High-precision semiconductor device probe testing tool

Abstract

The utility model discloses a high accuracy semiconductor device probe test frock, including frock base and side plate, one end is installed in frock base top side plate, and frock base top is installed servo motor B away from one end of side plate, the output of servo motor B is installed screw rod, and the outside screw thread of screw rod is installed screw pipe, the top of screw pipe is installed T type board. The utility model installs semiconductor device placement tray, push board, push board and push rod, when using, can place semiconductor device in semiconductor device placement tray inside and test, after testing, can push push board to upper side, make push rod push push board and move to upper side, can push semiconductor device from semiconductor device placement tray inside to the outside, thereby convenient for taking out semiconductor device, in the testing process, push board also can not touch probe, can not cause the influence to the testing process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing fixture technology, specifically to a high-precision semiconductor device probe testing fixture. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the special electrical properties of semiconductor materials to perform specific functions. When processing semiconductor devices such as wafers, they need to be placed on a movable stage and tested at close range using probes.

[0003] The invention patent with announcement number CN115267472A discloses a semiconductor wafer probe testing fixture. The patent uses two first support rods to lift the entire carrier plate and support plate, thereby allowing the probe and wafer to quickly approach each other. After the test is completed, the output shaft of the adjusting motor is started to rotate in the opposite direction, which makes the wafer and probe move away from each other, thus making it easier to remove the wafer.

[0004] However, in the implementation of this patent, the wafer is fixed by a spring pulling a baffle. During testing, the baffle is prone to touching the probe, causing it to move under force. This prevents the baffle from limiting the wafer from the side, which can easily cause the wafer to fall out of the U-shaped frame and affect the testing process. Therefore, this utility model provides a high-precision semiconductor device probe testing fixture to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a high-precision semiconductor device probe testing fixture to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-precision semiconductor device probe testing fixture, comprising a fixture base and a side plate. A side plate is mounted on one end of the top of the fixture base, and a servo motor B is mounted on the end of the top of the fixture base away from the side plate. A threaded rod is mounted on the output end of the servo motor B, and a threaded tube is mounted on the outer thread of the threaded rod. A T-shaped plate is mounted on the top of the threaded tube, and sliding components C are mounted on both ends of the top of the T-shaped plate. A slider B is slidably mounted on the top of each sliding component C, and a sliding plate is mounted on the top of the slider B. A servo motor A is mounted on the bottom end of the T-shaped plate away from the side plate, and the sliding plate is mounted on the end away from the side plate. A rack is installed at one end of the plate. Fixed plates are installed at both ends of the top of the sliding plate, and sliding components A are installed on the inner side of each fixed plate. A lifting plate is slidably installed on the inner side of the sliding component A, and connecting plates are installed at both ends of the top of the lifting plate. A semiconductor device placement tray is installed on the top of the connecting plate. An electric telescopic rod is installed at the middle position of the bottom of the sliding plate. A control panel is installed at the bottom of the side plate away from the servo motor B, and a top plate is installed on the top of the side plate. A probe is installed at the end of the top plate away from the side plate. The output end of the control panel is electrically connected to the input ends of the servo motor A, servo motor B, and electric telescopic rod respectively through wires.

[0007] Preferably, a mounting hole is provided at the middle position of the bottom of the semiconductor device placement tray, and a push rod is installed inside the mounting hole. The push rod passes through the mounting hole and extends into the interior of the semiconductor device placement tray, and a push plate is installed on the top of the push rod.

[0008] Preferably, a push plate is installed at the bottom of the push rod, and springs are installed at both ends of the top of the push plate. The ends of the springs away from the push plate are connected to the semiconductor device placement tray.

[0009] Preferably, the output end of the electric telescopic rod passes through the sliding plate, and the output end of the electric telescopic rod is connected to the lifting plate.

[0010] Preferably, the output end of the servo motor A is equipped with a rotating shaft, which passes through a T-shaped plate, and a gear that meshes with a rack is installed on the top of the rotating shaft.

[0011] Preferably, a sliding component B is installed on the top of the tooling base, and a slider A is slidably installed on the top of the sliding component B, with the end of the slider A away from the sliding component B connected to a threaded pipe.

