Heating evaporation source furnaces and molecular beam epitaxy apparatuses

Abstract

The application relates to a heating evaporation source furnace and a molecular beam epitaxy device, and belongs to the field of semiconductor manufacturing. The heating evaporation source furnace comprises a crucible, a heating assembly sleeved on the crucible, the heating assembly comprises heating wires which are arranged at intervals in the circumferential direction of the crucible and extend along the axial direction of the crucible, and a positioning ring configured to position the heating wires; the positioning ring comprises an inner positioning ring and an outer positioning ring which are connected to each other in the radial direction, and the heating wires are located between the inner positioning ring and the outer positioning ring in the radial direction and are limited in position in the radial direction and the circumferential direction by the combination of the inner positioning ring and the outer positioning ring. The technical scheme of the application improves the production efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to a heated evaporation source furnace and a molecular beam epitaxy device. Background Technology

[0002] Molecular beam epitaxy (MBE) is a high-end fabrication device that uses precise control of atomic or molecular beams to grow single-crystal thin films layer by layer in an ultra-high vacuum environment. The fabrication process of MBE is molecular beam epitaxy, the core principle of which is to heat high-purity materials to form molecular or atomic beams, which are then directionally sprayed onto the surface of a heated substrate to achieve epitaxial growth at the atomic scale, forming high-quality single-crystal thin films. Compared to processes such as metal-organic chemical vapor deposition (MOCVD) and pulsed laser deposition (PLD), MBE offers advantages such as lower defect density and higher purity.

[0003] Molecular beam epitaxy (MBE) equipment includes a heated evaporation source furnace (referred to as the source furnace) used to generate a molecular beam, also known as a jet furnace. In an ultra-high vacuum environment, the source furnace heats the various elements that make up the thin film, causing them to form oriented molecular or atomic beams that are jetted onto the substrate surface. Currently, most mainstream source furnaces employ a reciprocating wound tantalum wire (heating wire) structure design. Therefore, during the production process of the source furnace, the tantalum wire needs to be repeatedly bent and inserted through positioning rings, consuming a significant amount of installation time and resulting in relatively low production efficiency. Utility Model Content

[0004] In view of this, this application provides a heating evaporation source furnace and a molecular beam epitaxy device to solve at least one problem existing in the prior art.

[0005] To achieve the above objectives, the technical solution of this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a heating evaporation source furnace, comprising:

[0007] crucible;

[0008] A heating assembly is fitted onto the crucible; the heating assembly includes:

[0009] Heating wires are spaced apart around the circumference of the crucible, and all heating wires extend along the axial direction of the crucible.

[0010] A positioning ring is configured to position the heating wire; the positioning ring includes an inner positioning ring and an outer positioning ring that are radially connected to each other, the heating wire being located radially between the inner positioning ring and the outer positioning ring, and its radial and circumferential position being limited by the combination of the inner positioning ring and the outer positioning ring.

[0011] In one alternative embodiment, the outer positioning ring is composed of at least two segmented rings that are joined together in the circumferential direction.

[0012] In one optional embodiment, the inner positioning ring has a positioning groove for positioning the heating wire. The circumferential width of the positioning groove is adapted to the heating wire so that the heating wire is circumferentially positioned. The positioning groove is axially continuous and has a radially open outer end.

[0013] In one alternative embodiment, the circumferential width of the positioning groove is set such that the outer radial end is greater than the inner radial end.

[0014] In one alternative embodiment, the positioning groove is a trapezoidal groove.

[0015] In one optional embodiment, one of the inner positioning ring and the outer positioning ring has a connecting groove that runs circumferentially and faces the other, and the other can be inserted radially into the connecting groove to complete the connection.

[0016] In one optional embodiment, the outer positioning ring has a connecting groove that runs circumferentially around the perimeter, and the outer end of the inner positioning ring is inserted radially into the connecting groove, such that the heating wire abuts against the inner wall of the positioning groove at one end in the radial direction and against the inner wall of the outer positioning ring facing the heating wire at the other end.

