Light source device and laser apparatus
By employing a light source module and a beam combining module in the laser equipment, using SMD packaging technology to fix the laser chip, and performing beam combining and shaping, the problem of excessively large laser equipment is solved, achieving miniaturization and cost reduction of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YLX INC
- Filing Date
- 2025-07-15
- Publication Date
- 2026-07-07
AI Technical Summary
Existing laser equipment requires multiple lasers to generate multiple laser beams, resulting in excessively large equipment size and impacting market competitiveness.
The design employs a light source module and a beam combining module, utilizing surface mount device (SMD) packaging technology to fix the first and second laser chips, reducing the gap between the laser chips, and using the beam combining module and the shaping module to combine and shape the beam, thereby achieving miniaturization of the laser device.
This has enabled the miniaturization of laser equipment, reducing equipment size and processing costs, and enhancing market competitiveness.
Smart Images
Figure CN224472917U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of laser technology, and more specifically, to a light source device and laser equipment. Background Technology
[0002] To increase their output power, existing laser equipment (such as laser engraving equipment) typically employs a technique of combining multiple laser beams into a single beam. However, since multiple lasers are required within the equipment to generate these beams, this results in an excessively large overall size. Utility Model Content
[0003] This application provides a light source device and a laser equipment.
[0004] According to a first aspect of this application, an embodiment of this application provides a light source device, which includes a light source module, a beam combining module, and a shaping module. The light source module includes a housing, a first laser chip, and a second laser chip. The first laser chip generates a first light beam, and the second laser chip generates a second light beam. The housing includes a base plate, a dam, and a cover plate. The dam is connected between the base plate and the cover plate to form a sealed space together. The first and second laser chips are fixed to the side of the base plate facing the cover plate, and the first and second light beams are emitted through the cover plate to the beam combining module. The beam combining module is disposed on the optical path containing the first and second light beams to combine them into a combined beam. The shaping module is disposed on the optical path containing the combined beam to shape the combined beam.
[0005] In some possible embodiments, the light source module further includes a light guide, which is disposed in a sealed space and located on the optical path of the first beam emitted by the first laser chip and the second beam emitted by the second laser chip, for guiding the first beam and the second beam to the cover plate.
[0006] In some possible embodiments, the propagation direction of the first beam emitted from the first laser chip is the same as that of the second beam emitted from the second laser chip, and is parallel to the plane of the base plate. The light guide is a reflecting prism, which is fixed to the base plate, and the reflecting surface of the reflecting prism is inclined relative to the base plate to reflect the first beam and the second beam to the cover plate.
[0007] In some possible embodiments, the light source module further includes a heat-conducting component, which is fixed on the base plate; the first laser chip and the second laser chip are attached to the side of the heat-conducting component away from the base plate.
[0008] In some possible embodiments, the beam combining module includes a collimation unit and a beam combining unit. The collimation unit is positioned on the optical paths of the first beam and the second beam, and is used to collimate the first beam to form a first collimated beam; and to collimate the second beam to form a second collimated beam. The beam combining unit is used to combine the first collimated beam and the second collimated beam to form a combined beam.
[0009] In some possible embodiments, the collimation unit includes a first collimating lens and a second collimating lens; the first collimating lens is used to collimate a first beam to form a first collimated beam; the second collimating lens is used to collimate a second beam to form a second collimated beam; the first collimating lens and the second collimating lens are fixed on the side of the cover plate away from the bottom plate.
[0010] In some possible embodiments, the polarization states of both the first collimated beam and the second collimated beam are the first polarization state, which is one of S-polarization and P-polarization. The beam combining unit includes a half-wave plate, a reflector, and a polarizing beam combiner. The half-wave plate is disposed in the optical path of the second collimated beam to adjust the polarization state of the second collimated beam from the first polarization state to the second polarization state, which is the other of S-polarization and P-polarization. The reflector is disposed in the optical path of the second collimated beam to reflect the second collimated beam. The polarizing beam combiner is disposed in the optical path of the first collimated beam and the second collimated beam (reflected by the reflector) to polarize and combine the first and second collimated beams to form a combined beam.
