Wafer dicing blade gripping device

Abstract

The utility model discloses a wafer cutting knife clamping device, including outer sleeve, center connecting rod, spring, at least three's connecting rod, at least three's clamping jaw, spring is placed in the outer sleeve, and the first end of spring is connected with the inner wall of outer sleeve, and the second end of spring is connected with the first end near center connecting rod, and the first end of connecting rod is hinged with the second end side wall near center connecting rod, the first end of clamping jaw is hinged with the first end part of outer sleeve, and the second end of connecting rod is hinged with the second end near clamping jaw, the second end of center connecting rod is connected with the first step surface, and the second end of at least three clamping jaws is held outer ring wall setting, in the application, utilize spring to realize long -time self -locking clamping to round crystal cutting knife, will not fall, need not vacuum or air pipe always be connected, improve the convenience. The clamping point is located on the unimportant outer ring wall and inside step surface of round crystal cutting knife, does not leave the mark on the important surface of round crystal cutting knife, does not affect the appearance of round crystal cutting knife.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing blade transfer structure, and in particular to a wafer dicing blade clamping device. Background Technology

[0002] As an indispensable part of modern physical cutting, the wafer dicing blade is a very fragile product. During small-scale research and development testing, it is necessary to pick up and observe the blade. When manually picking up and placing the blade for observation, there is a high possibility that the blade may fall and damage the blade due to operational errors or slipping. Conventional vacuum adsorption methods require a long-term connection to an air tube to provide a vacuum in real time, which is not suitable for picking up and placing at a distance of more than 3-5 meters, and lacks convenience. In addition, the vacuum adsorption method requires adsorption on the two precision-machined end faces of the dicing blade, which will leave marks on the surface of the dicing blade that is close to the mirror, affecting the appearance. The non-marking suction cup has insufficient adsorption force, and the dicing blade will wobble on the suction cup.

[0003] Therefore, it is necessary to develop a wafer dicing blade gripping device to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to design a wafer dicing blade clamping device to solve the above-mentioned problems.

[0005] This utility model achieves the above objectives through the following technical solutions:

[0006] A wafer dicing blade gripping device includes a first stepped surface at the middle of the first end of the wafer dicing blade, and an annular outer ring wall on the side wall of the first end of the wafer dicing blade. The wafer dicing blade gripping device comprises:

[0007] Outerwear;

[0008] Central link;

[0009] Spring; The spring is placed inside the outer sleeve, with the first end of the spring connected to the inner wall of the outer sleeve, and the second end of the spring connected to the first end near the center connecting rod. The spring is in a pre-compressed state.

[0010] At least three connecting rods; at least three connecting rods are evenly distributed around the axis of the central connecting rod; the first end of the connecting rod is hinged to the side wall of the second end near the central connecting rod;

[0011] At least three grippers; at least three grippers are evenly distributed around the axis of the central connecting rod; the first end of the gripper is hinged to the first end of the outer sleeve, and the second end of the connecting rod is hinged to the second end near the gripper; the second end of the central connecting rod is connected to the first stepped surface, and the second ends of the at least three grippers are clamped to the outer ring wall.

[0012] The beneficial effects of this utility model are as follows:

[0013] In this application, a spring is used to achieve long-term self-locking clamping of the wafer dicing blade, preventing it from falling off and eliminating the need for a constant vacuum or air tube connection, thus improving convenience. The clamping points are located on the less critical outer ring wall and inner step surface of the wafer dicing blade, leaving no marks on the important surfaces of the wafer dicing blade and not affecting its appearance. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present application;

[0015] Figure 2 Cross-section of this application Figure 1 ;

[0016] Figure 3 Cross-section of this application Figure 2 ;

[0017] Figure 4 This is a schematic diagram of the wafer dicing blade in this application;

[0018] Figure 5 This is a partially enlarged schematic diagram of this application;

[0019] Figure 6 This is a schematic diagram of the outer sleeve structure in this application;

[0020] Figure 7 This is a schematic diagram of the central connecting rod in this application.

