Three-phase adaptive intelligent electric meter with improved heat dissipation structure

Abstract

This application relates to the field of power metering technology, and in particular to a three-phase adaptive smart meter with an improved heat dissipation structure. The meter includes a meter body, a sealed top cover fixedly mounted on the top of the meter body, and a display screen on one side of the sealed top cover. This application utilizes components such as a heat dissipation shell, heat dissipation cover plate, heat dissipation fins, and thermal grease. Through the thermal grease applied to the overlapping area between the heat dissipation cover plate and the PCB board, and the heat dissipation fins fixedly mounted in the fin mounting grooves of the heat dissipation cover plate, with the heat dissipation grooves of the heat dissipation shell communicating with the bottom cavity of the heat dissipation cover plate, the heat generated by the PCB board during operation can be quickly conducted to the heat dissipation cover plate via the thermal grease. The heat is then transferred to the heat dissipation cover plate, the heat is further amplified by the heat dissipation fins, and the heat is further dissipated through the heat dissipation grooves with the outside air. This achieves the effect of rapidly dissipating the heat generated by the PCB board during operation through a highly efficient heat conduction and convection structure, thus improving the heat dissipation efficiency of the meter body.

Description

Technical Field

[0001] This application relates to the field of power metering technology, and in particular to a three-phase adaptive smart meter with an improved heat dissipation structure. Background Technology

[0002] With the advancement of smart grid construction, the performance and reliability of three-phase adaptive smart meters, as key devices for power metering and data interaction, are becoming increasingly important. During operation, traditional smart meters generate continuous heat in their internal PCB boards, power modules, and other components. Poor heat dissipation can easily lead to performance degradation or even damage, affecting metering accuracy and equipment lifespan. Simultaneously, complex electrical environments, such as dust, moisture, and mechanical vibration, place higher demands on the structural protection of the meters. Existing meter heat dissipation structures mostly employ single ventilation holes or simple heat sink designs, resulting in limited heat dissipation efficiency and difficulty meeting the demands of high-load operation. Furthermore, the structural protection of components is relatively weak, failing to effectively resist external impacts and electromagnetic interference.

[0003] A search revealed Chinese Patent Publication No. CN206348371U, which discloses a three-phase adaptive smart meter with an improved heat dissipation structure. The meter includes a PCB board, a battery, an upper housing, and a lower housing. It also includes a heat insulation pad, a first thermally conductive pad, and a second thermally conductive pad. A metering chip is mounted on the PCB board. The battery is positioned between the PCB board and the lower housing. The first thermally conductive pad is positioned between the battery and the lower housing. The heat insulation pad is positioned between the PCB board and the battery. The second thermally conductive pad is positioned between the PCB board and the upper housing. This invention, on the one hand, uses a heat insulation pad to insulate the PCB board and battery, preventing heat transfer and potential safety risks. On the other hand, it uses thermally conductive pads to conduct heat from the PCB board and battery to the upper and lower housings respectively, resulting in excellent overall heat dissipation performance.

[0004] Regarding the aforementioned technologies, the inventors have discovered the following drawbacks: the heat dissipation structure of the aforementioned devices mainly relies on the direct contact between the heat-conducting pad and the shell to conduct heat, resulting in a relatively simple heat dissipation path. In high-power operation or dense installation scenarios, heat is prone to accumulate locally in the components, leading to limited heat dissipation efficiency. Furthermore, the heat dissipation airflow has not been optimized, resulting in poor air convection and difficulty in forming an efficient heat exchange cycle. Moreover, the lack of a reasonable design for the arrangement of the heat dissipation fins makes it impossible to achieve gradient heat diffusion based on airflow characteristics. Utility Model Content

[0005] To address the problems mentioned in the background section, this application provides a three-phase adaptive smart meter with an improved heat dissipation structure.

[0006] This application provides a three-phase adaptive smart meter with an improved heat dissipation structure, which adopts the following technical solution: A three-phase adaptive smart meter with an improved heat dissipation structure includes a meter body, a sealed top cover is fixedly installed on the top of the meter body, and a display screen is provided on one side of the sealed top cover.