[0012] Preferably, a bearing is installed at the top of the tooling base away from the servo motor B, and a rotating rod is installed inside the bearing. The end of the rotating rod away from the bearing is connected to a threaded rod.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This high-precision semiconductor device probe testing fixture is equipped with a semiconductor device placement tray, a push plate, a push rod, and a push rod. During use, the semiconductor device can be placed inside the semiconductor device placement tray for testing. After the test, the push plate can be pushed upwards, causing the push rod to push the push plate upwards, thus pushing the semiconductor device out of the semiconductor device placement tray, making it easy to remove the semiconductor device. During the test, the push plate will not touch the probe and will not affect the test process.

[0015] 2. This high-precision semiconductor device probe testing fixture is equipped with a threaded rod, a threaded tube, servo motor A, servo motor B, gears, a rotating shaft, and a rack. In use, servo motor B drives the threaded rod to rotate, causing the threaded tube to move outside the threaded rod through the thread. Servo motor A drives the gear to rotate through the rotating shaft, which in turn drives the sliding plate to move through the rack. This allows for adjustment of the position of the semiconductor device placement tray and precise adjustment of the testing position of the semiconductor device.

[0016] 3. The high-precision semiconductor device probe testing fixture is equipped with a fixed plate, a sliding component A, a lifting plate, and an electric telescopic rod. In use, the electric telescopic rod pushes the lifting plate to move, which moves the semiconductor device placement tray upward, thereby pushing the semiconductor device closer to the probe, facilitating the testing of the semiconductor device. Attached Figure Description

[0017] Figure 1 This is a schematic front sectional view of the present invention;

[0018] Figure 2 This is a top view of the T-shaped plate of this utility model;

[0019] Figure 3 This is a top view of the sliding plate of this utility model.

[0020] Figure 4 This utility model Figure 1 Enlarged view of the structure at point A in the image.

[0021] In the diagram: 1. Tooling base; 2. Bearing; 3. Rotating rod; 4. Control panel; 5. T-shaped plate; 6. Sliding plate; 7. Fixing plate; 8. Sliding assembly A; 9. Semiconductor device placement tray; 10. Probe; 11. Top plate; 12. Push plate; 13. Threaded rod; 14. Sliding assembly B; 15. Threaded tube; 16. Slider A; 17. Servo motor A; 18. Servo motor B; 19. Connecting plate; 20. Lifting plate; 21. Electric telescopic rod; 22. Gear; 23. Rotating shaft; 24. Sliding assembly C; 25. Slider B; 26. Rack; 27. Spring; 28. Push plate; 29. ​​Push rod; 30. Mounting hole; 31. Side plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides an embodiment of a high-precision semiconductor device probe testing fixture, comprising a fixture base 1 and a side plate 31. The side plate 31 is mounted on one end of the top of the fixture base 1, and a servo motor B18 (model MR-J2S-10A) is mounted on the end of the top of the fixture base 1 away from the side plate 31. The output end of the servo motor B18 is fitted with a threaded rod 13, and a threaded tube 15 is threaded onto the outer thread of the threaded rod 13. A T-shaped plate 5 is mounted on the top of the threaded tube 15, and sliding components C24 are mounted on both ends of the top of the T-shaped plate 5. A slider B25 is slidably mounted on the top of each sliding component C24, and a sliding plate 6 is mounted on the top of the slider B25. A servo motor A17 (model MR-J2S-10A) is mounted on the bottom end of the T-shaped plate 5 away from the side plate 31. A rack 26 is installed at the end of the moving plate 6 away from the side plate 31. Fixed plates 7 are installed at both ends of the top of the sliding plate 6, and sliding components A8 are installed on the inner side of the fixed plates 7. A lifting plate 20 is slidably installed on the inner side of the sliding components A8, and connecting plates 19 are installed at both ends of the top of the lifting plate 20. A semiconductor device placement tray 9 is installed on the top of the connecting plate 19. An electric telescopic rod 21 is installed at the middle position of the bottom of the sliding plate 6. The electric telescopic rod 21 can be model J64RT2UNIVER. A control panel 4 is installed at the bottom of the side plate 31 away from the servo motor B18, and a top plate 11 is installed on the top of the side plate 31. A probe 10 is installed at the end of the top plate 11 away from the side plate 31. The output end of the control panel 4 is electrically connected to the input end of the servo motor A17, the servo motor B18 and the electric telescopic rod 21 through wires.

