Semiconductor transport case with anti-shock cushion

Abstract

This utility model discloses a semiconductor transport box with shock-absorbing cushioning pads. It includes a box body and hinged lids on both sides of the back of the box. Cushioning pads are located on the front and rear sides of the box's internal cavity. Positioning guide grooves are sequentially formed from left to right on both the front and rear sides of the internal cavity. Positioning partitions are located within the inner cavities of the positioning guide grooves. The cushioning pads consist of an elastic rubber base layer, a cushioning layer, and a wear-resistant layer, with the cushioning layer disposed on the outer surface of the elastic rubber base layer. In this utility model, when using the box, the positioning partitions are first inserted into the positioning guide grooves inside the box according to the specifications of the semiconductor device to be transported. By adjusting the position of the positioning partitions within different positioning guide grooves, a space matching the device size is formed. The semiconductor device is then placed stably within this space, and the positioning partitions secure the device, preventing it from shaking inside the box.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor transport boxes, specifically a semiconductor transport box with shock-absorbing cushioning pads. Background Technology

[0002] In today's rapidly developing semiconductor industry, semiconductor devices, due to their precise structure and extremely high sensitivity, require extremely stringent environmental conditions during transportation. Even minor vibrations, collisions, or compression can damage the internal circuitry, degrade performance, or even cause complete failure, resulting in significant economic losses.

[0003] Traditional semiconductor transport devices often suffer from insufficient cushioning performance, limited fixing methods, and poor wear resistance of the cushioning pads. Over time, the pads wear out and become damaged, making them unable to withstand the impacts of transport. Furthermore, they cannot flexibly fix semiconductor devices of different specifications, failing to meet the safe transport requirements of high-precision semiconductor devices. Therefore, those skilled in the art have provided a semiconductor transport box with shock-absorbing cushioning pads to solve the problems mentioned in the background art.

[0004] Therefore, it is necessary to provide a semiconductor transport box with shock-absorbing pads to solve the above-mentioned technical problems. The information disclosed in this background section is only intended to enhance the understanding of the overall background of this utility model, and is not necessarily to be regarded as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor transport box with shock-absorbing pads to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor transport box with shock-absorbing cushioning pads, comprising a box body and a box cover hinged to the top of both sides of the back of the box body. Cushioning pad bodies are provided on the front and rear sides of the inner cavity of the box body. Positioning guide grooves are sequentially formed from left to right on the front and rear sides of the inner cavity of the box body. Positioning partitions are provided within the inner cavities of the positioning guide grooves. The cushioning pad body comprises an elastic rubber base layer, a buffer layer, and a wear-resistant layer. The buffer layer is disposed on the outer surface of the elastic rubber base layer, and the wear-resistant layer is disposed on the outer surface of the buffer layer. The wear-resistant layer comprises a polyurethane material layer, a composite material layer, and an EPDM rubber layer. The composite material layer is disposed on the outer surface of the polyurethane material layer, and the EPDM rubber layer is disposed on the outer surface of the composite material layer.

[0007] As a further embodiment of this utility model: locking assemblies are provided on the top of both sides of the front of the box body and on both sides of the front of the box cover, and handle grooves are provided on the top of both sides of the box body.

[0008] As a further improvement of this utility model: the bottom perimeter of the box cover contacts the top perimeter of the box body.

[0009] As a further improvement of this utility model: the inner side of the positioning guide groove penetrates the inner side of the buffer pad body, and the outer side of the buffer pad body is bonded to the front side and the rear side of the inner cavity of the box by an adhesive.

[0010] As a further improvement of this utility model: the material of the box body and the box lid are the same, and the box body and the box lid are made of PP plastic.

[0011] As a further improvement of this utility model: the number of positioning guide grooves is five sets, and the number of each set is five, and each of the five positioning guide grooves is provided with the inner cavity of the box.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. In this utility model, when using the box, firstly, according to the specifications of the semiconductor device to be transported, a positioning partition is inserted into the positioning guide groove inside the box. By adjusting the position of the positioning partition in different positioning guide grooves, a receiving space matching the size of the device is formed. The semiconductor device is then placed stably inside, and the positioning partition is used to fix the device to prevent it from shaking inside the box.

