Heating element assembly and aerosol-generating device

Abstract

This application discloses a heating element assembly and an aerosol generating apparatus, comprising: a tubular carrier defining a receiving space for receiving an aerosol-generated article; a first conductive carrier surrounding the tubular carrier, the first conductive carrier being adapted to transfer heat to the tubular carrier, the first conductive carrier including a positive terminal and a negative terminal; and a plurality of semiconductor components disposed on the first conductive carrier, each semiconductor component including an electrically connected N-type semiconductor and a P-type semiconductor, the N-type semiconductor and the P-type semiconductor having equal areas, the N-type semiconductor and the P-type semiconductor being connected in series between the positive terminal and the negative terminal; the N-type semiconductor and the P-type semiconductor are uniformly distributed on at least a portion of the surface of the first conductive carrier, thereby forming a uniform temperature field in at least a portion of the tubular carrier when a current is applied between the positive terminal and the negative terminal. Therefore, the heating effect of the aerosol-generated article can be improved.

Description

Technical Field

[0001] This application relates to the field of heated non-combustible aerosol generation technology, and more particularly to a heating element assembly and an aerosol generation device. Background Technology

[0002] Tobacco products (such as cigarettes, cigars, etc.) produce tobacco smoke by burning tobacco during use. Efforts are being made to replace these tobacco-burning products by creating products that release compounds without combustion.

[0003] Examples of such products are heating devices that release compounds by heating rather than burning materials. For example, the material could be an aerosol-generating article containing tobacco or other non-tobacco products, which may or may not contain nicotine. Known heating devices include heating element assemblies for heating the aerosol-generating article by means such as circumferential resistance, circumferential infrared, or circumferential electromagnetic methods. However, existing circumferential heating methods suffer from uneven temperature fields in their heating element assemblies, leading to inconsistent carbonization on, for example, the surface of the aerosol-generating article, thus reducing the heating effect. Utility Model Content

[0004] This application provides a heating element assembly and an aerosol generating device, which can form a uniform temperature field in at least a portion of a tubular carrier. The carbonization degree of the surface of the aerosol generating product acting in the uniform temperature field is consistent, thereby improving the heating effect of the aerosol generating product.

[0005] One embodiment of this application provides a heating element assembly, including:

[0006] A tubular carrier that defines a containment space for receiving aerosol-generated products;

[0007] A first conductive carrier is disposed around the tubular carrier, the first conductive carrier being adapted to transfer heat to the tubular carrier, the first conductive carrier including a positive electrode connection end and a negative electrode connection end;

[0008] Multiple semiconductor components are disposed on the first conductive carrier. Each semiconductor component includes an N-type semiconductor and a P-type semiconductor that are electrically connected. The N-type semiconductor and the P-type semiconductor have equal areas and are connected in series between the positive terminal and the negative terminal.

[0009] The N-type semiconductor and the P-type semiconductor are uniformly distributed on at least a portion of the surface of the first conductive carrier, thereby forming a uniform temperature field in at least a portion of the tubular carrier when current is passed between the positive terminal and the negative terminal.

[0010] In some embodiments, the N-type semiconductor and the P-type semiconductor are uniformly distributed across the entire surface of the first conductive carrier, thereby forming a uniform temperature field on the tubular carrier when a current is applied between the positive terminal and the negative terminal. In some embodiments, the first conductive carrier includes at least two heating zones along the length of the tubular carrier, and when a current is applied between the positive terminal and the negative terminal, each heating zone forms a uniform temperature field on the tubular carrier, and at least one heating zone has a temperature difference from the other heating zones.

[0011] In some embodiments, the N-type semiconductor and the P-type semiconductor are uniformly distributed in each heating zone, and the distribution density of the N-type semiconductor and the P-type semiconductor in at least two heating zones is not entirely equal.

[0012] In some embodiments, when the N-type semiconductor and the P-type semiconductor are uniformly distributed across the entire surface of the first conductive carrier, the maximum temperature difference between the inner walls of the tubular carrier is less than or equal to 20°C.

[0013] In some embodiments, the first conductive carrier includes a first heating region, a second heating region, and a third heating region along the length of the tubular carrier;

[0014] The number of N-type semiconductors and P-type semiconductors in the first heating zone is a first quantity, the number of N-type semiconductors and P-type semiconductors in the second heating zone is a second quantity, and the number of N-type semiconductors and P-type semiconductors in the third heating zone is a third quantity;

[0015] The first quantity, the second quantity, and the third quantity are not all equal.

[0016] In some embodiments, the first conductive carrier includes a first heating region, a second heating region, and a third heating region along the length of the tubular carrier;

[0017] The N-type semiconductors and P-type semiconductors in the first heating zone are configured into a first semiconductor matrix of N1 rows * M1 columns, the N-type semiconductors and P-type semiconductors in the second heating zone are configured into a second semiconductor matrix of N2 rows * M2 columns, and the N-type semiconductors and P-type semiconductors in the third heating zone are configured into a third semiconductor matrix of N3 rows * M3 columns.

[0018] In the first semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductors or P-type semiconductors is D1; ​​in the second semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductors or P-type semiconductors is D2; and in the third semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductors or P-type semiconductors is D3.

[0019] Where N1=N2>N3, M1>M2>M3, D1<D2<D3; or, N1<N2=N3, M1<M2<M3, D1>D2>D3.

[0020] In some embodiments, the first conductive carrier includes a flexible circuit board, on which the positive electrode connection terminal and the negative electrode connection terminal are disposed.

