Optoelectronic bracket and depth camera for assembling a 3D module

Abstract

The application provides an optoelectronic bracket and a depth camera for assembling a 3D module, comprising at least two mounting grooves for mounting the 3D module, wherein each mounting groove comprises a front side and a back side penetrating through the optoelectronic bracket, and the 3D module penetrates from the back side of the mounting groove to the front side of the mounting groove; the front side edge of the mounting groove is annularly provided with a first glue inlet groove with an inclined side wall for point setting of glue, and the glue enters the mounting groove along the first glue inlet groove to fix the 3D module on the optoelectronic bracket. The optoelectronic bracket provided by the application not only ensures that the 3D module has high precision during assembly, but also avoids screw locking between the 3D module and the optoelectronic bracket, which is beneficial to miniaturization.

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