[0017] In one optional embodiment, the heating assembly includes an upper heating assembly and a lower heating assembly, wherein the heating wire and the positioning ring in the upper heating assembly and the lower heating assembly are independent of each other and are separately arranged in the axial direction of the crucible.

[0018] In one alternative embodiment, the heating wires in both the upper heating assembly and the lower heating assembly are formed by a single heating wire that is circumferentially wrapped around the perimeter.

[0019] Secondly, embodiments of this application provide a molecular beam epitaxy apparatus, including any of the heating evaporation source furnaces described above.

[0020] The heating evaporation source furnace and molecular beam epitaxy equipment provided in this application embodiment include: a crucible; a heating assembly sleeved on the crucible; the heating assembly includes: heating wires spaced apart circumferentially on the crucible, all extending axially along the crucible; and positioning rings configured to position the heating wires. The positioning rings include an inner positioning ring and an outer positioning ring radially connected to each other. The heating wires are located radially between the inner and outer positioning rings and their radial and circumferential positions are restricted by the combination of the inner and outer positioning rings. Therefore, the heating evaporation source furnace and molecular beam epitaxy equipment of this application embodiment, by setting the positioning rings as inner and outer positioning rings radially connected to each other, and using the radial clamping and positioning by the inner and outer positioning rings, eliminates the need for repeated axial bending and insertion of the heating wires. Instead, the wires are bent once and embedded radially in one go, reducing installation time and improving production efficiency. Thus, the heating evaporation source furnace and molecular beam epitaxy equipment of this application embodiment improve production efficiency.

[0021] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0023] Figure 1 An isometric schematic diagram of the heating evaporation source furnace provided in the embodiments of this application;

[0024] Figure 2 for Figure 1 A cross-sectional schematic diagram;

[0025] Figure 3 A schematic diagram of a heating component in a heating evaporation furnace provided in an embodiment of this application;

[0026] Figure 4 Another schematic diagram of the heating component in the heating evaporation source furnace provided in the embodiments of this application;

[0027] Figure 5 A schematic diagram showing the disassembly of the outer positioning ring of the heating component in the heating evaporation source furnace provided in the embodiments of this application;

[0028] Figure 6 for Figure 5 A magnified view of a portion of point A in the middle;

[0029] Figure 7 A schematic diagram of the inner positioning ring in the heating evaporation source furnace provided in the embodiments of this application;

[0030] Figure 8 This is a schematic diagram of the outer positioning ring in the heating evaporation source furnace provided in an embodiment of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 10. Flange assembly; 20. Feedthrough assembly; 30. Crucible; 40. Heating assembly; 41. Heating wire; 42. Positioning ring; 421. Inner positioning ring; 4211. Positioning groove; 422. Outer positioning ring; 4221. Connecting groove; 50. Heat insulation cylinder. Detailed Implementation

[0033] To make the technical solutions and beneficial effects of this application more apparent and understandable, the technical solutions in the embodiments of this application are clearly and completely described below by listing specific examples. Obviously, the embodiments of this application are not exhaustive; the described embodiments are only a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] The exemplary embodiments disclosed in this application will now be described in more detail with reference to the accompanying drawings, providing detailed structures and steps to illustrate the technical solution of this application. Note that the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0036] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. To clearly define the inventive concept of this application and avoid confusion with its content, technical features well-known in the art and conventionally understood by those skilled in the art are not elaborated upon. Specifically, this document does not fully list all features of actual embodiments, nor does it provide a detailed description of well-known functions and structures.

[0037] To address the technical problems in related technologies, embodiments of this application provide a heating evaporation source furnace. (Reference) Figures 1-4 The heating evaporation source furnace includes:

[0038] Crucible 30;

[0039] Heating assembly 40 is fitted onto the crucible 30; the heating assembly 40 includes:

[0040] Heating wires 41 are spaced apart around the circumference of the crucible 30, and all heating wires 41 extend along the axial direction of the crucible 30.