[0011] In some possible embodiments, the shaping module includes a beam expanding unit and a focusing unit, which are sequentially arranged in the optical path where the combined beam is located; wherein, the beam expanding unit is used to expand the combined beam in the slow axis direction; and the focusing unit is used to focus the expanded combined beam.
[0012] In some possible embodiments, the beam expanding unit includes a plano-concave cylindrical lens and a plano-convex cylindrical lens, which are sequentially arranged in the optical path of the combined beam. The plano-concave cylindrical lens is used to expand the divergence angle of the combined beam in the slow axis direction, and the plano-convex cylindrical lens is used to collimate the combined beam in the slow axis direction.
[0013] According to a second aspect of this application, embodiments of this application also provide a laser device, which includes the aforementioned light source device.
[0014] This application provides a light source device and a laser equipment. In the light source device, a first laser chip and a second laser chip are fixed within a housing. The housing may include a base plate, a retaining wall, and a cover plate. The retaining wall connects the base plate and the cover plate to form a sealed space together. Specifically, the first laser chip and the second laser chip are fixed on the side of the base plate facing the cover plate. That is, in this embodiment, both the first laser chip and the second laser chip are fixed using surface mount device (SMD) packaging technology.
[0015] Therefore, by fixing the first and second laser chips together, the gap between the two laser chips can be reduced, thereby decreasing the overall size of the light source device and consequently reducing the size of the laser equipment equipped with this light source device, thus achieving a miniaturized design of the laser equipment. Furthermore, with a smaller equipment size, the processing cost of the laser equipment will also decrease, making the laser equipment more competitive in the market. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a structural block diagram of the laser device provided in the embodiments of this application.
[0018] Figure 2 yes Figure 1 The diagram shows the structural block diagram of the light source device in the laser equipment shown.
[0019] Figure 3 yes Figure 2 A cross-sectional schematic diagram of the light source module in the light source device shown.
[0020] Figure 4 yes Figure 2 A schematic diagram of an optical path structure of the light combining module in the light source device shown.
[0021] Figure 5 yes Figure 2 A schematic diagram of another optical path structure of the light combining module in the light source device shown.
[0022] Figure 6 yes Figure 2 A schematic diagram of the optical path structure of the shaping module in the light source device shown. Detailed Implementation
[0023] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.
[0024] This application provides a light source device 200 and a laser device 100 configured with the light source device 200. The laser device 100 refers to a device that can emit laser light when working.
[0025] In some possible embodiments, the laser device 100 can be a laser processing device, whose emitted laser is used for engraving. For example, the laser processing device can be a laser cutter, a laser engraver, a laser welder, etc. In other possible embodiments, the laser device 100 can be a laser lighting device, whose emitted laser is used for illumination. For example, the laser lighting device can be a laser stage light, a laser flashlight, a laser projector, etc. This embodiment does not limit the specific implementation of the laser device 100.
[0026] Please see Figure 1 The light source device 200 may include a housing (not shown) and the light source device 200. The light source device 200 is disposed in the housing, which serves to fix and protect the light source device 200. Specifically, the housing may be made of metal (e.g., copper, aluminum, iron, alloy, etc.) to dissipate heat from the light source device 200 and ensure its normal operation.
[0027] Please see Figure 2 and Figure 3 The light source device 200 may include a light source module 10, a light combining module 30, and a shaping module 50. The light source module 10 may include a housing 120, a first laser chip 130, and a second laser chip 140. The first laser chip 130 is used to generate a first light beam L1, and the second laser chip 140 is used to generate a second light beam L2.
[0028] exist Figure 3 In the illustrated embodiment, the housing 120 may include a base plate 1210, a dam 1230, and a cover plate 1250. The dam 1230 is connected between the base plate 1210 and the cover plate 1250 to form a sealed space 1201 together with the base plate 1210 and the cover plate 1250. Specifically, the dam 1230 may be disposed around the outer periphery of the base plate 1210 and protrude toward one side of the base plate 1210 to form an opening (not shown in the figure). The cover plate 1250 closes the opening to form the sealed space 1201.
[0029] The first laser chip 130 and the second laser chip 140 are disposed within the sealed space 1201 and fixed to the base plate 1210 on the side facing the cover plate 1250. That is to say, in this embodiment, both the first laser chip 130 and the second laser chip 140 are fixed using surface mount device (SMD) packaging technology.