[0021] Legend: 1-Outer sleeve; 11-First sliding channel; 12-Second sliding channel; 13-First rotating groove; 14-First notch; 15-First rotating seat; 16-First through hole; 2-Central connecting rod; 21-Rod part; 22-Sliding ring; 23-Second notch; 24-Second rotating seat; 25-Third through hole; 3-Spring; 4-Connecting rod; 5-Claw; 51-Rotating rod; 52-Claw part; 6-Wafer dicing blade; 61-First step surface; 62-Outer ring wall. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0027] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0029] like Figure 1-4 As shown, a wafer dicing blade gripping device includes a first stepped surface 61 at the middle of the first end of a wafer dicing blade 6, and an annular outer ring wall 62 on the side wall of the first end of the wafer dicing blade 6. The wafer dicing blade gripping device includes:

[0030] Outerwear tube 1;

[0031] Center link 2;

[0032] Spring 3; Spring 3 is placed inside the outer sleeve 1, and the first end of Spring 3 is connected to the inner wall of the outer sleeve 1, and the second end of Spring 3 is connected to the first end near the center connecting rod 2. Spring 3 is in a pre-compressed state.

[0033] Three connecting rods 4; the three connecting rods 4 are evenly distributed around the axis of the central connecting rod 2; the first end of the connecting rod 4 is hinged to the side wall of the second end near the central connecting rod 2;

[0034] Three grippers 5; the three grippers 5 are evenly distributed around the axis of the central connecting rod 2; the first end of the gripper 5 is hinged to the first end of the outer sleeve 1, and the second end of the connecting rod 4 is hinged to the second end near the gripper 5; the second end of the central connecting rod 2 is connected to the first step surface 61, and the second ends of at least three grippers 5 are configured to clamp the outer ring wall 62.

[0035] like Figure 3 and 6 As shown in Figure 7, the central connecting rod 2 includes a rod portion 21 and a sliding ring 22. The sliding ring 22 is fitted onto the side wall near the first end of the rod portion 21. A first sliding channel 11 is axially arranged inside the outer sleeve 1, and a second sliding channel 12 is axially arranged inside the first end of the outer sleeve 1. The first sliding channel 11 and the second sliding channel 12 are connected. The diameter of the first sliding channel 11 is slightly larger than the diameter of the sliding ring 22, and the sliding ring 22 is slidably placed inside the first sliding channel 11. The diameter of the second sliding channel 12 is slightly larger than the diameter of the rod portion 21, and the rod portion 21 is slidably placed inside the second sliding channel 12. The diameter of the second sliding channel 12 is smaller than the diameter of the first sliding channel 11. A second stepped surface is provided at the connection between the first sliding channel 11 and the second sliding channel 12. The first end of the spring 3 is placed on the second stepped surface, and the second end of the spring 3 is placed on the end face of the sliding ring 22.

[0036] like Figure 5 As shown, the gripper 5 includes a rotating rod 51 and a gripper 52. The gripper 52 is perpendicular to the rotating rod 51. The first end of the gripper 52 is connected to the first end sidewall of the rotating rod 51, and the second end of the gripper 52 is used to grip the outer ring wall 62.

[0037] like Figure 1 and 2As shown in Figures 5 and 6, three first rotating grooves 13 are provided on the side wall of the first end of the outer sleeve 1. The three first rotating grooves 13 are evenly distributed around the axis of the outer sleeve 1. A first rotating seat 15 is provided on each side of the first rotating groove 13. A first notch 14 is provided on the side of the first rotating seat 15 opposite to the first rotating groove 13. A first through hole 16 is provided on the side wall of the first rotating seat 15. A second through hole is provided on the side wall of the second end of the rotating rod 51. A rotating pin is provided by passing through the first through hole 16 on one first rotating seat 15, the second through hole on the rotating rod 51, and the first through hole 16 on another first rotating seat 15 in sequence.

[0038] like Figure 5 and 7 As shown, three second notches 23 are provided on the side wall near the second end of the rod 21. The three second notches 23 are evenly distributed around the axis of the rod 21. A second rotating seat 24 is provided between two adjacent second notches 23. A third through hole 25 is provided on the second rotating seat 24. A fourth through hole is provided on the first end of the connecting rod 4. A rotating pin passes through the third through hole 25 on a second rotating seat 24 and the fourth through hole on the rotating rod 51 in sequence.

[0039] like Figure 1 and 2 As shown in Figure 5, a fifth through hole is provided on the second end of the connecting rod 4, and a sixth through hole is provided on the side wall near the first end of the rotating rod 51. A rotating pin is provided by passing through the fifth through hole on the connecting rod 4 and the sixth through hole on the rotating rod 51 in sequence.

[0040] In some embodiments, both ends of all the rotating pins can be configured such that one end is non-rotatable and is installed in a through hole with an interference fit, while the other end is rotatable and placed in another through hole.

[0041] In some embodiments, the connecting rod 4 is formed in a grid shape, with the first end of the connecting rod 4 placed on the outside of the two first rotating seats 15 respectively, and the second end placed on both sides of the rotating rod 51 respectively.

