Optoelectronic device blister pack with multi-tail fiber length compatibility

By designing a blister pack for optoelectronic devices that is compatible with multiple fiber optic tail lengths, the problems of poor stability and high production costs caused by inconsistent fiber optic tail lengths in existing technologies have been solved. This design achieves stable fixation of fiber optic tails and devices of different lengths, improving the compatibility and protective capabilities of the packaging.

CN224410045UActive Publication Date: 2026-06-26SHAOXING ZKTEL EQUIP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHAOXING ZKTEL EQUIP
Filing Date
2025-06-30
Publication Date
2026-06-26

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Abstract

The application relates to an optical-electric device blister box with multi-tail fiber length compatibility, and relates to the technical field of optical communication device packaging. The blister box comprises a transparent protective upper cover and a black protective base, and the two are buckled to form an integrated structure, have good sealing and protection performance, and the black protective base is provided with symmetrical left and right buckles and outer upper and lower buckles, facilitating firm closure and stacked storage. The upper surface of the base is provided with a wavy tail fiber groove capable of accommodating tail fibers with different lengths; the left end of the tail fiber groove is provided with a device limiting groove, and the right end is provided with an adapter placing groove, the placing groove is provided with a tail rubber sleeve limiting buckle, and the tail end of the tail fiber is stably fixed. The left side of the device limiting groove is also provided with a device pin / soft plate placing groove, and the left side of the tail rubber sleeve limiting buckle is provided with a multi-point limiting convex point groove, thereby providing multi-section positioning support. The application can effectively avoid tail fiber bending damage and improve the safety of device transportation and storage.
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Description

Technical Field

[0001] This application relates to the field of packaging for optical communication devices, and in particular to a blister pack for optoelectronic devices with multi-tail fiber length compatibility. Background Technology

[0002] Currently, most common blister packs for optoelectronic devices are designed for standard-length fiber optic devices. They cannot flexibly accommodate devices with complex structures and varying fiber optic lengths, such as BOSA devices. Existing designs often use uniformly spaced grooves. If the fiber optic cable is too short, it will become loose; if it is too long, it will be squeezed, easily leading to various problems such as fiber optic cable bending, device displacement, and pin deformation.

[0003] Meanwhile, some blister packs lack dedicated limiting structures and rely solely on the size of the components for positioning. During transportation, they have poor shock resistance, making the components prone to rotation, displacement, or even collisions or tangling of the fiber optic cables.

[0004] Regarding the aforementioned technologies, the inventors believe that the following technical problems exist:

[0005] 1. The lack of a structure compatible with multiple fiber lengths necessitates the customization of multiple packaging versions, increasing production costs and inventory pressure;

[0006] 2. Lack of independent limiting structures between components results in poor component stability and susceptibility to damage during transportation;

[0007] 3. Lack of reasonable device end fixing and fiber optic guidance channels, insufficient fiber optic protection, easy breakage or tangling;

[0008] 4. The lack of a unified, standardized, and compatible structure reduces packaging efficiency and versatility. Utility Model Content

[0009] To address the aforementioned technical issues, this application provides a photoelectric device blister pack with multi-tail fiber length compatibility.

[0010] The blister pack for optoelectronic devices with multi-tail fiber length compatibility provided in this application adopts the following technical solution:

[0011] A blister pack for optoelectronic devices with compatibility for multiple fiber optic cable lengths includes a transparent protective cover and a black protective base, which are fastened together to form an integrated blister pack.

[0012] The bottom end face of the black protective base is provided with symmetrical left and right buckles, and the outer rounded corners of the left and right buckles of the black protective base are provided with upper and lower buckles.

[0013] The upper surface of the black protective base is provided with a wavy fiber optic cable groove at one end, a device limiting groove at the left end of the wavy fiber optic cable groove, an adapter placement groove at the right end of the wavy fiber optic cable groove, and a tail rubber sleeve limiting buckle at a certain distance from the adapter placement groove.

[0014] The left side of the device limiting groove is provided with a device pin / flexible plate placement groove, and the left side of the tail sleeve limiting buckle is provided with a multi-point limiting protrusion groove.