[0007] The meter body includes a heat dissipation shell, a heat insulation plate for mounting a PCB board and terminals, and a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation cover plate fixedly installed inside the heat dissipation shell and heat dissipation fins. The PCB board and terminals are fixedly installed on the top of the heat insulation plate. The PCB board is positioned directly above the heat dissipation cover plate. Thermal grease is applied to the overlapping area between the heat dissipation cover plate and the PCB board. Fin mounting slots are provided on the top of the heat dissipation cover plate, and heat dissipation fins are fixedly installed inside the fin mounting slots. A heat dissipation groove is provided through one side of the heat dissipation shell, and the heat dissipation groove communicates with the cavity at the bottom of the heat dissipation cover plate.

[0008] The above solution enhances heat conduction efficiency through thermal grease, and, combined with gradient-arranged heat sink fins and directional airflow design, significantly improves the heat dissipation performance of core components.

[0009] Optionally, the sealing top cover further includes a first locking post for fixing the heat insulation plate and a second locking post for supporting the heat dissipation cover plate. The top of the first locking post and the second locking post are provided with mounting holes, and the diameter of the mounting holes is the same as the diameter of the damping post at the bottom of the heat insulation plate.

[0010] The above solution utilizes the precise cooperation between the clamping column and the damping column to achieve rapid positioning and installation of components, while reducing the impact of vibration on the internal structure.

[0011] Optionally, the extension direction of the heat dissipation fins is parallel to the opening direction of the heat dissipation grooves in the heat dissipation shell, and the spacing density of the heat dissipation fins decreases gradually along the airflow direction.

[0012] The above solutions reduce wind resistance by optimizing fin layout and enhance airflow disturbance by gradient density design, thereby achieving synergistic effects between active and passive heat dissipation.

[0013] Optionally, an explosion-proof frame is fixedly installed on the top of the heat insulation board, and a power module is fixedly installed inside the explosion-proof frame. The power module is electrically connected to the display screen and the PCB board respectively.

[0014] The above solution employs an independent explosion-proof frame to isolate the power supply module, combined with a high-temperature resistant buffer pad design, to improve the safety and stability of the equipment under abnormal operating conditions.

[0015] Optionally, the sealing top cover is fixedly installed on the top of the heat dissipation shell by a snap-fit ​​structure, and a trapezoidal positioning groove is provided on the side of the sealing top cover near the display screen. The display screen is fixed to the top of the heat insulation plate by an embedded installation.

[0016] The above solution combines the trapezoidal positioning groove with embedded installation to ensure the display screen's sealing and shock resistance, while also facilitating quick disassembly and assembly during maintenance.

[0017] Optionally, a flow guide baffle is provided in the bottom cavity of the heat dissipation cover plate. The flow guide baffle and the inner wall of the heat dissipation shell form an S-shaped heat dissipation air duct, and the air duct outlet corresponds to the position of the heat dissipation groove.

[0018] The above scheme extends the airflow path and accelerates heat exchange, while the directional airflow design further improves heat dissipation efficiency.

[0019] Optionally, the explosion-proof frame is provided with elastic buffer pads at its four corners, and the elastic buffer pads are made of high-temperature resistant silicone material.

[0020] Through the above solution, the elastic buffer pad effectively protects the power module and extends its service life by absorbing mechanical impact and thermal expansion stress.

[0021] Optionally, the heat dissipation fins are provided with a dovetail-shaped protrusion at the base, and the surface of the protrusion is coated with a thermally conductive adhesive layer.

[0022] The above solution uses a dovetail structure combined with a thermally conductive adhesive layer to enhance the mechanical connection between the fins and the heat sink cover, thus avoiding the risk of detachment due to temperature-induced deformation.