[0042] Working principle: During operation, pressing the central connecting rod 2 by hand further compresses the spring 3, causing the central connecting rod 2 to push the first end of the connecting rod 4 forward. One end of the claw 52 of the gripper 5 opens outward. At this time, the second end of the central connecting rod 2 is pressed against the first step surface 61 of the wafer dicing blade 6. Then, the pressure on the central connecting rod 2 is slowly released. Under the rebound force, the spring 3 pushes the central connecting rod 2 backward, pulling the first end of the connecting rod 4 backward. One end of the claw 52 of the gripper 5 closes inward, and the claws 52 of the three grippers 5 clamp onto the outer ring wall 62, forming a stable clamping of the wafer dicing blade 6. The connecting rod structure in this application, combined with the central connecting rod 2 pressing against the first step surface 61 of the wafer dicing blade 6, ensures that the blade edge of the wafer dicing blade 6 cannot be damaged at any position.

[0043] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A wafer dicing blade clamping device, a first end of the wafer dicing blade is provided with a first step surface in the middle, and an annular outer ring wall is arranged on the sidewall of the first end of the wafer dicing blade, characterized in that, The wafer dicing blade gripping device includes: Outerwear; Central connecting rod; Spring; The spring is placed inside the outer sleeve, with the first end of the spring connected to the inner wall of the outer sleeve, and the second end of the spring connected to the first end near the center connecting rod. The spring is in a pre-compressed state. At least three connecting rods; at least three connecting rods are evenly distributed around the axis of the central connecting rod; the first end of the connecting rod is hinged to the side wall of the second end near the central connecting rod; At least three grippers; at least three grippers are evenly distributed around the axis of the central connecting rod; the first end of the gripper is hinged to the first end of the outer sleeve, and the second end of the connecting rod is hinged to the second end near the gripper; the second end of the central connecting rod is connected to the first stepped surface, and the second ends of the at least three grippers are clamped to the outer ring wall.

2. The wafer dicing blade gripping device according to claim 1, wherein The central connecting rod includes a rod and a sliding ring. The sliding ring is fitted onto the side wall near the first end of the rod. A first sliding channel is axially arranged inside the outer sleeve, and a second sliding channel is axially arranged inside the first end of the outer sleeve. The first and second sliding channels are connected. The diameter of the first sliding channel is slightly larger than the diameter of the sliding ring, and the sliding ring is slidably placed in the first sliding channel. The diameter of the second sliding channel is slightly larger than the diameter of the rod, and the rod is slidably placed in the second sliding channel. The diameter of the second sliding channel is smaller than the diameter of the first sliding channel. A second stepped surface is provided at the connection between the first and second sliding channels. The first end of the spring is placed on the second stepped surface, and the second end of the spring is placed on the end face of the sliding ring.

3. The wafer dicing blade gripping device according to claim 2, wherein The gripper includes a rotating rod and a gripper portion. The gripper portion is perpendicular to the rotating rod. The first end of the gripper portion is connected to the first end sidewall of the rotating rod, and the second end of the gripper portion is used to grip the outer ring wall.

4. The wafer dicing blade gripping device according to claim 3, wherein At least three first rotating grooves are provided on the side wall of the first end of the outer sleeve. The at least three first rotating grooves are evenly distributed around the axis of the outer sleeve. A first rotating seat is provided on each side of the first rotating groove. A first notch is provided on the side of the first rotating seat facing the first rotating groove. A first through hole is provided on the side wall of the first rotating seat. A second through hole is provided on the side wall of the second end of the rotating rod. A rotating pin is provided by passing through the first through hole on one first rotating seat, the second through hole on the rotating rod, and the first through hole on another first rotating seat in sequence.

5. The wafer dicing blade gripping device according to claim 4, wherein At least three second notches are provided on the side wall near the second end of the rod. The at least three second notches are evenly distributed around the axis of the rod. A second rotating seat is provided between two adjacent second notches. A third through hole is provided on the second rotating seat. A fourth through hole is provided on the first end of the connecting rod. A rotating pin is provided by passing through the third through hole on a second rotating seat and the fourth through hole on the rotating rod in sequence.

6. The wafer dicing blade gripping device according to claim 5, wherein A fifth through hole is provided on the second end of the connecting rod, and a sixth through hole is provided on the side wall near the first end of the rotating rod. A rotating pin is provided by passing through the fifth through hole on the connecting rod and the sixth through hole on the rotating rod in sequence.

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