Low-power dissipation heat sink structure for embedded multi-camera

Abstract

The utility model discloses a low -power dissipation heat radiation structure of embedded multi -objective camera, including the shell, the one side of shell is installed and is inlaid the shell, install multi -objective camera body between the shell with the inlaid shell, the inside fixed connection of multi -objective camera body has the PCB board, the other side of shell is installed the fan and is linked together, the inside and outside of shell are installed the heat dissipation spare, the utility model relates to multi -objective camera heat radiation structure technical field, this low -power dissipation heat radiation structure of embedded multi -objective camera can utilize the convection air of two groups of fins of vertical setting and the environment in combination with the heat dissipation demand of embedded multi -objective camera according to the outside environment and the heat dissipation demand of embedded multi -objective camera, and can open or close the fan according to the heat dissipation demand, and the embedded multi -objective camera is carried out the collaborative heat dissipation, does not need the fan long -time high -speed operation, reduces the loss of energy, realizes the effect that embedded multi -objective camera low -power dissipation heat radiation.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology for multi-view cameras, specifically a low-power heat dissipation structure for embedded multi-view cameras. Background Technology

[0002] An embedded multi-view camera is an integrated intelligent vision system that combines multiple cameras, a computing chip, and specific software algorithms. The multi-view camera simultaneously acquires images from multiple cameras and performs operations such as correction, noise reduction, and alignment on its internal chip. After processing by the core algorithm, it ultimately outputs valuable video stream information. Due to its unique advantages, embedded multi-view cameras are widely used in robotics, autonomous driving, and intelligent security. During operation, embedded multi-view cameras generate a significant amount of heat. If this heat cannot be dissipated in time and accumulates inside the device, it can lead to performance degradation, decreased image quality, and accelerated aging of electronic components due to prolonged operation at high temperatures. This can shorten the device's lifespan and even cause system crashes, restarts, and other reliability issues. Therefore, timely heat dissipation is crucial for embedded multi-view cameras.

[0003] The heat dissipation methods of embedded multi-view cameras are mainly divided into two categories: passive heat dissipation and active heat dissipation. Passive heat dissipation uses heat sinks and the outer casing to dissipate heat, while active heat dissipation relies on power components, usually using fans to force airflow to significantly improve heat dissipation efficiency. To improve the heat dissipation effect of embedded multi-view cameras, active and passive heat dissipation methods are combined. However, for high-performance embedded multi-view cameras, they need to continuously operate at full load for a long time. At this time, the fan needs to keep running at high speed. The power consumption of the device for heat dissipation is large. At the same time, due to the large amount of heat generated by the device, it is difficult to dissipate the device quickly and efficiently by relying solely on fans or heat sinks.

[0004] To address this issue, the present invention provides a low-power heat dissipation structure for embedded multi-view cameras, which allows for adjustment of the heat dissipation method of the embedded multi-view camera according to the environment, thereby solving the aforementioned problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a low-power heat dissipation structure for embedded multi-view cameras, thus solving the aforementioned problems.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a low-power heat dissipation structure for an embedded multi-view camera, including a housing, an embedded shell installed on one side of the housing, a multi-view camera body installed between the housing and the embedded shell, a PCB board fixedly connected to the inner side of the multi-view camera body, a fan installed and connected to the other side of the housing, and heat dissipation components installed inside and outside the housing.

[0007] The heat sink includes a sealing shell installed on one side of the embedded shell, the sealing shell being disposed inside the outer shell, the PCB board being installed inside the sealing shell, a transverse fin being fixedly connected to the outer side of the sealing shell, a flow guide hole being opened on the outer side of the outer shell, and a longitudinal fin being fixedly connected to the outer side of the outer shell.

[0008] Preferably, a heat-conducting cavity is provided between the PCB board and the sealing shell.

[0009] Preferably, the transverse fins are arranged perpendicular to the longitudinal fins.

[0010] Preferably, an air hole is provided on one side of the outer casing.

[0011] Preferably, a connecting wire is installed on one side of the PCB board, and connecting holes are provided on the bottom of the outer shell and one side of the sealing shell.

[0012] Preferably, a sealing ring is installed inside the connecting hole.

