Chip packaging structure of flexible circuit board

By setting a heat dissipation structure between the electrodes on the flexible circuit board, the heat dissipation problem between the flexible circuit board and the display driver chip is solved, achieving better heat conduction and heat dissipation effects, and improving the reliability and stability of the product.

CN224473486UActive Publication Date: 2026-07-07AMUSEN ZHENGYU (SHANGHAI) TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
AMUSEN ZHENGYU (SHANGHAI) TECHNOLOGY CO LTD
Filing Date
2025-03-17
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

The existing combination structure of flexible circuit boards and display driver chips is difficult to meet the heat dissipation requirements, resulting in heat accumulation and affecting the stability and reliability of the product.

Method used

A first heat dissipation structure is set between the electrodes on the flexible circuit board, so that the suspended area between the chip and the circuit board has an additional heat dissipation structure. The heat dissipation structure is formed by using high thermal conductivity materials such as copper and silver to enhance the heat dissipation capacity.

Benefits of technology

By adding a heat dissipation structure, the heat of the chip can be effectively dissipated, thereby improving the reliability and stability of the packaging structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a chip packaging structure of a flexible circuit board, which comprises a flexible circuit board, a first surface and a second surface of the flexible circuit board, electrodes on the first surface of the flexible circuit board, a chip on the first surface of the flexible circuit board, the chip being electrically connected with the electrodes, and a first heat dissipation structure on the first surface of the flexible circuit board, the first heat dissipation structure being located below the chip. The electrodes comprise a plurality of electrodes, the plurality of electrodes support the chip so that the chip is at least partially suspended relative to the flexible circuit board, and the first heat dissipation structure is located below the suspended region of the chip. The packaging structure can solve the problem of insufficient heat dissipation performance in the prior art, and enhance the heat dissipation performance and reliability of a product.
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