[0041] A positioning ring 42 is configured to position the heating wire 41; the positioning ring 42 includes an inner positioning ring 421 and an outer positioning ring 422 that are radially connected to each other, the heating wire 41 is located radially between the inner positioning ring 421 and the outer positioning ring 422, and its radial and circumferential positions are limited by the combination of the inner positioning ring 421 and the outer positioning ring 422.

[0042] The heating evaporation source furnace, also known as the jet furnace, will be referred to as the source furnace for simplicity. Specifically, the source furnace may also include a flange assembly 10, a feedthrough assembly 20, and a heat insulation cylinder 50.

[0043] The flange assembly 10 is the source furnace support structure, providing stable support for the entire heating and evaporation source furnace. At the same time, it also plays an important role in creating and maintaining a vacuum environment, ensuring that the evaporation process takes place under vacuum conditions, avoiding adverse effects such as oxidation of the evaporation material by external air, and guaranteeing the purity of the evaporation material and the stability of the evaporation process.

[0044] The feedthrough assembly 20 provides a power path, enabling the transfer of electrical energy from a power source outside the vacuum to the heating wire 41 inside the vacuum. The feedthrough assembly 20 typically employs special insulating materials and a sealing structure to ensure that electrical energy can be safely and stably transferred to the heating wire 41 in a vacuum environment, while preventing leakage of the vacuum environment.

[0045] A heat insulation cylinder 50 surrounds the heating element 40, isolating the heating element 40 from the outside environment to reduce heat loss and lower the energy consumption of the heating evaporation source furnace. Understandably, the crucible 30 is used to hold the material to be evaporated (such as metals, semiconductor materials, etc.). It is usually made of high-purity, high-temperature resistant, and chemically stable materials, such as pyrolytic boron nitride (PBN), quartz, graphite, or alumina. Its shape is typically cylindrical or conical to suit the evaporation requirements and process specifications of different materials. For example, for materials requiring specific evaporation rates and angles, a conical crucible 30 may be more conducive to uniform evaporation; while a cylindrical crucible 30 is more suitable for applications requiring high evaporation uniformity.

[0046] Specifically, the heating wire 41 can be made of tantalum, which has a high melting point, good high-temperature strength, and oxidation resistance (in a vacuum or inert atmosphere), making it suitable as a resistance heating element. Therefore, the heating assembly 40 is generally also referred to as a tantalum wire furnace. Specifically, the heating wire 41 can be uniformly distributed circumferentially around the crucible 30. The heating wire 41 is linear and generates Joule heat when energized by an external power source. For example, when the heating wire 41 has a power of 500W, the temperature of the crucible 30 can be raised to over 1200°C to meet the evaporation requirements of most semiconductor materials. Specifically, the heating wire 41 can be parallel to the axis of the crucible 30, thus making the heating more uniform. Furthermore, to ensure the stability of the heating effect, the diameter of the heating wire 41 is usually precisely calculated and selected based on the required heating power and resistance value.

[0047] Understandably, at least two positioning rings 42 are provided so that the two ends of the heating wire 41 can be positioned respectively.

[0048] Specifically, the positioning ring 42 can be made of PBN, which, in addition to providing support and fixation, can also achieve electrical insulation between the heating wires 41, effectively preventing short circuits caused by accidental contact between the heating wires 41.

[0049] In the prior art, the positioning ring 42 has through holes corresponding to the number of heating wires 41. After the heating wires 41 pass through the through holes of the positioning ring 42, both ends are fixed to the electrodes of the source furnace, forming a stable heating structure. The positioning ring 42 serves to position and fix the heating wires 41. If the heating wires 41 are relatively long axially, more positioning rings 42 can be set in the area between the two ends of the heating assembly 40, such as in the middle of the axial direction, to provide additional support and prevent the heating wires 41 from undergoing excessive deformation or vibration due to softening at high temperature or electromagnetic force. However, fixing the heating wires 41 by through holes requires the heating wires 41 to be repeatedly bent and inserted through the positioning rings 42, which consumes a lot of installation time and has low production efficiency.