[0013] Beneficial effects

[0014] This invention provides a low-power heat dissipation structure for embedded multi-view cameras. Compared with the prior art, it has the following advantages:

[0015] The low-power heat dissipation structure of this embedded multi-view camera can switch between two heat dissipation methods depending on the external environment and the heat dissipation requirements of the embedded multi-view camera. First, when the embedded multi-view camera is performing low-load operations or the wind speed in the external environment is high, the fan can be turned off. A vertical channel is formed by the horizontal and vertical fins arranged vertically, and the chimney effect is used to make the hot air move quickly in the channel, avoiding the air from stagnating in a certain area. Compared with a single fin, the air flow speed and efficiency are significantly enhanced. Second, when the device is performing high-load operations, the device is cooled by both the fins and the fan. The fan cooling is used as an auxiliary heat dissipation method, and the heat dissipation structure formed by the two sets of fins works in conjunction with the fan cooling to reduce the fan cooling load and reduce energy consumption, thereby achieving the effect of low-power heat dissipation for the embedded multi-view camera. Attached Figure Description

[0016] Figure 1 This is a perspective view of the external structure of this utility model;

[0017] Figure 2 This is an exploded view of this utility model;

[0018] Figure 3 This is a schematic diagram of the connection structure between the sealing shell and the transverse fins of this utility model;

[0019] Figure 4This is a schematic diagram of the connection structure between the outer shell and the longitudinal fins of this utility model.

[0020] In the diagram: 1. Outer shell; 2. Embedded shell; 3. Multi-lens camera body; 4. PCB board; 5. Fan; 6. Heat sink; 601. Sealing shell; 602. Horizontal fins; 603. Air guide hole; 604. Vertical fins; 7. Air hole; 8. Connecting wire; 9. Connecting hole; 10. Sealing ring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1:

[0023] Please see Figure 1-4 The low-power heat dissipation structure of the embedded multi-lens camera includes a housing 1, an embedded shell 2 installed on one side of the housing 1, a multi-lens camera body 3 installed between the housing 1 and the embedded shell 2, a slot is opened on the outer side of the embedded shell 2, the number of lenses in the slot and the multi-lens camera body 3 are the same and the positions are corresponding, a PCB board 4 is fixedly connected to the inner side of the multi-lens camera body 3, a fan 5 is installed on the other side of the housing 1 and connected to it, and heat sinks 6 are installed inside and outside the housing 1.

[0024] The heat sink 6 includes a sealing shell 601 installed on one side of the embedded shell 2. The sealing shell 601 is located inside the outer shell 1. The PCB board 4 is installed inside the sealing shell 601. A transverse fin 602 is fixedly connected to the outer side of the sealing shell 601. A guide hole 603 is opened on the outer side of the outer shell 1. There are four sets of guide holes 603. A longitudinal fin 604 is fixedly connected to the outer side of the outer shell 1. There are several longitudinal fins 604. The guide hole 603 is located between two adjacent longitudinal fins 604.

[0025] A heat-conducting cavity is provided between the PCB board 4 and the sealing shell 601.

[0026] The transverse fin 602 and the longitudinal fin 604 are arranged perpendicularly.

[0027] An air vent 7 is provided on one side of the outer casing 1.

[0028] In this embodiment, the heat dissipation method of the embedded multi-view camera can be switched between two modes depending on the external environment and heat dissipation requirements. When the multi-view camera body 3 is performing low-load operations or the external airflow speed is high, the fan 5 can be turned off. At this time, only the horizontal fins 602, the vertical fins 604, and the airflow are used to dissipate heat from the PCB board 4 connected to the multi-view camera body 3. During the heat dissipation process, the heat generated by the multi-view camera body 3 and the PCB board 4 is radiated outward from the heat conduction cavity inside the sealed shell 601. At the same time, the vertically arranged horizontal fins 602 and vertical fins 604 form a vertical airflow channel, using chimney efficiency to accelerate the airflow speed and efficiency in the channel, preventing air from stagnating at a certain position in the channel, and accelerating the embedded... The heat dissipation effect of the embedded multi-view camera is improved by starting the fan 5 when the multi-view camera body 3 is operating at full load. The fan 5 accelerates the airflow speed in the vertical channel formed by the vertical horizontal fins 602 and the vertical fins 604, so that the heat radiated from the multi-view camera body 3 and PCB board 4 to the outside of the sealing shell 601 is quickly extracted by the hot airflow outside the shell 1 through the fan 5 connected by the air hole 7. The fan 5 and the two sets of fins work together to dissipate heat, reducing the workload of the fan 5. While improving the heat dissipation effect of the embedded multi-view camera, the energy consumption required for heat dissipation by the fan 5 is reduced. Since there is a heat conduction cavity between the PCB board 4 and the sealing shell 601, the efficiency of heat radiation from the multi-view camera body 3 and PCB board 4 to the outside is further accelerated.

[0029] Example 2:

[0030] Please see Figure 1-3 Based on Embodiment 1, this embodiment provides a low-power heat dissipation structure technical solution for an embedded multi-view camera: a connecting line 8 is installed on one side of the PCB board 4, and connecting holes 9 are provided on the bottom of the outer shell 1 and one side of the sealing shell 601. The connecting line 8 extends through the two connecting holes 9 to the outside of the outer shell 1.

