Multi-station burning seat

Abstract

The utility model discloses a kind of multi-station burning seat, including lower base, upper pressure seat, circuit board, chip detection component and chip clamping component, upper pressure seat is connected movably with lower base upside down, chip detection component is installed in the installation groove of lower base, circuit board is installed in the lower surface of lower base, chip detection component is equipped with multiple side-by-side arrangement chip detection station, chip clamping component includes oppositely arranged first clamping component and second clamping component, first clamping component has multiple first clamps corresponding with chip detection station one by one, second clamping component has multiple second clamps corresponding with chip detection station one by one, upper pressure seat can drive first clamps and second clamps to be active, to make first clamps and second clamps hold or loosen chip on chip detection station, the utility model can test multiple chips at a time, effectively improve chip test efficiency, reduce production cost.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically to a multi-station programming socket. Background Technology

[0002] A programming socket is a tool used for testing chips. It mainly includes a lower base, an upper pressure base, a circuit board, a chip detection component, and a chip clamping component. The chip detection component is provided with a chip positioning groove, and a probe is provided in the chip positioning groove. The lower end of the probe is electrically connected to the circuit board. The chip clamping component includes two opposing jaws. During testing, the chip is clamped and fixed in the chip positioning groove by the two jaws, and the upper end of the probe is electrically connected to the chip to perform the test.

[0003] However, traditional programming sockets can usually only test a single chip at a time, resulting in low chip testing efficiency and high production costs. Utility Model Content

[0004] This invention addresses the shortcomings of existing technologies by providing a multi-station programming socket that can test multiple chips at once, thereby improving chip testing efficiency and reducing production costs.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A multi-station programming socket includes a lower base, an upper pressure base, a circuit board, a chip detection component, and a chip clamping component. The upper pressure base is movably connected to the lower base. The chip detection component is installed in a mounting slot in the lower base, and the circuit board is installed on the lower surface of the lower base. The chip detection component has multiple chip detection stations arranged side by side. The chip clamping component includes a first clamping component and a second clamping component arranged opposite to each other. The first clamping component has multiple first jaws corresponding to each chip detection station, and the second clamping component has multiple second jaws corresponding to each chip detection station. The upper pressure base can drive the first and second jaws to move, so that the first and second jaws clamp or release the chips on the chip detection stations.

[0007] By setting multiple chip testing stations arranged side by side on the chip testing assembly, the chip clamping assembly consists of a first clamping assembly and a second clamping assembly arranged opposite to each other. The first clamping assembly has multiple first grippers corresponding to each chip testing station, and the second clamping assembly has multiple second grippers corresponding to each chip testing station. The upper pressure seat can drive the first and second grippers to move, so that the first and second grippers clamp or release the chips on the chip testing stations. By using a multi-station programming socket, multiple chips can be placed on the corresponding chip testing stations for testing at one time, thereby improving chip testing efficiency and reducing production costs.

[0008] As a preferred embodiment, both the first and second grippers are rotatably connected to the lower base. When the upper pressure seat moves up and down, it can drive the first and second grippers to rotate synchronously, so that the first and second grippers can simultaneously clamp or release the chip on the detection station.

[0009] As a preferred embodiment, the first clamping assembly further includes a first rotating shaft, the axis of which is aligned with the arrangement direction of the chip detection station. The first rotating shaft is mounted on the lower base, and multiple first grippers are rotatably connected to the first rotating shaft.

[0010] As a preferred embodiment, the first gripper includes a connecting arm and a gripping arm. One end of the connecting arm is connected to the gripping arm, and the end of the connecting arm near the gripping arm is rotatably connected to a first rotating shaft. The end of the connecting arm away from the gripping arm is provided with a pin. The upper pressure seat is provided with a plurality of sliding grooves. The sliding grooves cooperate with the corresponding pins so that the upper pressure seat can drive the first gripper to rotate around the first rotating shaft.

[0011] As a preferred embodiment, the lower base is provided with a plurality of first clearance grooves and second clearance grooves on both sides. The first clearance grooves and second clearance grooves are both connected to the mounting groove. The first gripper is rotatably disposed in the first clearance groove, the second gripper is rotatably disposed in the second clearance groove, the first rotating shaft passes through the first clearance groove, and the second rotating shaft on the second clamping assembly passes through the second clearance groove.

