Induction component and method for manufacturing an induction component

Abstract

The present invention relates to a wire winding, a substrate of a magnetic conductive material, and an induction component having at least two conductive connection surfaces on the underside of the substrate for assembly by SMT (surface mount technology), wherein the wire winding is formed as a flat helical wire winding, the wire winding is positioned on the upper side of the substrate, and two U-shaped clips are provided with two legs and a base connecting the legs, the U-shaped clips are positioned on the substrate such that each of the first legs is positioned on the upper side of the substrate and each of the second legs is positioned on the underside of the substrate, and in each of the U-shaped clips, at least a portion of the second leg forms a connection surface, the first winding end of the wire winding is connected to the first leg of the first clip, and the second winding end of the wire winding is connected to the first leg of the second clip.

Description

Technical Field

[0001] The present invention relates to an inductive component having a wire winding and a method for manufacturing the inductive component.

Background Art

[0002] For non-contact energy transmission, particularly for charging electronic devices, a magnetic field generated by a so-called WPT coil (wireless power transmission) can be utilized. In order to generate the required power density, wire-wound coils are used for wireless power transmission (WPT). These coils have only two wire connections and are not suitable for SMT (surface mounting technology). As a result, after other necessary components on the printed circuit board are attached by an automatic soldering process, such wire-wound WPT coils have to be soldered manually. This brings uncertainty to the process and generally leads to high production costs.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to improve an inductive component having a wire winding and a method for manufacturing the inductive component.

Means for Solving the Problems

[0004] According to the present invention, there are provided an inductive component having the features of claim 1 and a method for manufacturing an inductive component having the features of claim 11 for this purpose. Advantageous embodiments of the present invention are given in the dependent claims.

[0005] The induction component according to the present invention comprises a wire winding, a substrate of a magnetic conductive material, and at least two conductive connection surfaces on the underside of the substrate for assembly by SMT (surface mount technology). The wire winding is formed as a flat helical wire winding and is positioned on the upper side of the substrate, and two U-shaped clips are provided with two legs and a base connecting the legs. The U-shaped clips are positioned on the substrate such that each of the first legs is positioned on the upper side of the substrate and each of the second legs is positioned on the underside of the substrate. In each U-shaped clip, at least a portion of the second leg forms a connection surface, the first winding end of the wire winding is connected to the first leg of the first clip, and the second winding end of the wire winding is connected to the first leg of the second clip.

[0006] A wire winding refers to a winding with conductive wires, usually insulated on the outside, particularly with an enamel coating. Wire windings are different from printed wire windings or stamped wire windings. The inductive components according to the present invention are intended for WPT (Wireless Power Transmission) applications, i.e., wireless transmission of energy in a relatively high power range reaching the kilowatt range. Such coils for high power ranges cannot be formed with printed wire windings or stamped wire windings. Because the wire winding is formed as a flat helical wire winding, the inductive component has a very small structural height on the printed circuit board. A substrate of magnetic conductive material can conduct the magnetic field generated by the wire winding, thereby ensuring very efficient energy transmission by the magnetic field. In a simple manner, two U-shaped clips are placed on the substrate such that each of the first legs is positioned on the upper side of the substrate and each of the second legs is positioned on the lower side of the substrate. The first legs on the upper side of the substrate serve to electrically connect the winding ends of the wire winding, for example, by soldering or mechanical pressing. The second legs, positioned on the underside of the substrate, at least partially form a connection surface for SMT assembly. Such SMT assembly can be carried out in a fully automated manner. The winding ends of the wire windings can also be electrically connected to each of the first legs on the upper side of the substrate, ideally in an automated manner. As a result, the present invention provides an inductive component that can be manufactured in a largely automated manner, mounted to a printed circuit board in an automated manner, and is suitable for wireless transmission of energy by magnetic fields in a high power range reaching the kilowatt range.

[0007] In one embodiment of the present invention, the substrate is formed from ferrite, at least partially.

[0008] Ferrite is a magnetically conductive material, but it is non-conductive. As a result, ferrite forms a material that is very suitable as a substrate for the induction component according to the present invention.

[0009] In one embodiment of the present invention, the substrate is particularly cylindrical, having a central protrusion, and the wire windings surround the protrusion.

[0010] Such a centrally raised section, especially a cylindrical one, can concentrate the magnetic field, thereby ensuring highly efficient energy transmission via the magnetic field.

[0011] In one embodiment of the present invention, the substrate has an annular projection, and the wire winding is arranged inside the annular projection.

[0012] In this way, the magnetic field generated by the wire winding can be conducted, ensuring efficient energy transmission by the magnetic field.