[0023] In summary, this application includes the following beneficial technical effects:

[0024] 1. This utility model, through the arrangement of components such as a heat dissipation shell, heat dissipation cover plate, heat dissipation fins, and thermal grease, utilizes the thermal grease applied to the overlapping area between the heat dissipation cover plate and the PCB board, and the heat dissipation fins fixedly installed in the fin mounting grooves of the heat dissipation cover plate. Furthermore, the heat dissipation grooves of the heat dissipation shell are connected to the bottom cavity of the heat dissipation cover plate. This allows the heat generated by the PCB board during operation to be rapidly conducted to the heat dissipation cover plate via the thermal grease, then further dissipated through the increased heat dissipation area by the heat dissipation fins, and finally convected with the outside air through the heat dissipation grooves. Thus, this device achieves the effect of rapidly dissipating the heat generated by the PCB board during operation through a highly efficient heat conduction and convection structure, thereby improving the heat dissipation efficiency of the meter itself.

[0025] 2. This utility model, through the arrangement of components such as a heat insulation plate, a first locking post, a second locking post, and an explosion-proof frame, uses the first locking post to fix the heat insulation plate and the second locking post to support the heat dissipation cover. The heat insulation plate, along with the PCB board, wiring terminals, and power module mounted on top of the heat insulation plate and within the explosion-proof frame, effectively isolates the PCB board from the heat dissipation shell, reducing the impact of the heat from the heat dissipation shell on the PCB board. Simultaneously, the explosion-proof frame protects the power module. Therefore, this device, through its stable structural layout and heat insulation protection, reliably installs and protects the internal electronic components of the electricity meter, improving the stability and safety of the meter's operation. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure in an embodiment of this application;

[0027] Figure 2 This is a partial structural diagram of an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the main structure of the meter body in the embodiments of this application;

[0029] Figure 4 This is a schematic diagram of a partial structure of the meter body in an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the partial structure installation of the meter body in an embodiment of this application.

[0031] Reference numerals in the attached diagram: 1. Meter body; 101. Heat dissipation shell; 102. Heat insulation board; 103. PCB board; 104. Wiring terminal; 105. First locking pin; 106. Heat dissipation cover plate; 107. Second locking pin; 108. Fin mounting slot; 109. Heat dissipation fins; 110. Explosion-proof frame; 111. Power module; 2. Sealed top cover; 3. Display screen. Detailed Implementation

[0032] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0033] This application discloses a three-phase adaptive smart meter with an improved heat dissipation structure.

[0034] Please see Figure 1 and Figure 2 A three-phase adaptive smart meter with an improved heat dissipation structure includes a meter body 1, a sealed top cover 2 fixedly installed on the top of the meter body 1, and a display screen 3 provided on one side of the sealed top cover 2.

[0035] The sealing top cover 2 is fixedly installed on the top of the heat dissipation shell 101 by a snap-fit ​​structure. A trapezoidal positioning groove is provided on the side of the sealing top cover 2 near the display screen 3. The display screen 3 is fixed on the top of the heat insulation plate 102 by an embedded installation.

[0036] Please see Figures 2 to 5 The meter body 1 includes a heat dissipation shell 101, a heat insulation plate 102 for mounting a PCB board 103 and a terminal block 104, and a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation cover plate 106 fixedly installed inside the heat dissipation shell 101 and heat dissipation fins 109 for heat dissipation. The PCB board 103 and the terminal block 104 are fixedly installed on the top of the heat insulation plate 102. The PCB board 103 is located directly above the heat dissipation cover plate 106. Thermal grease is applied to the overlapping area between the heat dissipation cover plate 106 and the PCB board 103. Fin mounting grooves 108 are opened on the top of the heat dissipation cover plate 106. Heat dissipation fins 109 are fixedly installed inside the fin mounting grooves 108. A heat dissipation groove is opened through one side of the heat dissipation shell 101, and the heat dissipation groove communicates with the cavity at the bottom of the heat dissipation cover plate 106.

[0037] The sealed top cover 2 also includes a first locking post 105 for fixing the heat insulation plate 102 and a second locking post 107 for supporting the heat dissipation cover plate 106. The top of the first locking post 105 and the second locking post 107 are provided with mounting holes, and the diameter of the mounting holes is the same as the diameter of the damping post at the bottom of the heat insulation plate 102.

