A semiconductor chip pin detection apparatus

Abstract

The utility model discloses a semiconductor chip pin detection equipment relates to semiconductor chip detection technical field, including base, the base top is opened with rectangular recess, and the inside setting of rectangular recess is with the boss of base flush, and the inside setting of boss is with island platform, and the spring is arranged between island platform and base, and the side surface of base is opened with the through slot of communication with the sliding slot, and the inside setting of through slot is with the sliding block, and the one end of sliding block is abutted with the rotating block away from through slot, and the side surface of boss is evenly spaced and is provided with the contact point of adaptation with chip pin one round, and the operator can cover chip in the boss top and press down, and the island platform is removed to the down during pressing process, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform, and the sliding block is removed to the down during the island platform

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip testing technology, and in particular to a semiconductor chip pin testing device. Background Technology

[0002] The connection between semiconductor chips and devices is made through pins. During the semiconductor chip manufacturing process, it is impossible to determine whether the pins are qualified or whether the chip can transmit information based solely on the operator's experience or visual observation. Therefore, testing equipment is used to test the pins of semiconductor chips.

[0003] Most existing testing equipment uses a quick-release mounting bracket to quickly install chips for testing and then quickly remove them. However, this installation method requires precise operation by the operator; otherwise, the chip's pins may be bent, deformed, or otherwise damaged, leading to the need for chip repair or even scrapping. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this invention is to provide a semiconductor chip pin testing device that solves the problem of damage to the pins during the testing process.

[0005] The technical solution of this utility model is as follows: a semiconductor chip pin detection device, including a base, a rectangular groove on the top of the base, a boss flush with the base inside the rectangular groove, the boss occupying the internal space of the rectangular groove to form a frame-shaped groove, an island extending through the boss and into the base is inserted inside the boss, the insertion position of the island forming a sliding groove inside the boss, a mounting hole on the bottom of the island, a spring connected to the base is installed on the island through the mounting hole, a through groove communicating with the sliding groove is opened on the side surface of the base, a slider is provided inside the through groove, the slider has inclined chamfers at both ends, a rotating block abuts at the end of the slider away from the through groove, the rotating block extends vertically upward into the rectangular groove, a torsion spring is provided between the rotating block and the base, and contacts adapted to chip pins are evenly spaced around the side surface of the boss, the contacts being electrically connected to external detection instruments.

[0006] Furthermore, the island platform is divided into a contact part and a pushing part. The contact part is a rectangular plate structure, and the pushing part is a vertical rectangular column structure. The bottom of the pushing part of the island platform is provided with an inclined chamfer to ensure that the island platform can move by pushing the slider through the vertical part during downward movement.

[0007] Furthermore, the spring is always in a relaxed state, with its two ends connected to the island platform and the base respectively, so that the spring can always push the island platform outward, causing the island platform to extend beyond the surface of the boss and provide a certain supporting force to the island platform.

[0008] Furthermore, the rotating block is T-shaped in general, wherein the parallel part extends to both sides along the rectangular groove and is flush with the boss, and the vertical part is connected to the torsion spring. The bottom of the vertical part of the rotating block is provided with an inclined surface that matches the inclined chamfer of the slider, so that the parallel part of the rotating block has sufficient length to match the boss, while the inclined surface of the vertical part can ensure smooth contact between the rotating block and the slider.

[0009] Furthermore, a clearance groove is provided on the side of the rectangular groove near the vertical portion of the rotating block to avoid affecting the rotation of the rotating block.

[0010] Furthermore, a flexible rubber pad is adhered to the surface of the horizontal portion of the rotating block, which insulates the horizontal portion of the rotating block itself to prevent short circuits when the rotating block contacts the pin.

[0011] Furthermore, the rotation direction of the torsion spring is always to drive the rotating block away from the boss, ensuring that the rotating block can reset itself while pushing the slider to reset through the vertical part of the rotating block.

[0012] The beneficial effects of this utility model are as follows:

[0013] This invention uses a spring to make the island protrude from the boss. The operator can cover the top of the boss with the chip and press it down. During the pressing process, the island moves downward. As the island moves, the inclined surface pushes the slider, which in turn pushes the rotating block to rotate. The horizontal part of the rotating block approaches the boss and squeezes the chip's pins, making the pins and contacts fully contact. In the whole process, the chip's pins are not only subjected to the holding forces from both sides, but the operator only needs to align the chip with the boss and press it down. The whole process is simple and quick to operate and will not cause the pins to be twisted or deformed by additional force, thus scrapping the chip. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the base structure of this utility model;

[0016] Figure 3 This is a cross-sectional view of the base of this utility model;

[0017] Figure 4 This is a cross-sectional view of the island platform in the compressed state of this utility model.

[0018] Reference numerals in the attached drawings: 1. Base; 2. Rectangular groove; 3. Boss; 4. Island; 5. Mounting hole; 6. Spring; 7. Through groove; 8. Slider; 9. Rotating block; 10. Torsion spring; 11. Contact point; 31. Slide groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] like Figure 1-4 As shown, a semiconductor chip pin detection device includes a base 1. A rectangular groove 2 is provided on the top of the base 1. A boss 3 flush with the base 1 is provided inside the rectangular groove 2. The boss 3 occupies the internal space of the rectangular groove 2, making the rectangular groove 2 form a frame-shaped groove. An island 4 extending through the boss 3 and into the base 1 is inserted into the boss 3. The insertion position of the island 4 forms a sliding groove 31 in the boss 3. A mounting hole 5 is provided at the bottom of the island 4. A spring 6 connected to the base 1 is installed on the island 4 through the mounting hole 5. The spring 6 is always in a relaxed state. Its two ends are connected to the island 4 and the base 1 respectively, so that the spring 6 can always push the island 4 outward, so that the island 4 extends out of the surface of the boss 3 and provides a certain support force to the island 4.

