A headphone circuit board test fixture

Abstract

This utility model belongs to the field of test fixture technology, and particularly relates to a test fixture for an earphone circuit board. It includes a lower mold assembly with test positions for placing the product under test; an upper mold assembly located above the lower mold assembly, which can be moved closer to or further away from the lower mold assembly to close or expose the test positions; a probe assembly located within the upper mold assembly and corresponding to the test positions, the lower end of which is used to contact the test points of the product under test to obtain electrical signals for electrical testing; and a gray card adjustment module located within the upper mold assembly, containing a gray card and used to adjust the relative distance between the gray card and the optical sensor of the product under test. This utility model aims to simultaneously complete the functional testing of the electrical test points and optical sensors of the circuit board, and has an adjustable gray card distance function to eliminate the influence of assembly tolerances, ensure the stability and accuracy of optical sensor testing, and simplify the debugging process.

Description

Technical Field

[0001] This utility model belongs to the field of test fixture technology, and in particular relates to a test fixture for an earphone circuit board. Background Technology

[0002] With the widespread adoption of wireless earphone technology, wear detection has become a key feature for enhancing user experience. This function allows earphones to intelligently recognize the user's wearing status: automatically playing audio when the earphones are put on and automatically pausing when they are removed, improving ease of use and effectively saving device power. Currently, mainstream wear detection technologies are mainly divided into two categories: capacitive detection and optical detection. Among them, optical detection technology, with its higher detection accuracy and stronger environmental adaptability, is widely used in high-end earphone products.

[0003] The realization of optical detection functions relies heavily on optical sensors integrated on the headphone circuit board. During headphone manufacturing, to ensure the sensor's performance meets standards, it is essential to simulate the real in-ear environment for precise testing. One crucial aspect is accurately controlling the distance between the sensor and the simulated in-ear reflective surface (typically using a standard gray card), while simultaneously measuring the sensor's output electrical signal. However, existing headphone circuit board test fixtures generally have significant limitations: firstly, they struggle to efficiently and synchronously test conventional electrical test points (such as connection points and pads) and optical sensors on the circuit board, resulting in cumbersome and inefficient testing processes; secondly, the gray card module used to simulate reflection distance in existing fixtures typically employs a fixed structure. This fixed design cannot effectively compensate for internal dimensional deviations caused by machining tolerances, assembly errors, and wear from long-term use, causing the actual distance between the optical sensor and the gray card to deviate from the preset value. This deviation directly leads to unstable intensity of the reflected light signal received by the sensor during testing, resulting in large fluctuations and poor repeatability in test results, making product qualification difficult and the debugging process exceptionally time-consuming and labor-intensive.

[0004] Therefore, there is an urgent need for a test fixture for headphone circuit boards that can simplify the debugging process and improve the stability and accuracy of testing. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a test fixture for headphone circuit boards. This fixture aims to simultaneously perform functional tests on the electrical test points of the circuit board and the optical sensors, and features an adjustable gray card distance to eliminate the influence of assembly tolerances, ensure the stability and accuracy of optical sensor testing, and simplify the debugging process.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A test fixture for an earphone circuit board includes:

[0008] A lower mold assembly, wherein the lower mold assembly is provided with a test position for placing the product to be tested;

[0009] An upper mold assembly is disposed above the lower mold assembly, and the upper mold assembly can be close to or away from the lower mold assembly to close or expose the test position;

[0010] A probe assembly is disposed within the upper mold assembly and corresponds to the test position above it. The lower end of the probe assembly is used to contact the test point of the product under test to obtain an electrical signal for electrical testing.

[0011] A gray card adjustment module is provided within the upper mold assembly. The gray card adjustment module contains a gray card and is used to adjust the relative distance between the gray card and the optical sensor of the product under test.

[0012] Furthermore, the gray card adjustment module includes a gray card fixing block, the lower end of which has a gray card mounting groove, and the gray card is installed in the gray card mounting groove. An adjustment component is provided on the upper surface of the upper mold assembly, and the adjustment component passes downward through the adjustment hole on the upper mold assembly and connects to the upper end of the gray card fixing block.