[0021] In some embodiments, the flexible circuit board includes a body, and the positive terminal and / or the negative terminal contact the surface of the body or are embedded in the body.

[0022] In some embodiments, the flexible circuit board further includes a conductive element disposed on the surface of the body, and the N-type semiconductor and the P-type semiconductor are connected in series between the positive terminal and the negative terminal through the conductive element.

[0023] In some embodiments, the N-type semiconductor and P-type semiconductor of the semiconductor component are fixed to the first conductive carrier at intervals by welding.

[0024] In some embodiments, the heating element assembly further includes conductive leads extending along the length of the tubular carrier, wherein one conductive lead is connected to the positive terminal and the other conductive lead is connected to the negative terminal.

[0025] In some embodiments, the tubular carrier is made of materials including metal, quartz, graphite, graphene, diamond, silicon carbide, aluminum nitride, or thermally conductive polymers.

[0026] In some embodiments, the heating element assembly further includes a plurality of second conductive carriers, each of which is connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor assembly.

[0027] In some embodiments, the heating element assembly further includes a fixing member disposed around the second conductive carrier.

[0028] In some embodiments, the heating element assembly further includes the temperature sensor, the sensing head of which is disposed between the second conductive carrier and the fixing member.

[0029] In some embodiments, the fastener comprises a PI membrane or aerogel.

[0030] In some embodiments, when the fixture includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor and less than or equal to the axial length of the tubular carrier.

[0031] In some embodiments, the heating element assembly further includes an isolator disposed between the second conductive carrier and the fixing member.

[0032] In some embodiments, the separator includes a PI film.

[0033] One embodiment of this application provides an aerosol generating apparatus, comprising:

[0034] The heating element assembly as described in any of the above embodiments further includes a plurality of second conductive carriers, each of which is respectively connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor assembly;

[0035] A power supply component, with its positive terminal electrically connected to the positive terminal and its negative terminal electrically connected to the negative terminal, is configured to provide current to the heating element component. When current flows through the semiconductor component, heat generated based on the Boltzmann effect is transferred from the second conductive carrier to the first conductive carrier, generating Joule heating at both ends of the first and second conductive carriers. The Joule heating generated by the second conductive carrier is also transferred to the first conductive carrier, thereby increasing the temperature of the first conductive carrier to heat the aerosol-generated product.

[0036] The aforementioned heating element assembly and aerosol generating device include: a tubular carrier defining a receiving space for receiving an aerosol-generated article; a first conductive carrier surrounding the tubular carrier, the first conductive carrier being adapted to transfer heat to the tubular carrier, the first conductive carrier including a positive electrode connection terminal and a negative electrode connection terminal; and a plurality of semiconductor components, each semiconductor component being disposed on the first conductive carrier, each semiconductor component including an electrically connected N-type semiconductor and a P-type semiconductor, the N-type semiconductor and the P-type semiconductor having equal areas, the N-type semiconductor and the P-type semiconductor being connected in series between the positive electrode connection terminal and the negative electrode connection terminal; the N-type semiconductor and the P-type semiconductor are uniformly distributed on at least a portion of the surface of the first conductive carrier, and when a current is applied between the positive electrode connection terminal and the negative electrode connection terminal, a uniform temperature field is formed in at least a portion of the tubular carrier. Therefore, this application can form a uniform temperature field in at least a portion of the tubular carrier, and the surface of the aerosol-generated article acting under the uniform temperature field has a consistent degree of carbonization, thereby improving the heating effect of the aerosol-generated article. Attached Figure Description

[0037] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0038] Figure 1 This is a schematic diagram of a heating element assembly provided in one embodiment;

[0039] Figure 2 This is a top view of a first conductive carrier unfolded away from the surface of a tubular carrier, with elements omitted, provided in one embodiment.

[0040] Figure 3 This is a top view of a first conductive carrier unfolded away from the surface of a tubular carrier, with elements omitted, provided in one embodiment.

[0041] Figure 4 This is a schematic diagram of a first conductive carrier, a plurality of semiconductor components, and a plurality of second conductive carriers provided in one embodiment;

[0042] Figure 5 This is a schematic diagram showing that N-type semiconductors and P-type semiconductors are uniformly distributed on at least a portion of the surface of a first conductive carrier, according to one embodiment.

[0043] Figure 6 This is a schematic diagram showing that N-type semiconductors and P-type semiconductors are uniformly distributed on at least a portion of the surface of a first conductive carrier, according to another embodiment.

[0044] Figure 7 This is a schematic diagram showing that, according to another embodiment, N-type and P-type semiconductors are uniformly distributed on at least a portion of the surface of a first conductive carrier.

[0045] Figure 8 This is a schematic diagram of an aerosol generating apparatus provided in one embodiment. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only one regional embodiment of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0047] The terms "first," "second," and "third" used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number or order of the indicated technical features. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship or movement of the components in a certain posture (as shown in the accompanying drawings). If the posture changes, the directional indication will also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0048] In this document, the term "embodiment" means that a feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be intervening elements. When an element is referred to as being "connected to" another element, it can be directly connected to the other element, or there may be one or more intervening elements. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0050] Reference Figure 1 One embodiment of this application provides a heating element assembly 100, the heating element assembly 100 comprising:

[0051] The tubular carrier 10 defines a containment space 101 for receiving aerosol-generated products.

