High power resistor

Abstract

This application discloses a high-power resistor, relating to the field of electronic component technology. The high-power resistor includes a housing, multiple resistor units, a fixing component, at least one ceramic substrate, and an aluminum cover plate. The housing has a first accommodating space; the multiple resistor units are spaced apart within the first accommodating space; the fixing component is disposed within the first accommodating space and supports the multiple resistor units; the ceramic substrate covers the resistor units; the aluminum cover plate covers the ceramic substrate, and the aluminum cover plate and the ceramic substrate are connected by thermally conductive silicone grease. This application can improve the heat dissipation efficiency of the high-power resistor and optimize the fixing stability of the internal components.

Description

Technical Field

[0001] This application relates to the field of electronic components technology, and in particular to a high-power resistor. Background Technology

[0002] In existing technologies, damping resistors are used to prevent circuits from forming constant-amplitude oscillations, dissipating excess energy through series or parallel connections. In high-power equipment and power industry applications, high-power resistors need to withstand high voltage, high power, and pulse energy, leading to severe internal heat accumulation. Traditional high-power resistor structures suffer from low heat dissipation efficiency and unstable internal component mounting. Long-term high-temperature environments can easily cause material aging, poor contact, and even structural deformation, affecting the safe operation of equipment. Utility Model Content

[0003] The main purpose of this invention is to provide a high-power resistor, which aims to improve the heat dissipation efficiency of the damping resistor and optimize its internal structure.

[0004] To achieve the above objectives, this utility model provides a high-power resistor, characterized in that the high-power resistor comprises:

[0005] A housing, wherein the housing is provided with a first accommodating space;

[0006] Multiple resistor units are spaced apart within the first accommodating space;

[0007] A fixing component is disposed within the first accommodating space, and the fixing component is used to support the plurality of resistor units;

[0008] At least one ceramic substrate, and at least one of the ceramic substrates is disposed on the resistor unit;

[0009] An aluminum cover plate is disposed on the ceramic substrate, and the aluminum cover plate and the ceramic substrate are connected by thermally conductive silicone grease.

[0010] Optionally, the housing is provided with a first electrode connection terminal and a second electrode connection terminal;

[0011] The number of the plurality of resistor units is three, the three resistor units are arranged sequentially in the first accommodating space, the three resistor units are connected in series to the first electrode connection terminal and the second electrode connection terminal, and the two resistor units are connected by a wire.

[0012] Optionally, the fixing component includes a positioning plate, an insulating ceramic plate, and a silicone layer stacked sequentially from the bottom to the top of the housing; the silicone layer is bonded and connected to the resistor unit.

[0013] Optionally, the number of ceramic substrates is three, and the three ceramic substrates are respectively covered on the resistor unit.

[0014] Optionally, the high-power resistor further includes:

[0015] A support spring is provided in the first accommodating space and is supported on the side of the fixing component facing away from the resistor unit.

[0016] Optionally, the supporting spring includes:

[0017] An arched substrate, wherein a first end secondary arch section, a first transition recess section, a middle main arch section, a second transition recess section and a second end secondary arch section are sequentially connected along the length direction.

[0018] A glue-filling hole is provided in at least one of the first transition recess and the second transition recess.

[0019] Optionally, the high-power resistor further includes:

[0020] A bottom cover plate, which is detachably connected to the housing.

[0021] Optionally, the housing has multiple mounting holes spaced apart on both sides, which are used to fix the high-power resistor to the corresponding mounting position.

[0022] Optionally, the aluminum cover plate is provided with sealing silicone on its periphery, which is used to seal the gap between the aluminum cover plate and the housing.

[0023] This embodiment of the invention comprises a housing, multiple resistor units, a fixing component, at least one ceramic substrate, and an aluminum cover plate. The housing has a first accommodating space, within which the multiple resistor units are spaced apart. The fixing component is also located within the first accommodating space and supports the resistor units. Ceramic substrates are then placed on top of the resistor units, and finally, the aluminum cover plate is placed on top of the ceramic substrate and connected to it using thermally conductive silicone grease. The ceramic substrate, acting as an excellent insulating and thermally conductive medium, tightly covers each resistor unit, efficiently dissipating the heat generated during operation upwards. The aluminum cover plate covers at least one ceramic substrate and forms a tight thermal interface with it through thermally conductive silicone grease, ensuring efficient heat transfer from the ceramic substrate to the aluminum cover plate. The large-area metal structure of the aluminum cover plate serves as the final heat dissipation surface, rapidly diffusing internal heat to the external environment. This improves the heat dissipation efficiency of the high-power resistor and optimizes the stability of the internal components. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a high-power resistor according to an embodiment of the present invention;

[0027] Figure 2 for Figure 1 A schematic diagram showing a structure with two ceramic substrates;

[0028] Figure 3 for Figure 1 A schematic diagram showing a structure with three ceramic substrates.

