Wafer handling robot with integrated electrostatic chuck

By employing a combination of direct-drive motor, hollow shaft, conductive slip ring, and feedthrough in the wafer handling robot, the problem of the inability to install electrostatic chucks in the vacuum chamber was solved, enabling reliable wafer handling in high-temperature and high-vacuum environments.

CN224477607UActive Publication Date: 2026-07-10WUXI FUCHUANGDE PRECISION EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUXI FUCHUANGDE PRECISION EQUIP CO LTD
Filing Date
2025-08-12
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing wafer handling robots cannot install electrostatic chucks in vacuum chambers because internal wiring cannot be achieved.

Method used

A direct-drive motor and hollow shaft provide internal wiring space for the electrostatic chuck. The reliability of the wiring is ensured by the cooperation of conductive slip rings and feedthroughs. The position of the cable is restricted by the limit tube. Combined with the magnetohydrodynamic sealing device and the air-cooling device, the reliability and airtightness of the robot are improved in vacuum and high-temperature environments.

Benefits of technology

It enables reliable movement of electrostatic chucks in vacuum chambers, ensuring normal operation of robotic arms in high-temperature vacuum environments, improving trace reliability and airtightness, and is suitable for wafer handling under high-temperature and high-vacuum conditions.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a wafer transfer manipulator integrated with an electrostatic chuck, and belongs to the technical field of semiconductor transfer. In order to solve the problem that a wafer transfer manipulator cannot be installed with an electrostatic chuck through internal wiring, the application provides a wafer transfer manipulator integrated with an electrostatic chuck, which comprises a manipulator arm, a transmission mechanism, a rotary driving mechanism, an electrostatic chuck and a cable. The electrostatic chuck is arranged at the tail end of the manipulator arm. The rotary driving mechanism comprises a direct drive motor, and the transmission mechanism comprises a hollow shaft. The direct drive motor is in transmission connection with the manipulator arm through the hollow shaft and is used for driving the manipulator arm to rotate and stretch out and retract. A conductive slip ring is arranged in the hollow shaft, the top of the hollow shaft is provided with a feedthrough, and the inside of the direct drive motor is provided with a limiting tube. The cable is connected with the conductive slip ring through the limiting tube, the conductive slip ring is also connected with the feedthrough, and the lead-out wire of the feedthrough is connected with the electrostatic chuck. The application provides internal space for wiring through the direct drive motor and the hollow shaft, and guarantees the wiring reliability in the movement of the electrostatic chuck through the cooperation of the conductive slip ring and the feedthrough.
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