[0012] As a preferred embodiment, the chip detection assembly includes an upper pin mold, a lower pin mold, and a plurality of probes. The chip detection station is located on the upper surface of the upper pin mold, and each chip detection station is provided with a chip positioning groove. The bottom of each chip positioning groove is provided with a plurality of first through holes. The lower pin mold is provided with a plurality of second through holes corresponding one-to-one with the first through holes. The upper end of the probe extends upward through the second through hole into the first through hole, and the lower end of the probe extends out of the second through hole and abuts against the contact point on the upper surface of the circuit board.

[0013] As a preferred embodiment, the spacing between two adjacent chip positioning slots is the same as the spacing between two adjacent chips on the chip carrier.

[0014] As a preferred embodiment, the lower surface of the upper needle mold is provided with a plurality of positioning guide grooves corresponding one-to-one with the chip positioning grooves. The positioning guide grooves are connected to the chip positioning grooves through corresponding first through holes. The upper surface of the lower needle mold is provided with a plurality of positioning guide bosses. The upper end of the second through hole passes through the positioning guide bosses upward. The positioning guide bosses cooperate with the corresponding positioning guide grooves to guide the up-and-down movement of the upper needle mold relative to the lower needle mold.

[0015] As a preferred embodiment, a first buffer spring group and a second buffer spring group are provided between the upper and lower needle molds. The first and second buffer spring groups are respectively arranged opposite to each other on both sides of the chip positioning groove. Each of the first and second buffer spring groups includes multiple buffer springs arranged along the arrangement direction of the chip positioning groove. The buffer springs ensure that the upper needle mold always has an upward movement tendency.

[0016] Compared with the prior art, this utility model has significant advantages and beneficial effects. Specifically, by setting multiple chip testing stations arranged side by side on the chip testing assembly, the chip clamping assembly is composed of a first clamping assembly and a second clamping assembly arranged opposite to each other. The first clamping assembly has multiple first jaws corresponding to each chip testing station, and the second clamping assembly has multiple second jaws corresponding to each chip testing station. The upper pressure seat can drive the first jaws and second jaws to move, so that the first jaws and second jaws clamp or release the chips on the chip testing stations. By using a multi-station programming socket, multiple chips can be placed on the corresponding chip testing stations for testing at one time, thereby improving chip testing efficiency and reducing production costs.

[0017] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments: Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the assembly structure of an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of the structure of this utility model without the circuit board;

[0020] Figure 3 This is an exploded view of an embodiment of the present utility model;

[0021] Figure 4 This is a cross-sectional schematic diagram of an embodiment of the present utility model.

[0022] Explanation of reference numerals in the attached diagram:

[0023] 10-Lower base; 11-Mounting slot; 12-First clearance slot

[0024] 13-Second relief groove 14-Reset spring 20-Upper pressure seat

[0025] 21-Slide groove 22-Window 30-Chip detection component

[0026] 31-Lower needle die; 311-Positioning guide boss; 312-Second through hole

[0027] 313 - Positioning post; 314 - First receiving groove; 315 - Second receiving groove

[0028] 32-Upper needle mold; 321-Chip inspection station; 322-Positioning guide groove

[0029] 323 - First through hole; 324 - First groove; 325 - Second groove

[0030] 326-Limit stop edge; 33-Probe; 40-Chip clamping assembly

[0031] 41-First clamping assembly; 411-First gripper; 4111-Connecting arm

[0032] 4112-Clamping arm; 412-First rotating shaft; 413-Pin shaft

[0033] 42-Second clamping assembly; 421-Second gripper; 422-Second rotating shaft

[0034] 50-Circuit Board Detailed Implementation

[0035] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] like Figure 1-4 As shown, this utility model discloses a multi-station programming socket, including a lower base 10, an upper pressure base 20, a chip detection component 30, a chip clamping component 40, and a circuit board 50. The upper pressure base 20 is movably connected to the lower base 10. The chip detection component 30 is installed in the mounting groove 11 of the lower base 10, and the circuit board 50 is installed on the lower surface of the lower base 10.