[0015] By adopting the above technical solution, the transparent protective cover and the black protective base are fastened together to form an integral structure, which has good sealing and protection, effectively preventing the optoelectronic devices from being affected by dust, moisture and other external environmental factors during transportation and storage. The bottom of the black protective base is equipped with symmetrical left and right buckles and upper and lower buckles on the outside, which can achieve a stable connection when the blister pack is stacked or combined for packaging, facilitating batch transportation and automated packing operations. The wave-shaped fiber optic cable groove design on the upper surface of the black protective base can flexibly adapt to the routing paths of fiber optic cables of different lengths and curvatures, effectively avoiding the performance loss caused by the fiber optic cable bending under stress, crossing and tangling, or due to the small bending radius. The device limiting groove on the left end and the device pin / flexible plate placement groove on its left side work together to accurately fix the main body and lead-out end of the optoelectronic device, preventing it from shifting or loosening in the packaging. The adapter placement groove on the right end and several tail sleeve limiting buckles inside can be positioned and fixed according to the position of different specifications of adapters, improving compatibility. The multi-point limiting protrusion groove on the left side of the buckle provides multi-segment limiting support, further enhancing the stability of the fiber optic tail sleeve.

[0016] Optionally, the transparent protective cover is made of impact-resistant polycarbonate material, which has high transparency and good scratch resistance.

[0017] By adopting the above technical solution, the transparent protective cover is made of impact-resistant polycarbonate material, which not only greatly improves the overall drop and pressure resistance of the blister box and effectively protects the internal optoelectronic devices from external impact damage, but also has high transparency and good scratch resistance, making it easy to visually check the status of the devices without opening the packaging, improving the practicality of the packaging and the efficiency of visual management, while enhancing the durability and reusability of the blister box in multiple uses.

[0018] Optionally, the black protective base is injection molded from a conductive and antistatic material to prevent static electricity from damaging the optoelectronic devices.

[0019] By adopting the above technical solution, the black protective base is injection molded from conductive and antistatic materials, which effectively prevents the accumulation of static electricity during transportation, storage and handling, avoids static electricity from causing breakdown or performance degradation of sensitive components inside optoelectronic devices, significantly improves the electrical safety and reliability of the device, and has good molding stability and protective strength, which helps to improve the overall protection capability and adaptability of blister boxes in the packaging application of electronic components.

[0020] Optionally, the upper and lower buckles adopt a beveled guide structure to enhance the fastening stability between the transparent protective cover and the black protective base.

[0021] By adopting the above technical solution, the upper and lower latches utilize a slanted guide structure, enabling the transparent protective cover and the black protective base to achieve self-guiding positioning during the latching process, making operation more convenient and effectively preventing misalignment. Simultaneously, this structure enhances the stability and sealing after latching, preventing loosening or detachment during transportation, improving the overall structural strength and repeated service life of the blister pack, and ensuring that the internal optoelectronic components remain firmly protected even under vibration, pressure, and other environmental conditions.

[0022] Optionally, the wavy fiber groove adopts a variable curvature structure to adapt to different lengths of fiber and reduce the bending stress of the fiber.

[0023] By adopting the above technical solution, the wave-shaped pigtail groove adopts a variable curvature structure, which can flexibly adapt to the arrangement requirements of pigtails of different lengths and flexibility, avoiding the stacking, knotting or suspension of pigtails due to different lengths, thereby improving the overall placement regularity and compatibility. The variable curvature design helps to reduce stress concentration at the bending point of the pigtail, prevents the pigtail from being damaged or signal attenuated due to excessive bending, and effectively improves the service life of the pigtail and the stability of optoelectronic devices.

[0024] Optionally, the bottom surface of the adapter placement slot is provided with buffer protrusions to prevent the adapter from shaking and being damaged during transportation.

[0025] By adopting the above technical solution, buffer protrusions are set on the bottom surface of the adapter placement slot, which can form flexible support when the adapter is placed in, effectively filling the gap between the adapter and the slot, preventing it from shaking, colliding or shifting during transportation and handling, thereby reducing the risk of physical damage caused by vibration or impact. The buffer protrusions can also improve the stability of the adapter positioning, enhance the overall protective performance of the blister box and its adaptability to precision optoelectronic devices.