[0029] Figure 4 This is a schematic diagram of the structure of a high-power resistor according to another embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of a high-power resistor according to another embodiment of the present invention;

[0031] Figure 6 for Figure 5 A schematic diagram of the supporting spring sheet in the middle;

[0032] Figure 7 This is a schematic diagram of the structure of a high-power resistor according to another embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram of the structure of a high-power resistor according to another embodiment of the present invention.

[0034] Explanation of icon numbers:

[0035]

[0036] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Well-known modules, units, and their connections, links, communications, or operations are not shown or described in detail. Furthermore, the described features, architectures, or functions can be combined in any way in one or more embodiments. Those skilled in the art should understand that the various embodiments described below are only for illustrative purposes and are not intended to limit the scope of protection of the present invention.

[0038] Damping resistors play a crucial role in circuit systems, primarily preventing constant-amplitude oscillations in the circuit. By connecting resistors in series or parallel within the circuit, some of the energy that might cause oscillations can be effectively dissipated. Especially in high-power equipment or power industry applications, these high-power resistors need to withstand significant operating power and high voltage, while also dealing with high-pulse energy surges. During actual operation, due to substantial power losses, high-power resistors experience significant heat accumulation. Traditional high-power resistor structures have shortcomings in heat dissipation, mechanical stability, and internal component fixation, easily leading to problems such as resistor unit displacement, decreased insulation performance, and poor heat dissipation efficiency, affecting equipment reliability and lifespan. Furthermore, the internal support structure of existing high-power resistors often lacks effective buffer protection mechanisms, making internal components susceptible to damage under mechanical vibration or thermal stress.

[0039] The main solution of this application embodiment is as follows: by setting a housing, multiple resistor units, a fixing component, at least one ceramic substrate and an aluminum cover plate, and the housing is provided with a first accommodating space, multiple resistor units are arranged at intervals in the first accommodating space, the fixing component is set in the first accommodating space and the fixing component is used to support multiple resistor units, then the ceramic substrate is correspondingly covered on the resistor units, and finally the aluminum cover plate is covered on the ceramic substrate, and the aluminum cover plate and the ceramic substrate are connected together by thermal grease.

[0040] This application provides a solution where a ceramic substrate, as an excellent insulating and thermally conductive medium, is tightly fitted over each resistor unit, efficiently dissipating the heat generated during resistor operation upwards. An aluminum cover plate covers at least one ceramic substrate and forms a tight thermal interface with it via thermally conductive silicone grease, ensuring efficient heat transfer from the ceramic substrate to the aluminum cover plate. The large-area metal structure of the aluminum cover plate serves as the final heat dissipation surface, rapidly diffusing internal heat to the external environment. This improves the heat dissipation efficiency of high-power resistors and optimizes the stability of internal components.

[0041] In existing technologies, damping resistors are used to prevent circuits from forming constant-amplitude oscillations, dissipating excess energy through series or parallel connections. In high-power equipment and power industry applications, high-power resistors need to withstand high voltage, high power, and pulse energy, leading to severe internal heat accumulation. Traditional high-power resistor structures suffer from low heat dissipation efficiency and unstable internal component mounting. Long-term high-temperature environments can easily cause material aging, poor contact, and even structural deformation, affecting the safe operation of equipment.

[0042] To address the aforementioned issues, a high-power resistor structure capable of withstanding high-power operating conditions and possessing efficient heat dissipation is required. Traditional solutions employing a single heat dissipation layer or simple fixing methods struggle to balance mechanical support and thermal conduction requirements. Analysis of the heat conduction path reveals that heat is primarily concentrated on the surface of the resistor unit 20. If heat can be rapidly dissipated to the external heat dissipation structure while ensuring stable contact of internal components during thermal expansion, overall performance can be effectively improved. Therefore, a combination of layered thermal conduction and elastic support is considered to optimize the internal structural layout.