[0052] As used herein, the term "aerosol-generating article" refers to an article comprising an aerosol-forming matrix that, when heated, releases volatile compounds that can form aerosols. In one embodiment, the aerosol-generating article is removably coupled to the heating element assembly 100.

[0053] Aerosol forming matrices can include solid aerosol forming matrices. Solid aerosol forming matrices can include tobacco-containing materials containing volatile tobacco flavor compounds that are released from the aerosol forming matrix upon heating. Solid aerosol forming matrices can also include non-tobacco materials. Solid aerosol forming matrices can include both tobacco-containing and non-tobacco-containing materials.

[0054] The aerosol-forming matrix may include a liquid aerosol-forming matrix. A liquid aerosol-forming matrix may contain a liquid containing tobacco-containing substances with volatile tobacco aroma components, or it may contain a liquid containing non-tobacco substances. The liquid aerosol-forming matrix may contain water, solvents, ethanol, plant extracts, fragrances, flavorings, or vitamin mixtures, etc. Fragrances may include, but are not limited to, menthol, peppermint oil, spearmint oil, and various fruit flavoring components. Flavorings may contain ingredients that can provide the user with various aromas or flavors. Vitamin mixtures may be mixtures containing at least one of vitamin A, vitamin B, vitamin C, and vitamin E, but are not limited to these.

[0055] The containment space 101 extends radially along the receiving direction of the aerosol-generated product.

[0056] A first conductive carrier 20 is disposed around the tubular carrier 10. The first conductive carrier 20 is adapted to transfer heat to the tubular carrier 10. The first conductive carrier 20 includes a positive electrode connection end and a negative electrode connection end.

[0057] The first conductive carrier 20 is disposed in close contact with the tubular carrier 10, so the tubular carrier 10 can support the first conductive carrier 20 and maintain the first conductive carrier 20 in a preset shape. Adhesive can be applied to the outer surface of the tubular carrier 10 and / or the surface of the first conductive carrier 20 facing the tubular carrier 10, so that the first conductive carrier 20 can be fixed to the tubular carrier 10 by adhesive.

[0058] The first conductive carrier 20 is bendable. In one embodiment, the first conductive carrier 20 is bent close to the outer surface of the tubular carrier 10. Preferably, the first conductive carrier 20 is closed around the tubular carrier 10. In this case, ignoring the thickness of the first conductive carrier 20, the area of ​​the side surface of the first conductive carrier 20 where the semiconductor component 30 is disposed is equal to the area of ​​the outer surface of the tubular carrier 10. The temperature field of the side surface of the first conductive carrier 20 where the semiconductor component 30 is disposed can be correspondingly conducted to the inner surface of the tubular carrier 10, and heat is transferred through the contact between the inner surface of the tubular carrier 10 and the aerosol generating article. Alternatively, the gap between the inner surface of the tubular carrier 10 and the aerosol generating article is used to heat the air flowing through the gap through the heat of the inner surface of the tubular carrier 10, thereby heating the aerosol generating article through the heated air. As an example, the gap is no greater than 0.5 mm, preferably no greater than 0.15 mm. In one embodiment, after the first conductive carrier 20 is bent close to the outer surface of the tubular carrier 10, its two ends are not closed.

[0059] Please refer to the following: Figure 2 The first conductive carrier 20 includes a flexible circuit board, on which a positive terminal 21 and a negative terminal 22 are provided.

[0060] The flexible circuit board includes a body 23, with a positive terminal 21 and / or a negative terminal 22 contacting the surface of the body 23 or embedded in the body 23.

[0061] The flexible circuit board also includes a conductive element 24, which is disposed on the surface of the body 23. The N-type semiconductor 31 and the P-type semiconductor 32 are connected in series between the positive terminal 21 and the negative terminal 22 through the conductive element 24.

[0062] In one embodiment, the conductive element 24 is a copper foil, which is a thin, continuous metal foil deposited on the substrate layer of the flexible circuit board, serving as a conductor of the flexible circuit board.

[0063] When the aerosol-generating article is received, the aerosol-generating article placed in the receiving space 101 is at least in contact with the tubular carrier 10. The tubular carrier 10 is a heat conductor, which can absorb heat from the first conductive carrier 20 and transfer at least a portion of the absorbed heat to the aerosol-generating article.

[0064] The tubular carrier 10 has a thermal conductivity greater than or equal to 10 W / (m•K). Suitable tubular carriers 10 include, but are not limited to, at least one or more of the following: metal, graphite, graphene, diamond, silicon carbide, aluminum nitride, or thermally conductive polymers. The metals include, but are not limited to, one or more of the following: silver, copper, gold, aluminum, tungsten, zinc, molybdenum, nickel, iron, platinum, ferrite, alloys, or stainless steel. The thermally conductive polymers include, but are not limited to, thermally conductive silicone or thermally conductive grease. By giving the tubular carrier 10 a high thermal conductivity, the efficiency of heat transfer from the heat pipe to the aerosol-generating product is improved.

[0065] The heating element assembly 100 may further include a temperature detector. The probe of the temperature detector is connected to the tubular carrier 10 for detecting the temperature of the tubular carrier 10. Simultaneously, the temperature detector is electrically connected to a controller on a circuit board to transmit the detected temperature information of the tubular carrier 10 to the controller. The controller can adjust the current or voltage supplied to the heating element assembly 100 by the power supply component based on this temperature information, thereby regulating the temperature of the tubular carrier 10 to ensure sufficient heating of the aerosol-generating product and prevent the aerosol-generating product from burning. The temperature detector can be a thermocouple or a thermistor; no limitation is made to the temperature detector used here.

