A glue injection mechanism of a semiconductor plastic packaging mold

Abstract

This utility model discloses a glue injection mechanism for semiconductor molding compounds, belonging to the field of glue injection machines. It includes a main body structure, with a drive mechanism mounted on its upper end. A movable mechanism is mounted inside the main body structure below the drive mechanism, and a limit mechanism is installed below the interior of the main body structure. The movable mechanism includes a movable rod with a movable groove inside its upper end. The key technical point is that by movably connecting the upper and lower ends of the movable rod to a rotating rod and a threaded tube, a metal ball can move up and down with the movable rod. This allows the metal ball to quickly adhere to and detach from the glue injection port according to the glue injection requirements, preventing glue from dripping onto the mold and equipment during glue injection stops, which is difficult to clean. Furthermore, this structure eliminates the need for manual control of the glue injection volume during semiconductor molding compound injection and prevents glue from dripping and wasting during glue injection stops, saving glue and making the device more automated.

Description

Technical Field

[0001] This utility model relates to the field of dispensing machines, and in particular to a dispensing mechanism for a semiconductor molding die. Background Technology

[0002] Semiconductor molding is a manufacturing process that encapsulates semiconductor devices in a plastic casing. Its main purpose is to protect the devices from environmental influences and mechanical damage. This process not only ensures the functionality of the devices but also improves the reliability and durability of semiconductor devices.

[0003] In existing technologies, the disassembly of the dispensing head and the glue tank is inconvenient, and the equipment does not heat the glue particles evenly during operation. Chinese Patent Publication No. CN220946289U proposed a glue dispensing mechanism for semiconductor molding compounds, which solved the problem of cumbersome mixing and disassembly settings in glue dispensing equipment. By setting up structures such as heating plates and melting plates, the glue particles are also heated evenly. However, in actual use, glue dispensing equipment used for semiconductor molding compounds cannot quickly and effectively control the dispensing and stopping of the dispensing head, causing glue to string and resulting in waste when the dispensing head dispenses or stops dispensing. At the same time, the stringy glue is also easy to stick to the mold and equipment, which is difficult to clean. Therefore, we propose a glue dispensing mechanism for semiconductor molding compounds. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a glue injection mechanism for semiconductor molding die. By movably connecting the upper and lower ends of the movable rod with the rotating rod and the threaded tube, the metal ball can move up and down with the movable rod. This allows the device to eliminate the need for manual control of the glue injection amount during the glue injection of semiconductor molding die, and also avoids the glue dripping and wasting when the glue is stopped. This saves glue and makes the device more automated.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] A dispensing mechanism for a semiconductor molding die includes a main body, a driving mechanism mounted on the upper end of the main body, a movable mechanism mounted inside the main body at the lower end of the driving mechanism, and a limiting mechanism mounted at the lower part of the interior of the main body.

[0007] The movable mechanism includes a movable rod with a movable groove inside the upper end. Limiting grooves are formed on both sides of the inner end of the movable groove. A connecting groove is formed inside the lower part of the movable rod. A guide rod is fixedly installed at the inner end of the connecting groove. A metal ball is fixedly installed at the lower end of the guide rod. A leather sleeve is fixedly installed at the outer end of the metal ball. A stirring sleeve is fixedly installed in the middle of the outer end of the movable rod. A crushing block is fixedly set at the outer end of the stirring sleeve. A heating rod is fixedly installed inside the stirring sleeve. By setting the heating rod, the colloid used in semiconductor molding can be continuously heated during stirring, preventing the colloid from cooling and solidifying.

[0008] Furthermore, the main body includes a base, a support frame is fixedly installed on the lower side of the base, a material barrel is fixedly installed in the middle of the base, an injection port is opened at the lower end of the material barrel, a feed port is opened inside the upper part of the material barrel, and a control box is fixedly installed on the upper side of the base. By setting the support frame, the device can be suspended and installed on the upper part of the semiconductor molding die, thereby facilitating the injection of glue into the semiconductor molding die.

[0009] Furthermore, the driving mechanism includes a bucket lid, a rotating motor is fixedly installed at the upper end of the bucket lid, a rotating rod is fixedly installed at the lower end of the rotating motor, and a limit block is fixedly provided at the outer end of the rotating rod. By setting the bucket lid, the material bucket can be kept in a sealed state during glue injection, preventing dust from entering and affecting the quality of the glue.

