Arrayed directional arrangement diamond copper-based composite heat dissipation fin
By combining diamond particles with copper plates in an array-oriented manner, a composite heat dissipation fin with high density and high thermal conductivity is formed, which solves the problems of heat conduction obstruction and processing difficulties in the existing diamond/copper composite heat dissipation fins, and achieves efficient heat dissipation and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- COMPOUND SEMICON (XIAMEN) TECH CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-07-07
AI Technical Summary
Existing diamond/copper composite heat sinks suffer from problems such as impeded heat conduction due to the random distribution of diamond particles during the manufacturing process, processing difficulties, and thermal stability issues. Furthermore, traditional processing methods are prone to copper plate breakage and the introduction of impurities, affecting product quality.
A composite heat sink is formed by embedding diamond particles into a copper plate in an array and then forming a composite heat sink through vacuum flat plate hot pressing and spark plasma sintering. Cut grooves are set between adjacent arrays, and a pure copper plate and an active layer are combined to form a composite heat sink with high density and high thermal conductivity.
It achieves improved thermal conductivity and structural strength, simplifies the processing, facilitates large-scale production, avoids problems such as copper plate breakage and impurity introduction, and improves the thermal conductivity and stability of the product.
Smart Images
Figure CN224473593U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of heat dissipation fin technology, specifically relating to an arrayed, directional arrangement of diamond-copper-based composite heat dissipation fins. Background Technology
[0002] With the rapid development of electronic devices towards high power density, miniaturization, and integration, thermal management has become a key bottleneck restricting device performance and reliability. Traditional heat dissipation materials (such as pure copper and aluminum alloys) are limited by their low thermal conductivity (pure copper is about 400 W / mK) and high coefficient of thermal expansion, making it difficult to meet the high-efficiency heat dissipation requirements under high-frequency and high-temperature conditions. Therefore, developing novel composite heat dissipation fins that combine ultra-high thermal conductivity, low coefficient of thermal expansion, and excellent mechanical properties has become a current research focus.
[0003] Diamond is an ideal material that has both ultra-high thermal conductivity (>2000 W / mK) and low coefficient of thermal expansion (~1.0 ppm / K). However, pure diamond films have disadvantages such as high cost and difficulty in preparation. Considering the requirement in industrial applications for materials whose thermal properties can be adjusted according to the usage conditions, its composite with metallic copper is considered an ideal high thermal conductivity solution.
[0004] However, the mainstream approach to preparing diamond / copper composite heat sinks both domestically and internationally is to directly mix diamond powder and copper powder of different particle sizes and then use solid-state sintering or pressure infiltration. In this type of composite heat sink, the diamond particles are in a randomly arranged, disordered state, and the chaotic distribution of the interface hinders heat conduction within the material. Furthermore, the random distribution of the hard particles also leads to processing difficulties and thermal stability issues. Patent CN118752861A discloses a method for preparing a directionally arranged, extruded, folded diamond-copper composite heat sink. The method involves annealing a pure copper plate to obtain an annealed pure copper plate surface; directionally arranging and bonding diamond particles coated with active elements onto the annealed pure copper plate surface; extruding the diamond particles into the pure copper plate to form a composite preform; folding the composite preform to obtain a folded composite preform; and hot-pressing the folded composite preform under high vacuum to obtain the extruded, folded diamond-copper composite heat sink. By oriented diamond particles within a copper matrix and through extrusion and folding, ordered, highly thermally conductive heat transfer channels are formed in the composite heat sink fins, fully utilizing the excellent thermal conductivity of the diamond particles and significantly improving the thermal conductivity of the composite heat sink fins. However, this method requires folding processing to achieve the layered arrangement, which increases impact and pressure. Bending can easily cause copper plate breakage, especially when diamond particles are present at the bend. Furthermore, the manufacturing process requires annealing the copper plate and using adhesives to fix the diamond particles, which can easily introduce impurities, affecting product quality and performance. Utility Model Content
[0005] This invention provides an arrayed, directional arrangement of diamond-copper composite heat dissipation fins, which can effectively solve the above-mentioned problems.
[0006] This utility model is implemented as follows:
[0007] An arrayed, oriented diamond-copper composite heat sink includes a composite plate in which diamond particles are oriented arrayed and embedded in a copper plate. The composite plates are stacked to form a composite heat sink, with diamond particles of the lower composite plate embedded in the upper composite plate. A sintered layer is formed between the upper and lower composite plates, and cutting grooves are provided between adjacent arrays of diamond particles on the composite heat sink.