[0013] In one embodiment of the present invention, the innermost turn of the wire winding is positioned adjacent to the central protrusion, and the outermost turn of the wire winding is positioned adjacent to the annular projection.

[0014] In this way, efficient induction of the magnetic field generated by the wire windings within the substrate can be achieved.

[0015] In one embodiment of the present invention, each clip is positioned to surround a portion of the periphery of the substrate.

[0016] Clips can be very easily positioned around the periphery of a circuit board, for example, simply by fastening them in place. Using clips allows for easy and highly reliable relocation of contacts around the periphery of a circuit board.

[0017] In one embodiment of the present invention, the wire winding is bonded to the upper side of the substrate.

[0018] In this way, the wire winding can be reliably held in place during handling and, for example, during the use of induction components in portable applications.

[0019] In the development of the present invention, the wire winding is embedded in a heat-resistant plastic material, particularly an adhesive, especially a synthetic resin.

[0020] By using such heat-resistant plastic materials, it is possible to achieve both adhesive bonding and protection from mechanical damage. Heat-resistant plastic materials also enable protection of inductive components during soldering.

[0021] In the development of the present invention, the wire winding is arranged within a housing made of heat-resistant plastic material.

[0022] This method also provides mechanical fixation, protection from mechanical damage, and protection from high temperatures, such as those during soldering.

[0023] In the development of the present invention, the plastic material in which the wire winding is embedded or the plastic material constituting the housing has heat resistance up to 300°C.

[0024] In this way, the induction components can be automatically soldered, for example, in an oven, or they can also be automatically soldered, for example, in a solder bath or solder wave.

[0025] The object based on the present invention can also be achieved by a method for manufacturing the above-described inductive component, wherein a wire winding formed as a flat helical wire winding is bonded to the upper side of a substrate of magnetic conductive material, two U-shaped clips of conductive material are placed on the substrate, each of the U-shaped clips having a first leg, a second leg, and a base connecting the legs, such that each of the first legs is in contact with the upper side of the substrate and each of the second legs is in contact with the lower side of the substrate, and the first end of the wire winding is electrically connected to the first leg of the first clip and the second end of the wire winding is electrically connected to the first leg of the second clip.

[0026] In one embodiment of the present invention, the clips are arranged such that the base of each clip is in contact with the periphery of the substrate.

[0027] In the development of the present invention, the embedding of the wire winding is carried out in a heat-resistant plastic material, particularly having heat resistance up to 300°C.

[0028] In the development of the present invention, it is envisioned to arrange a wire winding within a housing of a heat-resistant plastic material.

Brief Description of the Drawings

[0029] Further features and advantages of the present invention will become apparent from the following description of the preferred embodiments of the present invention in conjunction with the drawings. [Figure 1] A view from obliquely above of an inductive component according to the present invention is shown. [Figure 2] A plan view of the component according to the present invention of FIG. 1 is shown. [Figure 3] A side view of the component according to the present invention of FIG. 1 is shown. [Figure 4] A view from obliquely in front of a clip for an inductive component is shown.

Modes for Carrying Out the Invention

[0030] FIG. 1 shows an inductive component 10 according to the present invention having a wire winding 12, a substrate 14, and two U-shaped clips 16, 18. The wire winding 12 is manufactured from a round wire into a flat spiral wire winding. As a result, the wire winding 12 is mechanically wound and not particularly printed out or stamped out. It goes without saying that within the scope of the present invention, the wire winding 12 can also be manufactured from a wire having a rectangular or square cross-section. In an invisible form, the wire of the wire winding 12 is electrically insulated, for example, enamel-coated or enamel-painted, so that a short circuit cannot occur between adjacent wire portions or between wire portions overlapping each other.

[0031] The wire winding 12 has a first winding end 20 that is electrically connected to a first clip 16, and a second winding end 22 that is connected to a second clip 18. The conductive connections between the winding end 20 and the clip 16, and between the winding end 22 and the clip 18, may be made by soldering, for example, but can also be made by several other methods, such as welding.

[0032] The clips 16 and 18 are formed identically to each other and are made of a conductive material such as a metal plate, specifically a copper plate. As can be seen in Figure 4, each of the clips 16 and 18 has a U-shape, as shown in the example of clip 16 in Figure 4, having a first leg portion 24, a second leg portion 26, and a base portion 28 connecting the two legs 24 and 26.