[0050] Therefore, this application embodiment creatively proposes dividing the positioning ring 42 into an inner positioning ring 421 and an outer positioning ring 422 that are radially interconnected. The combination of the inner positioning ring 421 and the outer positioning ring 422 restricts the radial and circumferential positions, thus eliminating the need for the heating wire 41 to be repeatedly bent and inserted through the positioning ring 42. Instead, the bending can be completed in one step, for example, using a bending die on an automated stamping machine. Then, the positioning ring 42 is inserted radially in one go. This significantly reduces installation time and improves production efficiency.

[0051] Understandably, in both the prior art and this application, the heating wire 41 is connected or is a single wire throughout the entire circuit. Therefore, the heating wire 41 needs to be bent at both ends to complete the turning. For example, the heating wire 41 extends upwards to the positioning ring 42 at the upper end of the heating assembly 40, passes through the through hole in the prior art or the positioning groove 4211 in this application, then bends and turns downwards (the shape of the bend is similar to a "U" or an inverted "U") to the positioning ring 42 at the lower end of the heating assembly 40, passes through the through hole in the prior art or the positioning groove 4211 in this application, and then bends and turns again, repeating this process. The difference is that the through hole in the prior art can only be inserted vertically, so it cannot be bent in advance; it can only be bent after insertion. However, the positioning groove 4211 in this application can not only be inserted vertically but also be inserted from the side (radially), so it can be bent in advance. Therefore, this improves the installation efficiency of the heating assembly 40.

[0052] Furthermore, the heating evaporation source furnace of this application embodiment can also extend the service life of the heating wire 41. This is because the innovative design of the heating evaporation source furnace reduces damage to the heating wire 41 during installation and optimizes the working environment of the heating wire 41, thereby extending its service life.

[0053] In some embodiments of this application, reference is made to Figure 5 The outer positioning ring 422 is composed of at least two segmented rings that are joined together in the circumferential direction.

[0054] Understandably, since the outer positioning ring 422 and the inner positioning ring 421 are radially connected, forming at least two segmented rings that circumferentially close together, installation is facilitated. Each segmented ring is a portion of a complete ring formed by circumferential division. In this embodiment, there are two segmented rings, so they can also be considered semi-circular rings. During actual installation, the two semi-circular rings can be respectively fitted onto the heating wire 41 and the inner positioning ring 421 from both sides, and then circumferentially closed. This installation method is more convenient than the traditional installation of a single positioning ring 42, reducing installation difficulty and improving installation efficiency.

[0055] In some embodiments of this application, reference is made to Figure 6 and Figure 7 The inner positioning ring 421 has a positioning groove 4211 for positioning the heating wire 41. The circumferential width of the positioning groove 4211 is adapted to the heating wire 41 so that the heating wire 41 is positioned circumferentially. The positioning groove 4211 is axially continuous and has an open outer end in the radial direction.

[0056] The positioning groove 4211 is closed on its three side walls in the radial direction, except for the opening at its outer end, to accommodate the heating wire 41. The circumferential width of the positioning groove 4211 restricts the circumferential position of the heating wire 41, preventing it from moving left or right within the groove.

[0057] In some embodiments of this application, the circumferential width of the positioning groove 4211 is set such that the outer radial end is greater than the inner radial end.

[0058] This design not only positions the heating wire 41 but also facilitates its radial insertion into the positioning groove 4211. Specifically, the larger outer opening of the positioning groove 4211 guides the heating wire 41. In actual operation, the heating wire 41 is inserted through the wider outer opening of the positioning groove 4211. As it moves inward, its circumferential position is gradually restricted by the narrower inner end of the positioning groove 4211, achieving rapid and accurate installation of the heating wire 41.

[0059] In some embodiments of this application, the positioning groove 4211 is a trapezoidal groove.