[0026] Optionally, a connecting transition groove is provided between the device limiting groove and the device pin / flexible plate placement groove to ensure the overall positioning stability of the optoelectronic device.

[0027] By adopting the above technical solution, a connecting transition groove is set between the device limiting groove and the device pin / flexible plate placement groove, which effectively realizes the smooth connection between the device body and the lead-out structure, avoids unstable positioning or concentrated stress caused by the device due to step difference or jamming, helps to reduce the bending and stress of the flexible plate or pin during storage, improves the overall fit and protection of the device, and thus enhances the adaptability of the blister box in transportation and storage and the fixing stability of precision optoelectronic devices.

[0028] Optionally, the multi-point limiting protrusion grooves are arranged in a stepped structure to automatically achieve multi-segment positioning and limiting according to the length of the pigtail sleeve.

[0029] By adopting the above technical solution, the multi-point limiting protrusion groove has a stepped structure, which can achieve adaptive multi-segment positioning and limiting according to the different lengths of the tail fiber and tail sleeve. This improves the compatibility of the blister box with multiple specifications of optoelectronic devices, effectively limits the axial movement of the tail fiber end, prevents the tail fiber from loosening or being damaged due to shaking or pulling, enhances the stability and regularity of the tail fiber placement, and helps to improve the overall safety of the packaging and the reliability of transportation.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. Improved compatibility with various pigtail specifications: By setting up a wavy pigtail groove and a variable curvature structure, as well as a stepped arrangement of multi-point limiting protrusion grooves, it can achieve compatible fixation of pigtails and pigtail sleeves of different lengths, meeting the packaging needs of various types of optoelectronic devices.

[0032] 2. Enhanced overall protection: The transparent protective cover and the black protective base snap together to form a closed structure, effectively preventing external pollutants such as dust and moisture from entering; the impact-resistant materials and cushioning structure design significantly improve the blister box's resistance to drops and pressure, reducing the risk of damage to components during transportation.

[0033] 3. Optimize the device positioning structure: The device limiting groove, the pin / flexible plate placement groove and the connecting transition groove work together to achieve precise positioning and flexible transition between the device body and the lead-out structure, avoiding damage to the device due to shaking or jamming.

[0034] 4. Enhanced anti-static protection: The black protective base is made of conductive anti-static material, which effectively inhibits the accumulation of static electricity, avoids potential damage to optoelectronic components caused by electrostatic breakdown, and improves electrical safety.

[0035] 5. Facilitates convenient assembly and efficient transportation: The upper and lower snap-fit ​​inclined guide structure and symmetrical snap-fit ​​design not only improve the fastening stability between the top cover and the base, but also facilitate manual or automated assembly operations, enhancing the stability and reliability of transportation and stacking.

[0036] 6. Facilitates rapid visual inspection: The highly transparent top cover material allows for intuitive inspection of the device's status without opening the packaging, facilitating warehouse management and inbound / outbound inspection. Attached Figure Description

[0037] Figure 1 This application provides an embodiment of a photoelectric device blister pack with multi-tail fiber length compatibility.

[0038] A schematic diagram of the transparent protective cover.

[0039] Figure 2 This is a schematic diagram of a black protective base for a blister pack of optoelectronic devices with multi-tail fiber length compatibility according to an embodiment of this application.

[0040] Figure 3 yes Figure 2 A partial schematic diagram.

[0041] Figure 4 yes Figure 3 A partial schematic diagram.

[0042] Explanation of reference numerals in the attached diagram: 1. Transparent protective top cover; 2. Black protective base; 3. Left and right latches; 4. Top and bottom latches; 5. Component limiting groove; 6. Wavy pigtail groove; 7. Adapter placement groove; 8. Tail sleeve limiting latch; 9. Multi-point limiting protrusion groove; 10. Component pin / flex board placement groove. Detailed Implementation

[0043] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0044] This application discloses a blister pack for optoelectronic devices with multi-tail fiber length compatibility. (Refer to...) Figure 1-4 A blister pack for optoelectronic devices with compatibility for multiple fiber optic tail lengths includes a transparent protective top cover 1 and a black protective base 2. The transparent protective top cover 1 and the black protective base 2 are fastened together to form an integrated blister pack. The top cover and the bottom cover are designed with multiple side buckles so that when the top and bottom covers are together, they can be firmly secured and will not come apart during transportation, causing deformation or damage to the device.