[0033] The two clips 16 and 18 are pressed toward the periphery of the substrate 14 so that the first legs 24 of clip 16 and the first legs 24 of clip 18, as shown in Figure 1, rest on the upper side of the substrate. In the state shown in Figure 1, the second legs 26 of each clip are in contact with the underside of the substrate 14, and these are hidden in Figure 1. In the state shown in Figure 1, the base 28 is in contact with the outer circumference of the substrate 14, and the base 28 is hidden in Figure 1 and therefore cannot be seen.

[0034] In the configuration shown in Figure 1, the hidden second legs 26 can function as connection surfaces for the induction component 10. Since each second leg 26 is located on the underside of the substrate 14, the induction component 10 can be mechanically fixed to a printed circuit board using SMT (surface mount technology), and the connection surfaces formed by the second legs 26 on the underside of the substrate 14 can simultaneously be easily electrically connected to connection surfaces on the printed circuit board (not shown), particularly by soldering.

[0035] The inductive component 10 is intended for wireless energy transmission via a magnetic field (wireless power transmission), and in the shown embodiment, it is particularly targeted at a relatively high power range of about 100 watts to several kilowatts. For this reason, the wire winding 12 needs to be wound from wire and cannot be, for example, printed or stamped. Lower power levels can be achieved within the scope of the present invention.

[0036] The substrate 14 is made of ferrite. Ferrite is magnetically conductive and, as a result, can guide the magnetic field generated by the wire winding 12. The substrate 14 has a cylindrical central protrusion 30. The substrate 14 further has ring-shaped projections 32 on its outer circumference. These ring-shaped projections 32 are arranged parallel to the direction of extension of the central protrusion 30. However, the ring-shaped projections 32 are interrupted in the regions of the two clips 16 and 18.

[0037] The magnetic field generated by the wire winding 12 enters or exits the raised portion 30 in a concentrated form, extending upward beyond its periphery, and the electronic equipment to which energy is transmitted can be positioned above the raised portion 30. For this purpose, the electronic equipment also needs to have inductive components to convert the magnetic energy back into electrical energy, for example, to charge the rechargeable battery of the electronic equipment.

[0038] For example, as can be seen from the side view in Figure 3, the underside of the substrate 14 is flat. As a result, the substrate 14 can be easily placed on a printed circuit board.

[0039] As already mentioned, the ring-shaped projection 32 of the substrate 14 is interrupted in the area of ​​the two clips 16 and 18. The ring-shaped projection 32 is interrupted at both ends by ends 36 and 38 that extend radially outward, respectively. The ends 36 and 38 are located on the two sides of the clips 16 and 18, respectively. The stop block 34 is located between the two clips 16 and 18. Between the end 36 and the stop block 34, the substrate 14 has a portion with a thickness that matches the length of the base 28 of the clips 16 and 18. The same applies to the area between the stop block 34 and the end 38. As a result, the clips 16 and 18 can be pressed against the periphery of the substrate 14 until the inside of the base 28 of the clips 16 and 18 contacts the outer circumference of the substrate 14.

[0040] Clips 16 and 18 can be held in this position by clamping force. Alternatively, clips 16 and 18 can be adhesively bonded to the substrate 14. When the state shown in Figure 1 is reached, i.e., when the winding ends 20 and 22 are connected to clips 16 and 18, the wire winding 12 is favorably embedded in a thermally stable plastic material such as adhesive or synthetic resin. As a result, the wire winding 12 can be adhesively bonded to the upper side of the substrate 14, and at the same time, clips 16 and 18 can also be adhesively bonded to the substrate 14. The embedding has the effect of protecting the wire winding 12 from mechanical damage, as the heat-resistant plastic material in which the wire winding 12 is embedded protects the electrical insulation of the wire winding 12, particularly the wires of the wire winding 12. The induction component 10 can also be automatically mounted and soldered, for example, in an oven, solder bath, or solder wave. The wire winding 12 is further protected from mechanical loads.

[0041] Figure 2 shows a plan view of the induction component 10 according to the present invention. A substrate 14 having a ring-shaped projection 32 and a central raised portion 30, a spiral-shaped wire winding 12 on the upper side of the substrate 14, and two clips 16 and 18 are visible.

[0042] Figure 3 shows a side view of the induction component 10. In this side view, the outer circumference of the substrate 14 formed by the ring-shaped projection 32 is visible. From the viewpoint in Figure 3, the end 38 of the radially projecting ring-shaped projection 32 is also visible. In the illustration in Figure 3, it can also be seen that the wire winding 12 protrudes beyond the upper edge of the ring-shaped projection 32. From the viewpoint in Figure 3, the two clips 16 and 18 are hidden. The ends 36, 38 and the stop block 34 (see Figure 1) also serve to mechanically protect the electrical connections connecting the winding end 20 to the clip 16 and the electrical connections connecting the winding end 22 to the clip 18. For this purpose, the ends 36, 38 and the stop block 34 protrude beyond the legs 24 on which the winding ends 20 and 22 are located. Therefore, the legs 24 and the winding ends 20 and 22 are hidden in the side view of Figure 3.