[0021] The side surface of the base 1 is provided with a through groove 7 that communicates with the slide groove 31. A slider 8 is provided inside the through groove 7. The slider 8 has inclined chamfers at both ends. The island platform 4 is divided into a contact part and a pushing part. The contact part is a rectangular plate structure, and the pushing part is a vertical rectangular column structure. The bottom of the pushing part of the island platform 4 is provided with an inclined chamfer around the perimeter to ensure that the island platform 4 can move by pushing the slider 8 through the vertical part during downward movement.

[0022] The end of the slider 8 furthest from the through groove 7 abuts against a rotating block 9. The rotating block 9 extends vertically upward into the rectangular groove 2. A torsion spring 10 is provided between the rotating block 9 and the base 1. The rotating block 9 is T-shaped, with its parallel portion extending along both sides of the rectangular groove 2 to be flush with the boss 3, and its vertical portion connected to the torsion spring 10. The bottom of the vertical portion of the rotating block 9 has an inclined surface adapted to the chamfer of the slider 8, ensuring that the parallel portion of the rotating block 9 has sufficient length to fit the boss 3, while the inclined surface of the vertical portion ensures smooth contact between the rotating block 9 and the slider 8. A clearance groove is provided on the side near the vertical part of the rotating block 9 to avoid affecting the rotation of the rotating block 9. A flexible rubber pad is adhered to the surface of the horizontal part of the rotating block 9 to insulate the horizontal part of the rotating block 9 and prevent short circuit when the rotating block 9 contacts the pin. The rotation direction of the torsion spring 10 is to always drive the rotating block 9 away from the side of the boss 3, ensuring that the rotating block 9 can reset itself and push the slider 8 to reset through the vertical part of the rotating block 9. The side surface of the boss 3 is evenly spaced with contacts 11 that are adapted to the chip pins. The contacts 11 are electrically connected to the peripheral detection instruments.

[0023] Working principle of this utility model:

[0024] First, the operator aligns the chip vertically with the boss 3, ensuring the bottom pins of the chip are aligned with the rectangular groove 2. Then, the operator presses the chip down, causing it to move downwards and push the island 4. The island 4 then moves downwards, pushing the slider 8. Simultaneously, the moving island 4 compresses the spring 6, pushing the slider 8 along the through groove 7. During this movement, it pushes the rotating block 9, causing it to rotate along the torsion spring 10. During this rotation, the top horizontal portion of the rotating block 9 tilts towards the rectangular groove 2, contacting the chip's pins that are inserted into the groove 2 and pressing them against the contact point 11 on the surface of the boss 3. After the contact point 11 contacts the pins, the testing instrument can detect the chip pins. After the detection is complete, the operator stops pressing the chip. At this point, the island 4 loses pressure and, under the action of the spring 6, moves upwards to reset, pushing the chip away from the boss 3. After the island 4 moves upwards, one end of the slider 8 loses its restraint and is no longer pushed by the rotating block 9. The rotating block 9, having lost its thrust, rotates again under the action of the torsion spring 10, simultaneously pushing the slider 8 closer to the island 4 to complete the reset. The operator can then repeat the above operation for the next chip.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip pin detection device, comprising a base (1), characterized in that: The base (1) has a rectangular groove (2) at its top. Inside the rectangular groove (2) is a boss (3) flush with the base (1). The boss (3) occupies the space inside the rectangular groove (2), making the rectangular groove (2) form a frame-shaped groove. An island platform (4) extending through the boss (3) and into the base (1) is inserted inside the boss (3). The insertion position of the island platform (4) forms a sliding groove (31) inside the boss (3). The bottom of the island platform (4) has a mounting hole (5). A spring connected to the base (1) is installed on the island platform (4) through the mounting hole (5). 6) A through groove (7) communicating with the slide groove (31) is provided on the side surface of the base (1). A slider (8) is provided inside the through groove (7). The slider (8) has inclined chamfers at both ends. The end of the slider (8) away from the through groove (7) abuts against a rotating block (9). The rotating block (9) extends vertically upward into the rectangular groove (2). A torsion spring (10) is provided between the rotating block (9) and the base (1). The side surface of the boss (3) is evenly spaced with contacts (11) that are compatible with the chip pins. The contacts (11) are electrically connected to the peripheral detection device.

2. The semiconductor chip pin detection device according to claim 1, characterized in that: The island platform (4) is divided into a contact part and a pushing part. The contact part is a rectangular plate structure, and the pushing part is a vertical rectangular column structure. The bottom of the pushing part of the island platform (4) is provided with an inclined chamfer.

3. The semiconductor chip pin detection device according to claim 1, characterized in that: The spring (6) is always in a relaxed state, and its two ends are connected to the island platform (4) and the base (1) respectively.

4. The semiconductor chip pin detection device according to claim 1, characterized in that: The rotating block (9) is T-shaped in general. The parallel part extends along the rectangular groove (2) to both sides and is flush with the boss (3). The vertical part is connected to the torsion spring (10). The bottom of the vertical part of the rotating block (9) is provided with an inclined surface that matches the inclined chamfer of the slider (8).

5. A semiconductor chip pin detection device according to claim 4, characterized in that: The rectangular groove (2) has a clearance groove on one side near the vertical part of the rotating block (9).

6. A semiconductor chip pin detection device according to claim 4, characterized in that: The horizontal portion of the rotating block (9) is covered with a flexible rubber pad.

7. A semiconductor chip pin detection device according to claim 1, characterized in that: The rotation direction of the torsion spring (10) is such that it always drives the rotating block (9) away from the boss (3).

Images