Small volume low voltage full-bridge electromagnetic cooker
By using surface-mount MOSFETs and filter capacitors combined with a high thermal conductivity aluminum substrate and finned heat sinks in a low-voltage full-bridge induction cooker, the problems of large size and high heat dissipation cost of induction cookers are solved, achieving miniaturization and efficient heat dissipation of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN SHUNDE HIGHWAY ELECTRONICS
- Filing Date
- 2025-07-23
- Publication Date
- 2026-07-07
AI Technical Summary
Existing low-voltage induction cookers suffer from problems such as large size and high heat dissipation costs due to excessively long high-frequency current loops and long MOS pins.
Surface mount MOSFETs and surface mount filter capacitors are mounted on a high thermal conductivity aluminum substrate, which is then mounted on a finned heat sink to form a short circuit to reduce heat generation and conduct heat quickly through the aluminum substrate. The finned heat sink also increases the heat dissipation area.
Shorten the length of the current line, improve equipment efficiency, reduce heat generation, reduce equipment size and save costs.
Smart Images
Figure CN224473446U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of full-bridge circuit driving, and in particular to a small-volume, low-voltage full-bridge induction cooker. Background Technology
[0002] Currently, low-voltage induction cookers on the market use plug-in MOSFETs, which are mounted on an aluminum heat sink with a mica sheet in between. The heat sink is then mounted on the circuit board. This architecture results in an excessively long high-frequency current loop during circuit operation due to the mica sheet in between. Additionally, the MOSFET pins in this package are also very long, leading to a large device size. Since the high-frequency current is very large during the operation of a full-bridge circuit, with a peak current exceeding 50A at full power, it generates a lot of heat. Therefore, this structure incurs significant heat dissipation costs. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a small-volume, low-voltage full-bridge induction cooker that can shorten the length of the current line and increase the width of the current line, thereby improving equipment efficiency and reducing excessive heat generation; it improves heat dissipation efficiency and reduces the size of the equipment, thus overcoming the shortcomings of the prior art.
[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:
[0005] A small-volume, low-voltage full-bridge induction cooker includes a full-bridge circuit, a circuit board, a heat sink, an aluminum substrate, surface-mount MOSFETs, and surface-mount filter capacitors. The key feature is that the H-bridge inverter circuit of the full-bridge circuit consists of four MOSFETs: MOSFET1 and MOSFET2 are connected to the positive terminal of the power supply via the upper bridge arm, and MOSFET3 is connected to the negative terminal of the power supply via the lower bridge arm of MOSFET4. A resonant coil is connected to the midpoint of the H-bridge, and a resonant capacitor is connected in series with the coil to form an LC oscillation circuit. By alternating conduction, DC power is converted into high-frequency AC power, driving the coil to generate an alternating magnetic field, thereby heating the cookware. Surface-mount MOSFETs and filter capacitors are mounted on the aluminum substrate, which is then mounted on the heat sink, which is mounted on the circuit board.
[0006] The aluminum substrate is a high thermal conductivity aluminum substrate, used to quickly conduct the heat generated by the IGBT and filter capacitor to the heat sink; the heat sink has a finned structure to increase the heat dissipation area; U1 and U2 of the full-bridge circuit are driver chips.
[0007] The above technical solution has the following beneficial effects:
[0008] This invention utilizes a novel assembly technology to shorten the length and increase the width of the current line in a low-voltage full-bridge induction cooker, thereby improving equipment efficiency and reducing excessive heat generation; it also improves heat dissipation efficiency, reduces equipment size, and saves costs. Attached Figure Description
[0009] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.
[0010] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0011] Figure 1 This is the schematic diagram of the 48V full-bridge circuit of this utility model; Detailed Implementation
[0012] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0013] See Figure 1 As shown, this utility model discloses a small-volume, low-voltage full-bridge induction cooker, including a full-bridge circuit, a circuit board, a heat sink, an aluminum substrate, surface-mount MOSFETs, and surface-mount filter capacitors. The H-bridge inverter circuit of the full-bridge circuit consists of four MOSFETs: MOSFET1 and MOSFET2 are the upper bridge arms connected to the positive terminal of the power supply, MOSFET3 is the lower bridge arm of MOSFET4 connected to the negative terminal of the power supply, and a resonant coil is connected to the midpoint of the H-bridge. A resonant capacitor is connected in series with the coil to form an LC oscillation circuit. By alternating conduction, DC power is converted into high-frequency AC power, driving the coil to generate an alternating magnetic field, thereby heating the cookware. Surface-mount MOSFETs and surface-mount filter capacitors are used, which are mounted on the aluminum substrate, which is mounted on the heat sink, which is mounted on the circuit board.
[0014] The aluminum substrate is a high thermal conductivity aluminum substrate, used to quickly conduct the heat generated by the MOSFET and filter capacitor to the heat sink; the heat sink has a finned structure to increase the heat dissipation area; U1 and U2 of the full-bridge circuit are driver chips.
[0015] As a manifestation of the functionality of this utility model, the specific working process of this small-volume, low-voltage, full-bridge induction cooker is described in detail below:
[0016] like Figure 1 As shown, the small-volume, low-voltage full-bridge induction cooker circuit of this utility model includes a circuit board, a heat sink, and an aluminum substrate. Four surface-mount MOSFETs and one surface-mount filter capacitor are mounted on the aluminum substrate. The aluminum substrate is fixed to the heat sink with thermally conductive adhesive, and the heat sink is then connected to the circuit board.
[0017] During operation, the high-frequency current passes through the short circuit formed by the surface-mount MOSFET and the filter capacitor, reducing energy loss; at the same time, heat is quickly conducted through the aluminum substrate to the heat sink for dissipation, ensuring stable circuit operation.
[0018] All components involved in this utility model can be general standard parts or components known to those skilled in the art. Their structure, principle and control method are known to those skilled in the art through technical manuals or conventional experimental methods.
[0019] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, other circuits obtained by using the same or similar technical features as the above embodiments of the present utility model are all within the protection scope of the present utility model.
Claims
1. A small-volume, low-voltage full-bridge induction cooker, comprising a full-bridge circuit and a circuit board, characterized in that: The H-bridge inverter circuit of the full-bridge circuit consists of 4 MOS transistors. MOS1 and MOS2 are the upper bridge arms connected to the positive terminal of the power supply, MOS3 is the lower bridge arm connected to the negative terminal of the power supply, and the resonant coil is connected to the midpoint of the H-bridge. The resonant capacitor is connected in series with the coil to form an LC oscillation circuit. By alternating conduction, the DC power is converted into high-frequency AC power, which drives the coil to generate an alternating magnetic field, thereby heating the pot. The circuit board includes an aluminum substrate, a heat sink, surface-mount MOSFETs, and surface-mount filter capacitors. The MOSFETs and filter capacitors are surface-mounted on the aluminum substrate, which is then mounted on the heat sink, which is mounted on the circuit board.
2. The small-volume, low-voltage, full-bridge induction cooker according to claim 1, characterized in that: The aluminum substrate is a high thermal conductivity aluminum substrate, used to quickly conduct the heat generated by the IGBT and filter capacitor to the heat sink.
3. The small-volume, low-voltage, full-bridge induction cooker according to claim 1, characterized in that: The heat sink has a finned structure to increase the heat dissipation area.
4. The small-volume, low-voltage, full-bridge induction cooker according to claim 1, characterized in that: U1 and U2 in the full-bridge circuit are driver chips.