[0043] Reference Figures 1 to 3 In one embodiment of this utility model, the high-power resistor includes a housing 10, a plurality of resistor units 20, a fixing assembly 30, at least one ceramic substrate 40, and an aluminum cover plate 50, wherein:

[0044] The housing 10 has a first accommodating space; a plurality of resistor units 20 are spaced apart in the first accommodating space; a fixing component 30 is disposed in the first accommodating space, and the fixing component 30 is used to support the plurality of resistor units 20; at least one ceramic substrate 40 is correspondingly covered on the resistor unit 20; an aluminum cover plate 50 is covered on the ceramic substrate 40, and the aluminum cover plate 50 and the ceramic substrate 40 are connected by thermally conductive silicone grease to form a composite heat dissipation structure.

[0045] The housing 10 is a protective structure that houses the resistor unit 20 and auxiliary components. It can be made of metal alloy casting or engineering plastic injection molding. The internal spatial layout of the housing 10 must meet the requirements of the spaced arrangement of the resistor units 20. The resistor unit 20 is the core component that generates resistance. It can be made of metal oxide or carbon film material into a sheet structure. The spaced arrangement is conducive to forming heat dissipation channels. The fixing component 30 is a support structure that maintains the spatial position of the resistor unit 20. It can be a composite sandwich consisting of a positioning plate 31, an insulating ceramic plate 32, and a silicone layer 33 with elastic buffering capacity. It provides rigid support, absorbs thermal stress, and also provides insulation. The ceramic substrate 40 is a thermally conductive and insulating layer covering the surface of the resistor unit 20. It can be made of alumina ceramic material, which both isolates current and conducts heat. The aluminum cover plate 50 is a heat dissipation component located on top. It can be made of 6063 aluminum alloy sheet. It forms a low thermal resistance contact interface with the ceramic substrate 40 through thermally conductive silicone grease.

[0046] In this structure, the resistor units 20 are spaced apart to form heat dissipation gaps, and the multi-layered structure of the fixing component 30 provides gradient support in the vertical direction. The positioning plate 31 bears the main mechanical load, the insulating ceramic plate 32 blocks the current conduction path, and the elastic buffer layer compensates for the thermal expansion differences of different materials. The ceramic substrate 40 covers the surface of the resistor units 20 to form a local heat dissipation surface, and the aluminum cover plate 50 integrates the heat of multiple ceramic substrates 40 and dissipates it through the external environment of the housing 10. Thermally conductive silicone grease fills the microscopic gaps between the aluminum cover plate 50 and the ceramic substrates 40 to reduce contact thermal resistance. This structure, through a layered thermal conductivity design, conducts heat sequentially from the resistor units 20 to the ceramic substrates 40, the aluminum cover plate 50, and finally dissipates it to the outside.

[0047] Among them, such as Figures 1 to 3 As shown, the number of ceramic substrates 40 can be one, two, three or more, and the specific number can be selected and determined according to the actual situation. The attached figure only shows the structural schematics of one, two and three, but the same applies to the case of multiple. It is not required that the multiple ceramic substrates 40 be of equal length and width. The size of the ceramic substrates 40 can be adjusted according to actual needs. For example, when there are two, one ceramic substrate 40 can be two-thirds the size and the other ceramic substrate 40 can be one-third the size. The same applies to other cases.

[0048] Among them, such as Figure 3 As shown, this embodiment employs three ceramic substrates 40, each corresponding to a resistor unit, to achieve a more uniform heat distribution and efficient heat dissipation, ensuring stable operation of the resistor unit. Each ceramic substrate independently covers its corresponding resistor unit, reducing heat accumulation and improving overall heat dissipation performance. Compared to one, two, or multiple ceramic substrates, the three-substrate approach, with three resistors corresponding to three substrates, results in a more balanced heat distribution, avoiding overheating of a single substrate. This significantly improves heat dissipation efficiency and the reliability of the resistor unit, offering advantages in heat conduction efficiency and heat dissipation uniformity. It effectively reduces the risk of localized overheating, extends the lifespan of the resistor unit, and ensures the stability of the equipment under high load operation. By optimizing the heat conduction path, the overall heat dissipation system's efficiency is effectively improved, providing a more reliable protection mechanism for the resistor unit.