[0013] Furthermore, the adjusting component includes an adjusting knob and a screw connected to the adjusting knob. The adjusting knob is located on the upper surface of the upper mold assembly, and the screw is connected to the gray card fixing block.

[0014] Furthermore, the gray card fixing block has guide posts at both ends that are parallel to the screw, and the upper mold assembly has guide holes that cooperate with the guide posts.

[0015] Furthermore, a spring is fitted onto the guide post, the spring being used to tilt the gray card fixing block away from the optical sensor.

[0016] Furthermore, the gray card fixing block is provided with an opening cover plate at the opening position of the gray card mounting slot, and the opening cover plate is used to limit the opening size of the gray card mounting slot.

[0017] Furthermore, the upper mold assembly includes an upper loading plate, an upper needle plate, and an upper mold wireless plate arranged from bottom to top. An accommodating space for accommodating the gray card fixing block is provided between the upper loading plate and the upper needle plate. The gray card fixing block can move up and down within the accommodating space. The adjustment hole passes through the upper needle plate and the upper mold wireless plate.

[0018] Furthermore, the probe assembly is mounted on the upper needle plate, and the upper end of the probe assembly passes through the upper needle plate and connects to the upper mold wireless plate.

[0019] Furthermore, the lower mold assembly includes a download plate and a lower needle plate arranged from top to bottom, with the test position located on the download plate.

[0020] Furthermore, the upper mold assembly and the lower mold assembly are detachably connected, and the lower mold assembly is also provided with a magnetic cover plate for pressing down the product to be tested.

[0021] The beneficial effects of this utility model are:

[0022] This invention utilizes a gray card adjustment module that allows for adjustable distance between the gray card and the optical sensor. This module precisely simulates different in-ear states, eliminating optical sensor test distance deviations caused by fixture and workpiece tolerances. Combined with the test positions of the probe assembly and lower mold assembly, it enables efficient synchronous testing of circuit board electrical test point connections and optical sensor functional verification. The gray card fixing block, connected by an adjustable component, allows operators to directly and quickly adjust the gray card height from the outside. Guide pillars and guide holes ensure the stability of the gray card fixing block during adjustment. A magnetic cover plate uses magnetic force to press and fix the product under test, ensuring its stable position during testing. This invention aims to simultaneously complete the functional testing of circuit board electrical test points and optical sensors, with adjustable gray card distance to eliminate the influence of assembly tolerances, ensuring the stability and accuracy of optical sensor testing, while simplifying the debugging process. Attached Figure Description

[0023] Appendix Figure 1 This is a structural schematic diagram of the headphone circuit board test fixture of this utility model;

[0024] Appendix Figure 2 This is an exploded view of the headphone circuit board test fixture of this utility model;

[0025] Appendix Figure 3 This is an exploded structural diagram of the upper mold assembly of this utility model;

[0026] Appendix Figure 4 This is an exploded structural diagram of the gray card adjustment module of this utility model;

[0027] Appendix Figure 5 This is an exploded structural diagram of the gray card adjustment module of this utility model;

[0028] Appendix Figure 6 This is a cross-sectional view of the upper mold assembly of this utility model;

[0029] The diagram shows the following components: 1-Lower mold assembly, 110-Test position, 120-Download board, 130-Lower needle plate; 2-Upper mold assembly, 210-Upper loading plate, 220-Upper needle plate, 230-Upper mold wireless plate, 240-Accommodation space, 250-Adjustment hole, 260-Guide hole; 3-Probe assembly; 4-Gray card adjustment module, 410-Gray card, 420-Gray card fixing block, 421-Gray card mounting slot, 430-Adjustment component, 431-Adjustment knob, 432-Screw, 440-Guide post, 450-Spring, 460-Opening cover plate; 5-Magnetic cover plate; 6-Product under test, 610-Test point, 620-Optical sensor. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0031] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0034] See appendix Figure 1To be continued Figure 6 The figure shows a specific embodiment of the headphone circuit board test fixture provided by this utility model.