[0060] This design achieves a gradual reduction in the circumferential width of the positioning groove 4211 from the outside to the inside, while also facilitating machining. For example, the trapezoidal groove can be quickly formed using processes such as milling in machining. Simultaneously, the trapezoidal structure can withstand the stress generated by the heating wire 41 during operation due to thermal expansion and electromagnetic forces, ensuring the structural stability of the positioning groove 4211.

[0061] Specifically, the inner wall of the positioning groove 4211 is coated with an aluminum nitride (AlN) insulating coating to solve the problem that conductive debris generated by the high-temperature oxidation of tantalum wire may cause a short circuit in adjacent heating wires 41.

[0062] In some embodiments of this application, one of the inner positioning ring 421 and the outer positioning ring 422 has a connecting groove 4221 that runs circumferentially and faces the other, and the other can be inserted radially into the connecting groove 4221 to complete the connection.

[0063] The design of the connecting groove 4221 makes the connection between the inner positioning ring 421 and the outer positioning ring 422 tighter and more stable, while avoiding problems such as loosening and oxidation that may occur when using screws or other connecting parts, thus improving the overall reliability and stability of the positioning ring 42 structure. After connection, the positions of the two mutually limit each other. In this way, if either the inner positioning ring 421 or the outer positioning ring 422 is connected to the flange assembly 10, the position of the entire positioning ring 42 relative to the flange assembly 10 is defined.

[0064] In some embodiments of this application, reference is made to Figure 8The outer positioning ring 422 has a connecting groove 4221 that runs around the circumference. The outer end of the inner positioning ring 421 is inserted into the connecting groove 4221 radially, so that the heating wire 41 abuts against the inner wall of the positioning groove 4211 at one end in the radial direction and abuts against the inner wall of the outer positioning ring 422 facing the heating wire 41 at the other end.

[0065] The inner wall of the positioning groove 4211 can be closer to the bottom of the crucible 30, and the outer positioning ring 422 can face the inner wall of the heating wire 41, or it can be closer to the inner side wall of the crucible 30.

[0066] In this way, the outer positioning ring 422 can circumferentially wrap around the inner positioning ring 421, making the entire structure more stable. Here, the connecting groove 4221 opened in the outer positioning ring 422 can also be opened separately by the dividing rings in the outer positioning ring 422.

[0067] It should be noted that the connecting groove 4221 needs to be configured to have sufficient radial depth so that the other end abuts against the inner wall of the outer positioning ring 422 toward the heating wire 41. Understandably, if the depth is insufficient, the radial position of the outer positioning ring 422 will be restricted by the inner positioning ring 421 and will not be able to abut against the heating wire 41.

[0068] In some embodiments of this application, the heating assembly 40 includes an upper heating assembly 40 and a lower heating assembly 40. The heating wire 41 and the positioning ring 42 in the upper heating assembly 40 and the lower heating assembly 40 are independent of each other and are separately arranged in the axial direction of the crucible 30.

[0069] The upper and lower heating components 40 enable zoned heating, achieving an axial temperature gradient distribution within the crucible 30 and resulting in a more stable evaporation beam. Furthermore, different temperature controls can be applied to the upper and lower parts of the crucible 30, suitable for materials requiring gradient evaporation, such as in the growth of indium (In) gallium (Ga) arsenic (As) alloys, where the indium (In) evaporation temperature is lower than that of gallium (Ga). By adjusting the upper and lower heating power, the In / Ga beam current ratio can be precisely controlled.

[0070] In some embodiments of this application, the heating wires 41 in both the upper heating assembly 40 and the lower heating assembly 40 are formed by a single heating wire 41 wrapped around the perimeter.

[0071] Understandably, the heating wire 41 still needs to extend axially along the crucible 30 when it is circumferentially encircling the crucible 30. It is positioned and fixed in the positioning ring 42 by radially embedded positioning grooves 4211.

[0072] By using a single heating wire 41, the intermediate connecting joints are avoided, the contact resistance of intermediate connections is eliminated, and the heating efficiency is improved.