[0049] Compared with existing technologies, traditional high-power resistors often employ a multi-layer structure consisting of a ceramic substrate 40, a thermally conductive metal layer, and a metallized ceramic substrate 40. Furthermore, both the thermally conductive metal layer and the metallized ceramic substrate 40 are assembled from multiple pieces. This can lead to poor heat conduction and increased thermal resistance due to gaps between the pieces. Additionally, the weak mechanical strength at these joints can easily cause structural deformation, affecting the stability and lifespan of the high-power resistor. This embodiment utilizes a combined heat dissipation structure of the ceramic substrate 40 and the aluminum cover plate 50, forming a stepped heat conduction path that significantly improves heat dissipation efficiency. The aluminum cover plate 50 is integrally molded, eliminating gaps and enhancing overall mechanical strength. The composite layer structure of the fixing component 30, while ensuring mechanical strength, absorbs thermal deformation stress through the elastic buffer of the silicone layer 33, preventing structural loosening due to temperature changes. The spaced-apart resistor units 20 form natural convection channels, which, combined with the rapid heat dissipation of the top aluminum cover plate 50, create a three-dimensional heat dissipation system.

[0050] Through the above implementation methods, this embodiment effectively reduces the operating temperature of the resistor unit 20, preventing material performance degradation caused by localized overheating. The composite support structure maintains the positional stability of the resistor unit 20 during thermal cycling, ensuring reliable electrical connections. The layered thermal conductivity design enables rapid heat dissipation, extending the service life of the high-power resistor under high-load conditions. The combined heat dissipation interface of the aluminum cover plate 50 and the ceramic substrate 40 significantly improves the overall heat dissipation capacity, meeting the stringent requirements of high-power equipment for the thermal management of high-power resistors.

[0051] This embodiment comprises a housing 10, multiple resistor units 20, a fixing component 30, at least one ceramic substrate 40, and an aluminum cover plate 50. The housing 10 has a first accommodating space, within which the multiple resistor units 20 are spaced apart. The fixing component 30 is also located within the first accommodating space and supports the multiple resistor units 20. The ceramic substrate 40 is then placed on top of the resistor units 20. Finally, the aluminum cover plate 50 is placed on top of the ceramic substrate 40 and connected to the ceramic substrate 40 using thermally conductive silicone grease. The ceramic substrate 40, as an excellent insulating and thermally conductive medium, tightly covers each resistor unit 20, efficiently dissipating the heat generated during operation upwards. The aluminum cover plate 50 covers at least one ceramic substrate 40 and forms a tight thermal interface with it using thermally conductive silicone grease, ensuring efficient heat transfer from the ceramic substrate 40 to the aluminum cover plate 50. The large-area metal structure of the aluminum cover plate 50 serves as the final heat dissipation surface, rapidly diffusing internal heat to the external environment. This improves the heat dissipation efficiency of high-power resistors and optimizes the stability of internal components.

[0052] Optionally, refer to Figure 4 Another embodiment of this utility model provides a high-power resistor, based on the above... Figure 1In the embodiment shown, the housing 10 is provided with a first electrode connection terminal 11 and a second electrode connection terminal 12, wherein:

[0053] The number of the plurality of resistor units 20 is three. The three resistor units 20 are arranged sequentially in the first accommodating space. The three resistor units 20 are connected in series to the first electrode connection terminal 11 and the second electrode connection terminal 12. The two resistor units 20 are connected by a wire 21.

[0054] The first electrode connection end 11 and the second electrode connection end 12 refer to the conductive interfaces located on both sides of the housing 10. They can be made of copper alloy material through stamping and are used to form a current path between the resistor unit 20 and the external circuit. The number of three resistor units 20 refers to the use of three sets of independent resistor elements, which can be achieved by winding nickel-chromium alloy resistance wire on a ceramic substrate. The number configuration balances power distribution and heat dissipation requirements.

[0055] The sequential arrangement refers to the linear arrangement of the three resistor units 20 along the length of the housing 10, which can be achieved using an equidistant layout, facilitating the connection of the wires 21 and optimizing space utilization. The series connection refers to the electrical connection of the three resistor units 20 end-to-end, which can be achieved by welding or crimping the wires 21, making the total resistance the sum of the resistances of each unit. The wire connection refers to the conductive connection structure between the resistor units 20, which can be achieved using silver-plated copper wire or copper sheets, reducing contact resistance at the connection points and increasing current carrying capacity.