[0030] exist Figure 2 In the illustrated embodiment, the beam combining module 30 is disposed on the optical path where the first beam L1 and the second beam L2 are located, and is used to combine the first beam L1 and the second beam L2 to form a combined beam L3. The shaping module 50 is disposed on the optical path where the combined beam L3 is located, and is used to shape the combined beam L3.
[0031] Since both the first laser chip 130 and the second laser chip 140 in the light source device 200 are fixed inside the housing 120 using SMD packaging technology, fixing the first laser chip 130 and the second laser chip 140 can reduce the gap between the two laser chips, thereby reducing the overall size of the light source device 200 and consequently reducing the size of the laser device 100 equipped with the light source device 200, thus achieving a miniaturized design of the laser device 100. Furthermore, with the reduced size of the laser device 100, the processing cost of the laser device 100 will also decrease, making the laser device 100 more competitive in the market.
[0032] The specific implementation of the light source device 200 is described below.
[0033] In this embodiment, the first laser chip 130 can be a semiconductor laser chip (e.g., an edge-emitting laser chip, a vertical-cavity surface-emitting laser chip, etc.) used to generate a first laser beam L1. The first laser beam L1 can be a blue laser. For example, the wavelength of the first laser beam L1 can be greater than or equal to 405 nm and less than or equal to 490 nm. This embodiment does not limit this.
[0034] It should be noted that the light spot formed by the first beam L1 in this embodiment has a fast axis direction and a slow axis direction that are perpendicular to each other. The light spot is approximately elliptical; the "fast axis direction" can be considered as the major axis direction of the elliptical light spot, and the "slow axis direction" can be considered as the minor axis direction of the elliptical light spot. Specifically, the expansion of the first beam L1 in the fast axis direction is greater than the expansion of the first beam L1 in the slow axis direction.
[0035] In this embodiment, the second laser chip 140 can be a semiconductor laser chip (e.g., an edge-emitting laser chip, a vertical-cavity surface-emitting laser chip, etc.) used to generate the second beam L2. In some possible examples, the first laser chip 130 and the second laser chip 140 are two laser chips of the same type, that is, the first beam L1 and the second beam L2 can both be blue lasers, and the polarization state of the second beam L2 and the first beam L1 is the same.
[0036] In other possible examples, the first laser chip 130 and the second laser chip 140 are not the same. For example, the wavelengths of the second beam L2 and the first beam L1 are different; for instance, the first beam L1 can be a blue laser, and the second beam L2 can be a green laser, a yellow laser, a red laser, etc. Also, the polarization states of the second beam L2 and the first beam L1 are different; for instance, the polarization state of the first beam L1 can be S-polarization, and the polarization state of the second beam L2 can be P-polarization. This embodiment does not limit this.
[0037] It should be noted that the light spot formed by the second beam L2 also has perpendicular fast axis and slow axis directions. Specifically, the first laser chip 130 and the second laser chip 140 can be arranged in the slow axis direction so that the light spot formed by the second beam L2 and the light spot formed by the first beam L1 are also spaced apart in the slow axis direction. This reduces the overall spot size of the light spot formed by the first beam L1 and the second beam L2, which helps to reduce the difficulty of combining the first beam L1 and the second beam L2 by the subsequent beam combining module 30.
[0038] Please refer to it again. Figure 3 , Figure 3 The direction X in the equation can be understood as the fast axis direction of the second beam L2. When the first laser chip 130 and the second laser chip 140 are arranged in the slow axis direction, in... Figure 3 At the cross-sectional angle shown, the first laser chip 130 is blocked by the second laser chip 140, and the first beam L1 is blocked by the second beam L2.
[0039] In this embodiment, the housing 120 serves to securely encapsulate the first laser chip 130 and the second laser chip 140, thereby providing protection for the first laser chip 130 and the second laser chip 140. Figure 3 In the illustrated embodiment, the housing 120 may include a base plate 1210 and a dam 1230 connected to each other. The dam 1230 is disposed around the outer periphery of the base plate 1210 to define the sealed space 1201 together with the base plate 1210. In addition, the dam 1230 also serves to limit the flow range of the filling material (such as encapsulating adhesive, phosphor adhesive, etc.) and prevent the adhesive from overflowing.
