Molding device for notebook press molds

Abstract

The utility model relates to the technical field of notebook computer die mould, disclose a forming device for notebook computer die mould, including upper tool and lower tool, be equipped with the forming die cavity for matching notebook computer back cover in the lower tool, the upper tool has the punch head that is matched with the forming die cavity, the forming die cavity has a plurality of positioning holes, each positioning hole has the positioning telescopic rod that can be contacted with the punch head surface.

Description

Technical Field

[0001] This utility model relates to the technical field of notebook computer molding, and more specifically to a molding device for notebook computer molding. Background Technology

[0002] With the development of science and technology, stamped parts are being used more and more, especially in the field of electronic product manufacturing, and stamping technology is also constantly developing. The most critical technology in stamping technology includes the structural design of stamping dies, and modern stamping technology places increasingly higher demands on stamping dies.

[0003] Laptop back covers have a complex structure and are difficult to manufacture. Existing laptop back covers are made by stamping dies through multiple stamping processes, which involve multiple stamping and positioning steps. Due to positioning errors, the finished products have a high scrap rate, high costs, and low efficiency. Utility Model Content

[0004] The present invention aims to provide a molding device for laptop press molding, which can reduce the number of stamping and positioning operations of existing laptop back covers and reduce the high scrap rate of laptop back covers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] 1) A forming apparatus for a notebook press mold, comprising an upper mold and a lower mold, wherein the lower mold has a forming cavity for matching a notebook back cover, the upper mold has a punch head that matches the forming cavity, and the forming cavity has several positioning holes, each positioning hole having a positioning telescopic rod that can contact the surface of the punch head.

[0007] The above technical solution uses the stamping head of the upper mold for stamping. At this time, the surface of the stamping head contacts the end of the positioning telescopic rod in the forming mold cavity, realizing precise alignment and guidance between the positioning telescopic rod and the stamping head. This can improve the accuracy of the stamping and positioning of the laptop back cover, improve product quality, and complete the one-time stamping process of the laptop back cover. It is simple and fast, improves production efficiency, reduces the number of stamping and positioning operations of existing laptop back covers, and reduces the high scrap rate of laptop back covers.

[0008] 2) The molding apparatus for notebook computer pressing according to 1), wherein:

[0009] The lower mold has a support plate on its surface facing away from the upper mold. The side of the support plate has a connecting plate. The surfaces of the connecting plates face the support plate and the lower mold. The side of the support plate and the lower mold are fixed to the connecting plate.

[0010] In the above technical solution, the support plate is used to support the lower mold. When the stamping head is facing the forming cavity of the lower mold, the stability of the lower mold can be guaranteed. At the same time, the support plate and the side of the lower mold are fixedly connected in the same direction by the connecting plate, thereby increasing the support force of the lower mold.

[0011] 3) The molding apparatus for notebook computer pressing according to 1), wherein:

[0012] The molding cavity is provided with several positioning blocks. The upper surface of the positioning block is located in the molding cavity and corresponds to the protruding position of the laptop back cover. The lower surface of the positioning block passes through the lower mold and is embedded in the support plate.

[0013] The above technical solution uses several positioning blocks to position the surface of the forming mold cavity. The positioning blocks are located inside the forming mold cavity and form different height differences with the forming mold cavity. At the same time, the position of the positioning blocks corresponds to the protruding position of the laptop back cover. This allows for downward positioning of the protruding position of the laptop back cover, improving the precise positioning and stamping of the laptop back cover. In addition, the lower surface of the positioning block passes through the lower mold and is embedded in the support plate. The support plate supports and limits the positioning block, maintaining its stability within the forming mold cavity.

[0014] 4) The molding apparatus for notebook computer pressing according to 3), wherein:

[0015] The lower mold is provided with several support rods. The central axis of the support rod is perpendicular to the central axis of the telescopic rod. One end of the support rod is fixedly connected to the side of the positioning block, and the other end of the support rod extends outward toward the lower mold.

[0016] The above-mentioned technical solution is used to design several support rods to support the lower mold. At the same time, the support rods are fixedly connected to the side of the positioning block to increase the strength of the entire lower mold and ensure that the lower mold can maintain stability during the stamping process of the stamping head.

[0017] 5) The molding apparatus for notebook computer pressing according to 1), wherein:

[0018] Both the upper and lower molds are equipped with heating wires for heating the upper and lower molds. The sides of the upper and lower molds are equipped with charging terminals, which are electrically connected to the heating wires.

[0019] The heating wire designed using the above technical solution can heat the upper and lower molds. When stamping the laptop back cover, the laptop back cover material softens under heat, and the stamping head can press the laptop back cover into shape in one go. At the same time, the heating wire is powered through the charging end, so that the heating wire generates a certain temperature.

[0020] Compared with the prior art, this utility model also has the following technical effects:

[0021] This invention utilizes the cooperation between a telescopic rod and a positioning hole to ensure that when the top of the telescopic rod contacts the stamping head, the telescopic rod retracts into the positioning hole due to the impact force, thereby positioning and guiding the stamping head. At the same time, combined with the positioning block, it enables more precise stamping of the laptop back cover, and under the action of the heating wire, it can be stamped in one go, improving the yield of laptop products, reducing costs, and increasing stamping efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the molding device for notebook computer pressing according to the present invention;

[0023] Figure 2 for Figure 1 Sectional view of AA. Detailed Implementation

[0024] The following detailed description illustrates the specific implementation method:

[0025] The reference numerals in the accompanying drawings include: support plate 1, lower mold 2, upper mold 3, connecting plate 4, power supply terminal 5, positioning block 6, support rod 7, and positioning hole 8.