[0035] See appendix Figure 1 The headphone circuit board test fixture includes:

[0036] The lower mold assembly 1 has a test position 110 for placing the product to be tested 6.

[0037] An upper mold assembly 2 is located above the lower mold assembly 1. The upper mold assembly 2 can be close to or away from the lower mold assembly 1 to close or expose the test position 110.

[0038] The probe assembly 3 is located inside the upper mold assembly 2 and corresponds to the test position 110 above it. The lower end of the probe assembly 3 is used to contact the test point 610 of the product under test 6 to obtain an electrical signal for electrical testing.

[0039] A gray card adjustment module 4 is installed inside the upper mold assembly 2. The gray card adjustment module 4 is equipped with a gray card 410. The gray card adjustment module 4 is used to adjust the relative distance between the gray card 410 and the optical sensor 620 of the product under test 6.

[0040] See appendix Figure 2 and attached Figure 3 In the above embodiment, the upper mold assembly 2 and the lower mold assembly 1 can be configured as a flip-top structure or a vertically detachable structure. During testing, the product under test 6 is placed on the test position 110 of the lower mold assembly 1, and then the upper mold assembly 2 is pressed down onto the lower mold assembly 1. The probe assembly 3 of the upper mold assembly 2 abuts against the test point 610 of the product under test 6 to perform current and voltage testing. Simultaneously, since the upper mold assembly 2 covers and seals the test position 110 after being pressed onto the lower mold assembly 1, the test position 110 area is in a dark and closed state, and the optical sensor 620 of the product under test 6 is unaffected by external light sources. Adjusting the gray card adjustment module 4 accurately simulates different in-ear states, eliminating the test distance deviation of the optical sensor 620 caused by fixture and workpiece tolerances, ensuring the stability and accuracy of the optical sensor 620 test, and facilitating debugging.

[0041] See appendix Figure 3 and attached Figure 5In the above embodiment, the gray card adjustment module 4 includes a gray card fixing block 420. A gray card mounting groove 421 is provided at the lower end of the gray card fixing block 420, and the gray card 410 is installed in the gray card mounting groove 421. An adjusting member 430 is provided on the upper surface of the upper mold assembly 2. The adjusting member 430 passes downward through the adjusting hole 250 on the upper mold assembly 2 and connects to the upper end of the gray card fixing block 420. In this embodiment, the gray card fixing block 420 is located inside the upper mold assembly 2 and can move up and down within the upper mold assembly 2. The adjusting member 430 is located on the upper surface of the upper mold assembly 2 to allow the operator to directly and quickly adjust the height of the gray card fixing block 420 from the outside, thereby adjusting the distance between the gray card 410 and the optical sensor 620 of the product under test 6 at the test position 110.

[0042] See appendix Figure 4 and attached Figure 5 In the above embodiment, the adjusting member 430 includes an adjusting knob 431 and a screw 432 connected to the adjusting knob 431. The adjusting knob 431 is located on the upper surface of the upper mold assembly 2, and the screw 432 is connected to the gray card fixing block 420. In this embodiment, by adopting the adjusting member 430 with the adjusting knob 431 and the screw 432, precise and stepless adjustment of the position of the gray card 410 is achieved, facilitating fine-tuning and locking of the target distance between the gray card 410 and the optical sensor 620.

[0043] See appendix Figure 3 and attached Figure 4 In the above embodiment, the gray card fixing block 420 has guide posts 440 at both ends parallel to the screw 432, and the upper mold assembly 2 has guide holes 260 that cooperate with the guide posts 440. In this embodiment, the guide posts 440 at both ends of the gray card fixing block 420 are two screws of equal height. Through cooperation with the guide holes 260, the gray card fixing block 420 can move smoothly and without deviation in the vertical direction during adjustment, avoiding the gray card 410 tilting, which would cause the reflected light path to deviate or the distance measurement to be inaccurate.