[0045] The bottom end face of the black protective base 2 is provided with symmetrical left and right buckles 3, and the outer rounded corners of the left and right buckles 3 of the black protective base 2 are provided with upper and lower buckles 4; the blister box lid 1 is made of high-transparency antistatic PET material vacuum forming, which has good impact resistance, toughness and visibility. It is connected to the base through flip-top buckles, and has limiting buckles to ensure airtightness and device protection. The black protective base is made of injection-molded black antistatic PS material, which is rigid, has low moisture absorption, and has good structural support and static electricity suppression capabilities. The top edge of the box is provided with a stacking positioning edge and buckle structure, which facilitates the stacking and transportation of multiple boxes and safe sealing.

[0046] The upper surface of the black protective base 2 has a wavy fiber optic cable groove 6 at one end, a device limiting groove 5 at the left end of the wavy fiber optic cable groove 6, and an adapter placement groove 7 at the right end of the wavy fiber optic cable groove 6. Tail sleeve limiting buckles 8 are located at intervals between the adapter placement grooves 7. The tail sleeve limiting grooves 8 mainly fix the device base end to prevent it from falling off and being damaged during transportation. Simultaneously, the wavy fiber optic cable groove 6, with its maximum width, protects the fiber optic cable from damage. The adapter port is placed in the groove 7, and the limiting grooves secure the adapter port to prevent it from falling off and being damaged. The multi-point limiting protrusion grooves 9 can maximize the design of fiber optic cables with lengths between 110 and 165 mm, with the protrusion grooves all limiting the adapter to prevent the fiber optic cable from shifting or falling off and being damaged during rotation.

[0047] The left side of the device limiting groove 5 is provided with a device pin / flexible plate placement groove 10, and the left side of the tail sleeve limiting buckle 8 is provided with a multi-point limiting protrusion groove 9. The device pin / flexible plate placement groove 10 can meet the needs when the device pins are bent or cut to different lengths; the blister box can also meet the needs when the device transmitter needs to be welded to a flexible plate; it has excellent compatibility.

[0048] When using the blister pack: First, place the component base end in the component limiting groove 5 and fix it with the tail sleeve buckle groove 8. The fiber optic cable is placed through the fiber optic cable placement groove 6. The adapter end is fixed with the corresponding protrusion buckle. The components are placed crosswise to prevent the pins from pressing on the fiber optic cable, thus meeting market demand.

[0049] The implementation principle of the optoelectronic device blister box with multi-tail fiber length compatibility in this application embodiment is as follows: a modular, multi-limiting, multi-point buffering, and flexible adaptation structure. By optimizing the overall structure, material selection, and internal detail arrangement of the blister box, effective protection and stable support for optoelectronic devices of different specifications are formed. The entire blister box consists of a transparent protective cover and a black protective base. The two are precisely matched by multiple sets of inclined guide buckles to ensure that the assembled blister box has good airtightness and vibration resistance, preventing the device from being misaligned or falling due to loosening during transportation. The transparent protective cover is made of highly transparent antistatic PET material and is formed by vacuum forming process. It has strong impact toughness, scratch resistance, and visibility, which facilitates rapid identification and detection during transportation. At the same time, it has a certain antistatic performance to effectively avoid damage to optoelectronic devices due to static discharge. The edge of the cover is provided with a flip-top buckle, which facilitates quick combination and fastening with the lower cover, improving structural stability and ease of use.

[0050] The black protective base is made of injection-molded antistatic PS material, which has good pressure resistance, low moisture absorption and charge dissipation ability, and can be used safely in electronic packaging environments. The bottom is equipped with symmetrical left and right buckles and external stacking buckles, which can be used to securely fasten with the top cover, facilitate the stacking of multiple boxes and improve storage and transportation efficiency. One end of the upper surface of the black protective base is equipped with a wave-shaped fiber optic channel with a variable curvature structure design, which can flexibly adapt to the arrangement requirements of different lengths of fiber optic cables (such as 110~165mm). Placing the fiber optic cable in the wave-shaped channel not only avoids the risk of fiber breakage caused by excessively small bending radius, but also prevents the degradation of optical performance caused by fiber crossing and stacking.