[0056] Three resistor units 20 are connected in series between the first electrode connection terminal 11 and the second electrode connection terminal 12, with current flowing sequentially through each resistor unit 20. Because the total voltage is shared among the three units, the voltage load on a single resistor unit 20 is reduced, thus minimizing the risk of localized overheating. A wire 21 connects adjacent resistor units 20 to form a continuous conductive path, ensuring stable current transmission. The resistor units 20 are arranged along the length of the housing 10, resulting in a more uniform heat distribution and facilitating efficient heat dissipation through the combination of the aluminum cover plate 50 and the ceramic substrate 40.

[0057] Traditional high-power resistors typically employ a single, large-volume resistor unit 20, leading to excessively high localized temperature rise and limited heat dissipation efficiency. This embodiment disperses the voltage load through three series-connected resistor units 20, and optimizes heat distribution using a linear arrangement, significantly reducing the operating temperature of individual components and extending their lifespan. Furthermore, the series structure reduces the size of individual components while maintaining the same total resistance, facilitating compact design.

[0058] This embodiment effectively reduces the operating temperature of the resistor unit 20, avoiding performance degradation or damage caused by local overheating; the series structure ensures uniform voltage load distribution, improving the reliability of high-power resistors in high-voltage environments; the linear arrangement and wire connection method simplify the internal circuit layout, facilitating mass production and maintenance.

[0059] Optionally, refer to Figure 5 Another embodiment of this utility model provides a high-power resistor, based on the above... Figure 1 In the embodiment shown, the fixing assembly 30 includes a positioning plate 31, an insulating ceramic plate 32, and a silicone layer 33, wherein:

[0060] The positioning plate 31, the insulating ceramic plate 32, and the silicone layer 33 are stacked sequentially from the bottom to the top of the housing 10; the silicone layer 33 is bonded to the resistor unit 20.

[0061] The positioning plate 31 is used to buffer the pressure between the support spring 60 and the insulating ceramic plate 32 to prevent the insulating ceramic plate 32 from breaking. The insulating ceramic plate 32 is used to insulate the resistor unit 20, and the silicone layer 33 is used to buffer the resistor unit 20.

[0062] The positioning plate 31 refers to the support structure set between the bottom of the housing 10 and the insulating ceramic plate 32. It can be made of metal or engineering plastic and is used to disperse the pressure transmitted by the support spring 60 to prevent the insulating ceramic plate 32 from breaking due to local stress concentration.

[0063] The insulating ceramic plate 32 is an isolation layer disposed between the positioning plate 31 and the silicone layer 33. It can be made of alumina ceramic or silicon nitride ceramic and is used to block the current conduction between the resistor unit 20 and the housing 10, ensuring that the resistor unit 20 is insulated from the external structure. The silicone layer 33 is a buffer layer disposed between the insulating ceramic plate 32 and the resistor unit 20. It can be made of thermally conductive silicone or high-temperature resistant silicone and is used to absorb the deformation of the resistor unit 20 caused by thermal expansion or mechanical vibration, and can also transfer heat to the aluminum cover plate 50.

[0064] During the operation of the high-power resistor, the positioning plate 31 distributes the pressure from the supporting spring 60 through rigid support, preventing the insulating ceramic plate 32 from cracking due to uneven stress. While achieving electrical isolation, the insulating ceramic plate 32 transfers the heat generated by the resistor unit 20 upward through its own high thermal conductivity. The silicone layer 33 is tightly attached to the surface of the resistor unit 20, using elastic deformation to absorb the small displacement of the resistor unit 20 caused by temperature changes or mechanical loads, and conducts the heat to the aluminum cover plate 50 for heat dissipation through thermal grease.

[0065] Traditional high-power resistors typically employ a single material layer or simple stacking method in their mounting structure, such as using only a metal support plate or a single insulation layer. This results in insufficient support strength, unclear heat dissipation paths, or poor buffering effects. This embodiment utilizes a layered design combining a positioning plate 31, an insulating ceramic plate 32, and a silicone layer 33. This design ensures mechanical support strength while optimizing the heat transfer path and enhancing vibration resistance. Furthermore, this embodiment effectively solves the problem of insulation layer cracking caused by insufficient support structure strength in high-power resistors. The synergistic effect of the multi-layer structure improves heat dissipation efficiency and mechanical shock resistance, ensuring the long-term stable operation of the resistor unit 20 under high-temperature and high-vibration environments.