[0010] Furthermore, the limiting mechanism includes a bracket, with a limiting sleeve fixedly installed at the inner end of the bracket, and a threaded pipe fixedly connected to the upper end of the limiting sleeve. The bracket suspends the limiting sleeve and the threaded pipe inside the material barrel and is located above the glue injection port, so that other components of the device do not affect the normal glue dispensing from the glue injection port during operation.

[0011] Furthermore, the movable rod is movably installed below the rotating rod, the limiting grooves are symmetrically distributed inside the left and right sides of the inner end of the movable groove, and the stirring sleeves are symmetrically distributed at the outer end of the movable rod.

[0012] Furthermore, the bucket lid is movably installed on the upper end of the material bucket, and the limiting blocks are symmetrically distributed on the left and right sides below the outer end of the rotating rod. The rotating rod is movably installed inside the movable groove through the limiting blocks, and the limiting blocks and the limiting groove are compatible.

[0013] Furthermore, the bracket is fixedly installed below the inner end of the material barrel, and the bracket is symmetrically distributed on the left and right sides of the outer end of the limiting sleeve. The connecting groove at the lower end of the threaded tube and the movable rod are compatible.

[0014] Furthermore, the metal ball and the injection port are compatible, and the diameter of the threaded tube is larger than the diameter of the limiting sleeve.

[0015] In summary, this utility model has the following beneficial effects:

[0016] 1. By movably connecting the upper and lower ends of the movable rod with the rotating rod and the threaded tube, the metal ball can move up and down with the movable rod. The metal ball and the glue injection port can be attached and detached according to the glue injection requirements, avoiding glue dripping onto the mold and equipment when the glue is stopped. As a result of this structure, the device does not require manual control of the glue injection amount when injecting glue into semiconductor molding molds, and also avoids glue dripping and wasting when the glue is stopped, thus saving glue and making the device more automated.

[0017] 2. The limiting groove allows the rotating rod to be movably installed inside the lower part of the movable rod, while also having a movable connection structure with the movable rod. Therefore, when the rotating rod rotates, it can also drive the movable rod to rotate accordingly, and the movable connection structure between the movable rod and the rotating rod also has the ability to expand and contract. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure in this embodiment;

[0019] Figure 2 This is a cross-sectional structural diagram of this embodiment;

[0020] Figure 3 This is a three-dimensional structural diagram of the active mechanism in this embodiment;

[0021] Figure 4 This is a three-dimensional structural schematic diagram of the mixing sleeve in this embodiment;

[0022] Figure 5 This is a three-dimensional structural diagram of the limiting mechanism in this embodiment.

[0023] In the diagram, 1. Main body; 101. Base; 102. Support frame; 103. Material bucket; 104. Injection port; 105. Feed inlet; 106. Control box; 2. Drive mechanism; 201. Bucket lid; 202. Rotary motor; 203. Rotating rod; 204. Limiting block; 3. Movable mechanism; 301. Movable rod; 302. Movable groove; 303. Limiting groove; 304. Connecting groove; 305. Guide rod; 306. Metal ball; 307. Leather sleeve; 308. Mixing sleeve; 309. Crushed block; 310. Heating rod; 4. Limiting mechanism; 401. Bracket; 402. Limiting sleeve; 403. Threaded pipe. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings.

[0025] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0026] Reference Figure 1-5 As shown, this is a preferred embodiment of the present invention, which is a semiconductor molding die injection mechanism, including a main body 1, a drive mechanism 2 installed at the upper end of the main body 1, an active mechanism 3 installed inside the main body 1 at the lower end of the drive mechanism 2, and a limiting mechanism 4 installed at the lower part of the inside of the main body 1.

[0027] The active mechanism 3 includes an active rod 301. An active groove 302 is formed inside the upper end of the active rod 301. Limiting grooves 303 are formed on both sides of the inner end of the active groove 302. A connecting groove 304 is formed inside the lower end of the active rod 301. A guide rod 305 is fixedly installed at the inner end of the connecting groove 304. A metal ball 306 is fixedly installed at the lower end of the guide rod 305. A leather sleeve 307 is fixedly installed at the outer end of the metal ball 306. A stirring sleeve 308 is fixedly installed in the middle of the outer end of the active rod 301. A crushing block 309 is fixedly set at the outer end of the stirring sleeve 308. A heating rod 310 is fixedly installed inside the stirring sleeve 308. By setting the heating rod 310, the colloid used in the semiconductor molding can be continuously heated during stirring, preventing the colloid from cooling and solidifying. The leather sleeve 307 installed at the outer end of the metal ball 306 gives the metal ball 306 a certain degree of expansion and contraction function in a closed space.

