A compact LED module

Abstract

This utility model discloses a compact LED module, including a ceramic substrate with an upwardly protruding mounting portion for mounting LED chips in the center of the ceramic substrate cavity; a power circuit board with a mounting hole in the center that matches the mounting portion, allowing the power circuit board to fit against the bottom of the ceramic substrate and be sleeved on the outer periphery of the mounting portion; power modules on the power circuit board are distributed circumferentially around the mounting portion and have a gap between them; LED chips are fitted onto the top of the mounting portion and electrically connected to the power circuit board; and a lens is mounted above the ceramic substrate by a metal pressure post. This utility model improves the structure of the LED module, allowing the LED chips to fit tightly against the ceramic substrate, dissipating heat effectively and improving the lifespan of the LED chips. It also compresses the module size, reduces the number of components, greatly optimizes the spatial layout, and improves the overall compactness of the module, making it suitable for use in limited installation spaces.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, and in particular to a compact LED module. Background Technology

[0002] With the continuous development of LED lighting technology, LED modules, as the core component of light-emitting devices, are increasingly widely used in lighting products. The structure of existing LED modules generally includes an independently set power circuit board, an LED chip mounting substrate (such as an aluminum substrate or ceramic substrate), and heat dissipation components for heat conduction. These components are often electrically connected via connectors, ribbon cables, or soldering, while thermal management relies on materials such as thermally conductive adhesives and metal interlayers for heat conduction, thus forming an integrated lighting unit.

[0003] In this structure, the LED module has a large number of stacked layers and a complex spatial layout, making it difficult to achieve a compact structure and reducing the utilization efficiency of the internal space of the lamp. Furthermore, because heat must be conducted to the heat sink through multiple interface layers, the thermal path is long and the thermal resistance is high, which restricts the heat dissipation performance of the LED chip, extending its operating time at high temperatures and thus affecting the module's luminous efficacy, stability, and lifespan. Moreover, because multiple functional structural units need to be designed, processed, and assembled in layers, the assembly process is cumbersome, requires a high degree of manual intervention, and has a high overall manufacturing cost, which also limits the automated production and low-cost widespread adoption of the module.

[0004] Therefore, there is an urgent need for a new LED module structure that is more compact, has higher heat dissipation efficiency, and is easier to assemble, in order to meet the comprehensive requirements of modern LED lighting equipment for high performance, miniaturization, and low cost. Utility Model Content

[0005] Therefore, in order to solve the problems existing in the prior art, the purpose of this utility model is to provide a compact LED module.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A compact LED module includes:

[0008] A ceramic substrate having an internal cavity, wherein the center of the internal cavity of the ceramic substrate has an upwardly protruding mounting portion for mounting LED chips;

[0009] A power circuit board is disposed in the inner cavity of the ceramic substrate. The power circuit board has an assembly hole in the middle that matches the cross-sectional profile of the mounting part, so that the power circuit board can fit against the bottom of the ceramic substrate and be sleeved on the outer periphery of the mounting part. The power modules on the power circuit board are distributed around the mounting part in a circumferential direction and have a gap with the mounting part.

[0010] The LED chip is attached to the top of the mounting part and electrically connected to the power circuit board;

[0011] A lens, which is mounted above the ceramic substrate by a metal clamping post.

[0012] Optionally, the mounting part includes a mounting part body and integrally formed mounting posts located on both sides of the mounting part body, and an arc-shaped transition surface is provided between the mounting part body and the two mounting posts; the two opposite ends or two opposite corners of the LED chip are fixed to the upper end of the mounting posts by fasteners.

[0013] Optionally, the cross-sectional area of ​​the mounting body is larger than the cross-sectional area of ​​the mounting column, and the mounting body, the mounting column, and the ceramic substrate are integrally formed.

[0014] Optionally, the power circuit board is fixed to the bottom of the ceramic substrate with thermally conductive adhesive, and the height of the power module is less than the height of the mounting portion.

[0015] Optionally, the upper end of the ceramic substrate is radially recessed with an annular mounting groove for mounting the metal pressure column, and the lower end of the metal pressure column is sleeved on the outer periphery of the annular mounting groove; the outer peripheral surface of the metal pressure column is flush with the outer surface of the ceramic substrate.