[0073] This application also provides a molecular beam epitaxy apparatus, which includes the heating evaporation source furnace described above.

[0074] In the molecular beam epitaxy apparatus of this application embodiment, the positioning ring 42 is configured as an inner positioning ring 421 and an outer positioning ring 422 that are radially connected to each other. By clamping and positioning the inner positioning ring 421 and the outer positioning ring 422 in the radial direction, the heating wire 41 does not need to be bent and inserted repeatedly in the axial direction, but is bent once and embedded in the radial direction at once, which reduces the installation time and improves the production efficiency.

[0075] Furthermore, the heating evaporation source furnace of this application embodiment can also extend the service life of the heating wire 41. This is because the innovative design of the heating evaporation source furnace reduces damage to the heating wire 41 during installation and optimizes the working environment of the heating wire 41, thereby extending its service life.

[0076] It should be noted that the various embodiments or implementation methods in this document can be described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually. It should be understood that in the various embodiments of this application, the embodiment numbers are merely for descriptive purposes and do not represent the superiority or inferiority of the embodiments.

[0077] Furthermore, without conflict, the technical features in the technical solutions described in each embodiment can be arbitrarily combined to form new embodiments. For example, each step in each embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined, the order of the steps can be arbitrarily interchanged, and some or all of the steps in different embodiments can be arbitrarily combined. For example, each element, each row, or each column in the table in each embodiment can be implemented as an independent embodiment. For example, any combination of any element, any row, and any column can also be implemented as an independent embodiment.

[0078] In this document, when referring to terms such as "an embodiment," "some embodiments," "one implementation method," "some implementation methods," "illustrative implementation method," "example," "specific example," or "some examples," it means that the specific features, structures, materials, or characteristics described in connection with these implementation methods or examples are all included in at least one implementation method or example of this application. It should be noted that the illustrative expressions of the above terms in this document do not necessarily refer to the same implementation method or example. Furthermore, the specific features, structures, materials, or characteristics described can be appropriately combined in any one or more implementation methods or examples.

[0079] In some embodiments, prefixes such as "first" and "second" are used merely to distinguish different descriptive objects and do not impose restrictions on the position, order, priority, value, or content of the descriptive objects. The description of the descriptive objects should be based on the context of the claims or embodiments, and the use of prefixes should not constitute unnecessary restrictions. For example, the numerical value of a descriptive object is not limited by ordinal numbers and can be one or more. For instance, in "first device," the numerical value of "device" can be one or more. Furthermore, objects modified by different prefixes can be the same or different. For example, if the descriptive object is "device," then "first device" and "second device" can be the same device or different devices, and their types can be the same or different. Describing "first" does not necessarily imply the existence of "second," and discussing "second" does not necessarily imply the existence of "first."

[0080] In some embodiments, the terms "comprising," "including," or any other variations are intended to convey a non-exclusive meaning of inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0081] In some embodiments, unless otherwise stated, elements expressed in the singular form, such as “a,” “an,” “the,” “the,” “the,” “the,” “the,” “the,” “this,” etc., can mean “one and only one,” or “one or more,” “at least one,” etc. For example, when using articles such as “a,” “an,” “the,” etc. in translation, the noun following the article can be understood as either a singular or a plural expression.

[0082] In some embodiments, "multiple" means two or more.

[0083] In some embodiments, the terms “at least one of”, “one or more”, “a plurality of”, “multiple”, etc., may be used interchangeably.

[0084] In some embodiments, the notation "at least one of A and B", "A and / or B", "A in one case, B in another", "A in one case, B in another", etc., may include the following technical solutions depending on the situation: in some embodiments, A (A is executed regardless of B); in some embodiments, B (B is executed regardless of A); in some embodiments, execution is selected from A and B (A and B are selectively executed); in some embodiments, A and B (both A and B are executed). The same applies when there are more branches such as A, B, C, etc.