[0040] It should be noted that the names "base plate" and "dam" are used for ease of description. In specific examples, there may or may not be a clear dividing line between the two structures; for example, they may be assembled together or be a single molded structure. In some possible embodiments, the base plate 1210 and the dam 1230 may be a single molded structure. For example, the shell 120 may be made of plastic or metal through injection molding or machining, and the base plate 1210 and the dam 1230 may be two parts located at different positions on the shell 120.
[0041] In some possible embodiments, the material of the housing 120 can be metal (e.g., copper, aluminum, iron, alloy, etc.), ceramic, etc., so that the light source module 10 has better heat dissipation performance, thereby improving the service life of the first laser chip 130 and the second laser chip 140.
[0042] In this embodiment, the housing 120 may further include a cover plate 1250, which is disposed opposite to the bottom plate 1210 and is used to close the dam 1230 to form a sealed space 1201. Specifically, the cover plate 1250 may be attached to or embedded on the side of the dam 1230 away from the bottom plate 1210. As an example, the cover plate 1250 may be a light-transmitting window (e.g., flat glass) to ensure that the first light beam L1 and the second light beam L2 inside the housing 120 can pass through the cover plate 1250 and then enter the light combining module 30.
[0043] exist Figure 3 In the illustrated embodiment, the first laser chip 130 and the second laser chip 140 are mounted on the base plate 1210. As an example, the light emission ports of the first laser chip 130 and the second laser chip 140 can be positioned facing the cover plate 1250 so that the first beam L1 and the second beam L2 can be directly incident on the light combining module 30 through the cover plate 1250.
[0044] As another example, the light source module 10 may also include a light guide 150, which is disposed within the enclosed space 1201 and located on the optical path of the first beam L1 emitted from the first laser chip 130 and the second beam L2 emitted from the second laser chip 140. The light guide 150 guides the first beam L1 and the second beam L2 to the cover plate 1250. Specifically, the light guide 150 can fold the optical path of the first beam L1 and the second beam L2, making the optical path arrangement inside the light source module 10 more compact and reasonable.
[0045] exist Figure 3In the illustrated embodiment, the propagation direction of the first beam L1 emitted from the first laser chip 130 is the same as the propagation direction of the second beam L2 emitted from the second laser chip 140, and is parallel to the plane where the base plate 1210 is located. Here, "propagation direction" can be understood as the extension direction of the beam corresponding to the optical axis.
[0046] Specifically, the light guide 150 can be a reflecting prism, which is fixed on the base plate 1210. The reflecting surface 1501 of the reflecting prism is inclined relative to the base plate 1210 and is used to reflect the first beam L1 and the second beam L2 to the cover plate 1250. Figure 3 In this embodiment, the cross-section of the light guide 150 is approximately a right-angled triangle. The plane corresponding to one right-angled side of this triangle is fixed to the base plate 1210. The plane corresponding to the hypotenuse of the right-angled triangle is the aforementioned reflective surface 1501, which may be coated with a reflective film layer (e.g., a metal reflective layer, a dielectric reflective layer, etc.) to reflect the first beam L1 and the second beam L2. Exemplarily, a reflecting prism can be attached to or embedded in the base plate 1210. Of course, in other possible embodiments, the light guide 150 may also be one or more planar reflectors; this embodiment does not limit this.
[0047] It is easy to understand that in this embodiment, the first beam L1 and the second beam L2 are reflected by the same light guide 150, which can ensure that the two light spots corresponding to the reflected first beam L1 and the second beam L2 are arranged in the slow axis direction, which helps to reduce the difficulty of the subsequent light combining module 30 in combining the first beam L1 and the second beam L2.
[0048] In some possible embodiments, the light source module 10 may further include a heat-conducting component 160, which is fixed to the base plate 1210. For example, the heat-conducting component 160 may be attached to or embedded in the base plate 1210. The first laser chip 130 and the second laser chip 140 are attached to the side of the heat-conducting component 160 away from the base plate 1210, so that the heat-conducting component 160 can simultaneously dissipate heat for the first laser chip 130 and the second laser chip 140, thereby improving the service life of the first laser chip 130 and the second laser chip 140. Specifically, the heat-conducting component 160 may be a heat sink, a heat sink, etc., which is not limited in this embodiment.