[0066] Optionally, refer to Figure 5 Another embodiment of this utility model provides a high-power resistor, based on the above... Figure 1 In the embodiment shown, the high-power resistor further includes a support spring 60, wherein:

[0067] The support spring 60 is disposed in the first accommodating space, and the support spring 60 is supported on the side of the fixing component 30 facing away from the resistor unit 20.

[0068] The supporting spring 60 refers to a support structure with elastic deformation capability, which can be realized by stamping a thin metal sheet into an arched structure. It absorbs the mechanical stress transmitted by the fixing component 30 through elastic deformation, preventing the fixing component 30 from shifting due to thermal expansion or vibration. The fixing component 30 is a composite structure composed of a positioning plate 31, an insulating ceramic plate 32, and a silicone layer 33, which can be achieved through stacking and assembly. The positioning plate 31 is used to distribute the pressure on the supporting spring 60, the insulating ceramic plate 32 is used to block current, and the silicone layer 33 is used to adhere to the resistor unit 20 to buffer vibration.

[0069] The support spring 60 is mounted on the side of the fixing assembly 30 away from the resistor unit 20. When the resistor unit 20 generates heat during operation or is subjected to external impact, the fixing assembly 30 transfers stress to the support spring 60. The support spring 60 absorbs the stress through its own elastic deformation while maintaining a reaction force on the fixing assembly 30, thus maintaining a stable contact pressure between the resistor unit 20 and the ceramic substrate 40. The arched structure design of the support spring 60 provides preload in the vertical direction, which can compensate for material expansion differences caused by temperature changes.

[0070] Compared to existing technologies, traditional high-power resistors typically employ rigid support structures, which cannot effectively cope with stress concentration caused by thermal expansion or mechanical vibration, easily leading to cracking of the ceramic substrate 40 or displacement of the resistor unit 20. In this embodiment, the support spring 60 disperses stress through elastic support while maintaining the positioning accuracy of the fixing component 30, significantly improving structural reliability. This embodiment effectively solves the problem of internal structural instability in high-power resistors caused by thermal expansion or vibration. The elastic support of the support spring 60 extends the service life of the resistor unit 20 and the ceramic substrate 40, while avoiding the risk of breakage of the insulating ceramic plate 32 due to stress concentration, ensuring long-term stable operation of the high-power resistor under high-temperature and high-vibration conditions.

[0071] Optionally, refer to Figure 6 In another embodiment of this utility model, a high-power resistor is provided, based on the above. Figure 5 In the embodiment shown, the support spring 60 includes an arched substrate 61 and a potting hole 67, wherein:

[0072] The arched substrate 61 is provided with a first end secondary arch section 62, a first transition recess section 63, a middle main arch section 64, a second transition recess section 65 and a second end secondary arch section 66 connected sequentially along the length direction; the glue filling hole 67 is provided in at least one of the first transition recess section 63 and the second transition recess section 65.

[0073] The arched substrate 61 refers to a metal sheet with a continuously undulating structure, which can be achieved using a stamping process. Its arched structure provides elastic support. The first and second end secondary arched sections 62 and 66 refer to the low-curvature arched areas located at both ends of the substrate, which can be achieved using a gradual curvature design to disperse stress concentration. The central main arched section 64 refers to the high-curvature arched area located in the center of the substrate, which can be achieved using a symmetrical arc structure to bear the main support load.

[0074] The first transition recessed section 63 and the second transition recessed section 65 refer to the low-lying areas connecting the main arch section and the secondary arch section, which can be realized using a U-shaped groove structure to form a glue-filling channel. The glue-filling hole 67 refers to a through hole opened in the transition recessed section, which can be realized by drilling or punching, and is used to inject glue to fill the gap between the support spring 60 and the fixing component 30.

[0075] The arched substrate 61 contacts the housing 10 via a first end secondary arch section 62 and a second end secondary arch section 66. The central main arch section 64 rises upwards to form an elastic support surface. A first transition recessed section 63 and a second transition recessed section 65 serve as channels for the flow of the adhesive. During installation, the support spring 60 is compressed and then the adhesive is injected through the injection hole 67. The adhesive diffuses and solidifies along the transition recessed sections, forming a uniform filling layer. The continuous undulating structure of the arched substrate 61 generates elastic deformation under pressure, mitigating the vibration impact of external shocks on the resistor unit 20.

[0076] The continuous arched segment design of this embodiment makes the stress distribution more uniform, and the glue-filling channel formed by the transition concave section makes the glue flow path controllable, avoiding glue overflow or insufficient filling. Through the above implementation method, this embodiment achieves the synergistic effect of elastic support of the support spring 60 and glue-filling fixation, improves the stability of the resistor unit 20 in the vibration environment, simplifies the glue-filling operation process, and ensures uniform glue filling without residual voids.