[0038] The extension direction of the heat dissipation fins 109 is parallel to the opening direction of the heat dissipation slots of the heat dissipation shell 101, and the spacing density of the heat dissipation fins 109 decreases gradually along the airflow direction.

[0039] An explosion-proof frame 110 is fixedly installed on the top of the heat insulation plate 102. A power module 111 is fixedly installed inside the explosion-proof frame 110. The power module 111 is electrically connected to the display screen 3 and the PCB board 103 respectively.

[0040] A flow guide baffle is provided in the bottom cavity of the heat dissipation cover 106. The flow guide baffle and the inner wall of the heat dissipation shell 101 form an S-shaped heat dissipation air duct, and the air duct outlet corresponds to the position of the heat dissipation slot.

[0041] The explosion-proof frame 110 has elastic buffer pads at its four corners, which are made of high-temperature resistant silicone material.

[0042] The base of the heat dissipation fin 109 is provided with a dovetail-shaped protrusion, and the surface of the protrusion is coated with a thermally conductive adhesive layer.

[0043] Further explanation is needed: The main body of the meter 1 consists of a heat dissipation shell 101, a heat insulation plate 102, and a heat dissipation assembly. The heat insulation plate 102 serves as the mounting carrier for internal components, and the top of it fixes the PCB board 103, the wiring terminals 104, and the power module 111 within the explosion-proof frame 110, forming the electrical connection and control core. The PCB board 103 carries the core circuit of the smart meter, the wiring terminals 104 enable external circuit access, and the power module 111 provides stable power to the display screen 3 and the PCB board 103, ensuring the coordinated operation of metering, communication, and other functions. The heat dissipation cover 106 inside the heat dissipation shell 101 directly contacts the PCB board 103 through thermal grease, quickly conducting heat from high-heat components such as chips. The fin mounting slot 108 contains... The heat dissipation fins 109 are arranged parallel to the heat dissipation grooves, with a decreasing spacing density. Combined with the bottom S-shaped airflow channel, the airflow is guided to pass through the heat dissipation grooves in an orderly manner, forming a three-dimensional heat dissipation path of "heat conduction-flow diversion-heat dissipation", which significantly improves heat exchange efficiency and avoids component aging due to high temperature. The heat insulation plate 102 is fixed to the sealed top cover 2 by the first clip 105, isolating the external environment from the influence of the internal circuit. The high-temperature resistant silicone buffer pads at the four corners of the explosion-proof frame 110 can absorb external impacts and suppress vibration damage to components such as the power module 111. The snap-fit ​​sealing design of the heat dissipation shell 101 and the sealed top cover 2, combined with the embedded installation of the display screen 3, ensures that the meter maintains reliable operation in complex environments such as dust and humidity, providing physical protection for the long-term stable operation of the smart meter.

[0044] The implementation principle of a three-phase adaptive smart meter with an improved heat dissipation structure according to an embodiment of this application is as follows:

[0045] First, electricity is connected to the meter body 1 through terminal 104. Terminal 104 serves as the connection hub between the external circuit and the internal circuit, stably transmitting three-phase AC power to PCB board 103. PCB board 103 integrates core circuits such as metering and communication, which monitor and collect data of the input power in real time, and convert the electrical signal into identifiable metering data such as voltage, current, and power through built-in algorithms.

[0046] Secondly, the power module 111 begins to function. Installed inside the explosion-proof frame 110, the power module 111 converts the input electrical energy to provide a suitable and stable power supply to the PCB board 103 and the display screen 3, ensuring that each component can operate normally. At the same time, the elastic buffer pads at the four corners of the explosion-proof frame 110 effectively resist external impacts and ensure the safe and stable operation of the power module 111.

[0047] Next, the heat dissipation system starts to operate. During operation, the chips and other components on the PCB board 103 generate heat, which is conducted to the heat dissipation cover 106 through thermal grease. The heat dissipation fins 109 on the top of the heat dissipation cover 106 dissipate the heat quickly. The heat dissipation fins 109 are arranged in parallel along the direction of the heat dissipation groove, and the spacing density gradient decreases. Together with the S-shaped airflow channel at the bottom of the heat dissipation cover 106, the airflow is guided to be discharged from the heat dissipation groove, achieving efficient heat dissipation and preventing the performance of components from degrading due to high temperature.