[0049] It should be noted that, compared to the first laser chip 130 and the second laser chip 140 using transistor outline (TO) packaging, the use of SMD packaging can shorten the distance between the first laser chip 130 and the second laser chip 140 and the heat conductor 160, respectively. This allows the first laser chip 130 and the second laser chip 140 to have better heat dissipation performance, thereby improving the working reliability of the light source module 10.
[0050] Please see Figure 4 , Figure 4 The direction Y in the equation can be understood as the slow axis direction of the first beam L1 and the second beam L2. Here, the direction Y is related to... Figure 3 The direction X is perpendicular to the beam. The beam combining module 30 may include a collimation unit 320 and a beam combining unit 340. The collimation unit 320 is arranged on the optical path where the first beam L1 and the second beam L2 are located. It is used to collimate the first beam L1 to form a first collimated beam LZ1 and collimate the second beam L2 to form a second collimated beam LZ2.
[0051] Specifically, the collimation unit 320 may include a first collimating lens 3210 and a second collimating lens 3230, wherein the first collimating lens 3210 is used to collimate the first beam L1 to form a first collimated beam LZ1. Specifically, the first collimating lens 3210 may be an aspherical collimating lens, which can collimate the first beam L1 in the fast axis direction and the slow axis direction respectively, so as to reduce the difficulty of beam combining in the subsequent beam combining unit 340.
[0052] The second collimating lens 3230 is used to collimate the second beam L2 to form a second collimated beam LZ2. Specifically, the second collimating lens 3230 can be an aspherical collimating lens, which can collimate the second beam L2 in the fast axis direction and the slow axis direction respectively, so as to reduce the difficulty of beam combining in the subsequent beam combining unit 340.
[0053] exist Figure 4 In the illustrated embodiment, both the first collimating lens 3210 and the second collimating lens 3230 are plano-convex lenses. The planes of the first collimating lens 3210 and the second collimating lens 3230 are the light-incident surfaces, facing the light source module 10. The convex surfaces of the first collimating lens 3210 and the second collimating lens 3230 are the light-exit surfaces, and these convex surfaces can be aspherical. Of course, in other possible embodiments, the first collimating lens 3210 and the second collimating lens 3230 can also be biconvex lenses, and this embodiment does not limit this.
[0054] In some possible embodiments, the first collimating lens 3210 and the second collimating lens 3230 are fixed on the side of the cover plate 1250 away from the base plate 1210, so that the overall optical path structure of the light source device 200 is more compact, which helps to save the overall space occupied by the light source device 200.
[0055] As an example, the first collimating lens 3210 and the second collimating lens 3230 can be attached or embedded on the side of the cover plate 1250 away from the base plate 1210.
[0056] As another example, when both the first collimating lens 3210 and the second collimating lens 3230 are plano-convex lenses, the first collimating lens 3210, the second collimating lens 3230 and the cover plate 1250 can be an integrally formed structure, for example, made by injection molding or machining (e.g., engraving).
[0057] Therefore, in this embodiment, the first beam L1 and the second beam L2 can be collimated at the transmission cover plate 1250, which can reduce the size of the light spot of the first beam L1 and the second beam L2 incident on the light combining unit 340, thereby reducing the difficulty of light combining in the subsequent light combining unit 340.
[0058] In this embodiment, the beam combining unit 340 is used to combine the first collimated beam LZ1 and the second collimated beam LZ2 to form a combined beam L3, so that the laser emitted by the light source device 200 can have higher power.
[0059] In some possible embodiments, the polarization state of the first collimated beam LZ1 and the second collimated beam LZ2 is both a first polarization state, which is one of an S-polarization state and a P-polarization state. For example, the polarization state of the first collimated beam LZ1 and the second collimated beam LZ2 is both an S-polarization state; or, the polarization state of the first collimated beam LZ1 and the second collimated beam LZ2 is both a P-polarization state.