[0038] The chip detection assembly 30 is provided with multiple chip detection stations 321 arranged side by side. The chip clamping assembly 40 includes a first clamping assembly 41 and a second clamping assembly 42 arranged opposite to each other. The first clamping assembly 41 has multiple first grippers 411 that correspond one-to-one with the chip detection stations 321. The second clamping assembly 42 has multiple second grippers 421 that correspond one-to-one with the chip detection stations 321. The upper pressure seat 20 can drive the first grippers 411 and the second grippers 421 to move so that the first grippers 411 and the second grippers 421 clamp or release the chip on the chip detection station 321.

[0039] The first gripper 411 and the second gripper 421 are both rotatably connected to the lower base 10. When the upper pressure seat 20 moves up and down, it can drive the first gripper 411 and the second gripper 421 to rotate synchronously, so that the first gripper 411 and the second gripper 421 can simultaneously clamp or release the chip on the chip detection station 321.

[0040] The first clamping assembly 41 also has a first rotating shaft 412, the axis of which is in the same direction as the arrangement of the inspection stations. The first rotating shaft 412 is mounted on the lower base 10. Multiple first grippers 411 are connected to the first rotating shaft 412. Each first gripper 411 includes a connecting arm 4111 and a clamping arm 4112. One end of the connecting arm 4111 is connected to the clamping arm 4112, and the end of the connecting arm 4111 near the clamping arm 4112 rotates with the first rotating shaft 412. The connecting arm 4111 is provided with a pin 413 at one end away from the clamping arm 4112. The upper pressure seat 20 is provided with a plurality of sliding grooves 21. The extending direction of the sliding grooves 21 is perpendicular to the axial direction of the first rotating shaft 412. The sliding grooves 21 cooperate with the corresponding pins 413 so that the upper pressure seat 20 can drive the first clamping jaw 411 to rotate around the first rotating shaft 412. It can be understood that the structure and principle of the second clamping assembly 42 are the same as those of the first clamping assembly 41, and will not be described again here.

[0041] The lower base 10 has multiple first clearance grooves 12 and second clearance grooves 13 on both sides. The first clearance grooves 12 and second clearance grooves 13 are connected to the mounting groove 11. The first gripper 411 is rotatably disposed in the first clearance groove 12, and the second gripper 421 is rotatably disposed in the second clearance groove 13. The first rotating shaft 412 passes through the first clearance groove 12, and the second rotating shaft 422 on the second clamping assembly 42 passes through the second clearance groove 13.

[0042] The chip detection assembly 30 includes an upper die 32, a lower die 31, and a plurality of probes 33. A chip detection station 321 is located on the upper surface of the upper die 32, and each chip detection station 321 is provided with a chip positioning slot. For example, there are four chip positioning slots. The bottom of each chip positioning slot is provided with a plurality of first through holes 323. The lower die 31 is provided with a plurality of second through holes 312 corresponding one-to-one with the first through holes 323. The upper end of each probe 33 extends upward through the second through hole 312 into the first through hole. In hole 323, the lower end of probe 33 extends out of the second through hole 312 and abuts against the contact point on the upper surface of the circuit board 50. Specifically, probe 33 is an elastic probe 33, and both the upper and lower ends of probe 33 can elastically extend and retract in the vertical direction. By setting up a chip detection assembly consisting of an upper needle mold, a lower needle mold, and several probes, when replacing probes, the circuit board can be removed, and the old probe can be taken out from the second through hole and a new probe can be inserted. There is no need for the user to disassemble the upper and lower needle molds. The needle replacement is simple and convenient, the structure is simple, and the assembly is efficient.

[0043] The spacing b between two adjacent chip positioning slots is the same as the spacing between two adjacent chips on the chip carrier. By setting the spacing b between two adjacent chip positioning slots to be the same as the spacing between two adjacent chips on the chip carrier, the robot can remove multiple chips from the chip carrier at once and place them directly into the chip positioning slots without adjusting the spacing between the chips during loading. Similarly, the robot can remove multiple tested chips from the chip positioning slots at once and place them directly into the chip carrier without adjusting the spacing between the chips during unloading, thus improving production efficiency.