[0066] The thickness of the tubular carrier 10 can be less than or equal to 0.2 mm to reduce the heat consumption of the tubular carrier 10 itself, so that more of the heat transferred from the first conductive carrier 20 to the tubular carrier 10 can be transferred to the aerosol generating product by the tubular carrier 10, thereby improving the heat utilization rate.

[0067] In some embodiments, the tubular carrier 10 may be omitted. In this case, the inner wall surface of the first conductive carrier 20 defines at least a portion of the boundary of the receiving space 101. Alternatively, at least a portion of the first conductive carrier 20 may be configured as tubular, such that when receiving an aerosol-generating article, at least a portion of the aerosol-generating article is surrounded by the tubular first conductive carrier 20.

[0068] In other embodiments, at least a portion of the first conductive carrier 20 contacts the side surface of the aerosol-generating article to increase the heat transfer efficiency between the first conductive carrier 20 and the side surface of the aerosol-generating article through direct contact, thereby helping to reduce losses.

[0069] Multiple semiconductor components 30 are disposed on the first conductive carrier 20. Each semiconductor component 30 includes an N-type semiconductor 31 and a P-type semiconductor 32 that are electrically connected. The N-type semiconductor 31 and the P-type semiconductor 32 have equal areas and are connected in series between the positive terminal 21 and the negative terminal 22.

[0070] The N-type semiconductor 31 and the P-type semiconductor 32 are uniformly distributed on at least a portion of the surface of the first conductive carrier 20, thereby forming a uniform temperature field in at least a portion of the tubular carrier 10 when a current is passed between the positive terminal 21 and the negative terminal 22.

[0071] One end of the N-type semiconductor 31 and one end of the P-type semiconductor 32 in the semiconductor component 30 are both electrically connected to the first conductive carrier 20. Optionally, the N-type semiconductor 31 and the P-type semiconductor 32 of the semiconductor component 30 are fixed to the first conductive carrier 20 with an interval between them by welding.

[0072] In one embodiment, the flexible circuit board further includes pads, which are metal contact points on the flexible circuit board used for soldering N-type semiconductor 31 and P-type semiconductor 32, also known as solder pads. One end of the N-type semiconductor 31 and one end of the P-type semiconductor 32 in the semiconductor assembly 30 are respectively soldered to the corresponding pads.

[0073] In a preferred embodiment, both the N-type semiconductor 31 and the P-type semiconductor 32 are constructed as cuboids, and the N-type semiconductor 31 and the P-type semiconductor 32 are identical. One end of the N-type semiconductor 31 is defined as its bottom surface, and the other end of the P-type semiconductor 32 is defined as its top surface. In this embodiment, the areas of the bottom and top surfaces of the N-type semiconductor 31, the bottom surface and the top surface of the P-type semiconductor 32 are equal; and the lengths of the N-type semiconductor 31 and the P-type semiconductor 32 are equal.

[0074] The N-type semiconductor 31 and the P-type semiconductor 32 have equal areas, ensuring that their impedances are equal. At the same time, the N-type semiconductor 31 and the P-type semiconductor 32 are connected in series between the positive terminal 21 and the negative terminal 22, ensuring that the current flowing through each N-type semiconductor 31 and the P-type semiconductor 32 is equal. As a result, the heat generated by each N-type semiconductor 31 and the P-type semiconductor 32 is equal, and thus each N-type semiconductor 31 and the P-type semiconductor 32 forms the same independent temperature field.

[0075] It should be noted that the heat transfer direction of the independent temperature field is unidirectional, from the outside to the inside, along the axis perpendicular to the tubular carrier 10.

[0076] Based on this, the N-type semiconductor 31 and the P-type semiconductor 32 are uniformly distributed on at least a portion of the surface of the first conductive carrier 20. When a current is passed between the positive terminal 21 and the negative terminal 22, the N-type semiconductor 31 and the P-type semiconductor 32 form the same independent temperature field and are also uniformly distributed on at least a portion of the surface, thereby forming a uniform temperature field in at least a portion of the tubular carrier 10.

[0077] In an alternative embodiment, the areas of the N-type semiconductor 31 and the P-type semiconductor 32 are not equal. By setting the doping composition and ratio of the N-type semiconductor 31 and the P-type semiconductor 32, the impedances of the N-type semiconductor 31 and the P-type semiconductor 32 are made equal. At the same time, the N-type semiconductor 31 and the P-type semiconductor 32 are connected in series between the positive terminal 21 and the negative terminal 22 to ensure that the current flowing through each N-type semiconductor 31 and the P-type semiconductor 32 is equal, so that the heat generated by each N-type semiconductor 31 and the P-type semiconductor 32 is equal, and thus each N-type semiconductor 31 and the P-type semiconductor 32 forms the same independent temperature field.

[0078] N-type semiconductor 31 and P-type semiconductor 32 are uniformly distributed across the entire surface of the first conductive carrier 20. When current is applied between the positive terminal 21 and the negative terminal 22, a uniform temperature field is formed on the tubular carrier 10 by the first conductive carrier 20.