[0008] The diamond particles are embedded in the upper or lower composite plate to a depth of 2 / 3-9 / 10 of the copper plate thickness, and the surface of the diamond particles is coated with an active layer.
[0009] As a further improvement, the copper plate is a pure copper plate.
[0010] As a further improvement, the diamond particle size is 400~1000μm.
[0011] As a further improvement, the active layer is at least one of W, Mo, Cr, Ti, Zr, MoC, TiC or WC, and the thickness of the active layer is 200~800 nm.
[0012] As a further improvement, the thickness of the pure copper plate is 0.8~2mm.
[0013] As a further improvement, the composite panel has 4 to 10 layers.
[0014] As a further improvement, the array spacing of the diamond particles is 300~1100μm, and the volume ratio of the diamond particles in the composite plate to the copper plate is 20-70%.
[0015] As a further improvement, the width of the cutting groove is 200~1000μm.
[0016] As a further improvement, the diamond particles are arranged with the diamond particle (100) face upward.
[0017] The beneficial effects of this invention are as follows: The composite heat sink is produced by extruding diamond particles and pure copper plates onto an alloy mold with arrayed shallow square grooves using a vacuum flat plate hot pressing method. This yields a pre-fabricated diamond / copper composite heat sink with arrayed directional arrangement. The diamond / copper composite plate is then subjected to multi-layer stacking and spark plasma sintering to form a composite heat sink with arrayed directional arrangement of diamond particles inside. Finally, milling removes the non-diamond portions, resulting in an arrayed directional arrangement of diamond / copper composite heat sink with cutting grooves. This composite heat sink exhibits high density and thermal conductivity, good structural strength, and a simple structure, facilitating large-scale production and widespread application. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of an arrayed, directional arrangement of diamond-copper composite heat dissipation fins according to this utility model;
[0020] Figure 2 This is a schematic diagram of the composite plate structure provided in an embodiment of an arrayed, directional arrangement of diamond-copper-based composite heat dissipation fins according to this utility model;
[0021] Figure 3 This is another structural schematic diagram provided by an embodiment of an arrayed, directional arrangement of diamond-copper composite heat dissipation fins according to this utility model.
[0022] Figure 4 This is a schematic diagram of the composite heat sink structure provided in an embodiment of an arrayed, directional arrangement of diamond-copper composite heat sink fins according to this utility model.
[0023] Figure label:
[0024] Diamond particles 1; active layer 11; copper plate 2; composite plate 3; upper composite plate 31; lower composite plate 32; sintered layer 33; composite heat dissipation plate 4; cutting groove 5. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.
[0026] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0027] In the description of this utility model, the terms "upper", "middle", "side", "side", "upper side", "end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0028] Reference Figure 1-4As shown, an arrayed oriented diamond copper-based composite heat sink includes a composite plate 3 in which diamond particles 1 are orientedly arranged and embedded in a copper plate 2. The composite plates 3 are stacked to form a composite heat sink 4, and the diamond particles of the lower composite plate 32 are embedded in the upper composite plate 31. A sintered layer 33 is formed between the upper composite plate 31 and the lower composite plate 32. Cutting grooves 5 are provided between adjacent arrays of diamond particles 1 on the composite heat sink 4.
[0029] Diamond particles 1 are embedded into copper plate 2 by vacuum flat plate hot pressing to form a composite plate 3 in which diamond particles 1 are oriented array; after the composite plate 3 is stacked and pressed, a sintered layer 33 is formed by spark plasma sintering to form an integral composite heat sink 4; after milling, the copper plate 2 without diamond parts between adjacent arrays of diamond particles 1 is removed to form a cutting groove 5, and a diamond-copper composite heat sink fin is obtained.
[0030] Furthermore, the diamond particle 1 is embedded in the upper or lower composite plate 32 to a depth of 2 / 3-9 / 10 of the copper plate 2 thickness, and the surface of the diamond particle 1 is coated with an active layer 11.
[0031] Diamond particles 1 are embedded in both the upper and lower composite plates 32, which can enhance the lateral strength of the stacked copper plates 2. The depth of the diamond particles 1 embedded in the upper or lower composite plate 32 is 2 / 3-9 / 10, which ensures that the height of the diamond particles 1 embedded in the upper and lower composite plates 32 is consistent during lamination. This avoids uneven embedding depth, which would lead to uneven thermal conductivity and cause problems such as unbalanced expansion and contraction between the sintered layer 33 and the bonding layer between the diamond and the copper plate 2, resulting in decreased thermal conductivity. The active layer 11 can increase the bonding force and heat transfer effect between the diamond particles 1 and the copper plate 2, thereby improving thermal conductivity.