[0051] The left end of the wavy fiber optic cable tray features a device positioning groove, serving as a precision positioning groove for the device's main body base, ensuring that the device does not shift forward, backward, or laterally during placement. To the left of the groove is a device pin / flexible board placement slot, accommodating device lead-out structures of different lengths and shapes, such as bent-pin, clipped-pin devices, or devices with soldered flexible boards, significantly improving the box's compatibility with a wide variety of optoelectronic device models. The right end of the fiber optic cable tray has an adapter placement slot with several tail sleeve limiting clips, enabling multi-point fixation of the fiber optic cable and adapter ends, ensuring stability during transportation and preventing loosening of the fiber optic cable root due to shaking or pulling. To prevent breakage and other issues, the left side of the tail sleeve limiting buckle is further equipped with a stepped multi-point limiting protrusion groove. This allows for segmented limiting of the tail of the fiber optic adapters of different lengths, ensuring that the adapter is securely locked in its corresponding position. This meets the packaging needs of different specifications of fiber optic structural components on the market. During use, the base of the optoelectronic device is accurately placed in the device limiting groove, and the base of the fiber optic device is fixed by the tail sleeve limiting buckle. The fiber optic cable is naturally laid out along the wave groove, and the adapter end is inserted into the groove with the protrusion limiting structure to complete the fixation. The devices can be placed crosswise to avoid mutual interference between the fiber optic cable and the pins, further reducing the risks of fiber optic cable being compressed, tangled, or devices interfering with each other.

[0052] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A blister pack for optoelectronic devices with multi-tail fiber length compatibility, characterized in that: It includes a transparent protective cover (1) and a black protective base (2), which together form an integrated blister box. The bottom end face of the black protective base (2) is provided with symmetrical left and right buckles (3), and the outer rounded corners of the left and right buckles (3) of the black protective base (2) are provided with upper and lower buckles (4); The upper surface of the black protective base (2) is provided with a wavy fiber optic groove (6) at one end, a device limiting groove (5) is provided at the left end of the wavy fiber optic groove (6), an adapter placement groove (7) is provided at the right end of the wavy fiber optic groove (6), and a tail rubber sleeve limiting buckle (8) is provided at several positions away from the adapter placement groove (7). The device limiting groove (5) is provided with a device pin / flexible plate placement groove (10) on the left side, and the tail sleeve limiting buckle (8) is provided with a multi-point limiting protrusion groove (9) on the left side.

2. The blister pack for optoelectronic devices according to claim 1, characterized in that: The transparent protective cover (1) is made of impact-resistant polycarbonate material.

3. The blister pack for optoelectronic devices according to claim 1, characterized in that: The black protective base (2) is injection molded from conductive and antistatic material to prevent static electricity from damaging optoelectronic devices.

4. The blister pack for optoelectronic devices according to claim 1, characterized in that: The upper and lower buckles (4) adopt a sloping guide structure to enhance the fastening stability between the transparent protective cover and the black protective base.

5. The blister pack for optoelectronic devices according to claim 1, characterized in that: The wavy pigtail groove (6) adopts a variable curvature structure to adapt to pigtails of different lengths and reduce the bending stress of the pigtails.

6. The blister pack for optoelectronic devices according to claim 1, characterized in that: The bottom surface of the adapter placement slot (7) is provided with buffer protrusions to prevent the adapter from shaking and being damaged during transportation.

7. The blister pack for optoelectronic devices according to claim 1, characterized in that: A connecting transition groove is provided between the device limiting groove (5) and the device pin / flexible plate placement groove (10) to ensure the overall positioning stability of the optoelectronic device.

8. The blister pack for optoelectronic devices according to claim 1, characterized in that: The multi-point limiting protrusion groove (9) has a stepped arrangement structure, which is used to automatically realize multi-segment positioning and limiting according to the length of the tail fiber tail sleeve.