[0079] according to Figure 5 As shown, N-type semiconductor 31 and P-type semiconductor 32 are uniformly distributed on the entire surface of the first conductive carrier 20. When current is passed between the positive terminal 21 and the negative terminal 22, each N-type semiconductor 31 and P-type semiconductor 32 forms the same independent temperature field T1. Several independent temperature fields T1 are uniformly distributed on the entire surface of the first conductive carrier 20, so that a uniform temperature field is formed on the entire surface of the first conductive carrier 20. Furthermore, the first conductive carrier 20 is arranged around the tubular carrier 10. Therefore, the first conductive carrier 20 forms a uniform temperature field on the tubular carrier 10.

[0080] It is worth noting that the N-type semiconductor 31 and the P-type semiconductor 32 are uniformly distributed across the entire surface of the first conductive carrier 20 in a manner not limited to... Figure 5 The surface covering method shown can be, for example, the N-type semiconductor 31 and the P-type semiconductor 32 can be uniformly distributed in a polygonal pattern on the entire surface of the first conductive carrier 20, and the polygonal region forms a uniform temperature field on the tubular carrier 10; or the N-type semiconductor 31 and the P-type semiconductor 32 can be uniformly distributed in a circular pattern on the entire surface of the first conductive carrier 20, and the circular region forms a uniform temperature field on the tubular carrier 10.

[0081] When the N-type semiconductor 31 and the P-type semiconductor 32 are uniformly distributed across the entire surface of the first conductive carrier 20, the maximum temperature difference of the inner wall of the tubular carrier 10 is less than or equal to 20°C.

[0082] Ideally, since the first conductive carrier 20 forms a uniform temperature field on the tubular carrier 10, there is no temperature difference on the inner wall of the tubular carrier 10, achieving uniform heating of the side surface of the aerosol-generated product. In reality, due to various factors such as the tubular carrier 10 and the temperature detector fixed to the inner wall of the tubular carrier 10, the temperature measured at different locations on the inner wall of the tubular carrier 10 varies. For example, along the receiving direction of the aerosol-generated product, the temperature of the upper, middle, and lower regions of the inner wall of the tubular carrier 10 is measured, and the maximum temperature difference is less than or equal to 20°C. It can be seen that most of the temperature difference on the inner wall of the tubular carrier 10 is due to measurement error. Even if there is a temperature difference on the inner wall of the tubular carrier 10, by designing the maximum temperature difference to be less than or equal to 20°C, the impact on achieving uniform heating of the side surface of the aerosol-generated product is minimal, and the user will hardly perceive any change in the suction experience caused by the temperature difference on the inner wall of the tubular carrier 10.

[0083] The first conductive carrier 20 includes at least two heating zones along the length of the tubular carrier 10. When current is applied between the positive terminal 21 and the negative terminal 22, each heating zone forms a uniform temperature field on the tubular carrier 10, and there is a temperature difference between at least one heating zone and the other heating zones.

[0084] The heating element assembly 100 has a zoned heating function, achieving uniform heating of the aerosol-generating article within each heating zone. A suitable example is that at least one heating zone and the remaining heating zones have a temperature difference. For instance, the first conductive carrier 20 includes two heating zones along the length of the tubular carrier 10, where the temperature of the uniform temperature field of the heating zone closer to the aerosol-generating article's nozzle section is higher than the temperature of the uniform temperature field of the other heating zone, enabling rapid smoke extraction. It is understood that the temperature of the uniform temperature field of different heating zones is designed according to the actual needs of the heating element assembly 100.

[0085] The N-type semiconductor 31 and the P-type semiconductor 32 are uniformly distributed in each heating zone, and the distribution density of the N-type semiconductor 31 and the P-type semiconductor 32 in at least two heating zones is not entirely equal.

[0086] It is worth noting that the uniform distribution of N-type semiconductor 31 and P-type semiconductor 32 within each heating zone is not limited to... Figure 6 or Figure 7 The semiconductor matrix arrangement shown can be referenced. Figure 5 The uniform distribution shown can be any way.

[0087] The first conductive carrier 20 includes a first heating region, a second heating region, and a third heating region along the length of the tubular carrier 10; the number of N-type semiconductors 31 and P-type semiconductors 32 in the first heating region is a first quantity, the number of N-type semiconductors 31 and P-type semiconductors 32 in the second heating region is a second quantity, and the number of N-type semiconductors 31 and P-type semiconductors 32 in the third heating region is a third quantity; wherein, the first quantity, the second quantity, and the third quantity are not all equal.

[0088] As an example, according to Figure 6 As shown, the first conductive carrier 20 includes a first heating region H1, a second heating region H2, and a third heating region H3 along the length direction of the tubular carrier 10; the first heating region H1 has 14 N-type semiconductors 31 and P-type semiconductors 32, the second heating region H2 has 12 N-type semiconductors 31 and P-type semiconductors 32, and the third heating region H3 has 5 N-type semiconductors 31 and P-type semiconductors 32; the number of N-type semiconductors 31 and P-type semiconductors 32 in the first heating region H1, the second heating region H2, and the third heating region H3 are not all equal.

[0089] As another example, according to Figure 7 As shown, the first conductive carrier 20 includes a first heating region H1, a second heating region H2, and a third heating region H3 along the length direction of the tubular carrier 10; the first heating region H1 has 5 N-type semiconductors 31 and P-type semiconductors 32, the second heating region H2 has 12 N-type semiconductors 31 and P-type semiconductors 32, and the third heating region H3 has 14 N-type semiconductors 31 and P-type semiconductors 32; the number of N-type semiconductors 31 and P-type semiconductors 32 in the first heating region H1, the second heating region H2, and the third heating region H3 are not all equal.