[0024] like Figure 1-4As shown, a mounting hole 30 is provided at the middle position of the bottom of the semiconductor device placement tray 9, and a push rod 29 is installed inside the mounting hole 30. The push rod 29 passes through the mounting hole 30 and extends into the interior of the semiconductor device placement tray 9. A push plate 12 is installed on the top of the push rod 29, and a push plate 28 is installed on the bottom of the push rod 29. Springs 27 are installed at both ends of the top of the push plate 28. The ends of the springs 27 away from the push plate 28 are connected to the semiconductor device placement tray 9. After the test, the push plate 28 can be pushed upward, so that the push rod 29 pushes the push plate 12 upward, thereby pushing the semiconductor device out of the semiconductor device placement tray 9, which facilitates the removal of the semiconductor device. During the test, the push plate 12 will not touch the probe 10 and will not affect the test process.

[0025] like Figure 1 As shown, the output end of the electric telescopic rod 21 passes through the sliding plate 6 and is connected to the lifting plate 20. When in use, the electric telescopic rod 21 pushes the lifting plate 20 to move, which can move the semiconductor device placement tray 9 upward, thereby pushing the semiconductor device closer to the probe 10, which is convenient for testing the semiconductor device.

[0026] like Figure 1-3 As shown, a rotating shaft 23 is installed at the output end of the servo motor A17. The rotating shaft 23 passes through the T-shaped plate 5, and a gear 22 that meshes with the rack 26 is installed on the top of the rotating shaft 23. The servo motor A17 drives the gear 22 to rotate through the rotating shaft 23, which in turn drives the sliding plate 6 to move through the rack 26. This allows for adjustment of the position of the semiconductor device placement tray 9 and precise adjustment of the test position of the semiconductor device.

[0027] like Figure 1 As shown, a sliding component B14 is installed on the top of the tooling base 1, and a slider A16 is slidably installed on the top of the sliding component B14. The end of the slider A16 away from the sliding component B14 is connected to the threaded tube 15. By limiting the threaded tube 15 through the slider A16, the threaded tube 15 can be prevented from rotating together with the threaded rod 13. A bearing 2 is installed on the top of the tooling base 1 away from the servo motor B18, and a rotating rod 3 is installed inside the bearing 2. The end of the rotating rod 3 away from the bearing 2 is connected to the threaded rod 13, which can securely install both ends of the threaded rod 13, making the rotation of the threaded rod 13 more stable.

[0028] Working principle:

[0029] When in use, connect the device to the power supply, and then place the semiconductor device to be tested inside the semiconductor device placement tray 9. The operator can start the servo motor B18 through the control panel 4, so that the servo motor B18 drives the threaded rod 13 to rotate clockwise. The threaded tube 15 on the outside of the threaded rod 13 is limited by the slider A16, so that the threaded tube 15 cannot rotate with the threaded rod 13, so that the threaded tube 15 can only move towards the side plate 31 through the thread.

[0030] At this time, the threaded tube 15 drives the slider A16 to slide along a straight line on the sliding assembly B14, and the threaded tube 15 drives the T-shaped plate 5 to move together, so that the semiconductor device placement tray 9 can be moved to the bottom of the probe 10 for testing.

[0031] During the test, the electric telescopic rod 21 is activated through the control panel 4, which pushes the lifting plate 20 upward, so that the semiconductor device inside the semiconductor device placement tray 9 can be brought close to the probe 10 for testing.

[0032] Meanwhile, staff can start the servo motor A17 through the control panel 4, so that the servo motor A17 drives the gear 22 to rotate through the shaft 23, and the gear 22 drives the sliding plate 6 to move through the rack 26, thereby adjusting the horizontal position of the semiconductor device placement tray 9, and thus precisely adjusting the test position of the semiconductor device.

[0033] After the test is completed, the electric telescopic rod 21 can be started through the control panel 4, so that the electric telescopic rod 21 pulls the lifting plate 20 upward, which can move the semiconductor device inside the semiconductor device placement tray 9 away from the probe 10.