[0043] The present invention provides an inductive component suitable for high power levels reaching several kilowatts and is suitable for assembly using SMT (surface mount technology).

[0044] In the manufacturing of the induction component 10 shown in Figures 1 to 3, the wire winding 12 is first manufactured by winding wire as a flat spiral wire winding. This wire winding 12 is then bonded to the upper side of the substrate 14. To protect the electrical insulation of the wire winding 12, in particular the wires of the wire winding 12, the complete wire winding can be coated with a heat-resistant adhesive, or it can be embedded in a heat-resistant synthetic resin, for example.

[0045] Two U-shaped clips 16 and 18 are positioned around the periphery of the substrate 14. The two winding ends 20 and 22 of the wire winding 12 are then connected to the legs 24 of the clips 16 and 18, which are resting on the upper side of the substrate 14, for example, by soldering. Embedding of the wire winding 12 can also be done after the winding ends 20 and 22 have been electrically connected to the clips 16 and 18.

[0046] After these steps, the induction component 10 is complete. The induction component 10 can be manufactured fully automatically and mounted to a printed circuit board fully automatically.

Claims

1. An induction component having a wire winding, a substrate of magnetic conductive material, and at least two conductive connection surfaces on the underside of the substrate for assembly by SMT (surface mount technology), The aforementioned wire winding is formed on the upper side of the substrate as a flat spiral wire winding. The wire winding is positioned on the upper side of the substrate, and the two U-shaped clips are provided with two legs and a base connecting the legs. The U-shaped clip is positioned on the substrate such that each of the first legs is positioned on the upper side of the substrate and each of the second legs is positioned on the lower side of the substrate, and in each of the U-shaped clips, at least a portion of the second leg forms a connecting surface, the first winding end of the wire winding is connected to the first leg of the first clip, and the second winding end of the wire winding is connected to the first leg of the second clip. The induction component according to claim 1, characterized in that

2. The induction component according to claim 1, characterized in that the substrate is formed at least partially from ferrite.

3. The substrate is particularly cylindrical and has a central protrusion. The induction component according to claim 1 or 2, characterized in that the wire winding surrounds the raised portion.

4. The substrate has an annular projection, The induction component according to any one of claims 1 to 3, characterized in that the wire winding is arranged inside the annular projection.

5. The innermost turn of the wire winding is positioned adjacent to the central protrusion, The induction component according to claims 3 and 4, characterized in that the outermost turn of the wire winding is positioned adjacent to the annular projection.

6. The induction component according to at least one of claims 1 to 5, characterized in that each of the U-shaped clips is arranged to surround a part of the periphery of the substrate.

7. The induction component according to at least one of claims 1 to 6, characterized in that the wire winding is adhesively bonded to the upper side of the substrate.

8. The induction component according to at least one of claims 1 to 7, characterized in that the wire winding is embedded in a heat-resistant plastic material, in particular an adhesive, in particular a synthetic resin.

9. The induction component according to at least one of claims 1 to 8, characterized in that the wire winding is arranged in a housing made of heat-resistant plastic material.

10. The induction component according to claim 8 or 9, characterized in that the plastic material in which the wire winding is embedded or the plastic material constituting the housing has heat resistance up to 300°C.

11. A wire winding, formed as a flat spiral winding, is bonded to the upper side of a magnetic conductive material substrate. Two U-shaped clips made of conductive material, each having a first leg portion, a second leg portion, and a base portion connecting the legs, are placed on the substrate such that each of the first legs is in contact with the upper side of the substrate and each of the second legs is in contact with the lower side of the substrate. The first end of the wire winding is electrically connected to the first leg of the first clip, and the second end of the wire winding is electrically connected to the first leg of the second clip. A method for manufacturing an induction component according to at least one of claims 1 to 7, characterized by including the following:

12. The method according to claim 11, characterized in that the U-shaped clips are arranged such that each of the bases of the U-shaped clips is in contact with the periphery of the substrate.

13. A method for manufacturing an induction component according to claim 11 or 12, further comprising embedding the wire winding in a heat-resistant plastic material, particularly a heat-resistant plastic material up to 300°C.

14. A method for manufacturing an induction component according to claim 11 or 12, further comprising arranging the wire winding in a housing made of a heat-resistant plastic material.

Images