[0014] 2. In this utility model, the lid is then closed, ensuring a tight fit between the bottom perimeter of the lid and the top perimeter of the box. By operating the locking assembly on the front of the box and the lid, the lid is firmly fixed to the box, ensuring that the lid will not loosen during transportation. During transportation, when encountering external impacts such as bumps or collisions, the buffer pads on the front and rear sides of the box's inner cavity come into play. The external impact force first acts on the wear-resistant layer, which protects the internal structure from damage due to its excellent wear resistance. Then, the impact force is transmitted to the buffer layer, which further absorbs and attenuates the energy through its own deformation. Finally, the elastic rubber base layer buffers and absorbs the remaining energy, minimizing the impact of the impact force on the internal semiconductor devices. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the back of the box body and box cover structure in this utility model;

[0017] Figure 3 This is a schematic diagram showing the structure of the housing and the buffer pad in this utility model;

[0018] Figure 4This is a top view of the left side of the buffer pad body and the box structure in this utility model;

[0019] Figure 5 This is a partial cross-sectional view of the buffer pad body structure in this utility model;

[0020] Figure 6 This is a partial cross-sectional view of the wear-resistant layer structure in this utility model.

[0021] In the diagram: 1. Box body; 2. Box cover; 3. Buffer pad body; 4. Positioning guide groove; 5. Positioning partition; 6. Handle groove; 7. Elastic rubber base layer; 8. Buffer layer; 9. Wear-resistant layer; 91. Polyurethane material layer; 92. Composite material layer; 93. EPDM rubber layer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-6 In this embodiment of the present invention, a semiconductor transport box with shock-absorbing cushioning includes a box body 1 and a box cover 2 with hinges on the top of both sides of the back of the box body 1. A cushioning body 3 is provided on the front and rear sides of the inner cavity of the box body 1. Positioning guide grooves 4 are sequentially opened from left to right on the front and rear sides of the inner cavity of the box body 1. A positioning partition 5 is provided in the inner cavity of the positioning guide groove 4. The cushioning body 3 includes an elastic rubber base layer 7, a cushioning layer 8, and a wear-resistant layer 9. The cushioning layer 8 is disposed on the outer surface of the elastic rubber base layer 7. The wear-resistant layer 9 is disposed on the outer surface of the cushioning layer 8. The wear-resistant layer 9 includes a polyurethane material layer 91, a composite material layer 92, and an EPDM rubber layer 93. The composite material layer 92 is disposed on the outer surface of the polyurethane material layer 91, and the EPDM rubber layer 93 is disposed on the outer surface of the composite material layer 92.

[0024] Locking assemblies are provided on the top of both sides of the front of the box 1 and on both sides of the front of the box cover 2. The top of both sides of the box 1 is provided with handle grooves 6. During transportation, the operator can conveniently hold the box 1 through the handle grooves 6 on both sides of the box 1 to achieve safe and efficient transportation of semiconductor devices.

[0025] Among them, the bottom perimeter of the lid 2 contacts the top perimeter of the body 1, and the bottom perimeter of the lid 2 is in close contact with the top perimeter of the body 1. Together with the locking assembly, it can form a good sealing effect, effectively preventing external dust, moisture and other impurities from entering the body 1.

[0026] The inner side of the positioning guide groove 4 penetrates the inner side of the buffer pad body 3. The outer side of the buffer pad body 3 is bonded to the front and rear sides of the inner cavity of the box 1 by adhesive. The positioning guide groove 4 in the inner cavity of the box 1 is designed as five groups, with five in each group. The position of the positioning partition 5 can be flexibly adjusted according to the size and shape of the semiconductor device. This multi-group and multi-quantity positioning guide groove 4 setting can adapt to semiconductor devices of different specifications, realize the precise fixation of the device, effectively prevent the device from shaking or colliding during transportation, and ensure the stability of the device during transportation.

[0027] The box body 1 and the box cover 2 are made of the same material. The box body 1 and the box cover 2 are made of PP plastic. The box body 1 and the box cover 2 are made of PP plastic. This material is lightweight, which reduces the overall weight of the box body 1 and makes it easy to handle. PP plastic has high strength and is corrosion resistant, which can ensure that the box body 1 has sufficient structural strength and extend the service life of the box body 1.

