An electrical performance testing device for semiconductor chips

Abstract

The utility model discloses a kind of electrical performance detection devices for semiconductor chip, it is related to the field of semiconductor manufacturing, including processing station, and the top of processing station is equipped with moving assembly, and the moving end of moving assembly is installed with detection assembly, and the top of processing station is equipped with bottom plate, and the top of bottom plate is fixedly connected with arc plate, and two groups of support strip groups are symmetrically equipped in the top of bottom plate between arc plate both sides, each group of support strip group includes two parallelly arranged support strips, and between corresponding support strip of arc plate both sides, driving pulley and driven pulley are rotatably connected respectively, and driving pulley is driven connection with driven pulley by belt, the utility model is placed by the support piece of equidistance distribution outside both sides belt, forms multilayer wafer bearing structure, and operator can place multiple wafer at a time, realizes batch continuous detection, and layered structure reduces single feeding frequency, significantly shortens auxiliary time.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a device for testing the electrical performance of semiconductor chips. Background Technology

[0002] During the semiconductor chip manufacturing process, electrical performance testing is required to verify whether the chip's electrical performance parameters (such as voltage, current, resistance, leakage current, etc.) meet the design specifications. This is a crucial step in ensuring the chip's functional reliability, stability, and yield.

[0003] Traditional equipment typically uses a single-layer belt or linear track to transport wafers, carrying only one chip at a time for testing. Loading and unloading require frequent manual intervention. For example, operators must manually place the wafer at a designated position on the conveyor belt and remove it after testing. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor chip electrical performance testing device that solves the problems of easy chip slippage and low efficiency of manual operation in traditional testing methods.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows: A semiconductor chip electrical performance testing device includes a processing table, a moving component on the top of the processing table, a testing component installed at the moving end of the moving component, a base plate on the top of the processing table, an arc plate fixedly connected to the top of the base plate, two sets of support strips symmetrically arranged on both sides of the arc plate on the top of the base plate, each set of support strips including two parallel support strips, a driving pulley and a driven pulley rotatably connected between the corresponding support strips on both sides of the arc plate, the driving pulley being connected to the driven pulley via a belt, a plurality of trays for supporting semiconductor chip wafers being distributed equidistantly on the outer side of the belt, and a driving component installed on the top of the base plate for driving the driving pulleys on both sides to rotate synchronously.

[0006] Preferably, the drive assembly includes a motor, a rotating rod, a driving helical gear, and a driven helical gear. The rotating rod is provided on the top of the base plate, and its two ends are rotatably connected to the support bar groups on both sides. Two driving helical gears are symmetrically provided on the outer side of the rotating rod. A driven helical gear is connected to one side of each driving pulley. The driven helical gear meshes with the corresponding driving helical gear. A motor is fixedly installed on one side of one of the support bar groups, and the output end of the motor is fixedly connected to the corresponding end of the rotating rod.

[0007] Preferably, a support platform is fixedly connected to the top of the base plate between the two sets of support bars. The support platform is used to limit the minimum height when loading the wafer.

[0008] Preferably, the top of the base plate is provided with a movable arc plate, which cooperates with the arc plate to limit the displacement of the wafer in the horizontal direction and prevent the wafer from detaching from the tray due to vibration or collision during the testing process.

[0009] Preferably, the support bar assembly has a groove along the vertical direction on the side near the wafer, and the two sides of the movable arc plate are symmetrically provided with slide bars, which slide in cooperation with the corresponding slide grooves to facilitate the installation and disassembly of the movable arc plate.

[0010] Preferably, a soft pad is fixed on the upper surface of the tray to protect the back of the wafer from mechanical damage.

[0011] Preferably, the processing table is equipped with support feet at all four corners of its bottom to support the bottom four corners of the processing table.

[0012] Compared with the prior art, the advantages of this utility model are as follows:

[0013] 1. This utility model forms a multi-layered wafer support structure by using trays evenly distributed on the outer sides of the belts on both sides. Operators can place multiple wafers at once to achieve batch continuous testing. The layered structure reduces the number of times a single loading is performed, significantly shortening the auxiliary time. The drive component uses a motor to drive the rotating rod, and through the meshing transmission of the active helical gear and the driven helical gear, the synchronous rotation of the active pulleys on both sides is achieved, ensuring the consistency of the belt movement on both sides. The synchronous transmission avoids belt deviation or wafer tilting caused by unilateral drive.

[0014] 2. The curved plate and the movable curved plate of this utility model constitute a lateral guiding and limiting system for the wafer. The curved surface of the curved plate fits the outer contour of the wafer, providing initial lateral support. The movable curved plate can be quickly disassembled and reset through the cooperation of the sliding groove and the sliding strip. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the arc-shaped plate structure of this utility model.