[0048] Next, data communication and processing: the metering data processed by PCB board 103 is transmitted through the built-in communication module, which can interact with external intelligent systems to realize functions such as remote meter reading and power consumption monitoring. During this process, the heat insulation plate 102 is fixed to the sealed top cover 2 through the first locking post 105, which effectively isolates external electromagnetic interference and ensures the accuracy and stability of data transmission.

[0049] Finally, the data shows that the processed and transmitted data, powered by the power module 111, is displayed intuitively on the display screen 3. Users can view the power consumption information in real time through the display screen 3. The snap-fit ​​sealing design of the sealed top cover 2 and the heat dissipation shell 101, combined with the embedded installation of the display screen 3, ensures that the meter can display stably in various complex environments, providing users with reliable power consumption data reference.

[0050] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A three-phase adaptive smart meter with an improved heat dissipation structure, comprising a meter body (1), characterized in that: A sealing top cover (2) is fixedly installed on the top of the meter body (1), and a display screen (3) is provided on one side of the sealing top cover (2); The meter body (1) includes a heat dissipation shell (101), a heat insulation plate (102) for mounting a PCB board (103) and wiring terminals (104), and a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation cover plate (106) fixedly installed inside the heat dissipation shell (101) and heat dissipation fins (109) for heat dissipation. The PCB board (103) and wiring terminals (104) are fixedly mounted on the top of the heat insulation plate (102). The B board (103) is positioned directly above the heat dissipation cover plate (106). The overlapping area between the heat dissipation cover plate (106) and the PCB board (103) is coated with thermal grease. The top of the heat dissipation cover plate (106) is provided with fin mounting grooves (108). Heat dissipation fins (109) are fixedly installed inside the fin mounting grooves (108). A heat dissipation groove is provided through one side of the heat dissipation shell (101), and the heat dissipation groove is connected to the cavity at the bottom of the heat dissipation cover plate (106).

2. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 1, characterized in that: The sealed top cover (2) also includes a first locking post (105) for fixing the heat insulation plate (102) and a second locking post (107) for supporting the heat dissipation cover plate (106). The top of the first locking post (105) and the second locking post (107) are provided with mounting holes, and the diameter of the mounting holes is the same as the diameter of the damping post at the bottom of the heat insulation plate (102).

3. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 2, characterized in that: The extension direction of the heat dissipation fins (109) is parallel to the opening direction of the heat dissipation grooves of the heat dissipation shell (101), and the spacing density of the heat dissipation fins (109) decreases gradually along the airflow direction.

4. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 3, characterized in that: An explosion-proof frame (110) is fixedly installed on the top of the heat insulation plate (102), and a power module (111) is fixedly installed inside the explosion-proof frame (110). The power module (111) is electrically connected to the display screen (3) and the PCB board (103) respectively.

5. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 4, characterized in that: The sealing top cover (2) is fixedly installed on the top of the heat dissipation shell (101) by a snap-fit ​​structure. The sealing top cover (2) has a trapezoidal positioning groove on the side near the display screen (3). The display screen (3) is fixed on the top of the heat insulation plate (102) by an embedded installation.

6. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 1, characterized in that: A flow guide baffle is provided in the bottom cavity of the heat dissipation cover (106). The flow guide baffle and the inner wall of the heat dissipation shell (101) form an S-shaped heat dissipation air duct, and the air duct outlet corresponds to the position of the heat dissipation slot.

7. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 4, characterized in that: The explosion-proof frame (110) is provided with elastic buffer pads at its four corners, and the elastic buffer pads are made of high-temperature resistant silicone material.

8. A three-phase adaptive smart meter with an improved heat dissipation structure according to claim 1, characterized in that: The heat dissipation fins (109) have a dovetail-shaped protrusion at their base, and the surface of the protrusion is coated with a thermally conductive adhesive layer.

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