[0016] Optionally, the outer wall of the ceramic substrate has a plurality of axially extending grooves spaced apart along its circumference, the upper end of the grooves communicating with the mounting groove; the lower end of the metal pressure column is provided with a snap-fit ​​step, the snap-fit ​​step abutting against the top edge of the ceramic substrate.

[0017] Optionally, the upper end of the metal pressure column is provided with a mounting groove for mounting the lens, and the lens is embedded in the mounting groove.

[0018] Optionally, the ceramic matrix is ​​made of alumina ceramic or aluminum nitride ceramic.

[0019] Optionally, the bottom of the ceramic substrate is provided with a through hole for inserting an external power supply cable.

[0020] Compared with the prior art, the beneficial effects of this utility model are at least in the following aspects:

[0021] 1) This utility model improves the structure of the LED module, increasing its overall compactness and facilitating its use in limited installation space. Specifically, a protruding mounting portion is provided in the center of the ceramic substrate for mounting the LED chip, while the power module is located in the peripheral area of ​​the mounting portion. This makes the overall spatial layout more compact, facilitating the integration of the power supply and the light-emitting module onto a single ceramic substrate, effectively reducing module size, decreasing the number of components, greatly optimizing the spatial layout, and lowering manufacturing costs.

[0022] Meanwhile, utilizing the raised structure in the central area of ​​the ceramic substrate as the chip mounting area saves on additional support structures, reduces overall thickness, and eliminates the need for connecting components required in traditional designs, simplifying the product structure. On the other hand, the outer annular area rationally accommodates the power supply circuit, avoiding stacking interference between the power supply and the light source, and reducing the complexity of the overall board wiring. Overall, this gives the LED module a more compact and integrated structural characteristic, which helps meet the requirements of miniaturization design, is suitable for lighting equipment with limited space, improves the flexibility of product structural design and assembly efficiency, and further reduces manufacturing costs.

[0023] 2) This utility model designs an integrated mounting part in the middle of the ceramic substrate, allowing the LED chip to be directly attached to the mounting part of the ceramic substrate. The mounting part as a whole forms a stable support area with a widened center and locked ends, which enables the LED chip to be firmly installed. At the same time, it forms a larger heat-conducting surface, which not only improves the thermal coupling efficiency of the chip and enhances the heat dissipation channel, but also improves the heat dissipation effect of the LED chip through the widened contact area of ​​the mounting part body, thereby improving the chip's lifespan and reliability. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of a compact LED module according to a preferred embodiment of the present invention.

[0025] Figure 2 This is a cross-sectional view of the overall structure of a compact LED module according to a preferred embodiment of the present invention.

[0026] Figure 3 for Figure 2 Enlarged view of a portion of point A in the middle;

[0027] Figure 4 This is an exploded view of the overall structure of a compact LED module according to a preferred embodiment of the present invention.

[0028] Figure 5 This is a partial structural diagram of a compact LED module according to a preferred embodiment of the present invention, omitting the metal pressure column and lens.

[0029] In the picture:

[0030] 1. Ceramic substrate; 11. Mounting part; 111. Mounting part body; 112. Mounting post; 12. Annular assembly groove; 13. Groove; 2. Power circuit board; 21. Assembly hole; 3. Power module; 4. LED chip; 5. Lens; 6. Metal pressure post; 61. Snap-fit ​​step; 62. Mounting groove. Detailed Implementation

[0031] To facilitate understanding of this utility model, the technical solution and advantages of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments. The specific structure and features of this utility model are illustrated by way of example and should not constitute any limitation on this utility model. Furthermore, any of the technical features mentioned below (including implicit or disclosed features), as well as any technical features directly shown or implied in the figures, can be arbitrarily combined or deleted among these technical features to form other embodiments that may not be directly or indirectly mentioned in this utility model. The accompanying drawings show preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein.

[0032] In the description of this utility model, unless otherwise stated, all components used are conventional components in the prior art.

[0033] like Figure 1-5 As shown, this utility model provides a compact LED module, comprising:

[0034] The ceramic substrate 1 has an inner cavity, and a mounting portion 11 for mounting the LED chip 4 protrudes upward from the center of the inner cavity. Specifically, in this embodiment, the ceramic substrate 1 is made of alumina ceramic or aluminum nitride ceramic. Furthermore, the bottom of the ceramic substrate 1 has a through hole for threading an external power supply cable. The wiring method and specifications of the power supply cable can be selected according to product requirements.