[0077] Optionally, refer to Figure 7 Another embodiment of this utility model provides a high-power resistor, based on the above... Figure 1 In the embodiment shown, the high-power resistor also includes a bottom cover 70, wherein:

[0078] The bottom cover plate 70 is detachably connected to the housing 10. After the bottom cover plate 70 is moved away from the housing 10, glue is poured through the glue hole 67 to fix the resistor unit 20.

[0079] The bottom cover plate 70 is an independent component that covers the bottom opening of the housing 10. It can be made of a metal sheet with a threaded connection structure and is detachably connected to the housing 10 by bolts. The glue-filling hole 67 is a through hole set in the transition recess area of ​​the support spring 60. It can be made of a circular channel with a diameter range of 3-5 mm and is used to guide the glue into the internal space of the housing 10.

[0080] When the bottom cover 70 is removed, an open operating window is formed at the bottom of the housing 10. At this time, adhesive is injected into the housing 10 through the injection hole 67 provided in the transition recess of the support spring 60. Under the action of gravity, the adhesive flows evenly along the gap between the resistor unit 20 and the fixing component 30. As the adhesive cures, an integral fixing structure is formed between the resistor unit 20, the fixing component 30, and the support spring 60, effectively limiting the displacement of the resistor unit 20 under pulse energy impact.

[0081] This embodiment, through the cooperation of the detachable bottom cover plate 70 and the glue-filling hole 67 in the transition recess, ensures the sealing performance of the housing 10 and allows for directional glue-filling operations in the later stages of assembly according to actual working conditions. In the prior art, glue-filling operations need to be completed through openings in the side wall of the housing 10, which easily leads to uneven glue distribution. However, this embodiment utilizes the glue-filling hole 67 in the recessed section of the supporting spring 60, allowing the glue to penetrate evenly along the arrangement direction of the resistor units 20.

[0082] This embodiment achieves multi-dimensional fixation of the resistor unit 20 inside the housing 10, solving the displacement problem caused by thermal expansion of the resistor unit 20 under high-power conditions. The adhesive is injected through the potting hole 67 at a specific location, which not only avoids the adhesive blocking the heat dissipation channel, but also ensures uniform stress distribution between the fixing component 30 and the resistor unit 20. Combined with the thermally conductive silicone grease connection between the aluminum cover plate 50 and the ceramic substrate 40, a complete mechanical support and heat conduction system is formed.

[0083] Optionally, refer to Figure 7 Another embodiment of this utility model provides a high-power resistor, based on the above... Figure 1 In the embodiment shown, the housing 10 has a plurality of mounting holes 80 spaced apart on both sides, wherein:

[0084] The mounting hole 80 is used to fix the high-power resistor to the corresponding mounting position.

[0085] The mounting hole 80 refers to a hole-like structure that penetrates the side wall of the housing 10. It can be implemented using threaded holes or through holes with bolts, and is used to mechanically connect the high-power resistor body to the external mounting structure. The spacing setting refers to the distribution of multiple mounting holes 80 along the length of the housing 10 at a preset interval. It can be implemented with uniform or non-uniform spacing to disperse stress concentration generated during installation.

[0086] The mounting holes 80 symmetrically opened on both sides of the housing 10 can adapt to the fixing requirements of different installation scenarios. When high-power resistors are used in power cabinets, the mounting holes 80 can be aligned with the pre-set guide rail slots inside the cabinet, and fastened by bolts passing through the holes; when used in open brackets, the mounting holes 80 can be used with U-shaped clips for multi-point fixing. The spacing of the mounting holes 80 takes into account the thermal expansion coefficient of the housing 10 material. For example, in aluminum housing 10, an 8mm diameter through hole is opened every 50mm to ensure fixing strength and avoid misalignment of the holes due to thermal deformation.

[0087] This embodiment utilizes a double-sided, multi-hole arrangement to evenly distribute the fixed load across both sides of the housing 10, effectively reducing localized stress. Simultaneously, the multi-hole structure adapts to the positioning requirements of different installation scenarios, eliminating the need for additional adapter brackets. Through the above implementation, this embodiment achieves reliable fixing of high-power resistors under complex operating conditions, avoiding contact problems caused by vibration, and simplifying the installation process. The spaced mounting holes 80 further enhance the structural strength of the housing 10, preventing cracking of the housing 10 caused by concentrated stress at the fixing points, and extending the equipment's service life.