[0026] See the example. Figure 1 and Figure 2 As shown, the forming device for laptop press molding in this embodiment includes an upper mold 3 and a lower mold 2. The lower mold 2 is provided with a forming cavity for matching the back cover of the laptop. The upper mold 3 has a punch head that matches the forming cavity. The forming cavity has several positioning holes 8, and each positioning hole 8 has a positioning telescopic rod that can contact the surface of the punch head.

[0027] In this embodiment, stamping is performed using the stamping head of the upper mold 3. At this time, the surface of the stamping head contacts the end of the positioning telescopic rod in the forming mold cavity, so as to achieve precise alignment and guidance between the positioning telescopic rod and the stamping head. This can improve the accuracy of the stamping positioning of the laptop back cover, improve product quality, and complete the one-time stamping forming process of the laptop back cover. It is simple, fast and improves production efficiency.

[0028] In this embodiment, the lower mold 2 is provided with a support plate 1 on the surface away from the upper mold 3, and a connecting plate 4 is provided on the side of the support plate 1. The plate surfaces of the connecting plate 4 face the support plate 1 and the lower mold 2 together, and the sides of the support plate 1 and the lower mold 2 are fixed on the connecting plate 4.

[0029] In this embodiment, the support plate 1 is used to support the lower mold 2. When the punch head is punching in the forming cavity of the lower mold 2, the stability of the lower mold 2 can be guaranteed. At the same time, the support plate 1 and the side of the lower mold 2 are fixedly connected in the same direction by the connecting plate 4, thereby increasing the supporting force of the lower mold 2.

[0030] Combination Figure 2 As shown, in this embodiment, several positioning blocks 6 are provided in the molding cavity. The upper surface of the positioning block 6 is located in the molding cavity and corresponds to the protruding position of the laptop back cover. The lower surface of the positioning block 6 passes through the lower mold 2 and is embedded in the support plate 1.

[0031] In this embodiment, several positioning blocks 6 are used to position the surface of the forming mold cavity. The positioning blocks 6 are located inside the forming mold cavity and form different height differences with the forming mold cavity. At the same time, the position of the positioning blocks 6 corresponds to the protruding position of the laptop back cover. This allows for downward positioning of the protruding position of the laptop back cover, improving the accurate positioning and stamping of the laptop back cover. In addition, the lower surface of the positioning blocks 6 passes through the lower mold 2 and is embedded in the support plate 1. The support plate 1 supports and limits the positioning blocks 6, maintaining the stability of the positioning blocks 6 in the forming mold cavity.

[0032] Meanwhile, in this embodiment, the lower mold 2 is provided with several support rods 7. The central axis of the support rod 7 is perpendicular to the central axis of the telescopic rod. One end of the support rod 7 is fixedly connected to the side of the positioning block 6, and the other end of the support rod 7 extends outward toward the lower mold 2.

[0033] In this embodiment, several support rods 7 are designed to support the lower mold 2. At the same time, the support rods 7 are fixedly connected to the side of the positioning block 6 to increase the strength of the entire lower mold 2, so that the lower mold 2 can maintain stability during the stamping process of the stamping head.

[0034] In addition, heating wires are provided inside both the upper mold 3 and the lower mold 2. The heating wires are used to heat the upper mold 3 and the lower mold 2. Charging terminals are provided on the sides of the upper mold 3 and the lower mold 2. The charging terminals are electrically connected to the heating wires.

[0035] The heating wire designed in this embodiment can heat the upper mold 3 and the lower mold 2. When stamping the laptop back cover, the laptop back cover material softens under heat, and the stamping head can press the laptop back cover into shape in one go. At the same time, the heating wire is powered through the charging end, so that the heating wire generates a certain temperature. In this embodiment, the charging end is a charging connector. The charging head is inserted into the charging connector to power the heating wire.

[0036] In this embodiment, the telescopic rod and the positioning hole 8 work together to ensure that when the top of the telescopic rod comes into contact with the stamping head, the telescopic rod will retract into the positioning hole 8 due to the impact force, thereby positioning and guiding the stamping head. At the same time, combined with the positioning block 6, the stamping of the notebook back cover is more precise, and under the action of the heating wire, it can be stamped in one go, improving the yield of notebook products, reducing costs, and improving stamping efficiency.

[0037] The above are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A molding apparatus for notebook computer pressing, characterized in that, It includes an upper mold and a lower mold. The lower mold has a forming cavity for matching the back cover of a laptop. The upper mold has a punch head that matches the forming cavity. The forming cavity has several positioning holes, and each positioning hole has a positioning telescopic rod that can contact the surface of the punch head.

2. The molding apparatus for notebook computer pressing according to claim 1, characterized in that: The lower mold has a support plate on its surface facing away from the upper mold. The side of the support plate has a connecting plate. The surfaces of the connecting plates face the support plate and the lower mold. The side of the support plate and the lower mold are fixed to the connecting plate.

3. The molding apparatus for notebook computer compression molding according to claim 1, characterized in that: The molding cavity is provided with several positioning blocks. The upper surface of the positioning block is located in the molding cavity and corresponds to the protruding position of the laptop back cover. The lower surface of the positioning block passes through the lower mold and is embedded in the support plate.

4. The molding apparatus for notebook computer compression molding according to claim 3, characterized in that: The lower mold is provided with several support rods. The central axis of the support rod is perpendicular to the central axis of the telescopic rod. One end of the support rod is fixedly connected to the side of the positioning block, and the other end of the support rod extends outward toward the lower mold.

5. The molding apparatus for notebook computer compression molding according to claim 1, characterized in that: Both the upper and lower molds are equipped with heating wires for heating the upper and lower molds. The sides of the upper and lower molds are equipped with charging terminals, which are electrically connected to the heating wires.

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