[0044] See appendix Figure 5 and attached Figure 6 In the above embodiment, a spring 450 is sleeved on the guide post 440. The spring 450 is used to make the gray card fixing block 420 tend to move away from the optical sensor 620. In the embodiment, the spring 450 causes the guide post 440 to obtain an upward force through its elasticity, that is, the two ends of the gray card fixing block 420 obtain an upward force, which further improves the stability of the gray card fixing block 420 and makes the gray card fixing block 420 more stable during adjustment and testing.

[0045] See appendix Figure 5 and attached Figure 6In the above embodiment, the gray card fixing block 420 is provided with an opening cover 460 at the opening position of the gray card mounting slot 421. The opening cover 460 is used to limit the opening size of the gray card mounting slot 421. In this embodiment, after the gray card 410 is installed into the gray card mounting slot 421, the opening cover 460 can prevent the gray card 410 from accidentally falling off during use and reduce the entry of dust and other foreign objects into the gray card mounting slot 421 to contaminate the surface of the gray card 410. At the same time, it also allows testers to select opening cover 460s of different opening sizes according to different products under test or different simulated scenarios.

[0046] See appendix Figure 3 and attached Figure 6 In the above embodiment, the upper mold assembly 2 includes an upper carrying plate 210, an upper needle plate 220, and an upper mold wireless plate 230 arranged from bottom to top. A receiving space 240 is formed between the upper carrying plate 210 and the upper needle plate 220 to accommodate the gray card fixing block 420. The gray card fixing block 420 can move up and down within the receiving space 240. An adjustment hole 250 passes through the upper needle plate 220 and the upper mold wireless plate 230. In this embodiment, the receiving space 240 is used to enable the gray card fixing block 420 to move freely in the vertical direction. An adjustment knob 431 is located above the upper mold wireless plate 230, and a screw 432 passes through the upper mold wireless plate 230 and the upper needle plate 220 and connects to the gray card fixing block 420 within the receiving space 240.

[0047] See appendix Figure 3 In the above embodiment, the probe assembly 3 is installed on the upper needle plate 220, and the upper end of the probe assembly 3 passes through the upper needle plate 220 and connects to the upper mold wireless plate 230, so as to realize the reliable transmission of the signal between the test point 610 of the product under test 6 and the upper mold wireless plate 230 through the probe assembly 3.

[0048] See appendix Figure 1 In the above embodiment, the lower mold assembly 1 includes a download plate 120 and a lower needle plate 130 arranged from top to bottom, with the test position 110 located on the download plate 120. The upper mold assembly 2 and the lower mold assembly 1 are detachably connected. The lower mold assembly 1 is also provided with a magnetic cover plate 5 for pressing down on the product under test 6. In the embodiment, during testing, the product under test 6 is first placed on the test position 110 of the download plate 120; then the magnetic cover plate 5 is placed on top. When the magnetic cover plate 5 is magnetically attracted to the download plate 120, it presses down on the product under test 6, preventing some parts of the product under test 6 from lifting or shifting, and ensuring the product position is stable during the test; finally, the upper mold assembly 2 is installed above the magnetic cover plate 5 to perform the test on the product under test 6.

[0049] In summary, this embodiment provides a test fixture for an earphone circuit board. By setting a gray card adjustment module 4 that can adjust the relative distance between the gray card 410 and the optical sensor 620, it can accurately simulate different in-ear states, eliminate the test distance deviation of the optical sensor 620 caused by fixture and workpiece tolerances, and achieve efficient synchronous testing of the connection of electrical test points on the circuit board and the functional verification of the optical sensor 620 by combining the test positions 110 of the probe assembly 3 and the lower mold assembly 1. By setting an adjustment component 430 to connect the gray card fixing block 420, it is convenient for the operator to directly and quickly adjust the height of the gray card from the outside. By setting a guide post 440 and a guide hole 260, the stability of the gray card fixing block 420 during the adjustment process is ensured. By setting a magnetic cover plate 5, the product under test 6 is fixed by magnetic force, ensuring the stable position of the product under test 6 during the test. This embodiment aims to simultaneously complete the functional testing of the electrical test points on the circuit board and the optical sensor 620, and has the function of adjustable distance of gray card 410 to eliminate the influence of assembly tolerances, ensure the stability and accuracy of the optical sensor 620 test, and simplify the debugging process.