[0060] like Figure 4 As shown, the beam combining unit 340 may include a half-wave plate 3410, a reflector 3430, and a polarizing beam combiner 3450. The half-wave plate 3410 is disposed in the optical path of the second collimated beam LZ2, and is used to adjust the polarization state of the second collimated beam LZ2 from a first polarization state to a second polarization state, which is either an S-polarization state or a P-polarization state. For example, if the polarization state of the second collimated beam LZ2 before passing through the half-wave plate 3410 is P-polarized, the polarization state of the second collimated beam LZ2 after passing through the half-wave plate 3410 is adjusted to an S-polarization state.
[0061] exist Figure 4 In the illustrated embodiment, reflector 3430 is disposed in the optical path of the second collimated beam LZ2, and is used to reflect the second collimated beam LZ2. Specifically, reflector 3430 can be a reflecting prism, a plane mirror, etc. Polarizing combiner 3450 is disposed in the optical path of the first collimated beam LZ1 and the second collimated beam LZ2 reflected by reflector 3430, and is used to polarize and combine the first collimated beam LZ1 and the second collimated beam LZ2 to form a combined beam L3.
[0062] Specifically, when the first collimated beam LZ1 is in the P-polarization state, Figure 4The polarizing beam combiner 3450 is used to transmit P-polarized light and reflect S-polarized light. Of course, in other possible embodiments, the polarizing beam combiner 3450 can also be used to reflect P-polarized light and transmit S-polarized light. Specifically, the transmission and reflection characteristics of the polarizing beam combiner 3450 can be flexibly adjusted according to the emission direction of the combined beam L3; this embodiment is not limited to this.
[0063] It should be noted here that, Figure 4 In this embodiment, a half-wave plate 3410 is positioned on the optical path of the second collimated beam LZ2 between the second collimating lens 3230 and the reflector 3430. That is, the second collimated beam LZ2 passes through the half-wave plate 3410 before entering the reflector 3430. In other possible embodiments, the half-wave plate 3410 can also be positioned on the optical path of the second collimated beam LZ2 between the reflector 3430 and the polarizing combiner 3450. That is, the second collimated beam LZ2 passes through the reflector 3430 before entering the half-wave plate 3410. In other possible embodiments, the half-wave plate 3410 can also be positioned on the optical path of the first collimated beam LZ1 between the first collimating lens 3210 and the polarizing combiner 3450. This embodiment does not limit the specific position of the half-wave plate 3410.
[0064] In some other possible embodiments, the wavelengths of the first collimated beam LZ1 and the second collimated beam LZ2 are different. For example, the first collimated beam LZ1 may be a blue laser and the second collimated beam LZ2 may be a green laser.
[0065] Please see Figure 5 The beam combining unit 340 may include a third reflector 3470 and a wavelength beam combiner 3490. The third reflector 3470 is disposed in the optical path of the second collimated beam LZ2 and is used to reflect the second collimated beam LZ2. Specifically, the third reflector 3470 may be a reflecting prism, a plane mirror, etc.
[0066] A wavelength combiner 3490 is disposed in the optical path containing the first collimated beam LZ1 and the second collimated beam LZ2 (reflected by the third reflector 3470). It is used to combine the wavelengths of the first collimated beam LZ1 and the second collimated beam LZ2 to form a combined beam L3. Specifically, when the first collimated beam LZ1 is blue laser and the second collimated beam LZ2 is green laser... Figure 4 The wavelength combiner 3490 is used to transmit blue light and reflect green light. Of course, in other possible embodiments, the wavelength combiner 3490 can also be used to reflect green light and transmit blue light. Specifically, the transmission and reflection characteristics of the wavelength combiner 3490 can be flexibly adjusted according to the emission direction of the combined beam L3, which is not limited in this embodiment.
[0067] In this embodiment, the shaping module 50 is used to shape the combined beam L3, for example, by expanding or focusing it. It should be noted that because the expansion of the first beam L1 in the fast axis direction X is greater than its expansion in the slow axis direction Y, the collimated first beam L1 (i.e., the first collimated beam LZ1) has a larger size in the fast axis direction X than in the slow axis direction Y. Similarly, the collimated second beam L2 (i.e., the second collimated beam LZ2) has a larger size in the fast axis direction X than in the slow axis direction Y. Therefore, the combined beam L3 (i.e., the combined beam L3) formed by combining the first collimated beam LZ1 and the second collimated beam LZ2 also has a larger size in the fast axis direction X than in the slow axis direction Y.