[0017] Figure 3 This is a schematic diagram of the support strip assembly structure of this utility model.

[0018] Figure 4 This is a schematic diagram of the movable arc plate structure of this utility model.

[0019] Reference numerals: 1. Processing table; 2. Moving component; 3. Detection component; 4. Base plate; 5. Arc plate; 6. Support bar assembly; 7. Driving pulley; 8. Driven pulley; 9. Belt; 10. Wafer; 11. Support plate; 12. Drive assembly; 121. Motor; 122. Rotating rod; 123. Driving helical gear; 124. Driven helical gear; 13. Support platform; 14. Movable arc plate; 16. Slide groove; 17. Slide bar; 18. Support foot. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figures 1 to 4 This embodiment provides a semiconductor chip electrical performance testing device, including a processing table 1, a moving component 2 on the top of the processing table 1, a testing component 3 installed at the moving end of the moving component 2, a base plate 4 on the top of the processing table 1, an arc plate 5 fixedly connected to the top of the base plate 4, two sets of support strips 6 symmetrically arranged on both sides of the arc plate 5 on the top of the base plate 4, each set of support strips 6 including two parallel support strips, a driving pulley 7 and a driven pulley 8 rotatably connected between the corresponding support strips on both sides of the arc plate 5, the driving pulley 7 being connected to the driven pulley 8 via a belt 9, a plurality of trays 11 for supporting semiconductor chip wafers 10 are equidistantly distributed on the outer side of the belt 9, and a driving component 12 is installed on the top of the base plate 4, the driving component 12 being used to drive the driving pulleys 7 on both sides to rotate synchronously.

[0022] The operator places multiple semiconductor chip wafers 10 at specific intervals on the corresponding support plates 11 of the two belts 9. The wafers 10 are stably supported on the corresponding support plates 11 between the two belts 9, forming a layered structure. The curved surface of the arc plate 5 fits the outer contour of the wafer 10, providing lateral support for the wafer 10 and preventing it from shifting or slipping due to vibration or centrifugal force during the belt 9 transmission process. This ensures the stability of the wafer 10 during the rising or falling process. The drive component 12 is started, driving the two active pulleys 7 to rotate synchronously. Through the belt 9, the driven pulleys 8 are driven to rotate, realizing the synchronous transmission of the two belts 9. During the belt 9 transmission process, the support plates 11 carry the wafers 10 and rise or fall layer by layer. When the uppermost wafer 10 moves to the detection station, that is, directly below the flying probe test module, the drive component 12 stops, the belt 9 stops transmission, and the detection stage begins.

[0023] The displacement drive mechanism of the moving component 2, such as a three-axis slide table, adjusts the position of the flying probe test module, so that the probe of the flying probe test module is accurately aligned with the test point of the top layer wafer chip, such as the pad or pin. The flying probe test module inputs test signals to the chip through the probe and collects output signals to complete the detection of electrical performance parameters such as voltage, current, resistance, and leakage current. The test data is transmitted to the control system for analysis to determine whether the chip 10 is qualified. After the test is completed, the operator removes the tested wafer 10, the drive component 12 starts again, and the belt 9 continues to drive, moving the next layer of wafer 10 to the test station. The above test process is repeated to realize the continuous layered test of multiple wafers 10. Through the combination of layered conveying and automatic testing, the device can efficiently complete the electrical performance test of batch wafers 10 and improve the test efficiency.

[0024] The drive assembly 12 includes a motor 121, a rotating rod 122, a driving helical gear 123, and a driven helical gear 124. The rotating rod 122 is provided on the top of the base plate 4. The two ends of the rotating rod 122 are rotatably connected to the support bar groups 6 on both sides. Two driving helical gears 123 are symmetrically provided on the outer side of the rotating rod 122. A driven helical gear 124 is connected to one side of each driving pulley 7. The driven helical gear 124 meshes with the corresponding driving helical gear 123. The motor 121 is fixedly installed on one side of one of the support bar groups 6. The output end of the motor 121 is fixedly connected to the corresponding end of the rotating rod 122.

[0025] After the motor 121 starts, its output end drives the rotating rod 122 to rotate. When the rotating rod 122 rotates, the two active helical gears 123 symmetrically arranged on its outer side rotate synchronously. Each active helical gear 123 meshes with the driven helical gear 124 on the corresponding side of the active pulley 7, converting the rotational motion of the rotating rod 122 into a vertical rotational motion, driving the active pulley 7 to rotate. Through the meshing transmission of the helical gears, the active pulleys 7 on both sides achieve synchronous rotation, thereby driving the belt 9 and the driven pulley 8 to drive synchronously, ensuring the consistency of the movement of the belts 9 on both sides.