[0090] The first conductive carrier 20 includes a first heating region, a second heating region, and a third heating region along the length of the tubular carrier 10; the N-type semiconductors 31 and P-type semiconductors 32 in the first heating region are configured as an N1-row * M1-column first semiconductor matrix, the N-type semiconductors 31 and P-type semiconductors 32 in the second heating region are configured as an N2-row * M2-column second semiconductor matrix, and the N-type semiconductors 31 and P-type semiconductors 32 in the third heating region are configured as an N3-row * M3-column third semiconductor matrix; in the first semiconductor... In the first semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductor 31 or P-type semiconductor 32 is D1; ​​in the second semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductor 31 or P-type semiconductor 32 is D2; and in the third semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductor 31 or P-type semiconductor 32 is D3. Wherein, N1=N2>N3, M1>M2>M3, D1<D2<D3; or, N1<N2=N3, M1<M2<M3, D1>D2>D3.

[0091] The spacing between two adjacent columns of N-type semiconductors 31 or P-type semiconductors 32 along the length direction of the first conductive carrier 20 is defined as the lateral spacing.

[0092] As an example, according to Figure 6 As shown, the first conductive carrier 20 includes a first heating region H1, a second heating region H2, and a third heating region H3 along the length direction of the tubular carrier 10; the N-type semiconductor 31 and P-type semiconductor 32 of the first heating region H1 are configured into a first semiconductor matrix A1 with 2 rows * 7 columns (N1=2, M1=7); the N-type semiconductor 31 and P-type semiconductor 32 of the second heating region H2 are configured into a second semiconductor matrix A2 with 2 rows * 6 columns (N2=2, M2=6); the N-type semiconductor 31 and P-type semiconductor 32 of the third heating region H3 are configured into a third semiconductor matrix A3 with 1 row * 5 columns (N3=1, M3=5); it can be seen that N1=N2>N3, M1>M2>M3. Since the length direction of the first conductive carrier 20 is fixed, the N-type semiconductors 31 and P-type semiconductors 32 are uniformly distributed on the first semiconductor matrix A1, the second semiconductor matrix A2 and the third semiconductor matrix A3, and M1 > M2 > M3. The lateral spacing between the first and second columns of N-type semiconductors 31 or P-type semiconductors 32 is inversely proportional to the length direction of the first conductive carrier 20. Therefore, D1 < D2 < D3.

[0093] As another example, according to Figure 7 As shown, the first conductive carrier 20 includes a first heating region H1, a second heating region H2, and a third heating region H3 along the length direction of the tubular carrier 10; the N-type semiconductor 31 and P-type semiconductor 32 of the first heating region H1 are configured into a first semiconductor matrix A1 with 1 row * 5 columns (N1=1, M1=5); the N-type semiconductor 31 and P-type semiconductor 32 of the second heating region H2 are configured into a second semiconductor matrix A2 with 2 rows * 6 columns (N2=2, M2=6); the N-type semiconductor 31 and P-type semiconductor 32 of the third heating region H3 are configured into a third semiconductor matrix A3 with 2 rows * 7 columns (N3=2, M3=7); it can be seen that N1 < N2 = N3, M1 < M2 < M3. Since the length direction of the first conductive carrier 20 is fixed, the N-type semiconductors 31 and P-type semiconductors 32 are uniformly distributed on the first semiconductor matrix A1, the second semiconductor matrix A2 and the third semiconductor matrix A3, and M1 < M2 < M3, which has an inverse proportional relationship with the lateral spacing of the two adjacent columns of N-type semiconductors 31 or P-type semiconductors 32. It can be seen that D1 > D2 > D3.

[0094] Please continue reading. Figure 1 and Figure 2The heating element assembly 100 also includes conductive leads 40 extending along the length of the tubular carrier 10, one of which is connected to the positive terminal 21 and the other is connected to the negative terminal 22.

[0095] according to Figure 1 As shown, the other end of the conductive lead 40 extends along the axial direction of the tubular carrier 10 and is used to connect the power supply assembly.

[0096] Based on any of the above embodiments, please refer to Figures 1 to 4 The heating element assembly 100 also includes a plurality of second conductive carriers 50, each of which is connected to the N-type semiconductor 31 and the P-type semiconductor 32 of the corresponding semiconductor assembly 30.

[0097] according to Figures 2 to 4 As shown, one end of the N-type semiconductor 31 and one end of the P-type semiconductor 32 in the semiconductor component 30 are electrically connected to the first conductive carrier 20, and the other ends of the N-type semiconductor 31 and the P-type semiconductor 32 in the semiconductor component 30 are electrically connected through a second conductive carrier 50. In one embodiment, the second conductive carrier 50 includes a copper sheet. The N-type semiconductor 31 and the P-type semiconductor 32 in the semiconductor component 30 are electrically connected through the copper sheet.

[0098] When the heating element assembly 100 is operating, current flows through the semiconductor component 30. Heat generated based on the Boltzmann effect is transferred from the second conductive carrier 50 to the first conductive carrier 20, creating a temperature difference between the first conductive carrier 20 and the second conductive carrier 50. The more heat is lost from the second conductive carrier 50, the more heat is gained from the first conductive carrier 20. Therefore, the second conductive carrier 50 is the heat supply end of the heating element assembly 100, and the first conductive carrier 20 is the heat receiving end of the heating element assembly 100.

[0099] Please continue reading. Figure 1 The heating element assembly 100 also includes:

[0100] The fastener 60 is arranged around the second conductive carrier 50.