[0068] Therefore, in this embodiment, a shaping module 50 is used to shape the combined beam L3. This expands the combined beam L3 in the slow axis direction Y, making the size of the expanded combined beam L3 in the fast axis direction X and the size in the slow axis direction Y approximately equal. This facilitates the convergence of the combined beam L3 into a nearly circular spot, thereby increasing the power density of the combined beam L3. Furthermore, when an optical fiber is required in the subsequent optical path, the nearly circular combined beam L3 can be more easily coupled into the optical fiber, improving the energy utilization efficiency of the combined beam L3.
[0069] Please see Figure 6 The shaping module 50 may include a beam expanding unit 520 and a focusing unit 540, which are sequentially arranged in the optical path of the combined beam L3. The beam expanding unit 520 expands the combined beam L3 along its slow axis Y, and the focusing unit 540 focuses the expanded combined beam L3 to form a high-power-density laser spot.
[0070] As an example, the beam expander 520 may include a plano-concave cylindrical lens 5210 and a plano-convex cylindrical lens 5230, which are sequentially arranged in the optical path of the combined beam L3. The concave surface of the plano-concave cylindrical lens 5210 is the incident surface, and the flat surface is the exit surface, which is used to expand the divergence angle of the combined beam L3 in the slow axis direction Y. The flat surface of the plano-convex cylindrical lens 5230 is the incident surface, and the convex surface is the exit surface, which is used to collimate the combined beam L3 in the slow axis direction Y to avoid an excessively large divergence angle, thus reducing the element size of the subsequent focusing unit 540.
[0071] As another example, the beam expander 520 may also include a biconcave cylindrical lens and a biconvex cylindrical lens, which are sequentially arranged in the optical path of the combined beam L3. This embodiment does not limit the specific implementation of the beam expander 520.
[0072] exist Figure 6 In the embodiment shown, the focusing unit 540 can be a focusing lens, such as a biconvex lens, a plano-convex lens, etc. There can be one or more focusing lenses, and this embodiment does not limit this.
[0073] This application provides a light source device 200 and a laser device 100 configured with the light source device 200. The light source device 200 may include a light source module 10, a light combining module 30, and a shaping module 50. The light source module 10 may include a housing 120, a first laser chip 130, and a second laser chip 140. The first laser chip 130 generates a first light beam L1, and the second laser chip 140 generates a second light beam L2. The housing 120 may include a base plate 1210, a dam 1230, and a cover plate 1250. The dam 1230 is connected between the base plate 1210 and the cover plate 1250 to form a sealed space 1201 together with the base plate 1210 and the cover plate 1250. Specifically, the dam 1230 may be disposed around the outer periphery of the base plate 1210 and protrude towards one side of the base plate 1210 to form an opening (not shown in the figure). The cover plate 1250 closes the opening to form the sealed space 1201.
[0074] The first laser chip 130 and the second laser chip 140 are disposed within the sealed space 1201 and fixed to the base plate 1210 on the side facing the cover plate 1250. That is to say, in this embodiment, both the first laser chip 130 and the second laser chip 140 are fixed using surface mount device (SMD) packaging technology.
[0075] A beam combining module 30 is disposed on the optical path containing the first beam L1 and the second beam L2, and is used to combine the first beam L1 and the second beam L2 to form a combined beam L3. A shaping module 50 is disposed on the optical path containing the combined beam L3, and is used to shape the combined beam L3.
[0076] Since both the first laser chip 130 and the second laser chip 140 in the light source device 200 are fixed inside the housing using surface mount device packaging technology, fixing the first laser chip 130 and the second laser chip 140 can reduce the gap between the two laser chips, thereby reducing the overall size of the light source device 200 and consequently reducing the size of the laser device 100 equipped with the light source device 200, thus achieving a miniaturized design of the laser device 100. Furthermore, with the reduced size of the laser device 100, the processing cost of the laser device 100 will also decrease, making the laser device 100 more competitive in the market.