[0034] Then, the staff can start the servo motor B18 through the control panel 4, so that the servo motor B18 drives the threaded rod 13 to rotate counterclockwise. The threaded tube 15 on the outside of the threaded rod 13 is limited by the slider A16, so that the threaded tube 15 cannot rotate with the threaded rod 13, so that the threaded tube 15 can only move away from the side plate 31 through the thread.

[0035] At this time, the threaded tube 15 drives the slider A16 to slide along a straight line on the sliding assembly B14, and the threaded tube 15 drives the T-shaped plate 5 to move together, so that the semiconductor device placement tray 9 can be moved away from under the probe 10.

[0036] The staff can push the push plate 28 upward, so that the push plate 28 pushes the push plate 12 upward through the push rod 29, and the semiconductor device can be pushed out from the semiconductor device placement tray 9 through the push plate 12, so as to facilitate the removal of the semiconductor device.

[0037] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-precision semiconductor device probe testing fixture, comprising a fixture base (1) and a side plate (31), characterized in that: A side plate (31) is installed at one end of the top of the tooling base (1), and a servo motor B (18) is installed at the end of the top of the tooling base (1) away from the side plate (31). A threaded rod (13) is installed at the output end of the servo motor B (18), and a threaded tube (15) is installed on the outer thread of the threaded rod (13). A T-shaped plate (5) is installed at the top of the threaded tube (15), and sliding components C (24) are installed at both ends of the top of the T-shaped plate (5). A slider B (25) is slidably installed at the top of the sliding components C (24), and a sliding plate (6) is installed at the top of the slider B (25). A servo motor A (17) is installed at the bottom of the T-shaped plate (5) away from the side plate (31), and a rack (26) is installed at the end of the sliding plate (6) away from the side plate (31). A fixed plate (7) is installed, and a sliding component A (8) is installed on the inner side of the fixed plate (7). A lifting plate (20) is slidably installed on the inner side of the sliding component A (8). A connecting plate (19) is installed at both ends of the top of the lifting plate (20). A semiconductor device placement tray (9) is installed on the top of the connecting plate (19). An electric telescopic rod (21) is installed at the middle position of the bottom of the sliding plate (6). A control panel (4) is installed at the bottom of the side plate (31) away from the servo motor B (18). A top plate (11) is installed on the top of the side plate (31). A probe (10) is installed at the end of the top plate (11) away from the side plate (31). The output end of the control panel (4) is electrically connected to the input end of the servo motor A (17), the servo motor B (18) and the electric telescopic rod (21) respectively through wires.

2. The high-precision semiconductor device probe testing fixture according to claim 1, characterized in that: A mounting hole (30) is provided at the middle position of the bottom of the semiconductor device placement tray (9), and a push rod (29) is installed inside the mounting hole (30). The push rod (29) passes through the mounting hole (30) and extends into the interior of the semiconductor device placement tray (9), and a push plate (12) is installed on the top of the push rod (29).

3. The high-precision semiconductor device probe testing fixture according to claim 2, characterized in that: The bottom of the push rod (29) is equipped with a push plate (28), and both ends of the top of the push plate (28) are equipped with springs (27). The ends of the springs (27) away from the push plate (28) are connected to the semiconductor device placement tray (9).

4. The high-precision semiconductor device probe testing fixture according to claim 1, characterized in that: The output end of the electric telescopic rod (21) passes through the sliding plate (6), and the output end of the electric telescopic rod (21) is connected to the lifting plate (20).

5. The high-precision semiconductor device probe testing fixture according to claim 1, characterized in that: The output end of the servo motor A (17) is equipped with a rotating shaft (23), which passes through the T-shaped plate (5), and a gear (22) that meshes with the rack (26) is installed on the top of the rotating shaft (23).

6. The high-precision semiconductor device probe testing fixture according to claim 1, characterized in that: The tooling base (1) is equipped with a sliding component B (14) on its top, and a slider A (16) is slidably mounted on the top of the sliding component B (14). The end of the slider A (16) away from the sliding component B (14) is connected to the threaded pipe (15).

7. The high-precision semiconductor device probe testing fixture according to claim 1, characterized in that: The tooling base (1) has a bearing (2) installed at the end away from the servo motor B (18) on the top, and a rotating rod (3) is installed inside the bearing (2). The end of the rotating rod (3) away from the bearing (2) is connected to the threaded rod (13).

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