[0028] The positioning guide grooves 4 are in five sets, with five in each set, and each of the five positioning guide grooves 4 is provided with an inner cavity of the housing 1. This arrangement of multiple sets and multiple quantities of positioning guide grooves 4 can adapt to semiconductor devices of different specifications, achieve precise fixation of the devices, effectively prevent the devices from shaking or colliding during transportation, and ensure the stability of the devices during transportation.

[0029] The working principle of this utility model is as follows: The buffer pad body 3 adopts a multi-layer composite structure. The elastic rubber base layer 7 provides basic elastic support and can initially absorb external impact force. The buffer layer 8 further enhances the buffering effect and can effectively attenuate the vibration energy during transportation. The wear-resistant layer 9 is composed of a polyurethane material layer 91, a composite material layer 92, and a EPDM rubber layer 93. This not only significantly improves the wear resistance of the buffer pad body 3 and extends its service life, but also reduces the wear of the buffer pad body 3 itself during vibration, ensuring a long-term stable anti-vibration effect. The three-layer structure works synergistically to significantly reduce the probability of semiconductor devices being damaged by vibration and collision. The positioning guide grooves 4 in the inner cavity of the housing 1 are designed in five groups, with five in each group. The position of the positioning partition 5 can be flexibly adjusted according to the size and shape of the semiconductor device. This multi-group and multi-quantity positioning guide groove setting can Adaptable to semiconductor devices of different specifications, this device achieves precise fixation, effectively preventing shaking and collision during transportation and ensuring stability during transit. The lid 2 is connected to the body 1 via hinges, with its bottom and top edges tightly contacting each other. Combined with the locking assembly, this creates a good seal, effectively preventing external dust, moisture, and other impurities from entering the body 1. It also ensures that the lid 2 will not open accidentally during transportation, providing reliable safety for the semiconductor devices. Both the body 1 and lid 2 are made of PP plastic, a lightweight material that reduces the overall weight of the body 1, making it easy to handle. PP plastic is also high-strength and corrosion-resistant, ensuring sufficient structural strength and extending the lifespan of the body 1. The handle grooves 6 on both sides of the body 1 facilitate gripping by handlers, improving transportation convenience.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0031] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor transport case with shock-absorbing cushioning, comprising a case body (1) and case covers (2) hinged to the top of both sides of the back of the case body (1), characterized in that: The front and rear sides of the inner cavity of the box (1) are provided with buffer pad bodies (3). The front and rear sides of the inner cavity of the box (1) are provided with positioning guide grooves (4) from left to right. The inner cavity of the positioning guide groove (4) is provided with a positioning partition (5). The buffer pad body (3) includes an elastic rubber base layer (7), a buffer layer (8) and a wear-resistant layer (9). The buffer layer (8) is provided on the outer surface of the elastic rubber base layer (7). The wear-resistant layer (9) is provided on the outer surface of the buffer layer (8). The wear-resistant layer (9) includes a polyurethane material layer (91), a composite material layer (92) and a EPDM rubber layer (93). The composite material layer (92) is provided on the outer surface of the polyurethane material layer (91). The EPDM rubber layer (93) is provided on the outer surface of the composite material layer (92).

2. A semiconductor transport box with shock-absorbing cushioning as described in claim 1, characterized in that: Locking assemblies are provided on the top of both sides of the front of the box body (1) and on both sides of the front of the box cover (2). Handle grooves (6) are provided on the top of both sides of the box body (1).

3. A semiconductor transport box with shock-absorbing cushioning as described in claim 1, characterized in that: The bottom perimeter of the lid (2) contacts the top perimeter of the body (1).

4. A semiconductor transport box with shock-absorbing cushioning as described in claim 1, characterized in that: The inner side of the positioning guide groove (4) penetrates the inner side of the buffer pad body (3), and the outer side of the buffer pad body (3) is bonded to the front and rear sides of the inner cavity of the box body (1) by adhesive.

5. A semiconductor transport box with shock-absorbing cushioning as described in claim 1, characterized in that: The box body (1) and the box cover (2) are made of the same material, and the box body (1) and the box cover (2) are made of PP plastic.

6. A semiconductor transport box with shock-absorbing cushioning as described in claim 1, characterized in that: The number of positioning guide grooves (4) is five sets, and the number of each set is five, and each of the five positioning guide grooves (4) is provided with the inner cavity of the box body (1).

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