[0101] In one embodiment, the fastener 60 comprises a PI membrane or aerogel.

[0102] Temperature sensor 70, the sensing head 71 of temperature sensor 70 is disposed between the second conductive carrier 50 and the fixing member 60.

[0103] The fixing member 60 is used to fix the temperature sensor 70 at a corresponding position on the second conductive carrier 50, so that the temperature sensor 70 detects the temperature of the heat supply end of the heating element assembly 100. It is understood that the fixing member 60 is not limited to the manner provided in this embodiment.

[0104] like Figure 1 As shown, the temperature sensor 70 also includes a lead 72, which is electrically connected to the sensing head 71. The lead 72 is also electrically connected to the main control board, and is used to output the data collected by the sensing head 71 to the main control board for processing.

[0105] Preferably, when the fixing member 60 includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor 70 and less than or equal to the axial length of the tubular carrier 10.

[0106] The axial length of the PI film is greater than or equal to the axial length of the temperature sensor 70, which can fix the temperature sensor 70. In addition, the axial length of the PI film is less than or equal to the axial length of the tubular carrier 10, which can reduce the heat absorbed by the PI film and improve the accuracy of the detection results of the temperature sensor 70.

[0107] The isolator 80 is disposed between the second conductive carrier 50 and the fixing member 60.

[0108] In one embodiment, the separator 80 includes a PI film.

[0109] The PI film provides electrical isolation, effectively preventing short circuits between the second conductive carrier 50 and the temperature sensor 70, thus improving the safety of the heating element assembly 100. It is understood that the insulating element 80 is not limited to the configuration provided in this embodiment.

[0110] Please see Figure 8 One embodiment of this application provides an aerosol generating apparatus 1, comprising:

[0111] As in any of the above embodiments, the heating element assembly 100 further includes a plurality of second conductive carriers 50, each of which is connected to the N-type semiconductor 31 and the P-type semiconductor 32 of the corresponding semiconductor assembly 30.

[0112] The power supply component 200 has its positive terminal electrically connected to the positive terminal 21 and its negative terminal electrically connected to the negative terminal 22. The power supply component 200 is configured to provide current to the heating element component 100. When current flows through the semiconductor component 30, heat generated based on the Boltzmann effect is transferred from the second conductive carrier 50 to the first conductive carrier 20. Joule heating is generated at both ends of the first conductive carrier 20 and the second conductive carrier 50, and the Joule heating generated by the second conductive carrier 50 is also transferred to the first conductive carrier 20, thereby raising the temperature of the first conductive carrier 20 to heat the aerosol to form the product.

[0113] The heat generated by the Bolter effect can be calculated using the Bolter formula: Q = |Πn – Πp|*I, where Q is the heat, Πn and Πp are the Bolter coefficients of the N-type semiconductor 31 and the P-type semiconductor 32, respectively, and I is the magnitude of the current supplied by the power supply component 200 to the heating element component 100, which is equal to the magnitude of the current flowing through the N-type semiconductor 31 and the P-type semiconductor 32 of the semiconductor component 30.

[0114] When thermal equilibrium is reached, a constant temperature difference appears between the heat supply end and the heat receiving end of the heating element assembly 100; the tubular carrier 10 is also used to store the energy of the temperature rise of the first conductive carrier 20.

[0115] The heating element assembly provided in this application includes: a tubular carrier defining a receiving space for receiving an aerosol-generated article; a first conductive carrier surrounding the tubular carrier, the first conductive carrier being adapted to transfer heat to the tubular carrier, the first conductive carrier including a positive electrode connection terminal and a negative electrode connection terminal; and a plurality of semiconductor components, each semiconductor component being disposed on the first conductive carrier, each semiconductor component including an electrically connected N-type semiconductor and a P-type semiconductor, the N-type semiconductor and the P-type semiconductor having equal areas, the N-type semiconductor and the P-type semiconductor being connected in series between the positive electrode connection terminal and the negative electrode connection terminal; the N-type semiconductor and the P-type semiconductor are uniformly distributed on at least a portion of the surface of the first conductive carrier, and when a current is applied between the positive electrode connection terminal and the negative electrode connection terminal, a uniform temperature field is formed in at least a portion of the tubular carrier. Therefore, this application can form a uniform temperature field in at least a portion of the tubular carrier, and the surface of the aerosol-generated article acting under the uniform temperature field has a consistent degree of carbonization, thereby improving the heating effect of the aerosol-generated article.

[0116] It should be noted that the preferred embodiments of this application are given in the specification and accompanying drawings, but are not limited to the embodiments described in this specification. Furthermore, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heating element assembly, characterized in that, include: A tubular carrier that defines a containment space for receiving aerosol-generated products; A first conductive carrier is disposed around the tubular carrier, the first conductive carrier being adapted to transfer heat to the tubular carrier, the first conductive carrier including a positive electrode connection end and a negative electrode connection end; Multiple semiconductor components are disposed on the first conductive carrier. Each semiconductor component includes an N-type semiconductor and a P-type semiconductor that are electrically connected. The N-type semiconductor and the P-type semiconductor have equal areas and are connected in series between the positive terminal and the negative terminal. The N-type semiconductor and the P-type semiconductor are uniformly distributed on at least a portion of the surface of the first conductive carrier, thereby forming a uniform temperature field in at least a portion of the tubular carrier when current is passed between the positive terminal and the negative terminal.