[0088] Optionally, refer to Figure 8 Another embodiment of this utility model provides a high-power resistor, based on the above... Figure 1 In the embodiment shown, the aluminum cover plate 50 is provided with sealing silicone 90 on its periphery, wherein:

[0089] The sealing silicone 90 is used to seal the gap between the aluminum cover plate 50 and the housing 10.

[0090] The sealing silicone 90 refers to an elastic and high-temperature resistant organic silicone material, which can be made of single-component or two-component silicone. It forms a sealing barrier by filling the physical gap between the aluminum cover plate 50 and the housing 10. The gap sealing refers to the elimination of the gap at the connection between the aluminum cover plate 50 and the housing 10 by the filling effect of the sealing silicone 90. It can be achieved by molding or coating process. Its function is to prevent moisture, dust and other pollutants from the external environment from entering the interior of the housing 10.

[0091] An aluminum cover plate 50 covers the ceramic substrate 40 and is connected by thermally conductive silicone grease. During assembly, sealing silicone 90 is applied to the contact area between the edge of the aluminum cover plate 50 and the housing 10. After curing, the sealing silicone 90 forms a continuous sealing ring, covering the seam between the aluminum cover plate 50 and the housing 10. This maintains the heat dissipation function of the aluminum cover plate 50 while preventing external contaminants from entering the interior of the housing 10 through the seam.

[0092] In traditional high-power resistors, there are often tiny gaps between the aluminum cover plate 50 and the housing 10, allowing contaminants to easily penetrate into the interior of the housing 10. This embodiment utilizes the elastic filling properties of the sealing silicone 90 to accommodate deformations caused by thermal expansion and contraction of the aluminum cover plate 50 and the housing 10, while maintaining long-term sealing stability. This embodiment effectively solves the problem of internal component contamination or moisture absorption caused by insufficient sealing in high-power resistors, improving the reliability of high-power resistors under complex operating conditions and extending their service life.

[0093] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-power resistor, characterized in that, The high-power resistor includes: A housing, wherein the housing is provided with a first accommodating space; Multiple resistor units are spaced apart within the first accommodating space; A fixing component is disposed within the first accommodating space, and the fixing component is used to support the plurality of resistor units; At least one ceramic substrate, and at least one of the ceramic substrates is disposed on the resistor unit; An aluminum cover plate is disposed on the ceramic substrate, and the aluminum cover plate and the ceramic substrate are connected by thermally conductive silicone grease.

2. The high-power resistor as described in claim 1, characterized in that, The housing is provided with a first electrode connection end and a second electrode connection end; The number of the plurality of resistor units is three, the three resistor units are arranged sequentially in the first accommodating space, the three resistor units are connected in series to the first electrode connection terminal and the second electrode connection terminal, and the two resistor units are connected by a wire.

3. The high-power resistor as described in claim 1, characterized in that, The fixing component includes a positioning plate, an insulating ceramic plate, and a silicone layer stacked sequentially from the bottom to the top of the housing; the silicone layer is bonded and connected to the resistor unit.

4. The high-power resistor as described in claim 1, characterized in that, The number of ceramic substrates is three, and the three ceramic substrates are respectively covered on the resistor unit.

5. The high-power resistor as described in claim 1, characterized in that, The high-power resistor also includes: A support spring is provided in the first accommodating space and is supported on the side of the fixing component facing away from the resistor unit.

6. The high-power resistor as described in claim 5, characterized in that, The supporting spring includes: An arched substrate, wherein a first end secondary arch section, a first transition recess section, a middle main arch section, a second transition recess section and a second end secondary arch section are sequentially connected along the length direction. A glue-filling hole is provided in at least one of the first transition recess and the second transition recess.

7. The high-power resistor as described in claim 1, characterized in that, The high-power resistor also includes: A bottom cover plate, which is detachably connected to the housing.

8. The high-power resistor as described in claim 1, characterized in that, The housing has multiple mounting holes spaced apart on both sides, which are used to fix the high-power resistor to the corresponding mounting position.

9. The high-power resistor as described in claim 1, characterized in that, The aluminum cover plate is provided with sealing silicone on its periphery, which is used to seal the gap between the aluminum cover plate and the housing.

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