[0077] In this application specification, certain terms are used to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to"; "generally" means that those skilled in the art can solve the technical problem within a certain margin of error and basically achieve the technical effect.
[0078] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description of this application and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0079] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or merely surface contact. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A light source apparatus, characterized by comprising: It includes a light source module, a light combining module, and a shaping module; the light source module includes a housing, a first laser chip, and a second laser chip, wherein the first laser chip is used to generate a first light beam, and the second laser chip is used to generate a second light beam. The housing includes a base plate, a dam, and a cover plate. The dam is connected between the base plate and the cover plate to form a sealed space together with the base plate and the cover plate. The first laser chip and the second laser chip are fixed on the side of the base plate facing the cover plate. The first beam and the second beam are emitted to the beam combining module through the cover plate. The beam combining module is disposed on the optical path where the first beam and the second beam are located, and is used to combine the first beam and the second beam to form a combined beam; The shaping module is disposed on the optical path of the combined beam and is used to shape the combined beam.
2. The light source apparatus according to claim 1, wherein The light source module also includes a light guide, which is disposed in the sealed space and located on the optical path of the first beam emitted by the first laser chip and the second beam emitted by the second laser chip, for guiding the first beam and the second beam to the cover plate.
3. The light source device according to claim 2, characterized in that, The propagation direction of the first beam emitted by the first laser chip is the same as the propagation direction of the second beam emitted by the second laser chip, and is parallel to the plane where the base plate is located; The light guide is a reflecting prism, which is fixed on the base plate. The reflecting surface of the reflecting prism is inclined relative to the base plate to reflect the first light beam and the second light beam to the cover plate.
4. The light source device according to claim 1, characterized in that, The light source module also includes a heat-conducting component, which is fixed on the base plate; the first laser chip and the second laser chip are attached to the side of the heat-conducting component away from the base plate.
5. The light source device according to any one of claims 1 to 4, characterized in that, The light combining module includes a collimation unit and a light combining unit; The collimation unit is positioned on the optical paths of the first beam and the second beam to collimate the first beam to form a first collimated beam and collimate the second beam to form a second collimated beam. The beam combining unit is used to combine the first collimated beam and the second collimated beam to form the combined beam.
6. The light source device according to claim 5, characterized in that, The collimation unit includes a first collimating lens and a second collimating lens; the first collimating lens is used to collimate the first beam to form the first collimated beam; the second collimating lens is used to collimate the second beam to form the second collimated beam. The first collimating lens and the second collimating lens are fixed to the side of the cover plate away from the bottom plate.
7. The light source device according to claim 5, characterized in that, The first collimated beam and the second collimated beam are both in a first polarization state, which is one of S-polarization and P-polarization; the beam combining unit includes a half-wave plate, a reflector, and a polarizing beam combining plate; The half-wave plate is disposed in the optical path of the second collimated beam and is used to adjust the polarization state of the second collimated beam from the first polarization state to the second polarization state, wherein the second polarization state is the other of the S polarization state and the P polarization state. The reflector is disposed in the optical path of the second collimated beam and is used to reflect the second collimated beam; The polarizing beam combiner is disposed on the optical path of the first collimated beam and the second collimated beam reflected by the reflector, and is used to polarize and combine the first collimated beam and the second collimated beam to form the combined beam.
8. The light source device according to any one of claims 1 to 4, characterized in that, The shaping module includes a beam expanding unit and a focusing unit, which are sequentially arranged on the optical path where the combined beam is located. The beam expanding unit is used to expand the combined beam in the slow axis direction; the focusing unit is used to focus the expanded combined beam.
9. The light source device according to claim 8, characterized in that, The beam expanding unit includes a plano-concave cylindrical lens and a plano-convex cylindrical lens, and the plano-concave cylindrical lens and the plano-convex cylindrical lens are sequentially arranged in the optical path of the combined beam. The plano-concave cylindrical lens is used to expand the divergence angle of the combined beam in the slow axis direction; the plano-convex cylindrical lens is used to collimate the combined beam in the slow axis direction.
10. A laser device, characterized in that, include: The light source device as described in any one of claims 1 to 9.