[0031] A sealing ring 10 is installed inside the connection hole 9, and the sealing ring 10 is sleeved on the outside of the connection wire 8.

[0032] In this embodiment, a sealed space consisting of a sealing shell 601 and an insert shell 2 is used to place the PCB board 4, preventing dust from falling on the PCB board 4 and also reducing the power consumption generated during the operation of the device. The connection holes 9 opened at the bottom of the outer shell 1 and the outside of the sealing shell 601 facilitate the connection wire 8 to pass through the inside of the sealing shell 601 and the outer shell 1. The sealing ring 10 enhances the sealing performance of the connection wire 8 and the outer shell 1 and the sealing shell 601 during assembly.

[0033] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0034] Working principle:

[0035] When assembling an embedded multi-view camera, the multi-view camera body 3 is first snapped together with the housing 2. Then, the sealing shell 601 is connected to the housing 2, and the connecting wire 8 passes through the connecting hole 9 on the bottom of the housing 1 and the outside of the sealing shell 601. A sealing ring 10 is used to seal the connection between the connecting wire 8 and the housing 1 and the sealing shell 601. At this time, the PCB board 4 is installed inside the sealed structure formed by the housing 2 and the sealing shell 601, which has a dustproof effect on the PCB board 4, preventing dust from adhering to the outside of the PCB board 4, increasing the resistance of the external components of the PCB board 4, thereby preventing energy consumption during the operation of the PCB board 4 and reducing the heat generated during the operation of the PCB board 4. The embedded multi-view camera can switch between two heat dissipation methods according to the external environment and heat dissipation requirements. When the external wind speed is high or the PCB board 4 connected to the multi-view camera body 3 is subjected to high heat dissipation, the PCB board 4 can switch between two heat dissipation methods. During low-load operation, the fan 5 can be turned off. In this case, the device is cooled only by the horizontal fins 602 and the vertical fins 604. During the heat dissipation process, the multi-view camera body 3 and the PCB board 4 generate heat. At this time, the heat is radiated from the heat conduction cavity inside the sealed shell 601 to the cavity between the outer shell 1 and the sealed shell 601. At the same time, the vertically arranged horizontal fins 602 and vertical fins 604 form a vertical channel, which uses the chimney effect to accelerate the heat dissipation effect in the channel. This method does not require the fan 5 and does not generate energy loss. When the PCB board 4 is operating at full load, the fan 5 can be turned on. While the airflow flows naturally in the horizontal fins 602 and the vertical fins 604, the suction generated by the fan 5 further accelerates the heat dissipation efficiency. By reducing the workload of the fan 5, the low-power heat dissipation effect of the embedded multi-view camera is achieved.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low-power heat dissipation structure for an embedded multi-view camera, comprising a housing (1), characterized in that: A housing (2) is installed on one side of the outer shell (1), and a multi-view camera body (3) is installed between the outer shell (1) and the housing (2). A PCB board (4) is fixedly connected to the inner side of the multi-view camera body (3). A fan (5) is installed on the other side of the outer shell (1) and is connected to it. Heat sinks (6) are installed inside and outside the outer shell (1). The heat sink (6) includes a sealing shell (601) installed on one side of the embedded shell (2). The sealing shell (601) is located inside the outer shell (1). The PCB board (4) is installed inside the sealing shell (601). A transverse fin (602) is fixedly connected to the outer side of the sealing shell (601). A guide hole (603) is opened on the outer side of the outer shell (1). A longitudinal fin (604) is fixedly connected to the outer side of the outer shell (1).

2. The low-power heat dissipation structure for an embedded multi-view camera according to claim 1, characterized in that: A heat-conducting cavity is provided between the PCB board (4) and the sealing shell (601).

3. The low-power heat dissipation structure for an embedded multi-view camera according to claim 1, characterized in that: The transverse fins (602) are arranged perpendicularly to the longitudinal fins (604).

4. The low-power heat dissipation structure for an embedded multi-view camera according to claim 1, characterized in that: The outer shell (1) has an air hole (7) on one side.

5. The low-power heat dissipation structure for an embedded multi-view camera according to claim 1, characterized in that: A connecting wire (8) is installed on one side of the PCB board (4), and connecting holes (9) are provided on the bottom of the outer shell (1) and one side of the sealing shell (601).

6. The low-power heat dissipation structure for an embedded multi-view camera according to claim 5, characterized in that: A sealing ring (10) is installed inside the connection hole (9).

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