[0028] The main body 1 includes a base 101, a support frame 102 fixedly installed on the lower side of the base 101, a material barrel 103 fixedly installed in the middle of the base 101, a glue injection port 104 opened at the lower end of the material barrel 103, a feed inlet 105 opened inside the upper part of the material barrel 103, and a control box 106 fixedly installed on the upper side of the base 101. By setting the support frame 102, the device can be suspended and installed on the upper end of the semiconductor molding die, thereby facilitating the glue injection operation of the semiconductor molding die.

[0029] The drive mechanism 2 includes a bucket lid 201. A rotating motor 202 is fixedly installed on the upper end of the bucket lid 201, and a rotating rod 203 is fixedly installed on the lower end of the rotating motor 202. A limit block 204 is fixedly provided on the outer end of the rotating rod 203. By setting the bucket lid 201, the material bucket 103 can be kept sealed during glue injection to prevent dust from entering and affecting the quality of the glue.

[0030] The limiting mechanism 4 includes a bracket 401. A limiting sleeve 402 is fixedly installed on the inner end of the bracket 401. A threaded tube 403 is fixedly connected to the upper end of the limiting sleeve 402. The bracket 401 suspends the limiting sleeve 402 and the threaded tube 403 inside the material barrel 103 and is located at the upper end of the glue injection port 104, so that other components of the device do not affect the normal glue dispensing from the glue injection port 104 during operation.

[0031] The movable rod 301 is movably installed below the rotating rod 203. The limiting grooves 303 are symmetrically distributed inside the left and right sides of the inner end of the movable groove 302. The stirring sleeve 308 is symmetrically distributed outside the movable rod 301. The limiting grooves 303 not only allow the rotating rod 203 to be movably installed inside them, but also have a connecting structure. When the rotating rod 203 rotates, it can also drive the movable rod 301 to rotate with it, so that there is a movable telescopic connection structure between the movable rod 301 and the rotating rod 203.

[0032] The lid 201 is movably installed on the upper end of the material bucket 103. The limiting blocks 204 are symmetrically distributed on the left and right sides below the outer end of the rotating rod 203. The rotating rod 203 is movably installed inside the movable groove 302 through the limiting blocks 204. The limiting blocks 204 and the limiting groove 303 are matched. The limiting blocks 204 are provided at both ends of the rotating rod 203, so that the connection between the rotating rod 203 and the movable rod 301 is stable when the rotating rod 203 rotates. This allows the movable rod 301 to rotate and move with high stability.

[0033] The bracket 401 is fixedly installed below the inner end of the material barrel 103. The bracket 401 is symmetrically distributed on the left and right sides of the outer end of the limiting sleeve 402. The threaded tube 403 and the connecting groove 304 at the lower end of the movable rod 301 are compatible. The upper end of the bracket 401 has a tapered structure, which makes the bracket 401 provide support while making it difficult for the colloid to stick to the upper end.

[0034] The metal ball 306 is compatible with the glue injection port 104. The diameter of the threaded tube 403 is larger than the diameter of the limiting sleeve 402. Setting the diameter of the threaded tube 403 to be larger than the diameter of the limiting sleeve 402 allows the movable rod 301 to extend and retract at the upper end of the rotating rod 203.