[0026] A support platform 13 is fixedly connected to the top of the base plate 4 between the two sets of support bars 6. The support platform 13 is fixedly installed in the center of the top of the base plate 4, between the two sets of support bars 6. Its top plane is matched with the bearing surface of the bottom support plate 11. When the belt 9 drives to the bottom position, the support plate 11 carries the wafer 10 down to the lowest point. At this time, the top plane of the support platform 13 supports the bottom of the wafer 10, preventing the wafer 10 from continuing to move down and colliding with the base plate 4 or other components, thus ensuring the safety of the wafer 10 during the transmission process.

[0027] The top of the base plate 4 is provided with a movable arc plate 14, which is arranged on the left and right sides corresponding to the arc plate 5 fixed to the support strip group 6, together forming the guide and limiting structure of the wafer 10.

[0028] A vertical groove 16 is provided on the side of the support bar group 6 near the wafer 10. Slide strips 17 are symmetrically provided on both sides of the movable arc plate 14. The slide strips 17 slide in cooperation with the corresponding grooves 16. When loading is required, the operator holds the top of the movable arc plate 14 and pulls it upward along the groove 16. The slide strips 17 slide out of the groove 16, and the movable arc plate 14 is completely separated from the support bar group 6. At this time, the wafer 10 is unrestrained in the horizontal direction and can be placed or removed freely. After loading is completed, the slide strips 17 of the movable arc plate 14 are aligned with the entrance of the groove 16 and pressed vertically down to the preset position. The movable arc plate 14 returns to the cooperation state with the arc plate 5 and restricts the horizontal displacement of the wafer 10 again.

[0029] A soft pad is fixed on the upper surface of the tray 11. The soft pad absorbs the impact force of the wafer 10 through elastic deformation, so as to prevent the hard surface of the tray 11 from scratching the back electrode or wafer of the wafer 10.

[0030] The processing table 1 is equipped with support feet 18 at the four corners of the bottom. The support feet 18 are designed to adapt to uneven ground and reduce probe offset or wafer 10 shaking caused by mechanical vibration during the testing process.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip electrical performance testing device, comprising a processing table (1), wherein a moving component (2) is provided on the top of the processing table (1), and a testing component (3) is installed on the moving end of the moving component (2), characterized in that, The processing table (1) is provided with a base plate (4) on top. An arc plate (5) is fixedly connected to the top of the base plate (4). Two sets of support strips (6) are symmetrically arranged on both sides of the arc plate (5) on the top of the base plate (4). Each set of support strips (6) includes two parallel support strips. The support strips on both sides of the arc plate (5) are respectively rotatably connected to the driving pulley (7) and the driven pulley (8). The driving pulley (7) is connected to the driven pulley (8) through the belt (9). Multiple trays (11) for carrying semiconductor chip wafers (10) are distributed equidistantly on the outer side of the belt (9). A drive assembly (12) is installed on the top of the base plate (4). The drive assembly (12) is used to drive the driving pulleys (7) on both sides to rotate synchronously.

2. The semiconductor chip electrical performance testing device according to claim 1, characterized in that, The drive assembly (12) includes a motor (121), a rotating rod (122), an active helical gear (123), and a driven helical gear (124). The top of the base plate (4) is provided with a rotating rod (122). The two ends of the rotating rod (122) are rotatably connected to the support bar groups (6) on both sides. Two active helical gears (123) are symmetrically provided on the outer side of the rotating rod (122). A driven helical gear (124) is connected to one side of each active pulley (7). The driven helical gear (124) meshes with the corresponding active helical gear (123). A motor (121) is fixedly installed on one side of one of the support bar groups (6). The output end of the motor (121) is fixedly connected to the corresponding end of the rotating rod (122).

3. The semiconductor chip electrical performance testing device according to claim 1, characterized in that, The top of the base plate (4) is fixedly connected to a support platform (13) between two sets of support strips (6).

4. The semiconductor chip electrical performance testing device according to claim 1, characterized in that, The bottom plate (4) is provided with a movable arc plate (14) at the top.

5. The semiconductor chip electrical performance testing device according to claim 4, characterized in that, The support bar group (6) has a groove (16) on the side near the wafer (10) in the vertical direction. The movable arc plate (14) has symmetrically arranged slide bars (17) on both sides. The slide bars (17) are slidably engaged with the corresponding grooves (16).

6. The semiconductor chip electrical performance testing device according to claim 1, characterized in that, A soft pad is fixedly provided on the upper surface of the support plate (11).

7. The semiconductor chip electrical performance testing device according to claim 1, characterized in that, The processing table (1) is provided with support feet (18) at the four corners of its bottom.

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