[0044] The lower surface of the upper needle mold 32 is provided with a plurality of positioning guide grooves 322 corresponding one-to-one with the chip positioning grooves. The positioning guide grooves 322 are connected to the chip positioning grooves through corresponding first through holes 323. The upper surface of the lower needle mold 31 is provided with a plurality of positioning guide protrusions 311. The upper end of the second through hole 312 passes through the positioning guide protrusions 311 upward. The cooperation between the positioning guide protrusions 311 and the corresponding positioning guide grooves 322 guides the up-and-down movement of the upper needle mold 32 relative to the lower needle mold 31. By setting the positioning guide protrusions 311 and the positioning guide grooves 322, the up-and-down movement of the upper needle mold 32 relative to the lower needle mold 31 can be positioned and guided by the positioning and guiding function, without the need to set an additional positioning structure between the upper needle mold and the lower needle mold 31.

[0045] A first buffer spring group (not shown) and a second buffer spring group (not shown) are provided between the upper needle mold 32 and the lower needle mold 31. The first buffer spring group and the second buffer spring group are respectively arranged opposite to each other on both sides of the chip positioning groove. The first buffer spring group and the second buffer spring group each include multiple buffer springs arranged along the arrangement direction of the chip positioning groove. The buffer springs make the upper needle mold 32 always have an upward tendency. The circumferential inner sidewall of the mounting groove 11 is provided with an inwardly protruding limiting stop 326. The limiting stop 326 restricts the upward movement of the upper needle mold 32. Specifically, the upper surface of the lower needle mold 31 is provided with multiple first receiving grooves 314 and second receiving grooves 315 for mounting buffer springs. The first receiving grooves 314 and the second receiving grooves 315 are respectively arranged opposite to each other on both sides of the positioning guide boss 311. When the first gripper 411 and the second gripper 421 clamp the chip downward, the buffer springs can play a buffering role to avoid chip damage.

[0046] The lower surface of the lower needle mold 31 is provided with a positioning post 313, and the circuit board 50 is provided with a positioning hole (not shown). During assembly, the positioning post 313 of the lower needle mold 31 is embedded in the positioning hole of the circuit board 50.

[0047] One side of the chip positioning slot is provided with a first clearance groove 314 for the first gripper 411 to extend into, and the other side of the chip positioning slot is provided with a second clearance groove 325 for the second gripper 421 to extend into.

[0048] Multiple return springs 14 are provided between the lower base 10 and the upper pressure seat 20. The return springs 14 ensure that the upper pressure seat 20 always has an upward tendency. Specifically, there are four return springs 14, which are distributed at the four corners of the lower base 10. The upper pressure seat 20 has a window 22 in the middle that corresponds to the mounting slot 11. The window 22 is connected to all chip positioning slots. The window 22 can be used to place the chip into the chip positioning slot.

[0049] The working principle of this utility model is as follows: The external drive mechanism pushes the upper pressure seat 10 downward, so that the upper pressure seat 10 moves downward against the elastic force of the return spring 14. The slide groove 21 drives the pin 413 to move downward. The pin 413 drives the connecting arm 4111 to rotate downward around the first rotating shaft 412. The clamping arm 4112 rotates upward around the first rotating shaft 412 (the second clamping jaw 421 moves in the same way as the first clamping jaw 411). The first clamping jaw 411 and the second clamping jaw 421 open synchronously.

[0050] The robotic arm picks up multiple chips from the chip carrier tape at once and places them into the chip positioning slots on the corresponding chip detection station 321. The external drive mechanism disengages from the upper pressure seat 20, and the reset spring 14 pushes the upper pressure seat 20 upward. The first gripper 411 and the second gripper 421 rotate downward synchronously and clamp the chip, so that the upper end of the probe 33 abuts against the contact point (not shown) on the chip, and the chip is positioned.

[0051] Circuit board 50 is powered on and begins testing the chip. After the chip completes the test, the robotic arm grabs the chip in the chip positioning slot and places the multiple tested chips onto the chip carrier tape.

[0052] In summary, this utility model provides multiple chip testing stations 321 arranged side-by-side on the chip testing assembly 30. The chip clamping assembly 40 consists of a first clamping assembly 41 and a second clamping assembly 42 arranged opposite to each other. The first clamping assembly 41 has multiple first grippers 411 corresponding to each chip testing station 321, and the second clamping assembly 42 has multiple second grippers 421 corresponding to each chip testing station 321. The upper pressure seat 20 can drive the first grippers 411 and the second grippers 421 to move, so that the first grippers 411 and the second grippers 421 clamp or release the chips on the chip testing station 321. By using a multi-station programming socket, multiple chips can be placed on the corresponding chip testing stations 321 for testing at one time, thereby improving chip testing efficiency and reducing production costs.