[0035] A power circuit board 2 is disposed within the inner cavity of the ceramic substrate 1. The power circuit board 2 has a mounting hole 21 in its center that matches the cross-sectional profile of the mounting portion 11, allowing the power circuit board 2 to fit against the bottom of the ceramic substrate 1 and be fitted around the outer periphery of the mounting portion 11. Power modules 3 on the power circuit board 2 are distributed circumferentially around the mounting portion 11, with gaps between them. In this embodiment, the power circuit board 2 is a conventional control component installed inside the ceramic substrate 1, integrating power modules 3, capacitors, inductors, and other components required to drive the LED chip 4. Existing mature constant current driving schemes or intelligent dimming modules can be selected according to specific application requirements. Its size, function, and parameter configuration can be determined by referring to commonly used power supply technologies for existing LED modules, as long as the beneficial effects of this utility model are met. Further, the power circuit board 2 is fixed to the bottom of the ceramic substrate with thermally conductive adhesive, and the height of the power modules 3 is less than the height of the mounting portion 11.

[0036] LED chip 4 is attached to the top of the mounting part 11 and electrically connected to the power circuit board 2;

[0037] Lens 5 is mounted on top of the ceramic substrate 1 via a metal pressure post 6. Lens 5 is also a conventional component; commercial lens assemblies of different shapes, materials, and optical parameters can be selected according to specific application requirements, as long as the beneficial effects of this invention are achieved.

[0038] This invention improves the structure of the LED module, increasing its overall compactness and facilitating its use within limited installation space. Specifically, a protruding mounting portion 11 is provided in the middle of the ceramic substrate 1 for mounting the LED chip 4, while the power module 3 is located in the peripheral area of ​​the mounting portion 11. This makes the overall spatial layout more compact, facilitating the integration of the power supply and the light-emitting module onto a single ceramic substrate 1, effectively reducing module size, decreasing the number of components, and greatly optimizing the spatial layout.

[0039] Meanwhile, utilizing the raised structure in the central area of ​​the ceramic substrate 1 as the chip mounting part 11 saves on additional support structures and reduces the overall thickness. On the other hand, the outer annular area reasonably accommodates the power supply circuit, avoiding stacking interference between the power supply and the light source, and reducing the overall board wiring complexity. Overall, this gives the LED module a more compact and integrated structural characteristic, which is conducive to miniaturization design requirements, especially suitable for lighting equipment with limited space, further improving the product's structural design flexibility and assembly efficiency.

[0040] In one optional embodiment, the mounting part 11 includes a mounting part body 111 and integrally formed mounting posts 112 located on both sides of the mounting part body 111. An arc-shaped transition surface is provided between the mounting part body 111 and the two mounting posts 112. The two opposite ends or two opposite corners of the LED chip 4 are fixed to the upper end of the mounting posts 112 by fasteners.

[0041] Further refining the design, the cross-sectional area of ​​the mounting body 111 is larger than that of the mounting post 112, and the mounting body 111, mounting post 112, and ceramic substrate 1 are integrally formed. In this embodiment, by designing an integrated mounting part 11 in the middle of the ceramic substrate 1, the LED chip 4 is directly attached to the mounting part 11 of the ceramic substrate 1, forming a stable support area that is widened in the center and locked at both ends. This allows the LED chip 4 to be firmly installed and also forms a larger heat-conducting surface. This not only improves the thermal coupling efficiency of the chip and enhances the heat dissipation channel, but also improves the heat dissipation effect of the LED chip 4 through the widened contact area of ​​the mounting body 111, thereby improving the chip's lifespan and reliability.

[0042] Optionally, the upper end of the ceramic substrate 1 is radially recessed with an annular mounting groove 12 for mounting the metal pressure post 6, and the lower end of the metal pressure post 6 is fitted around the outer periphery of the annular mounting groove 12; the outer peripheral surface of the metal pressure post 6 is flush with the outer surface of the ceramic substrate 1. Furthermore, the upper end of the metal pressure post 6 is provided with a mounting groove 62 for mounting the lens 5, and the lens 5 is embedded in the mounting groove 62. The lens 5 mounting groove 62 at the upper end of the metal pressure post 6, with the lens 5 embedded in this groove, facilitates standardized assembly and allows for later maintenance or replacement of lens 5 components with different optical parameters, improving the module's adaptability.