[0032] Furthermore, the copper plate 2 is a pure copper plate.
[0033] Pure copper plates are easier to process and reduce costs.
[0034] Furthermore, the diamond particle 1 has a size of 400~1000μm.
[0035] This value takes into account performance, copper plate thickness, and cost, allowing for the selection of particles larger than 900μm, reducing the number of particles and the amount of composite plate 32 prepared.
[0036] This size allows for good thermal conductivity and facilitates product processing.
[0037] Further, the active layer 11 is at least one of W, Mo, Cr, Ti, Zr, MoC, TiC or WC, and the thickness of the active layer 11 is 200~800 nm.
[0038] Considering factors such as the masking effect of the active layer 11, mechanical stress, and interfacial thermal resistance, a single element requires a thinner 200-300nm coating, while a multi-layer coating would increase the thickness to some extent.
[0039] Furthermore, the thickness of the pure copper plate 2 is 0.8~2mm.
[0040] The top and bottom copper plates of the composite heat sink 4 can be thicker, with uniformly distributed internal copper plates, and the mass ratio of diamond to copper is [missing information].
[0041] While ensuring the embedding of diamond particles 1, there is good thermal conductivity between the upper and lower layers.
[0042] Furthermore, the composite board 3 has 4 to 10 layers.
[0043] More layers can be added, and the thickness of these layers is sufficient to ensure good heat dissipation and meet the heat dissipation requirements of the heat dissipation components. However, too many layers are not conducive to processing. More layers result in a larger working space in the sintering furnace, which requires higher standards of heat preservation and uniformity of the temperature field, leading to higher production costs.
[0044] Furthermore, the array spacing of the diamond particles 1 is 300~1100μm, and the volume ratio of the diamond particles in the composite plate to the copper plate is 20-70%.
[0045] Too small a spacing is not conducive to processing and can easily cause damage to the copper plate 2 or the diamond particles 1 to align. Too small a spacing will also affect the heat dissipation effect.
[0046] Furthermore, the width of the cutting groove 5 is 200~1000μm.
[0047] Furthermore, the diamond particle 1 has its (100) face facing upwards.
[0048] This ensures that the diamond particles 1 have good embedding effect and thermal conductivity.
[0049] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. An arrayed, directional arrangement of diamond-copper-based composite heat dissipation fins, characterized in that, The composite plate includes a copper plate with diamond particles arranged in an oriented pattern. The composite plate is stacked to form a composite heat sink, with diamond particles of the lower composite plate embedded in the upper composite plate. A sintered layer is formed between the upper and lower composite plates, and cutting grooves are provided between adjacent arrays of diamond particles on the composite heat sink.
2. The arrayed, directionally arranged diamond-copper composite heat dissipation fins according to claim 1, characterized in that, The diamond particles are embedded in the upper or lower composite plate to a depth of 2 / 3-9 / 10 of the copper plate thickness, and the surface of the diamond particles is coated with an active layer.
3. An arrayed, directionally arranged diamond-copper composite heat dissipation fin as described in claim 1 or 2, characterized in that, The copper plate is a pure copper plate.
4. An arrayed, directionally arranged diamond-copper composite heat dissipation fin as described in claim 1 or 2, characterized in that, The diamond particles have a size of 400~1000μm.
5. The arrayed, directionally arranged diamond-copper composite heat dissipation fins according to claim 2, characterized in that, The active layer is at least one of W, Mo, Cr, Ti, Zr, MoC, TiC or WC, and the thickness of the active layer is 200~800 nm.
6. The arrayed, directionally arranged diamond-copper composite heat dissipation fins according to claim 3, characterized in that, The thickness of the pure copper plate is 0.8~2mm.
7. The arrayed, directionally arranged diamond-copper composite heat dissipation fins according to claim 1, characterized in that, The composite board has 4 to 10 layers.
8. The arrayed, directionally arranged diamond-copper composite heat dissipation fins according to claim 1, characterized in that, The array spacing of the diamond particles is 300~1100μm, and the volume ratio of the diamond particles in the composite plate to the copper plate is 20-70%.
9. The arrayed, directionally arranged diamond-copper composite heat dissipation fins according to claim 1, characterized in that, The width of the cutting groove is 200~1000μm.
10. An arrayed, directionally arranged diamond-copper composite heat dissipation fin as described in claim 1, 2, or 8, characterized in that, The diamond particles are arranged with the diamond particle (100) face upwards.