[0053] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Therefore, any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the actual technical aspects of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A multi-station programming socket, comprising a lower base, an upper pressure base, a circuit board, a chip detection component, and a chip clamping component, wherein the upper pressure base is movably connected to the lower base, the chip detection component is installed in a mounting slot of the lower base, and the circuit board is installed on the lower surface of the lower base, characterized in that: The chip detection assembly has multiple chip detection stations arranged side by side. The chip clamping assembly includes a first clamping assembly and a second clamping assembly arranged opposite to each other. The first clamping assembly has multiple first jaws corresponding to each chip detection station. The second clamping assembly has multiple second jaws corresponding to each chip detection station. The upper pressure seat can drive the first jaws and the second jaws to move so that the first jaws and the second jaws clamp or release the chip on the chip detection station.

2. The multi-station programming socket according to claim 1, characterized in that, Both the first and second grippers are rotatably connected to the lower base. When the upper pressure seat moves up and down, it can drive the first and second grippers to rotate synchronously, so that the first and second grippers can simultaneously clamp or release the chip on the detection station.

3. The multi-station programming socket according to claim 2, characterized in that, The first clamping assembly also has a first rotating shaft, the axis of which is in the same direction as the arrangement of the chip detection station. The first rotating shaft is mounted on the lower base, and the plurality of first grippers are rotatably connected to the first rotating shaft.

4. The multi-station programming socket according to claim 3, characterized in that, The first gripper includes a connecting arm and a gripping arm. One end of the connecting arm is connected to the gripping arm. The end of the connecting arm near the gripping arm is rotatably connected to a first rotating shaft. The end of the connecting arm away from the gripping arm is provided with a pin. The upper pressure seat is provided with a plurality of sliding grooves. The sliding grooves cooperate with the corresponding pins so that the upper pressure seat can drive the first gripper to rotate around the first rotating shaft.

5. The multi-station programming socket according to claim 3, characterized in that, The lower base has multiple first clearance grooves and second clearance grooves on both sides. The first clearance groove and the second clearance groove are connected to the mounting groove. The first gripper is rotatably disposed in the first clearance groove, the second gripper is rotatably disposed in the second clearance groove, the first rotating shaft passes through the first clearance groove, and the second rotating shaft on the second clamping assembly passes through the second clearance groove.

6. The multi-station programming socket according to any one of claims 1-5, characterized in that, The chip detection assembly includes an upper needle mold, a lower needle mold, and several probes. The chip detection station is located on the upper surface of the upper needle mold, and each chip detection station is provided with a chip positioning groove. The bottom of each chip positioning groove is provided with several first through holes. The lower needle mold is provided with several second through holes that correspond one-to-one with the first through holes. The upper end of the probe passes through the second through hole and extends into the first through hole, and the lower end of the probe extends out of the second through hole and abuts against the contact point on the upper surface of the circuit board.

7. The multi-station programming socket according to claim 6, characterized in that, The spacing between two adjacent chip positioning slots is the same as the spacing between two adjacent chips on the chip carrier tape.

8. The multi-station programming socket according to claim 6, characterized in that, The lower surface of the upper needle mold is provided with a plurality of positioning guide grooves corresponding one-to-one with the chip positioning grooves. The positioning guide grooves are connected to the chip positioning grooves through corresponding first through holes. The upper surface of the lower needle mold is provided with a plurality of positioning guide bosses. The upper end of the second through hole passes through the positioning guide bosses upward. The positioning guide bosses cooperate with the corresponding positioning guide grooves to guide the up and down movement of the upper needle mold relative to the lower needle mold.

9. The multi-station programming socket according to claim 8, characterized in that, A first buffer spring group and a second buffer spring group are provided between the upper and lower needle molds. The first buffer spring group and the second buffer spring group are respectively arranged opposite to each other on both sides of the chip positioning groove. The first buffer spring group and the second buffer spring group each include multiple buffer springs arranged along the arrangement direction of the chip positioning groove. The buffer springs make the upper needle mold always have an upward movement tendency.

Images