[0043] An annular assembly groove 12 is provided on the upper end of the ceramic substrate 1, and the lower end of the metal pressure column 6 is fitted around the outer periphery of the groove to form a precise fit, which effectively improves the coaxiality and stability of the pressure column installation and prevents the lens 5 from shifting or loosening.

[0044] Optionally, the outer wall of the ceramic substrate 1 is provided with a plurality of axially extending grooves 13 at intervals along its circumference, and the upper end of the grooves 13 communicates with the mounting groove 62; this is beneficial for the maintenance of the metal pressure column or the operation of replacing the lens assembly.

[0045] The lower inner wall of the metal pressure column 6 is provided with a snap-fit ​​step 61, which abuts against the top edge of the ceramic substrate 1. By providing an annular assembly groove 12 at the upper end of the ceramic substrate 1, the lower end of the metal pressure column 6 is fitted onto its outer circumference, thereby achieving precise positioning and stable connection between the pressure column and the ceramic substrate 1, improving the coaxiality and structural reliability of the overall assembly; the upper end of the metal pressure column 6 is provided with an installation groove 62 for installing the lens 5, which facilitates the standardized installation and replacement of the lens 5 assembly, improving the optical flexibility and maintenance convenience of the module.

[0046] The above embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of protection of the present utility model. For those skilled in the art, it will be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A compact LED module, characterized in that, include: A ceramic substrate having an internal cavity, wherein the center of the internal cavity of the ceramic substrate has an upwardly protruding mounting portion for mounting LED chips; A power circuit board is disposed in the inner cavity of the ceramic substrate. The power circuit board has an assembly hole in the middle that matches the cross-sectional profile of the mounting part, so that the power circuit board can fit against the bottom of the ceramic substrate and be sleeved on the outer periphery of the mounting part. The power modules on the power circuit board are distributed around the mounting part in a circumferential direction and have a gap with the mounting part. The LED chip is attached to the top of the mounting part and electrically connected to the power circuit board; A lens, which is mounted above the ceramic substrate by a metal clamping post.

2. The compact LED module as described in claim 1, characterized in that, The mounting part includes a mounting part body and integrally formed mounting posts located on both sides of the mounting part body. An arc-shaped transition surface is provided between the mounting part body and the two mounting posts. The two opposite ends or two opposite corners of the LED chip are fixed to the upper end of the mounting posts by fasteners.

3. The compact LED module as described in claim 2, characterized in that, The cross-sectional area of ​​the mounting body is larger than that of the mounting column, and the mounting body, the mounting column, and the ceramic substrate are integrally formed.

4. The compact LED module as described in claim 3, characterized in that, The power circuit board is fixed to the bottom of the ceramic substrate with thermally conductive adhesive, and the height of the power module is less than the height of the mounting part.

5. The compact LED module as described in claim 4, characterized in that, The upper end of the ceramic substrate is radially recessed with an annular assembly groove for mounting the metal pressure column, and the lower end of the metal pressure column is sleeved on the annular assembly groove; the outer circumferential surface of the metal pressure column is flush with the outer surface of the ceramic substrate.

6. The compact LED module as described in claim 5, characterized in that, The upper end of the metal pressure column is provided with a mounting groove for mounting the lens, and the lens is embedded in the mounting groove.

7. The compact LED module as described in claim 6, characterized in that, The outer wall of the ceramic substrate has several axially extending grooves distributed at intervals along its circumference, and the upper end of the grooves is connected to the mounting groove; the lower end of the metal pressure column is provided with a snap-fit ​​step, and the snap-fit ​​step abuts against the top edge of the ceramic substrate.

8. The compact LED module as described in claim 7, characterized in that, The ceramic matrix is ​​made of alumina ceramic or aluminum nitride ceramic.

9. The compact LED module as described in claim 1, characterized in that, The bottom of the ceramic substrate is provided with a through hole for inserting an external power supply cable.

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