[0035] Specific implementation process: This device is a dispensing mechanism for semiconductor molding compounds, including a main body 1. A drive mechanism 2 is installed on the upper end of the main body 1. Firstly, a movable rod 301 is movably installed on the outer side below the rotating rod 203. The two are connected by a limiting block 204 and a limiting groove 303, allowing the rotating rod 203 to be movably installed inside the movable groove 302 above the movable rod 301 while also having a connection structure with the movable rod 301. The lower part of the movable rod 301 is threadedly connected to the threaded tube 403. During operation, when the rotating rod 203 rotates forward, the movable rod 301 rotates downward, slowly tightening the threaded tube 403 into the connecting groove 304. The threaded teeth at the inner end of the movable rod 301 then pass over the threaded tube 403. After step 03, the lower end of the movable rod 301 moves to the position of the limiting sleeve 402. The movable rod 301 and the limiting sleeve 402 remain in a movable connection. During this process, the guide rod 305 drives the metal ball 306 vertically downward to the position of the glue injection port 104, which can block the glue injection port 104 and prevent the glue from flowing out. When the rotating rod 203 rotates in the opposite direction, the threaded connection between the movable rod 301 and the threaded tube 403 causes the movable rod 301 to drive the guide rod 305 to make the metal ball 306 leave the glue injection port 104, so that the glue injection port 104 can be injected normally. The design of this structure makes it possible for the device to eliminate the need for manual control of the glue injection amount when injecting glue into semiconductor molding molds, and also avoids the glue from being exposed when blocked. This saves glue and makes the device more automated.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A dispensing mechanism for a semiconductor molding compound, characterized in that: It includes a main body (1), a drive mechanism (2) is installed at the upper end of the main body (1), an active mechanism (3) is installed inside the main body (1) at the lower end of the drive mechanism (2), and a limit mechanism (4) is installed at the lower part of the inside of the main body (1). The movable mechanism (3) includes a movable rod (301), an movable groove (302) is provided inside the upper end of the movable rod (301), a limiting groove (303) is provided on both sides of the inner end of the movable groove (302), a connecting groove (304) is provided inside the lower part of the movable rod (301), a guide rod (305) is fixedly installed at the inner end of the connecting groove (304), a metal ball (306) is fixedly installed at the lower end of the guide rod (305), a leather sleeve (307) is fixedly installed at the outer end of the metal ball (306), a stirring sleeve (308) is fixedly installed at the middle part of the outer end of the movable rod (301), a crushing block (309) is fixedly provided at the outer end of the stirring sleeve (308), and a heating rod (310) is fixedly installed inside the stirring sleeve (308).

2. The injection mechanism of a semiconductor molding die according to claim 1, characterized in that: The main body (1) includes a base (101), a support frame (102) is fixedly installed on the side of the lower end of the base (101), a material bucket (103) is fixedly installed in the middle of the base (101), an injection port (104) is opened at the lower end of the material bucket (103), an inlet (105) is opened inside the upper part of the material bucket (103), and a control box (106) is fixedly installed on the side of the upper end of the base (101).

3. The injection mechanism of a semiconductor molding die according to claim 1, characterized in that: The driving mechanism (2) includes a bucket lid (201), a rotating motor (202) is fixedly installed on the upper end of the bucket lid (201), a rotating rod (203) is fixedly installed on the lower end of the rotating motor (202), and a limit block (204) is fixedly provided on the outer end of the rotating rod (203).

4. The injection mechanism of a semiconductor molding die according to claim 2, characterized in that: The limiting mechanism (4) includes a bracket (401), a limiting sleeve (402) is fixedly installed at the inner end of the bracket (401), and a threaded pipe (403) is fixedly connected to the upper end of the limiting sleeve (402).

5. The injection mechanism of a semiconductor molding die according to claim 1, characterized in that: The movable rod (301) is movably installed below the rotating rod (203), the limiting groove (303) is symmetrically distributed on the inside of the left and right sides of the inner end of the movable groove (302), and the stirring sleeve (308) is symmetrically distributed on the outer end of the movable rod (301).

6. The injection mechanism of a semiconductor molding die according to claim 3, characterized in that: The bucket lid (201) is movably installed on the upper end of the material bucket (103). The limiting blocks (204) are symmetrically distributed on the left and right sides below the outer end of the rotating rod (203). The rotating rod (203) is movably installed inside the movable groove (302) through the limiting blocks (204). The limiting blocks (204) and the limiting groove (303) are compatible.

7. The injection mechanism of a semiconductor molding die according to claim 4, characterized in that: The bracket (401) is fixedly installed below the inner end of the material bucket (103). The bracket (401) is symmetrically distributed on the left and right sides of the outer end of the limiting sleeve (402). The threaded tube (403) and the connecting groove (304) at the lower end of the movable rod (301) are compatible.

8. The injection mechanism of a semiconductor molding die according to claim 4, characterized in that: The metal ball (306) and the glue injection port (104) are compatible, and the diameter of the threaded tube (403) is larger than the diameter of the limiting sleeve (402).

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