[0085] In some embodiments, the notation "A or B" may include the following technical solutions, depending on the situation: in some embodiments, A (execution of A regardless of B); in some embodiments, B (execution of B regardless of A); in some embodiments, execution is selected from A and B (A and B are selectively executed). The same applies when there are more branches such as A, B, C, etc.

[0086] In some embodiments, the terms “greater than,” “greater than or equal to,” “not less than,” “more than,” “more than or equal to,” “not less than,” “higher than,” “higher than or equal to,” “not lower than,” and “above” can be used interchangeably, as can the terms “less than,” “less than or equal to,” “not greater than,” “less than,” “less than or equal to,” “not more than,” “lower than,” “lower than or equal to,” “not higher than,” and “below”.

[0087] In some embodiments, devices, etc., can be interpreted as physical or virtual, and their names are not limited to the names recorded in the embodiments. Terms such as “device”, “equipment”, “circuit”, “network element”, “node”, “function”, “unit”, “section”, “system”, “network”, “chip”, “chip system”, “entity”, and “subject” can be used interchangeably.

[0088] In some embodiments, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0089] In some embodiments, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “height,” “up,” “down,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limitations on this application.

[0090] In some embodiments, unless otherwise expressly defined, "above," "on top of," "over," "above," "below," "below," or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. "Below," "below," and "below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0091] In some embodiments, spatial relation terms such as “below,” “under,” “below,” “below,” “above,” “above,” etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, then the element or feature described as “below” or “below” other elements or features will be oriented “above” other elements or features. Thus, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0092] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the technical solutions contained in this application. Various modifications and changes can be made to the above embodiments without departing from the scope of this application. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments merely illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A heating evaporation source furnace, characterized in that, include: crucible; A heating assembly is fitted onto the crucible; the heating assembly includes: Heating wires are spaced apart around the circumference of the crucible, and all heating wires extend along the axial direction of the crucible. A positioning ring is configured to position the heating wire; the positioning ring includes an inner positioning ring and an outer positioning ring that are radially connected to each other, the heating wire being located radially between the inner positioning ring and the outer positioning ring, and its radial and circumferential position being limited by the combination of the inner positioning ring and the outer positioning ring.

2. The heating evaporation source furnace according to claim 1, characterized in that, The outer positioning ring is composed of at least two segmented rings that are joined together circumferentially.

3. The heating evaporation source furnace according to claim 2, characterized in that, The inner positioning ring has a positioning groove for positioning the heating wire. The circumferential width of the positioning groove is adapted to the heating wire so that the heating wire is positioned circumferentially. The positioning groove is axially continuous and has an open outer end in the radial direction.

4. The heating evaporation source furnace according to claim 3, characterized in that, The circumferential width of the positioning groove is set such that the outer radial end is greater than the inner radial end.

5. The heating evaporation source furnace according to claim 4, characterized in that, The positioning groove is a trapezoidal groove.

6. The heating evaporation source furnace according to claim 3, characterized in that, One of the inner positioning ring and the outer positioning ring has a connecting groove that runs circumferentially and faces the other, and the other can be inserted radially into the connecting groove to complete the connection.

7. The heating evaporation source furnace according to claim 6, characterized in that, The outer positioning ring has a connecting groove that runs circumferentially around the perimeter. The outer end of the inner positioning ring is inserted into the connecting groove radially, so that the heating wire abuts against the inner wall of the positioning groove at one end in the radial direction and against the inner wall of the outer positioning ring facing the heating wire at the other end.

8. The heating evaporation source furnace according to claim 7, characterized in that, The heating assembly includes an upper heating assembly and a lower heating assembly. The heating wire and the positioning ring in the upper heating assembly and the lower heating assembly are independent of each other and are separately arranged in the axial direction of the crucible.

9. The heating evaporation source furnace according to claim 8, characterized in that, The heating wires in both the upper and lower heating components are formed by a single heating wire wrapped around the circumference.

10. A molecular beam epitaxy apparatus, characterized in that, Includes the heating evaporation source furnace as described in any one of claims 1-9.

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