[0050] The embodiments described above are merely one of the preferred embodiments of this utility model. Ordinary variations and substitutions made by those skilled in the art within the scope of the technical solution of this utility model should be included within the protection scope of this utility model.

Claims

1. A test fixture for an earphone circuit board, characterized in that, include: The lower mold assembly (1) is provided with a test position (110) for placing the product to be tested (6). An upper mold assembly (2) is disposed above the lower mold assembly (1), and the upper mold assembly (2) can be close to or away from the lower mold assembly (1) to close or expose the test position (110). A probe assembly (3) is provided inside the upper mold assembly (2) and above the test position (110). The lower end of the probe assembly (3) is used to abut against the test point (610) of the product under test (6) to obtain an electrical signal for electrical testing. A gray card adjustment module (4) is provided in the upper mold assembly (2). The gray card adjustment module (4) is provided with a gray card (410). The gray card adjustment module (4) is used to adjust the relative distance between the gray card (410) and the optical sensor (620) of the product to be tested (6).

2. The headphone circuit board test fixture according to claim 1, characterized in that, The gray card adjustment module (4) includes a gray card fixing block (420), and a gray card mounting groove (421) is provided at the lower end of the gray card fixing block (420). The gray card (410) is installed in the gray card mounting groove (421). An adjustment member (430) is provided on the upper surface of the upper mold assembly (2). The adjustment member (430) passes downward through the adjustment hole (250) on the upper mold assembly (2) and is connected to the upper end of the gray card fixing block (420).

3. The headphone circuit board test fixture according to claim 2, characterized in that, The adjusting component (430) includes an adjusting knob (431) and a screw (432) connected to the adjusting knob (431). The adjusting knob (431) is located on the upper surface of the upper mold assembly (2), and the screw (432) is connected to the gray card fixing block (420).

4. The headphone circuit board test fixture according to claim 3, characterized in that, The gray card fixing block (420) has guide posts (440) at both ends that are parallel to the screw (432), and the upper mold assembly (2) has guide holes (260) that cooperate with the guide posts (440).

5. A test fixture for an earphone circuit board according to claim 4, characterized in that, A spring (450) is fitted on the guide post (440), the spring (450) being used to tilt the gray card fixing block (420) away from the optical sensor (620).

6. A test fixture for an earphone circuit board according to claim 2, characterized in that, The gray card fixing block (420) has an opening cover plate (460) at the opening position of the gray card mounting groove (421), and the opening cover plate (460) is used to limit the opening size of the gray card mounting groove (421).

7. A test fixture for an earphone circuit board according to claim 2, characterized in that, The upper mold assembly (2) includes an upper plate (210), an upper needle plate (220), and an upper mold wireless plate (230) arranged from bottom to top. An accommodating space (240) for accommodating the gray card fixing block (420) is provided between the upper plate (210) and the upper needle plate (220). The gray card fixing block (420) can move up and down within the accommodating space (240). The adjusting hole (250) passes through the upper needle plate (220) and the upper mold wireless plate (230).

8. A test fixture for an earphone circuit board according to claim 7, characterized in that, The probe assembly (3) is mounted on the upper needle plate (220), and the upper end of the probe assembly (3) passes through the upper needle plate (220) and is connected to the upper mold wireless plate (230).

9. A test fixture for an earphone circuit board according to claim 1, characterized in that, The lower mold assembly (1) includes a download plate (120) and a lower needle plate (130) arranged from top to bottom, and the test position (110) is located on the download plate (120).

10. A test fixture for an earphone circuit board according to claim 1, characterized in that, The upper mold assembly (2) and the lower mold assembly (1) are detachably connected. The lower mold assembly (1) is also provided with a magnet cover plate (5) for pressing down the product to be tested (6).

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