2. The heating element assembly as described in claim 1, characterized in that, The N-type semiconductor and the P-type semiconductor are uniformly distributed on the entire surface of the first conductive carrier. When current is passed between the positive terminal and the negative terminal, the first conductive carrier forms a uniform temperature field on the tubular carrier.

3. The heating element assembly as described in claim 1, characterized in that, The first conductive carrier includes at least two heating zones along the length of the tubular carrier. When current is passed between the positive electrode connection terminal and the negative electrode connection terminal, each heating zone forms a uniform temperature field on the tubular carrier, and there is a temperature difference between at least one heating zone and the other heating zones.

4. The heating element assembly as described in claim 3, characterized in that, The N-type semiconductor and the P-type semiconductor are uniformly distributed in each heating zone, and the distribution density of the N-type semiconductor and the P-type semiconductor in at least two heating zones is not entirely equal.

5. The heating element assembly as described in claim 2, characterized in that, When the N-type semiconductor and the P-type semiconductor are uniformly distributed across the entire surface of the first conductive carrier, the maximum temperature difference between the inner walls of the tubular carrier is less than or equal to 20°C.

6. The heating element assembly as described in claim 4, characterized in that, The first conductive carrier includes a first heating zone, a second heating zone, and a third heating zone along the length of the tubular carrier; The number of N-type semiconductors and P-type semiconductors in the first heating zone is a first quantity, the number of N-type semiconductors and P-type semiconductors in the second heating zone is a second quantity, and the number of N-type semiconductors and P-type semiconductors in the third heating zone is a third quantity; The first quantity, the second quantity, and the third quantity are not all equal.

7. The heating element assembly as described in claim 4, characterized in that, The first conductive carrier includes a first heating zone, a second heating zone, and a third heating zone along the length of the tubular carrier; The N-type semiconductors and P-type semiconductors in the first heating zone are configured into a first semiconductor matrix of N1 rows * M1 columns, the N-type semiconductors and P-type semiconductors in the second heating zone are configured into a second semiconductor matrix of N2 rows * M2 columns, and the N-type semiconductors and P-type semiconductors in the third heating zone are configured into a third semiconductor matrix of N3 rows * M3 columns. In the first semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductors or P-type semiconductors is D1; ​​in the second semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductors or P-type semiconductors is D2; and in the third semiconductor matrix, the lateral spacing between two adjacent columns of N-type semiconductors or P-type semiconductors is D3. Where N1=N2>N3, M1>M2>M3, D1<D2<D3; or, N1<N2=N3, M1<M2<M3, D1>D2>D3.

8. The heating element assembly as claimed in claim 1, characterized in that, The first conductive carrier includes a flexible circuit board, on which the positive electrode connection terminal and the negative electrode connection terminal are disposed.

9. The heating element assembly as claimed in claim 8, characterized in that, The flexible circuit board includes a body, and the positive terminal and / or the negative terminal are in contact with the surface of the body or embedded in the body.

10. The heating element assembly as claimed in claim 9, characterized in that, The flexible circuit board also includes conductive elements disposed on the surface of the body, and the N-type semiconductor and the P-type semiconductor are connected in series between the positive terminal and the negative terminal through the conductive elements.

11. The heating element assembly as claimed in claim 1, characterized in that, The N-type and P-type semiconductors of the semiconductor assembly are fixed to the first conductive carrier at intervals by welding.

12. The heating element assembly as claimed in claim 8, characterized in that, The heating element assembly also includes conductive leads extending along the length of the tubular carrier, wherein one conductive lead is connected to the positive terminal and the other conductive lead is connected to the negative terminal.

13. The heating element assembly as claimed in claim 1, characterized in that, The tubular carrier is made of materials including metal, quartz, graphite, graphene, diamond, silicon carbide, aluminum nitride, or thermally conductive polymers.

14. The heating element assembly as described in any one of claims 1-13, characterized in that, The heating element assembly further includes a plurality of second conductive carriers, each of which is connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor assembly.

15. The heating element assembly as claimed in claim 14, characterized in that, The heating element assembly also includes a fixing member arranged around the second conductive carrier.

16. The heating element assembly as claimed in claim 15, characterized in that, The heating element assembly also includes a temperature sensor, the sensing head of which is disposed between the second conductive carrier and the fixing member.

17. The heating element assembly as claimed in claim 16, characterized in that, The fastener includes a PI membrane or aerogel.

18. The heating element assembly as claimed in claim 16, characterized in that, When the fixture includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor and less than or equal to the axial length of the tubular carrier.

19. The heating element assembly as claimed in claim 15, characterized in that, The heating element assembly further includes an isolation element disposed between the second conductive carrier and the fixing element.

20. The heating element assembly as claimed in claim 19, characterized in that, The insulating element includes a PI film.

21. An aerosol generating device, characterized in that, include: The heating element assembly according to any one of claims 1-20 further includes a plurality of second conductive carriers, each of the second conductive carriers being respectively connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor assembly; A power supply component, with its positive terminal electrically connected to the positive terminal and its negative terminal electrically connected to the negative terminal, is configured to provide current to the heating element component. When current flows through the semiconductor component, heat generated based on the Boltzmann effect is transferred from the second conductive carrier to the first conductive carrier, generating Joule heating at both ends of the first and second conductive carriers. The Joule heating generated by the second conductive carrier is also transferred to the first conductive carrier, thereby increasing the temperature of the first conductive carrier to heat the aerosol-generated product.

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