. The misalignment space 101 is used to accommodate the portion of the stacked blister box 100 where the horizontal height of the circuit board assembly 5 is greater than the horizontal height of the first mounting slot 201, the second mounting slot 301 and the third mounting slot 401. The circuit board assembly 5 includes a circuit board body 51 and a high plate 52. The circuit board body 51 is placed on the first mounting slot 201 and / or the second mounting slot 301 and / or the third mounting slot 401. The high plate 52 is disposed on the circuit board body 51. The horizontal height of the high plate 52 is greater than the horizontal height of the first mounting slot 201, the second mounting slot 301 and the third mounting slot 401. A portion of the high plate 52 is located in the misalignment space 101. By setting the high plate 52 on the circuit board body 51, the layered structure of the circuit board body 51 and the high plate 52, as well as their coordination with the mounting slot and the misalignment space 101, fundamentally solves the problem of protection and stacking of irregularly shaped components on the circuit board. The circuit board body 51 is stably fixed on the chassis assembly 1 by the support structure of the first mounting slot 201, the second mounting slot 301, and the third mounting slot 401. These mounting slots provide horizontal positioning and support for the circuit board body 51 through precise size design and asymmetrical / spaced layout, ensuring that it will not shift during transportation. The tall board 52, because its horizontal height exceeds the mounting slot, has part of its structure embedded in the misaligned space 101, which forms the misaligned space 101. The shape of the misaligned space 101 is precisely matched with the contour of the tall board 52. This not only avoids the tall board 52 from being damaged by collision due to shaking inside the blister box, but also allows the tall board 52 of the lower blister box to fall into the corresponding misaligned space 101 of the upper layer when the upper and lower blister boxes are rotated 180 degrees and stacked, forming a convex-concave interlocking stacking structure. This design not only utilizes the staggered space 101 to provide vertical limiting protection for the tall board 52, but also achieves compact stacking of the blister box through layered layout, maximizing the number of circuit boards that can be accommodated in a limited space.

[0063] like Figure 6 As shown, in addition to the features of the above embodiments, this embodiment further defines that the chassis assembly 1, the first mounting component 2, the second mounting component 3, and the third mounting component 4 are integrally molded. By integrally molding the chassis assembly 1, the first mounting component 2, the second mounting component 3, and the third mounting component 4, the seams and weak points of the traditional splicing structure are eliminated, making the blister box a sturdy and stable whole. During transportation, it can effectively resist external impacts, prevent parts from falling off or deforming, and better protect the circuit board assembly 5. In addition, integral molding simplifies the production process, reduces manual assembly steps and material waste, lowers production costs and scrap rates, and is especially suitable for large-scale mass production.

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A blister pack, characterized in that, The blister pack includes: Multiple blister packs (100) are provided, and the multiple blister packs (100) can be stacked. The blister box (100) has multiple mounting slots (1001) on one side and a misalignment space (101) on the other side; One of the blister packs (100) can be stacked on top of the other blister pack (100) in a first direction and a second direction; When one of the blister packs (100) is stacked on top of another blister pack (100) in the first direction, the plurality of mounting slots (1001) of the adjacent blister packs (100) are arranged opposite to each other; When one of the blister packs (100) is stacked on top of the other blister pack (100) in the second direction, the plurality of mounting slots (1001) of the one blister pack (100) are respectively arranged opposite to a portion of the misalignment space (101) of the other blister pack (100).

2. The blister pack according to claim 1, characterized in that, When the blister box (100) is stacked on top of another blister box (100) in the second direction, the mounting groove (1001) partially cooperates with the misalignment space (101) to form a receiving space, which is used to adapt to the circuit board assembly (5).

3. The blister pack according to claim 1, characterized in that, The blister box body (100) includes a chassis assembly (1), a first mounting member (2), a second mounting member (3), and a third mounting member (4). Multiple mounting slots (1001) are a first mounting slot (201), a second mounting slot (301), and a third mounting slot (401). The first mounting member (2) is disposed on the chassis assembly (1) and has the first mounting slot (201). The second mounting member (3) is disposed on the chassis assembly (1) and has the second mounting slot (301). The third mounting member (4) is disposed on the chassis assembly (1) and has the third mounting slot (401). The chassis assembly (1), the first mounting member (2), the second mounting member (3), and the third mounting member (4) cooperate to form the misaligned space (101).

4. The blister box according to claim 3, characterized in that, The misaligned space (101) includes a first misaligned space (1011), a second misaligned space (1012), and a third misaligned space (1013). There are multiple first placement components (2) and multiple second placement components (3). Multiple first placement components (2) form the first misaligned space (1011) by combining their long sides with the short sides of multiple second placement components (3). There are multiple third placement components (4). Multiple second placement components (3) form the second misaligned space (1012) by combining their short sides with the short sides of multiple third placement components (4). The long sides of two adjacent third misaligned spaces (1013) are combined to form the third misaligned space (1013).

5. The blister box according to claim 4, characterized in that, The cross-sectional area of ​​the third misaligned space (1013) is greater than the cross-sectional areas of the first misaligned space (1011) and the second misaligned space (1012).

6. The blister pack according to claim 4, characterized in that, The openings of the first mounting slot (201), the second mounting slot (301), and the third mounting slot (401) face the same direction; And / or the first misaligned space (1011), the second misaligned space (1012), and the third misaligned space (1013) have the same orientation; And / or the opening orientations of the first placement slot (201), the second placement slot (301) and the third placement slot (401) are opposite to the orientations of the first misaligned space (1011), the second misaligned space (1012) and the third misaligned space (1013).

7. The blister box according to claim 4, characterized in that, The misaligned space (101) further includes a fourth misaligned space (1014) and a fifth misaligned space (1015). The fourth misaligned space (1014) is formed by the cooperation between the short sides of two adjacent first mounting members (2), and the fifth misaligned space (1015) is formed by the cooperation between the long sides of two adjacent second mounting members (3).

8. The blister pack according to claim 3, characterized in that, The blister box (100) is also provided with lifting and placing spaces (102), and there are multiple lifting and placing spaces (102) arranged on the side of the blister box (100).

9. The blister box according to claim 3, characterized in that, The number of the first mounting members (2) is multiple, and the multiple first mounting members (2) are spaced apart along the length direction of the chassis assembly (1) with their long sides apart; And / or the number of the second mounting member (3) is multiple, and the multiple second mounting members (3) are spaced apart along the length direction of the chassis assembly (1) with their short sides; And / or the number of the third mounting members (4) is multiple, and the multiple third mounting members (4) are spaced apart along the length direction of the chassis assembly (1) with their short sides.

10. The blister pack according to claim 3, characterized in that, The number of the first mounting components (2) is multiple, and the multiple first mounting components (2) are asymmetrically distributed relative to the central axis of the chassis assembly (1); And / or the number of the second mounting components (3) is multiple, and the multiple second mounting components (3) are asymmetrically distributed relative to the central axis of the chassis assembly (1); And / or the number of the third mounting components (4) is multiple, and the multiple third mounting components (4) are asymmetrically distributed relative to the central axis of the chassis assembly (1); And / or the chassis assembly (1), the first mounting member (2), the second mounting member (3) and the third mounting member (4) are integrally formed.

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